JP6324442B2 - 電子モジュールおよび光電デバイス - Google Patents
電子モジュールおよび光電デバイス Download PDFInfo
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- JP6324442B2 JP6324442B2 JP2016141494A JP2016141494A JP6324442B2 JP 6324442 B2 JP6324442 B2 JP 6324442B2 JP 2016141494 A JP2016141494 A JP 2016141494A JP 2016141494 A JP2016141494 A JP 2016141494A JP 6324442 B2 JP6324442 B2 JP 6324442B2
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/3431—Leadless components
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
Claims (16)
- 上面(1A)と、該上面とは反対側の下面(1B)と、少なくとも2つの側面(3)とを有するベースボディ(100)、並びに、前記ベースボディ(100)の前記上面(1A)に配置された光感応性半導体チップまたは発光半導体チップ(2)を備えた
電子モジュール(EBT)であって、
前記ベースボディ(100)は、前記下面(1B)に複数の端子部(A1,A2)を有する金属支持体(101)を含んでおり、
前記少なくとも2つの側面は第1の領域(4A)および第2の領域(4B)を含む少なくとも1つの検査位置(4)を有しており、
前記第2の領域(4B)は、前記第1の領域(4A)内の凹部(5)として構成されており、付加的なコーティングによって前記第1の領域(4A)から区別され、これにより、前記第2の領域(4B)は前記第1の領域(4A)よりも接続材料(A)によって強く濡らされており、
前記電子モジュール(EBT)は前記複数の端子部(A1,A2)を介して電気的にコンタクトされ、
前記金属支持体(101)は部分ごとに不透光性のケーシングボディ(6)によって覆われており、前記金属支持体(101)および前記ケーシングボディ(6)は前記ベースボディ(100)を形成しており、
前記ケーシングボディ(6)は、前記複数の端子部(A1,A2)と前記金属支持体(101)とを、部分的に、形状により接合しつつ包囲しており、
前記複数の端子部(A1,A2)は、前記下面(1B)から任意にアクセス可能であり、
前記複数の端子部(A1,A2)は、前記電子モジュール(EBT)の実装状態では見通せず、前記検査位置(4)は、該検査位置が外部の観察者から任意に見通し可能となるように構成されており、これにより、視覚的な監視によって、前記複数の端子部(A1,A2)が接続材料(A)によって充分に濡らされているか否かに関する記述を得ることができ、
前記凹部(5)は、前記ベースボディ(100)の、それぞれ2つの側面(3)によって形成される稜辺(31)における凹部として形成されている
ことを特徴とする電子モジュール(EBT)。 - 前記金属支持体(101)は、前記複数の端子部(A1,A2)及び前記半導体チップ(2)用の実装領域を除いて、前記ケーシングボディ(6)によって包囲されており、
前記ケーシングボディ(6)は、実装領域以外は、前記ベースボディ(100)の前記上面(1A)の所定の面を完全に覆っており、前記実装領域には、不透光性の前記ケーシングボディ(6)の材料が存在しない、
請求項1記載の電子モジュール(EBT)。 - 前記ベースボディ(100)は、複数の稜辺(31)と複数の検査位置(4)とを有しており、
前記稜辺(31)のそれぞれが、第1の領域(4A)及び第2の領域(4B)を有する相応の検査位置(4)を有する、
請求項1または2記載の電子モジュール(EBT)。 - 前記第2の領域(4B)及び前記複数の端子部(A1,A2)は、同じ金属材料によってコーティングされている、
請求項1から3までのいずれか1項記載の電子モジュール(EBT)。 - 前記ケーシングボディ(6)は、前記金属支持体(101)と前記検査位置(4)とを機械的に相互に接続している、
請求項1から4までのいずれか1項記載の電子モジュール(EBT)。 - 前記金属支持体(101)および/または前記検査位置(4)は、前記ケーシングボディ(6)内に少なくとも部分的に埋め込まれている、
請求項1から5までのいずれか1項記載の電子モジュール(EBT)。 - 前記複数の端子部(A1,A2)は、前記下面(1B)で、前記ケーシングボディ(6)に面整合している、
請求項1から6までのいずれか1項記載の電子モジュール(EBT)。 - 前記検査位置(4)は、前記側面(3)の一部であり、該一部は、材料の点で前記側面(3)の残りの部分から区別される、
請求項1から7までのいずれか1項記載の電子モジュール(EBT)。 - 前記検査位置(4)の前記第1の領域(4A)は、金属によって形成されている、
請求項1から8までのいずれか1項記載の電子モジュール(EBT)。 - 前記検査位置(4)の前記第1の領域(4A)は、セラミック材料によって形成されている、
請求項1から8までのいずれか1項記載の電子モジュール(EBT)。 - 前記検査位置(4)の前記第2の領域(4B)の付加的なコーティングは、金属によって形成されている、
請求項1から10までのいずれか1項記載の電子モジュール(EBT)。 - 前記稜辺(31)の前記凹部は円筒状部分として構成されており、これにより、前記凹部(5)は、連続的に湾曲した内壁面と該内壁面に対して垂直に延在する内上面とによって形成されている、
請求項1から11までのいずれか1項記載の電子モジュール(EBT)。 - 請求項1から12までのいずれか1項記載の電子モジュール(EBT)と、
該電子モジュール(EBT)の電気的接続に用いられるコンタクト支持体(110)と
を有しており、
前記コンタクト支持体(110)の上面(120)に少なくとも1つの実装領域(140)が形成されており、
