DE102009032253B4 - Elektronisches Bauteil - Google Patents

Elektronisches Bauteil Download PDF

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Publication number
DE102009032253B4
DE102009032253B4 DE102009032253.1A DE102009032253A DE102009032253B4 DE 102009032253 B4 DE102009032253 B4 DE 102009032253B4 DE 102009032253 A DE102009032253 A DE 102009032253A DE 102009032253 B4 DE102009032253 B4 DE 102009032253B4
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DE
Germany
Prior art keywords
area
electronic component
base body
carrier
control point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102009032253.1A
Other languages
German (de)
English (en)
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DE102009032253A1 (de
Inventor
Dr. Zitzlsperger Michael
Stefan Grötsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102009032253.1A priority Critical patent/DE102009032253B4/de
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to PCT/EP2010/058831 priority patent/WO2011003732A1/de
Priority to CN201610294382.2A priority patent/CN105789143B/zh
Priority to JP2012518868A priority patent/JP6016630B2/ja
Priority to CN201080039982.5A priority patent/CN102484949B/zh
Priority to EP10730744.9A priority patent/EP2452547B1/de
Priority to US13/382,698 priority patent/US8981238B2/en
Priority to KR1020127003193A priority patent/KR101769632B1/ko
Priority to TW099121168A priority patent/TW201115696A/zh
Publication of DE102009032253A1 publication Critical patent/DE102009032253A1/de
Priority to US14/607,993 priority patent/US9307647B2/en
Priority to JP2016141494A priority patent/JP6324442B2/ja
Application granted granted Critical
Publication of DE102009032253B4 publication Critical patent/DE102009032253B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Structure Of Telephone Exchanges (AREA)
DE102009032253.1A 2009-07-08 2009-07-08 Elektronisches Bauteil Active DE102009032253B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE102009032253.1A DE102009032253B4 (de) 2009-07-08 2009-07-08 Elektronisches Bauteil
KR1020127003193A KR101769632B1 (ko) 2009-07-08 2010-06-22 전자 소자
JP2012518868A JP6016630B2 (ja) 2009-07-08 2010-06-22 電子モジュールおよび光電デバイス
CN201080039982.5A CN102484949B (zh) 2009-07-08 2010-06-22 电子组件
EP10730744.9A EP2452547B1 (de) 2009-07-08 2010-06-22 Elektronisches bauteil
US13/382,698 US8981238B2 (en) 2009-07-08 2010-06-22 Electronic device
PCT/EP2010/058831 WO2011003732A1 (de) 2009-07-08 2010-06-22 Elektronisches bauteil
CN201610294382.2A CN105789143B (zh) 2009-07-08 2010-06-22 电子组件
TW099121168A TW201115696A (en) 2009-07-08 2010-06-29 Electronic device
US14/607,993 US9307647B2 (en) 2009-07-08 2015-01-28 Electronic device
JP2016141494A JP6324442B2 (ja) 2009-07-08 2016-07-19 電子モジュールおよび光電デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009032253.1A DE102009032253B4 (de) 2009-07-08 2009-07-08 Elektronisches Bauteil

Publications (2)

Publication Number Publication Date
DE102009032253A1 DE102009032253A1 (de) 2011-01-13
DE102009032253B4 true DE102009032253B4 (de) 2022-11-17

Family

ID=42937488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009032253.1A Active DE102009032253B4 (de) 2009-07-08 2009-07-08 Elektronisches Bauteil

Country Status (8)

