CN105514165B - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

Info

Publication number
CN105514165B
CN105514165B CN201510658801.1A CN201510658801A CN105514165B CN 105514165 B CN105514165 B CN 105514165B CN 201510658801 A CN201510658801 A CN 201510658801A CN 105514165 B CN105514165 B CN 105514165B
Authority
CN
China
Prior art keywords
fin
finfet
substrate
semiconductor device
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510658801.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN105514165A (zh
Inventor
郑恩爱
崔正达
中西俊郎
金有彬
南甲镇
李同规
焦广泛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CN105514165A publication Critical patent/CN105514165A/zh
Application granted granted Critical
Publication of CN105514165B publication Critical patent/CN105514165B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H01L29/7855Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET with at least two independent gates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/0886Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate including transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823431MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/84Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
    • H01L21/845Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1203Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
    • H01L27/1211Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • H01L29/0688Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions characterised by the particular shape of a junction between semiconductor regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66484Unipolar field-effect transistors with an insulated gate, i.e. MISFET with multiple gate, at least one gate being an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66787Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
    • H01L29/66795Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H01L29/7853Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET the body having a non-rectangular crossection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/785Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
    • H01L29/7856Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET with an non-uniform gate, e.g. varying doping structure, shape or composition on different sides of the fin, or different gate insulator thickness or composition on opposing fin sides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/823412MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
CN201510658801.1A 2014-10-13 2015-10-12 半导体器件及其制造方法 Active CN105514165B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140137857A KR102245133B1 (ko) 2014-10-13 2014-10-13 이종 게이트 구조의 finFET를 구비한 반도체 소자 및 그 제조방법
KR10-2014-0137857 2014-10-13

Publications (2)

Publication Number Publication Date
CN105514165A CN105514165A (zh) 2016-04-20
CN105514165B true CN105514165B (zh) 2020-06-16

Family

ID=55655987

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510658801.1A Active CN105514165B (zh) 2014-10-13 2015-10-12 半导体器件及其制造方法

Country Status (4)

