CN105789143B - 电子组件 - Google Patents

电子组件 Download PDF

Info

Publication number
CN105789143B
CN105789143B CN201610294382.2A CN201610294382A CN105789143B CN 105789143 B CN105789143 B CN 105789143B CN 201610294382 A CN201610294382 A CN 201610294382A CN 105789143 B CN105789143 B CN 105789143B
Authority
CN
China
Prior art keywords
ebt
electronic building
building brick
area
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610294382.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN105789143A (zh
Inventor
M.齐茨尔施珀格
S.格雷奇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN105789143A publication Critical patent/CN105789143A/zh
Application granted granted Critical
Publication of CN105789143B publication Critical patent/CN105789143B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Telephone Exchanges (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
CN201610294382.2A 2009-07-08 2010-06-22 电子组件 Active CN105789143B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009032253.1A DE102009032253B4 (de) 2009-07-08 2009-07-08 Elektronisches Bauteil
DE102009032253.1 2009-07-08
CN201080039982.5A CN102484949B (zh) 2009-07-08 2010-06-22 电子组件

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201080039982.5A Division CN102484949B (zh) 2009-07-08 2010-06-22 电子组件

Publications (2)

Publication Number Publication Date
CN105789143A CN105789143A (zh) 2016-07-20
CN105789143B true CN105789143B (zh) 2018-10-19

Family

ID=42937488

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201610294382.2A Active CN105789143B (zh) 2009-07-08 2010-06-22 电子组件
CN201080039982.5A Active CN102484949B (zh) 2009-07-08 2010-06-22 电子组件

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201080039982.5A Active CN102484949B (zh) 2009-07-08 2010-06-22 电子组件

Country Status (8)

Country Link
US (2) US8981238B2 (https=)
EP (1) EP2452547B1 (https=)
JP (2) JP6016630B2 (https=)
KR (1) KR101769632B1 (https=)
CN (2) CN105789143B (https=)
DE (1) DE102009032253B4 (https=)
TW (1) TW201115696A (https=)
WO (1) WO2011003732A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil
DE102011056706B4 (de) * 2011-12-20 2016-12-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Anordnung und optoelektronisches Halbleiterbauteil
TWI485387B (zh) * 2013-07-31 2015-05-21 Genesis Photonics Inc 發光二極體的檢測裝置
DE102014119390A1 (de) * 2014-12-22 2016-06-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016188566A1 (en) * 2015-05-26 2016-12-01 Osram Opto Semiconductors Gmbh Optoelectronic package device and method for producing the same
DE102017126268A1 (de) 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers
DE102023104437A1 (de) * 2023-02-23 2024-08-29 Ams-Osram International Gmbh Elektronisches Bauelement und Verfahren zum Montieren eines elektronischen Bauelements
DE102023127271A1 (de) * 2023-10-06 2025-04-10 Ams-Osram International Gmbh Halbleiterbauelement und verfahren zum herstellen eines halbleiterbauelements

