CN1591853A - 无引线型半导体封装及其制作工艺 - Google Patents
无引线型半导体封装及其制作工艺 Download PDFInfo
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- CN1591853A CN1591853A CNA2004100749717A CN200410074971A CN1591853A CN 1591853 A CN1591853 A CN 1591853A CN A2004100749717 A CNA2004100749717 A CN A2004100749717A CN 200410074971 A CN200410074971 A CN 200410074971A CN 1591853 A CN1591853 A CN 1591853A
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Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003308571A JP3789443B2 (ja) | 2003-09-01 | 2003-09-01 | 樹脂封止型半導体装置 |
JP308571/2003 | 2003-09-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1591853A true CN1591853A (zh) | 2005-03-09 |
CN100355066C CN100355066C (zh) | 2007-12-12 |
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-
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CN101308831B (zh) * | 2007-05-17 | 2010-06-09 | 南茂科技股份有限公司 | 用于无引线封装的引线框及其封装结构 |
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CN102347304A (zh) * | 2010-07-29 | 2012-02-08 | Nxp股份有限公司 | 具有改进的可安装性的无引线芯片载体 |
US9418919B2 (en) | 2010-07-29 | 2016-08-16 | Nxp B.V. | Leadless chip carrier having improved mountability |
CN109747106A (zh) * | 2017-11-07 | 2019-05-14 | 华新科技股份有限公司 | 电子元件封装装置及其封装方法 |
CN113424311A (zh) * | 2019-02-15 | 2021-09-21 | 罗姆股份有限公司 | 半导体器件和半导体器件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7655506B2 (en) | 2010-02-02 |
US7166919B2 (en) | 2007-01-23 |
CN100355066C (zh) | 2007-12-12 |
US20050017335A1 (en) | 2005-01-27 |
JP3789443B2 (ja) | 2006-06-21 |
US20070105281A1 (en) | 2007-05-10 |
JP2005079372A (ja) | 2005-03-24 |
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