検査位置(4)の第2の領域(4B)が、接続材料(A)の物質による結合によって、前記実装領域(140)に接続されており、
前記検査位置(4)は、前記コンタクト支持体(110)の上面(120)から任意に見通し可能である
ことを特徴とする光電デバイス(130)。 - 前記接続材料(A)は、はんだである、
請求項13記載の光電デバイス(130)。 - 前記接続材料(A)は、接着剤である、
請求項13記載の光電デバイス(130)。 - 前記実装領域(140)は、前記接続材料(A)に接触しており、
前記接続材料(A)は、前記端子部(A1,A2)及び前記検査位置(4)及び前記実装領域(140)の少なくとも一部を濡らしている、
請求項13記載の光電デバイス(130)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009032253.1A DE102009032253B4 (de) | 2009-07-08 | 2009-07-08 | Elektronisches Bauteil |
DE102009032253.1 | 2009-07-08 |
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JP2012518868A Division JP6016630B2 (ja) | 2009-07-08 | 2010-06-22 | 電子モジュールおよび光電デバイス |
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JP2016192574A JP2016192574A (ja) | 2016-11-10 |
JP6324442B2 true JP6324442B2 (ja) | 2018-05-16 |
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JP2012518868A Active JP6016630B2 (ja) | 2009-07-08 | 2010-06-22 | 電子モジュールおよび光電デバイス |
JP2016141494A Active JP6324442B2 (ja) | 2009-07-08 | 2016-07-19 | 電子モジュールおよび光電デバイス |
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JP2012518868A Active JP6016630B2 (ja) | 2009-07-08 | 2010-06-22 | 電子モジュールおよび光電デバイス |
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Country | Link |
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US (2) | US8981238B2 (ja) |
EP (1) | EP2452547B1 (ja) |
JP (2) | JP6016630B2 (ja) |
KR (1) | KR101769632B1 (ja) |
CN (2) | CN105789143B (ja) |
DE (1) | DE102009032253B4 (ja) |
TW (1) | TW201115696A (ja) |
WO (1) | WO2011003732A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE102009032253B4 (de) * | 2009-07-08 | 2022-11-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil |
DE102011056706B4 (de) | 2011-12-20 | 2016-12-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Anordnung und optoelektronisches Halbleiterbauteil |
TWI485387B (zh) * | 2013-07-31 | 2015-05-21 | Genesis Photonics Inc | 發光二極體的檢測裝置 |
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CN105789143A (zh) | 2016-07-20 |
DE102009032253A1 (de) | 2011-01-13 |
DE102009032253B4 (de) | 2022-11-17 |
US9307647B2 (en) | 2016-04-05 |
EP2452547A1 (de) | 2012-05-16 |
WO2011003732A1 (de) | 2011-01-13 |
JP6016630B2 (ja) | 2016-10-26 |
JP2016192574A (ja) | 2016-11-10 |
JP2012532469A (ja) | 2012-12-13 |
US20120111628A1 (en) | 2012-05-10 |
EP2452547B1 (de) | 2018-10-31 |
KR20120046732A (ko) | 2012-05-10 |
CN102484949A (zh) | 2012-05-30 |
US20150144985A1 (en) | 2015-05-28 |
US8981238B2 (en) | 2015-03-17 |
TW201115696A (en) | 2011-05-01 |
CN102484949B (zh) | 2016-05-25 |
KR101769632B1 (ko) | 2017-08-18 |
CN105789143B (zh) | 2018-10-19 |
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