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2392778A (en) * 2002-09-04 2004-03-10 Atlantic Technology Quad flat pack terminals
CN1591853A (zh) * 2003-09-01 2005-03-09 恩益禧电子股份有限公司 无引线型半导体封装及其制作工艺
JP2006303397A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE58908841D1 (de) 1989-05-31 1995-02-09 Siemens Ag Oberflächenmontierbares Opto-Bauelement.
JPH0648215U (ja) 1992-11-27 1994-06-28 京セラ株式会社 表面実装型水晶発振器
JPH0982760A (ja) * 1995-07-07 1997-03-28 Toshiba Corp 半導体装置、半導体素子およびその半田接続部検査方法
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
US6627482B2 (en) 2001-02-09 2003-09-30 Harvatek Corporation Mass production technique for surface mount optical device with a focusing cup
US6429464B1 (en) * 2001-02-16 2002-08-06 Para Light Electronics Co., Ltd. Light emitting diode
JP4959071B2 (ja) * 2001-07-04 2012-06-20 ローム株式会社 面実装型半導体装置
JP2003068921A (ja) 2001-08-22 2003-03-07 Toyo Commun Equip Co Ltd 表面実装型電子部品
JP3999969B2 (ja) * 2001-12-28 2007-10-31 日本電波工業株式会社 表面実装発振器用とした容器本体の製造方法及びこれによる水晶発振器
US6879040B2 (en) * 2002-09-18 2005-04-12 Agilent Technologies, Inc. Surface mountable electronic device
US6872599B1 (en) * 2002-12-10 2005-03-29 National Semiconductor Corporation Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
JP4363859B2 (ja) 2003-01-31 2009-11-11 東京電波株式会社 水晶発振器の製造方法
JP3981977B2 (ja) 2003-02-05 2007-09-26 株式会社大真空 圧電発振器
JP2006313943A (ja) * 2003-02-18 2006-11-16 Sharp Corp 半導体発光装置、その製造方法および電子撮像装置
JP4635471B2 (ja) * 2004-04-22 2011-02-23 ソニー株式会社 半導体装置及びその製造方法、半導体装置の実装構造並びにリードフレーム
JP2006066545A (ja) 2004-08-25 2006-03-09 Mitsubishi Electric Corp 電子部品パッケージ
JP2007110060A (ja) 2005-09-15 2007-04-26 Nichia Chem Ind Ltd 発光装置
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
DE102006003931B3 (de) * 2006-01-26 2007-08-02 Infineon Technologies Ag Halbleiterbauteil mit oberflächenmontierbaren Außenkontakten und Verfahren zur Herstellung desselben
JP2007201324A (ja) * 2006-01-30 2007-08-09 Denso Corp 電子装置の実装構造および電子部品の実装方法
US8044418B2 (en) 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
JP5259978B2 (ja) 2006-10-04 2013-08-07 ローム株式会社 半導体装置の製造方法
KR20080051236A (ko) 2006-12-05 2008-06-11 삼성전자주식회사 엘이디 패키지 및 그 엘이디 패키지를 포함하는 광원유닛및 백라이트 유닛
JP5122172B2 (ja) * 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
JP5217800B2 (ja) 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2392778A (en) * 2002-09-04 2004-03-10 Atlantic Technology Quad flat pack terminals
CN1591853A (zh) * 2003-09-01 2005-03-09 恩益禧电子股份有限公司 无引线型半导体封装及其制作工艺
JP2006303397A (ja) * 2005-04-25 2006-11-02 Matsushita Electric Works Ltd 発光装置

Also Published As

Publication number Publication date
JP6016630B2 (ja) 2016-10-26
US9307647B2 (en) 2016-04-05
JP6324442B2 (ja) 2018-05-16
DE102009032253A1 (de) 2011-01-13
KR20120046732A (ko) 2012-05-10
KR101769632B1 (ko) 2017-08-18
TW201115696A (en) 2011-05-01
EP2452547B1 (de) 2018-10-31
EP2452547A1 (de) 2012-05-16
WO2011003732A1 (de) 2011-01-13
CN102484949B (zh) 2016-05-25
US20150144985A1 (en) 2015-05-28
JP2012532469A (ja) 2012-12-13
JP2016192574A (ja) 2016-11-10
DE102009032253B4 (de) 2022-11-17
US20120111628A1 (en) 2012-05-10
CN105789143A (zh) 2016-07-20
CN102484949A (zh) 2012-05-30
US8981238B2 (en) 2015-03-17

Similar Documents

Publication Publication Date Title
CN105789143B (zh) 电子组件
JP5790682B2 (ja) モジュールおよびその製造方法
US5796163A (en) Solder ball joint
CN110402492B (zh) 柔性导电粘合
KR20160008199A (ko) 광전자 컴포넌트를 포함하는 조명 디바이스
CN101188221A (zh) 布线基板和采用该布线基板的半导体器件
US20220376152A1 (en) Component and method for producing a component
JP2012532469A5 (https=)
JP2020161697A (ja) 半導体発光装置
US10174914B2 (en) Light-emitting-element mounting substrate, light emitting device, and light emitting module
KR20100031775A (ko) 전자 부품
US7365421B2 (en) IC chip package with isolated vias
JP2001308388A (ja) チップ型発光素子
KR101675008B1 (ko) 광전자 모듈 그리고 광전자 모듈을 제조하기 위한 방법
US20060097405A1 (en) IC chip package and method for packaging same
WO2014166692A1 (en) Contact mechanism for electrical substrates
CN102210021B (zh) 能够表面安装的装置
JP4435074B2 (ja) 半導体装置およびその製造方法
JP2006153724A (ja) 加速度センサモジュール
JP2015076584A (ja) 電子部品収納用パッケージ
JP2008171962A (ja) 半導体装置および半導体装置の製造方法
JP2010187031A (ja) チップ型発光素子
JP2013179232A (ja) 電子部品および電子部品の製造方法
JP2006093395A (ja) 電子部品搭載用配線基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant