JP6016630B2 - 電子モジュールおよび光電デバイス - Google Patents

電子モジュールおよび光電デバイス Download PDF

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Publication number
JP6016630B2
JP6016630B2 JP2012518868A JP2012518868A JP6016630B2 JP 6016630 B2 JP6016630 B2 JP 6016630B2 JP 2012518868 A JP2012518868 A JP 2012518868A JP 2012518868 A JP2012518868 A JP 2012518868A JP 6016630 B2 JP6016630 B2 JP 6016630B2
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Japan
Prior art keywords
region
electronic module
inspection position
metal support
ebt
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Application number
JP2012518868A
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English (en)
Japanese (ja)
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JP2012532469A (ja
JP2012532469A5 (https=
Inventor
ツィツルスペルガー ミヒャエル
ツィツルスペルガー ミヒャエル
グレッチュ シュテファン
グレッチュ シュテファン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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Filing date
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Publication of JP2012532469A5 publication Critical patent/JP2012532469A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Structure Of Telephone Exchanges (AREA)
JP2012518868A 2009-07-08 2010-06-22 電子モジュールおよび光電デバイス Active JP6016630B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009032253.1 2009-07-08
DE102009032253.1A DE102009032253B4 (de) 2009-07-08 2009-07-08 Elektronisches Bauteil
PCT/EP2010/058831 WO2011003732A1 (de) 2009-07-08 2010-06-22 Elektronisches bauteil

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016141494A Division JP6324442B2 (ja) 2009-07-08 2016-07-19 電子モジュールおよび光電デバイス

Publications (3)

Publication Number Publication Date
JP2012532469A JP2012532469A (ja) 2012-12-13
JP2012532469A5 JP2012532469A5 (https=) 2016-09-01
JP6016630B2 true JP6016630B2 (ja) 2016-10-26

Family

ID=42937488

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2012518868A Active JP6016630B2 (ja) 2009-07-08 2010-06-22 電子モジュールおよび光電デバイス
JP2016141494A Active JP6324442B2 (ja) 2009-07-08 2016-07-19 電子モジュールおよび光電デバイス

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2016141494A Active JP6324442B2 (ja) 2009-07-08 2016-07-19 電子モジュールおよび光電デバイス

Country Status (8)

Country Link
US (2) US8981238B2 (https=)
EP (1) EP2452547B1 (https=)
JP (2) JP6016630B2 (https=)
KR (1) KR101769632B1 (https=)
CN (2) CN102484949B (https=)
DE (1) DE102009032253B4 (https=)
TW (1) TW201115696A (https=)
WO (1) WO2011003732A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil
DE102011056706B4 (de) 2011-12-20 2016-12-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Anordnung und optoelektronisches Halbleiterbauteil
TWI485387B (zh) * 2013-07-31 2015-05-21 Genesis Photonics Inc 發光二極體的檢測裝置
DE102014119390A1 (de) * 2014-12-22 2016-06-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016188566A1 (en) * 2015-05-26 2016-12-01 Osram Opto Semiconductors Gmbh Optoelectronic package device and method for producing the same
DE102017126268A1 (de) 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers
DE102023104437A1 (de) * 2023-02-23 2024-08-29 Ams-Osram International Gmbh Elektronisches Bauelement und Verfahren zum Montieren eines elektronischen Bauelements
DE102023127271A1 (de) * 2023-10-06 2025-04-10 Ams-Osram International Gmbh Halbleiterbauelement und verfahren zum herstellen eines halbleiterbauelements

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DE58908841D1 (de) 1989-05-31 1995-02-09 Siemens Ag Oberflächenmontierbares Opto-Bauelement.
JPH0648215U (ja) * 1992-11-27 1994-06-28 京セラ株式会社 表面実装型水晶発振器
JPH0982760A (ja) 1995-07-07 1997-03-28 Toshiba Corp 半導体装置、半導体素子およびその半田接続部検査方法
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
US6627482B2 (en) 2001-02-09 2003-09-30 Harvatek Corporation Mass production technique for surface mount optical device with a focusing cup
US6429464B1 (en) * 2001-02-16 2002-08-06 Para Light Electronics Co., Ltd. Light emitting diode
JP4959071B2 (ja) * 2001-07-04 2012-06-20 ローム株式会社 面実装型半導体装置
JP2003068921A (ja) * 2001-08-22 2003-03-07 Toyo Commun Equip Co Ltd 表面実装型電子部品
JP3999969B2 (ja) * 2001-12-28 2007-10-31 日本電波工業株式会社 表面実装発振器用とした容器本体の製造方法及びこれによる水晶発振器
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US6872599B1 (en) * 2002-12-10 2005-03-29 National Semiconductor Corporation Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
JP4363859B2 (ja) * 2003-01-31 2009-11-11 東京電波株式会社 水晶発振器の製造方法
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JP3789443B2 (ja) 2003-09-01 2006-06-21 Ｎｅｃエレクトロニクス株式会社 樹脂封止型半導体装置
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JP5259978B2 (ja) 2006-10-04 2013-08-07 ローム株式会社 半導体装置の製造方法
KR20080051236A (ko) 2006-12-05 2008-06-11 삼성전자주식회사 엘이디 패키지 및 그 엘이디 패키지를 포함하는 광원유닛및 백라이트 유닛
JP5122172B2 (ja) 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
JP5217800B2 (ja) * 2008-09-03 2013-06-19 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil

Also Published As

Publication number Publication date
TW201115696A (en) 2011-05-01
WO2011003732A1 (de) 2011-01-13
US8981238B2 (en) 2015-03-17
JP2012532469A (ja) 2012-12-13
DE102009032253A1 (de) 2011-01-13
US9307647B2 (en) 2016-04-05
JP6324442B2 (ja) 2018-05-16
CN105789143A (zh) 2016-07-20
CN102484949A (zh) 2012-05-30
KR20120046732A (ko) 2012-05-10
DE102009032253B4 (de) 2022-11-17
KR101769632B1 (ko) 2017-08-18
CN102484949B (zh) 2016-05-25
EP2452547A1 (de) 2012-05-16
US20150144985A1 (en) 2015-05-28
EP2452547B1 (de) 2018-10-31
JP2016192574A (ja) 2016-11-10
CN105789143B (zh) 2018-10-19
US20120111628A1 (en) 2012-05-10

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