Country Link
US (2) US8981238B2 (https=)
EP (1) EP2452547B1 (https=)
JP (2) JP6016630B2 (https=)
KR (1) KR101769632B1 (https=)
CN (2) CN102484949B (https=)
DE (1) DE102009032253B4 (https=)
TW (1) TW201115696A (https=)
WO (1) WO2011003732A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil
DE102011056706B4 (de) 2011-12-20 2016-12-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen, Anordnung und optoelektronisches Halbleiterbauteil
TWI485387B (zh) * 2013-07-31 2015-05-21 Genesis Photonics Inc 發光二極體的檢測裝置
DE102014119390A1 (de) * 2014-12-22 2016-06-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016188566A1 (en) * 2015-05-26 2016-12-01 Osram Opto Semiconductors Gmbh Optoelectronic package device and method for producing the same
DE102017126268A1 (de) 2017-11-09 2019-05-09 Osram Opto Semiconductors Gmbh Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers
DE102023104437A1 (de) * 2023-02-23 2024-08-29 Ams-Osram International Gmbh Elektronisches Bauelement und Verfahren zum Montieren eines elektronischen Bauelements
DE102023127271A1 (de) * 2023-10-06 2025-04-10 Ams-Osram International Gmbh Halbleiterbauelement und verfahren zum herstellen eines halbleiterbauelements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035483A (en) 1989-05-31 1991-07-30 Siemens Aktiengesellschaft Surface-mountable opto-component
US5914536A (en) 1995-07-07 1999-06-22 Kabushiki Kaisha Toshiba Semiconductor device and soldering portion inspecting method therefor
US20020110951A1 (en) 2001-02-09 2002-08-15 Bily Wang Mass production technique for surface mount optical device with a focusing cup
US20060043566A1 (en) 2004-08-25 2006-03-02 Mitsubishi Denki Kabushiki Kaisha Electronic component package
JP2007110060A (ja) 2005-09-15 2007-04-26 Nichia Chem Ind Ltd 発光装置
DE102006003931B3 (de) 2006-01-26 2007-08-02 Infineon Technologies Ag Halbleiterbauteil mit oberflächenmontierbaren Außenkontakten und Verfahren zur Herstellung desselben
WO2010026716A1 (ja) 2008-09-03 2010-03-11 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

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DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
US6429464B1 (en) * 2001-02-16 2002-08-06 Para Light Electronics Co., Ltd. Light emitting diode
JP4959071B2 (ja) * 2001-07-04 2012-06-20 ローム株式会社 面実装型半導体装置
JP2003068921A (ja) * 2001-08-22 2003-03-07 Toyo Commun Equip Co Ltd 表面実装型電子部品
JP3999969B2 (ja) * 2001-12-28 2007-10-31 日本電波工業株式会社 表面実装発振器用とした容器本体の製造方法及びこれによる水晶発振器
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JP4363859B2 (ja) * 2003-01-31 2009-11-11 東京電波株式会社 水晶発振器の製造方法
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DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
JP2007201324A (ja) * 2006-01-30 2007-08-09 Denso Corp 電子装置の実装構造および電子部品の実装方法
US8044418B2 (en) 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
JP5259978B2 (ja) 2006-10-04 2013-08-07 ローム株式会社 半導体装置の製造方法
KR20080051236A (ko) 2006-12-05 2008-06-11 삼성전자주식회사 엘이디 패키지 및 그 엘이디 패키지를 포함하는 광원유닛및 백라이트 유닛
JP5122172B2 (ja) 2007-03-30 2013-01-16 ローム株式会社 半導体発光装置
DE102009032253B4 (de) * 2009-07-08 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektronisches Bauteil

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035483A (en) 1989-05-31 1991-07-30 Siemens Aktiengesellschaft Surface-mountable opto-component
US5914536A (en) 1995-07-07 1999-06-22 Kabushiki Kaisha Toshiba Semiconductor device and soldering portion inspecting method therefor
US20020110951A1 (en) 2001-02-09 2002-08-15 Bily Wang Mass production technique for surface mount optical device with a focusing cup
US20060043566A1 (en) 2004-08-25 2006-03-02 Mitsubishi Denki Kabushiki Kaisha Electronic component package
JP2007110060A (ja) 2005-09-15 2007-04-26 Nichia Chem Ind Ltd 発光装置
DE102006003931B3 (de) 2006-01-26 2007-08-02 Infineon Technologies Ag Halbleiterbauteil mit oberflächenmontierbaren Außenkontakten und Verfahren zur Herstellung desselben
WO2010026716A1 (ja) 2008-09-03 2010-03-11 日亜化学工業株式会社 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

Also Published As

Publication number Publication date
TW201115696A (en) 2011-05-01
WO2011003732A1 (de) 2011-01-13
US8981238B2 (en) 2015-03-17
JP2012532469A (ja) 2012-12-13
DE102009032253A1 (de) 2011-01-13
US9307647B2 (en) 2016-04-05
JP6324442B2 (ja) 2018-05-16
CN105789143A (zh) 2016-07-20
CN102484949A (zh) 2012-05-30
KR20120046732A (ko) 2012-05-10
JP6016630B2 (ja) 2016-10-26
KR101769632B1 (ko) 2017-08-18
CN102484949B (zh) 2016-05-25
EP2452547A1 (de) 2012-05-16
US20150144985A1 (en) 2015-05-28
EP2452547B1 (de) 2018-10-31
JP2016192574A (ja) 2016-11-10
CN105789143B (zh) 2018-10-19
US20120111628A1 (en) 2012-05-10

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