Country Link
US (1) US9564435B2 (ko)
KR (1) KR102245133B1 (ko)
CN (1) CN105514165B (ko)
TW (1) TWI673873B (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017044117A1 (en) 2015-09-11 2017-03-16 Intel Corporation Aluminum indium phosphide subfin germanium channel transistors
US9786563B2 (en) 2015-11-23 2017-10-10 International Business Machines Corporation Fin pitch scaling for high voltage devices and low voltage devices on the same wafer
US9570356B1 (en) * 2015-12-07 2017-02-14 International Business Machines Corporation Multiple gate length vertical field-effect-transistors
US9741581B2 (en) * 2016-01-11 2017-08-22 Globalfoundries Inc. Using tensile mask to minimize buckling in substrate
US9905645B2 (en) * 2016-05-24 2018-02-27 Samsung Electronics Co., Ltd. Vertical field effect transistor having an elongated channel
JP6652451B2 (ja) * 2016-06-14 2020-02-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2017218014A1 (en) * 2016-06-17 2017-12-21 Intel Corporation Field effect transistors with gate electrode self-aligned to semiconductor fin
US10424515B2 (en) * 2016-06-30 2019-09-24 International Business Machines Corporation Vertical FET devices with multiple channel lengths
CN106020170B (zh) * 2016-07-07 2019-03-15 工业和信息化部电子第五研究所 SoC健康监测的方法、装置及系统
KR102568718B1 (ko) 2016-11-09 2023-08-21 삼성전자주식회사 반도체 장치
KR102483546B1 (ko) 2016-11-28 2023-01-02 삼성전자주식회사 수직 채널을 가지는 반도체 소자
EP3340308B1 (en) 2016-12-22 2022-09-07 IMEC vzw Method for forming transistors on a substrate
US10163900B2 (en) * 2017-02-08 2018-12-25 Globalfoundries Inc. Integration of vertical field-effect transistors and saddle fin-type field effect transistors
WO2018182733A1 (en) * 2017-03-31 2018-10-04 Intel Corporation Resistor between gates on self-aligned gate edge architecture
KR102330087B1 (ko) * 2017-04-03 2021-11-22 삼성전자주식회사 반도체 장치 및 이의 제조 방법
CN108735809B (zh) * 2017-04-13 2021-08-17 中芯国际集成电路制造(北京)有限公司 一种半导体器件及其制造方法和电子装置
US10297602B2 (en) * 2017-05-18 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Implantations for forming source/drain regions of different transistors
CN109309005B (zh) * 2017-07-27 2022-03-22 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
KR102303300B1 (ko) * 2017-08-04 2021-09-16 삼성전자주식회사 반도체 장치
KR102350485B1 (ko) 2017-08-18 2022-01-14 삼성전자주식회사 반도체 소자
DE102017125352B4 (de) * 2017-08-30 2020-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Verfahren zur Bildung von FinFETs
US10541319B2 (en) 2017-08-30 2020-01-21 Taiwan Semiconductor Manufacturing Co., Ltd. Fin structures having varied fin heights for semiconductor device
US10276720B2 (en) * 2017-08-31 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming fin field effect transistor (FINFET) device structure
KR102608959B1 (ko) 2017-09-04 2023-12-01 삼성전자주식회사 2차원 물질을 포함하는 소자
KR102449898B1 (ko) * 2018-04-10 2022-09-30 삼성전자주식회사 집적회로 소자
KR102553778B1 (ko) * 2018-05-23 2023-07-10 삼성전자주식회사 반도체 소자
US10714604B2 (en) * 2018-06-25 2020-07-14 Intel Corporation Quantum dot devices with multiple dielectrics around fins
US11031291B2 (en) 2018-11-28 2021-06-08 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method of forming the same
DE102019117775B4 (de) * 2018-11-28 2024-04-25 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleiterstruktur und verfahren zu deren herstellung
US11424165B2 (en) 2019-10-16 2022-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of manufacturing semiconductor devices having different gate dielectric thickness within one transistor
US11437491B2 (en) * 2019-10-31 2022-09-06 Taiwan Semiconductor Manufacturing Company, Ltd. Non-conformal capping layer and method forming same
US11348957B2 (en) * 2019-12-27 2022-05-31 Omnivision Technologies, Inc. Transistor having increased effective channel width
CN113725220A (zh) * 2021-08-26 2021-11-30 长江存储科技有限责任公司 三维存储器及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103839810A (zh) * 2012-11-21 2014-06-04 中芯国际集成电路制造(上海)有限公司 鳍式场效应晶体管芯片及其制造方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706571B1 (en) 2002-10-22 2004-03-16 Advanced Micro Devices, Inc. Method for forming multiple structures in a semiconductor device
US6909147B2 (en) 2003-05-05 2005-06-21 International Business Machines Corporation Multi-height FinFETS
JP2005021748A (ja) 2003-06-30 2005-01-27 Ohbayashi Corp 揮発性有機化合物の拡散防止壁及びその構築方法並びに揮発性有機化合物の浄化方法
US7224029B2 (en) 2004-01-28 2007-05-29 International Business Machines Corporation Method and structure to create multiple device widths in FinFET technology in both bulk and SOI
KR100634372B1 (ko) * 2004-06-04 2006-10-16 삼성전자주식회사 반도체 소자들 및 그 형성 방법들
US6949768B1 (en) 2004-10-18 2005-09-27 International Business Machines Corporation Planar substrate devices integrated with finfets and method of manufacture
KR20070006441A (ko) 2005-07-08 2007-01-11 삼성전자주식회사 혼성 cmosfet 및 그 제조방법
JP2007149942A (ja) 2005-11-28 2007-06-14 Nec Electronics Corp 半導体装置およびその製造方法
US7723805B2 (en) 2006-01-10 2010-05-25 Freescale Semiconductor, Inc. Electronic device including a fin-type transistor structure and a process for forming the electronic device
JP4490927B2 (ja) * 2006-01-24 2010-06-30 株式会社東芝 半導体装置
WO2007093930A1 (en) 2006-02-13 2007-08-23 Nxp B.V. Double-gate semiconductor devices having gates with different work functions and methods of manufacture thereof
US7582516B2 (en) 2006-06-06 2009-09-01 International Business Machines Corporation CMOS devices with hybrid channel orientations, and methods for fabricating the same using faceted epitaxy
US20080157225A1 (en) * 2006-12-29 2008-07-03 Suman Datta SRAM and logic transistors with variable height multi-gate transistor architecture
JP4459257B2 (ja) 2007-06-27 2010-04-28 株式会社東芝 半導体装置
US8263462B2 (en) 2008-12-31 2012-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. Dielectric punch-through stoppers for forming FinFETs having dual fin heights
US9484462B2 (en) 2009-09-24 2016-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Fin structure of fin field effect transistor
US9087725B2 (en) 2009-12-03 2015-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. FinFETs with different fin height and EPI height setting
US8373238B2 (en) 2009-12-03 2013-02-12 Taiwan Semiconductor Manufacturing Company, Ltd. FinFETs with multiple Fin heights
US8937353B2 (en) 2010-03-01 2015-01-20 Taiwan Semiconductor Manufacturing Co., Ltd. Dual epitaxial process for a finFET device
US9287385B2 (en) 2011-09-01 2016-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Multi-fin device and method of making same
US8946829B2 (en) 2011-10-14 2015-02-03 Taiwan Semiconductor Manufacturing Company, Ltd. Selective fin-shaping process using plasma doping and etching for 3-dimensional transistor applications
CN104025293B (zh) 2011-10-18 2018-06-08 英特尔公司 利用非平面拓扑的反熔丝元件
US8963257B2 (en) 2011-11-10 2015-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Fin field effect transistors and methods for fabricating the same
JP2013162076A (ja) 2012-02-08 2013-08-19 Toshiba Corp 半導体装置およびその製造方法
KR101823105B1 (ko) 2012-03-19 2018-01-30 삼성전자주식회사 전계 효과 트랜지스터의 형성 방법
US20140103451A1 (en) 2012-10-17 2014-04-17 International Business Machines Corporation Finfet circuits with various fin heights
US8722494B1 (en) 2012-11-01 2014-05-13 International Business Machines Corporation Dual gate finFET devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103839810A (zh) * 2012-11-21 2014-06-04 中芯国际集成电路制造(上海)有限公司 鳍式场效应晶体管芯片及其制造方法

