CN105531297A - 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置 - Google Patents

环氧树脂混合物、环氧树脂组合物、固化物和半导体装置 Download PDF

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Publication number
CN105531297A
CN105531297A CN201480049986.XA CN201480049986A CN105531297A CN 105531297 A CN105531297 A CN 105531297A CN 201480049986 A CN201480049986 A CN 201480049986A CN 105531297 A CN105531297 A CN 105531297A
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CN
China
Prior art keywords
epoxy resin
resin composition
composition
compound
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480049986.XA
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English (en)
Chinese (zh)
Inventor
中西政隆
长谷川笃彦
木村昌照
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of CN105531297A publication Critical patent/CN105531297A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
CN201480049986.XA 2013-09-10 2014-09-09 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置 Pending CN105531297A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2013-186859 2013-09-10
JP2013186859 2013-09-10
JP2014-143791 2014-07-14
JP2014143791 2014-07-14
PCT/JP2014/073807 WO2015037584A1 (ja) 2013-09-10 2014-09-09 エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置

Publications (1)

Publication Number Publication Date
CN105531297A true CN105531297A (zh) 2016-04-27

Family

ID=52665687

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480049986.XA Pending CN105531297A (zh) 2013-09-10 2014-09-09 环氧树脂混合物、环氧树脂组合物、固化物和半导体装置

Country Status (5)

Country Link
JP (1) JP6366590B2 (ko)
KR (1) KR20160053907A (ko)
CN (1) CN105531297A (ko)
TW (1) TWI638850B (ko)
WO (1) WO2015037584A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109715619A (zh) * 2016-09-26 2019-05-03 沙特基础工业全球技术有限公司 均质无定形高热环氧共混复合材料组合物、其制品及用途
CN112831270A (zh) * 2021-02-02 2021-05-25 上海创林新材料技术有限公司 一种耐高温高湿高压、耐酸碱高附着力滚喷涂料

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170033886A (ko) 2014-07-22 2017-03-27 사빅 글로벌 테크놀러지스 비.브이. 고온 모노머 및 이들의 용도의 방법
JP6556735B2 (ja) * 2014-08-26 2019-08-07 日本化薬株式会社 反応性ポリエステル化合物、それを用いた活性エネルギー線硬化型樹脂組成物
JP6428147B2 (ja) * 2014-10-22 2018-11-28 味の素株式会社 樹脂組成物
EP3272782B1 (en) * 2015-03-18 2023-03-22 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board
JP2017071706A (ja) * 2015-10-08 2017-04-13 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
US20200181391A1 (en) * 2016-09-26 2020-06-11 Sabic Global Technologies B.V. High heat and high toughness epoxy compositions, articles, and uses thereof
JP6831008B2 (ja) * 2016-09-26 2021-02-17 サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ 均一非晶質の高熱エポキシブレンド、物品、及びその使用
CN109790278A (zh) * 2016-09-26 2019-05-21 沙特基础工业全球技术有限公司 高热复合材料组合物、制品及其用途
KR102040296B1 (ko) * 2016-12-19 2019-11-04 삼성에스디아이 주식회사 필름형 반도체 밀봉 부재, 이를 이용하여 제조된 반도체 패키지 및 그 제조 방법
JP2020026439A (ja) * 2016-12-22 2020-02-20 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物および硬化物
CN110582528A (zh) * 2017-04-28 2019-12-17 日立化成株式会社 密封用膜和密封结构体、以及它们的制造方法
US10487077B1 (en) 2018-06-14 2019-11-26 Sabic Global Technologies B.V. Bis(benzoxazinyl)phthalimidine and associated curable composition and composite
WO2020175038A1 (ja) * 2019-02-28 2020-09-03 日本ゼオン株式会社 樹脂組成物、樹脂膜、及び、電子部品
JP7439817B2 (ja) 2019-02-28 2024-02-28 日本ゼオン株式会社 樹脂組成物、電子部品、及び、樹脂膜の製造方法
KR102696450B1 (ko) * 2019-12-05 2024-08-16 주식회사 두산 반도체 패키지용 언더필 필름 및 이를 이용하는 반도체 패키지의 제조방법
CN116583943A (zh) * 2020-12-03 2023-08-11 Dic株式会社 环氧树脂、固化性组合物、固化物、半导体密封材料、半导体装置、预浸料、电路基板、及积层薄膜
JP2024010251A (ja) * 2020-12-03 2024-01-24 Dic株式会社 エポキシ樹脂、硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、回路基板、及び、ビルドアップフィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1158606A (en) * 1966-03-10 1969-07-16 Ciba Ltd New Polyglycidylethers, their preparation and their use
WO2011142466A1 (ja) * 2010-05-14 2011-11-17 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01108218A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JPH01108217A (ja) * 1987-10-21 1989-04-25 Mitsui Petrochem Ind Ltd エポキシ樹脂の精製方法
JP2004099744A (ja) * 2002-09-10 2004-04-02 Mitsui Chemicals Inc エポキシ樹脂の精製方法
JP5273762B2 (ja) * 2007-01-26 2013-08-28 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1158606A (en) * 1966-03-10 1969-07-16 Ciba Ltd New Polyglycidylethers, their preparation and their use
WO2011142466A1 (ja) * 2010-05-14 2011-11-17 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109715619A (zh) * 2016-09-26 2019-05-03 沙特基础工业全球技术有限公司 均质无定形高热环氧共混复合材料组合物、其制品及用途
CN112831270A (zh) * 2021-02-02 2021-05-25 上海创林新材料技术有限公司 一种耐高温高湿高压、耐酸碱高附着力滚喷涂料

Also Published As

Publication number Publication date
JP6366590B2 (ja) 2018-08-01
TWI638850B (zh) 2018-10-21
KR20160053907A (ko) 2016-05-13
WO2015037584A1 (ja) 2015-03-19
JPWO2015037584A1 (ja) 2017-03-02
TW201522486A (zh) 2015-06-16

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Application publication date: 20160427

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