JP2012532469A - 電子モジュール - Google Patents
電子モジュール Download PDFInfo
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- JP2012532469A JP2012532469A JP2012518868A JP2012518868A JP2012532469A JP 2012532469 A JP2012532469 A JP 2012532469A JP 2012518868 A JP2012518868 A JP 2012518868A JP 2012518868 A JP2012518868 A JP 2012518868A JP 2012532469 A JP2012532469 A JP 2012532469A
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- 239000000463 material Substances 0.000 claims abstract description 73
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 25
- 238000000576 coating method Methods 0.000 claims description 25
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229910010293 ceramic material Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- -1 for example Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000965 Duroplast Polymers 0.000 description 1
- 239000004638 Duroplast Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/1605—Shape
- H01L2224/16057—Shape in side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16104—Disposition relative to the bonding area, e.g. bond pad
- H01L2224/16105—Disposition relative to the bonding area, e.g. bond pad the bump connector connecting bonding areas being not aligned with respect to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Light Receiving Elements (AREA)
- Structure Of Telephone Exchanges (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (13)
- 電子素子(2)を有する上面(1A)と、該上面とは反対側の、複数の端子部(A1,A2)を有する下面(1B)と、少なくとも1つの側面(3)とを有するベースボディ(100)を備えた
電子モジュール(EBT)であって、
前記少なくとも1つの側面は第1の領域(4A)および第2の領域(4B)を含む少なくとも1つの制御位置(4)を有しており、
前記第2の領域は前記第1の領域内の凹部(5)として構成されており、
前記第1の領域と前記第2の領域とは異なる材料を含む
ことを特徴とする電子モジュール。 - 前記第2の領域は前記第1の領域よりも接続材料(A)によって強く濡らすことができる、請求項1記載の電子モジュール。
- 前記ベースボディは金属支持体(101)を有する、請求項1または2記載の電子モジュール。
- 前記金属支持体は部分ごとに不透光性のケーシングボディ(6)によって覆われている、請求項3記載の電子モジュール。
- 前記ケーシングボディは前記金属支持体と前記制御位置とを機械的に接続している、請求項4記載の電子モジュール。
- 前記金属支持体および/または前記制御位置は前記ケーシングボディ内に少なくとも部分的に埋め込まれている、請求項4または5記載の電子モジュール。
- 前記複数の端子部および前記制御位置は同じ材料によって形成されている、請求項1から6までのいずれか1項記載の電子モジュール。
- 前記ベースボディの少なくとも1つの側面は位置ごとのダイシングによって形成されている、請求項1から7までのいずれか1項記載の電子モジュール。
- 前記第1の領域は金属によって形成されている、請求項1から8までのいずれか1項記載の電子モジュール。
- 前記第1の領域はセラミック材料によって形成されている、請求項1から8までのいずれか1項記載の電子モジュール。
- 前記第2の領域は金属コーティングを有する、請求項1から10までのいずれか1項記載の電子モジュール。
- 請求項1から11までのいずれか1項記載の電子モジュール(EBT)と、
該電子モジュールの電気的接続に用いられるコンタクト支持体(110)と
を有しており、
前記コンタクト支持体の上面(120)に少なくとも1つの実装領域(140)が形成されており、
該実装領域と制御位置(4)の第2の領域(4B)とが接続材料(A)によって接続されており、
前記制御位置は前記コンタクト支持体の上面から任意に見通し可能である
ことを特徴とする光電デバイス(130)。 - 前記接続材料(A)ははんだである、請求項12記載の光電デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009032253.1 | 2009-07-08 | ||
DE102009032253.1A DE102009032253B4 (de) | 2009-07-08 | 2009-07-08 | Elektronisches Bauteil |
PCT/EP2010/058831 WO2011003732A1 (de) | 2009-07-08 | 2010-06-22 | Elektronisches bauteil |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016141494A Division JP6324442B2 (ja) | 2009-07-08 | 2016-07-19 | 電子モジュールおよび光電デバイス |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2012532469A true JP2012532469A (ja) | 2012-12-13 |
JP2012532469A5 JP2012532469A5 (ja) | 2016-09-01 |
JP6016630B2 JP6016630B2 (ja) | 2016-10-26 |
Family
ID=42937488
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012518868A Active JP6016630B2 (ja) | 2009-07-08 | 2010-06-22 | 電子モジュールおよび光電デバイス |
JP2016141494A Active JP6324442B2 (ja) | 2009-07-08 | 2016-07-19 | 電子モジュールおよび光電デバイス |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016141494A Active JP6324442B2 (ja) | 2009-07-08 | 2016-07-19 | 電子モジュールおよび光電デバイス |
Country Status (8)
Country | Link |
---|---|
US (2) | US8981238B2 (ja) |
EP (1) | EP2452547B1 (ja) |
JP (2) | JP6016630B2 (ja) |
KR (1) | KR101769632B1 (ja) |
CN (2) | CN105789143B (ja) |
DE (1) | DE102009032253B4 (ja) |
TW (1) | TW201115696A (ja) |
WO (1) | WO2011003732A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009032253B4 (de) * | 2009-07-08 | 2022-11-17 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektronisches Bauteil |
DE102011056706B4 (de) * | 2011-12-20 | 2016-12-15 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Anordnung und optoelektronisches Halbleiterbauteil |
TWI485387B (zh) * | 2013-07-31 | 2015-05-21 | Genesis Photonics Inc | 發光二極體的檢測裝置 |
DE102014119390A1 (de) * | 2014-12-22 | 2016-06-23 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
WO2016188566A1 (en) * | 2015-05-26 | 2016-12-01 | Osram Opto Semiconductors Gmbh | Optoelectronic package device and method for producing the same |
DE102017126268A1 (de) * | 2017-11-09 | 2019-05-09 | Osram Opto Semiconductors Gmbh | Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers |
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Also Published As
Publication number | Publication date |
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CN105789143B (zh) | 2018-10-19 |
CN102484949A (zh) | 2012-05-30 |
EP2452547B1 (de) | 2018-10-31 |
CN102484949B (zh) | 2016-05-25 |
WO2011003732A1 (de) | 2011-01-13 |
EP2452547A1 (de) | 2012-05-16 |
US20120111628A1 (en) | 2012-05-10 |
US20150144985A1 (en) | 2015-05-28 |
JP6016630B2 (ja) | 2016-10-26 |
JP2016192574A (ja) | 2016-11-10 |
JP6324442B2 (ja) | 2018-05-16 |
CN105789143A (zh) | 2016-07-20 |
DE102009032253B4 (de) | 2022-11-17 |
US8981238B2 (en) | 2015-03-17 |
TW201115696A (en) | 2011-05-01 |
KR101769632B1 (ko) | 2017-08-18 |
US9307647B2 (en) | 2016-04-05 |
KR20120046732A (ko) | 2012-05-10 |
DE102009032253A1 (de) | 2011-01-13 |
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