Also Published As

Publication number Publication date
KR102245133B1 (ko) 2021-04-28
KR20160043455A (ko) 2016-04-21
TW201618302A (zh) 2016-05-16
US9564435B2 (en) 2017-02-07
TWI673873B (zh) 2019-10-01
US20160104705A1 (en) 2016-04-14
CN105514165A (zh) 2016-04-20

Similar Documents

Publication Publication Date Title
CN105514165B (zh) 半导体器件及其制造方法
US10784357B2 (en) Fabrication of vertical field effect transistor structure with controlled gate length
CN107968119B (zh) 半导体器件
US9972717B2 (en) Semiconductor device and method of fabricating the same
TWI573222B (zh) 半導體裝置及其製造方法
US9514990B2 (en) Methods for manufacturing semiconductor devices having different threshold voltages
US9601492B1 (en) FinFET devices and methods of forming the same
TWI728413B (zh) 半導體裝置與半導體結構之形成方法、以及半導體裝置
CN105047698B (zh) 半导体器件
CN107527910A (zh) 集成电路器件及其制造方法
KR102349990B1 (ko) 반도체 장치 제조 방법
US20150132908A1 (en) Method for fabricating semiconductor device
TW201436228A (zh) 場效電晶體
TW201445710A (zh) 半導體裝置及其製造方法
KR20150130087A (ko) 반도체 장치 및 그 제조 방법
US10930668B2 (en) Semiconductor device
US9947592B2 (en) FinFET devices and methods of forming the same
US9023704B2 (en) Method for fabricating a semiconductor device
US20230093897A1 (en) Integrated circuit semiconductor element having heterogeneous gate structures and method of fabricating integrated circuit semiconductor element
US10388570B2 (en) Substrate with a fin region comprising a stepped height structure
KR20230135440A (ko) finFET과 플래너 FET을 구비한 반도체 소자
US20170317214A1 (en) Semiconductor device
KR20160144287A (ko) 반도체 장치 및 이의 제조 방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant