CN105153954B - 倒装芯片型半导体背面用膜及其用途 - Google Patents

倒装芯片型半导体背面用膜及其用途 Download PDF

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Publication number
CN105153954B
CN105153954B CN201510557774.9A CN201510557774A CN105153954B CN 105153954 B CN105153954 B CN 105153954B CN 201510557774 A CN201510557774 A CN 201510557774A CN 105153954 B CN105153954 B CN 105153954B
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China
Prior art keywords
film
back surface
semiconductor
semiconductor back
resin
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Expired - Fee Related
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CN201510557774.9A
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English (en)
Chinese (zh)
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CN105153954A (zh
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高本尚英
志贺豪士
浅井文辉
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Nitto Denko Corp
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Nitto Denko Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/144—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations comprising foils
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01271—Cleaning, e.g. oxide removal or de-smearing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07211—Treating the bond pad before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201510557774.9A 2010-07-29 2011-07-28 倒装芯片型半导体背面用膜及其用途 Expired - Fee Related CN105153954B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-170807 2010-07-29
JP2010170807A JP5419226B2 (ja) 2010-07-29 2010-07-29 フリップチップ型半導体裏面用フィルム及びその用途
CN201110217073.2A CN102382587B (zh) 2010-07-29 2011-07-28 倒装芯片型半导体背面用膜及其用途

Related Parent Applications (1)

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CN201110217073.2A Division CN102382587B (zh) 2010-07-29 2011-07-28 倒装芯片型半导体背面用膜及其用途

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CN105153954A CN105153954A (zh) 2015-12-16
CN105153954B true CN105153954B (zh) 2018-12-21

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CN201510557774.9A Expired - Fee Related CN105153954B (zh) 2010-07-29 2011-07-28 倒装芯片型半导体背面用膜及其用途
CN201110217073.2A Expired - Fee Related CN102382587B (zh) 2010-07-29 2011-07-28 倒装芯片型半导体背面用膜及其用途

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Country Link
US (2) US20120028416A1 (https=)
JP (1) JP5419226B2 (https=)
KR (2) KR20120024386A (https=)
CN (2) CN105153954B (https=)
TW (1) TWI465543B (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5419226B2 (ja) 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
WO2013031500A1 (ja) * 2011-08-30 2013-03-07 日東電工株式会社 導電性粘着テープ
EP2636712A1 (en) * 2012-03-07 2013-09-11 Nitto Denko Corporation Pressure-sensitive adhesive tape for resin encapsulation and method for producing resin encapsulation type semiconductor device
SG11201509734YA (en) * 2013-05-29 2015-12-30 Mitsui Chemicals Tohcello Inc Semiconductor wafer protective film and method of manufacturing semiconductor device
KR102270480B1 (ko) * 2014-02-28 2021-06-29 닛토덴코 가부시키가이샤 도전성 점착 테이프 및 도전성 점착 테이프가 부착된 표시 장치
WO2015186814A1 (ja) 2014-06-05 2015-12-10 宇部興産株式会社 電極の製造方法
JP6379389B2 (ja) * 2014-12-15 2018-08-29 リンテック株式会社 ダイシングダイボンディングシート
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
JP6265954B2 (ja) 2015-09-16 2018-01-24 古河電気工業株式会社 半導体裏面用フィルム
WO2017057009A1 (ja) * 2015-09-29 2017-04-06 太陽インキ製造株式会社 保護膜形成用フィルム
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
CN105336581A (zh) * 2015-11-04 2016-02-17 株洲南车时代电气股份有限公司 功率半导体器件制作方法及装置
JP6660156B2 (ja) * 2015-11-13 2020-03-04 日東電工株式会社 積層体および合同体・半導体装置の製造方法
US20190057936A1 (en) * 2015-12-18 2019-02-21 Intel Corporation Transmissive composite film for application to the backside of a microelectronic device
MY192250A (en) * 2015-12-25 2022-08-11 Furukawa Electric Co Ltd Tape for semiconductor processing
MY184346A (en) * 2015-12-25 2021-04-01 Furukawa Electric Co Ltd Tape for semiconductor processing
CN106997900A (zh) * 2016-01-22 2017-08-01 中芯国际集成电路制造(上海)有限公司 半导体结构、其形成方法及测试方法
MY192601A (en) * 2016-03-31 2022-08-29 Furukawa Electric Co Ltd Tape for electronic device packaging
WO2017168829A1 (ja) * 2016-03-31 2017-10-05 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6422462B2 (ja) * 2016-03-31 2018-11-14 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6429824B2 (ja) 2016-03-31 2018-11-28 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6310492B2 (ja) * 2016-03-31 2018-04-11 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP6339619B2 (ja) 2016-03-31 2018-06-06 古河電気工業株式会社 電子デバイスパッケージ用テープ
TWI772293B (zh) * 2016-04-28 2022-08-01 日商琳得科股份有限公司 附有保護膜的半導體晶片的製造方法以及半導體裝置的製造方法
KR101654510B1 (ko) * 2016-05-06 2016-09-05 주식회사 티에스피글로벌 반도체 칩 패키지 마킹 방법
JP6616738B2 (ja) * 2016-06-09 2019-12-04 積水化学工業株式会社 積層シート及び半導体装置の製造方法
JP2017217882A (ja) * 2016-06-10 2017-12-14 積水化学工業株式会社 積層体、接着層及び金属材付き半導体チップ、及び半導体装置の製造方法
JP6440657B2 (ja) * 2016-07-27 2018-12-19 古河電気工業株式会社 電子デバイス用テープ
US11183416B2 (en) * 2016-10-03 2021-11-23 Lintec Corporation Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
KR102019943B1 (ko) * 2017-04-25 2019-09-11 (주) 씨앤아이테크놀로지 전자 부품 캐리어 시트 및 이를 이용한 박막 형성장치
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
US11795103B2 (en) 2017-10-17 2023-10-24 PGBC Intellectual Holdings, LLC Chemically-strengthened thin glass substrates new paradigms for modified curvature and methods of manufacture
JP7311284B2 (ja) * 2019-03-22 2023-07-19 日東電工株式会社 バックグラインドテープ
CN111725066B (zh) * 2019-03-22 2025-01-24 东莞新科技术研究开发有限公司 一种半导体表面去除氟杂质的方法
WO2022025160A1 (ja) * 2020-07-31 2022-02-03 ボンドテック株式会社 チップ接合システムおよびチップ接合方法
CN113035720B (zh) * 2021-03-01 2024-08-09 宏茂微电子(上海)有限公司 芯片上片方法
JP7635038B2 (ja) * 2021-03-23 2025-02-25 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1671609A (zh) * 2002-07-30 2005-09-21 日立化成工业株式会社 粘接材料带及其连接方法、制造方法、压接方法、粘接材料带卷、粘接装置、粘接剂带盒、使用它们的粘接剂的压接方法及各向异性导电材料带

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566935A (en) * 1984-07-31 1986-01-28 Texas Instruments Incorporated Spatial light modulator and method
US4596992A (en) * 1984-08-31 1986-06-24 Texas Instruments Incorporated Linear spatial light modulator and printer
US4956619A (en) * 1988-02-19 1990-09-11 Texas Instruments Incorporated Spatial light modulator
US5028939A (en) * 1988-08-23 1991-07-02 Texas Instruments Incorporated Spatial light modulator system
JP2681167B2 (ja) * 1988-10-12 1997-11-26 株式会社半導体エネルギー研究所 電子装置作製方法
US5250329A (en) * 1989-04-06 1993-10-05 Microelectronics And Computer Technology Corporation Method of depositing conductive lines on a dielectric
US5073423A (en) * 1990-01-04 1991-12-17 Corning Incorporated Decalcomania
JPH04315452A (ja) * 1991-04-15 1992-11-06 Fuji Electric Co Ltd 半導体装置チップの標識賦与方法
JPH0677283A (ja) 1992-08-26 1994-03-18 Kyocera Corp 配線基板へのｉｃ素子の実装方法
US5496691A (en) * 1994-02-08 1996-03-05 Fuji Photo Film Co., Ltd. Process for producing silver halide photographic material
JP3307207B2 (ja) 1995-12-25 2002-07-24 松下電器産業株式会社 半導体装置およびその製造方法
JPH10256431A (ja) * 1997-03-06 1998-09-25 Sony Corp 半導体装置及びその製造方法
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
US6284122B1 (en) * 1998-06-09 2001-09-04 International Lead Zinc Research Organization, Inc. Production of a zinc-aluminum alloy coating by immersion into molten metal baths
US7038310B1 (en) * 1999-06-09 2006-05-02 Matsushita Electric Industrial Co., Ltd. Power module with improved heat dissipation
JP2001196642A (ja) * 2000-01-11 2001-07-19 Toyoda Gosei Co Ltd 発光装置
JP4351348B2 (ja) * 2000-01-27 2009-10-28 リンテック株式会社 保護層を有するｉｃカードの製造方法
JP3631956B2 (ja) * 2000-05-12 2005-03-23 富士通株式会社 半導体チップの実装方法
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
CN1208742C (zh) * 2000-12-04 2005-06-29 王子油化合成纸株式会社 标识及采用该标识的标签
TW511405B (en) * 2000-12-27 2002-11-21 Matsushita Electric Industrial Co Ltd Device built-in module and manufacturing method thereof
JP3649129B2 (ja) 2001-01-12 2005-05-18 松下電器産業株式会社 半導体装置の製造方法および半導体装置
JP2002313914A (ja) * 2001-04-18 2002-10-25 Sony Corp 配線形成方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
TW508987B (en) * 2001-07-27 2002-11-01 Phoenix Prec Technology Corp Method of forming electroplated solder on organic printed circuit board
CN1264940C (zh) * 2001-08-10 2006-07-19 日东电工株式会社 切割用胶粘薄膜及切割方法
JP2003108008A (ja) * 2001-09-27 2003-04-11 Oji Paper Co Ltd 粘着シート
US6974659B2 (en) * 2002-01-16 2005-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming a solder ball using a thermally stable resinous protective layer
WO2003067656A1 (en) * 2002-02-06 2003-08-14 Ibiden Co., Ltd. Semiconductor chip mounting board, its manufacturing method, and semiconductor module
JP2004231932A (ja) * 2002-12-02 2004-08-19 Nitto Denko Corp 接着剤組成物、接着フィルムおよびこれを用いた半導体装置
JP3892359B2 (ja) 2002-07-25 2007-03-14 松下電器産業株式会社 半導体チップの実装方法
KR101095753B1 (ko) * 2002-08-01 2011-12-21 니치아 카가쿠 고교 가부시키가이샤 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치
JP4199198B2 (ja) * 2003-01-16 2008-12-17 富士通株式会社 多層配線基板およびその製造方法
JP2004364041A (ja) * 2003-06-05 2004-12-24 Fujitsu Media Device Kk 弾性表面波デバイス及びその製造方法
TW200532259A (en) * 2003-12-25 2005-10-01 Nitto Denko Corp Method of manufacturing laminated polarizing plate, laminated polarizing plate obtained by the method, and image display including the same
JP2005340761A (ja) * 2004-04-27 2005-12-08 Seiko Epson Corp 半導体装置の実装方法、回路基板、電気光学装置並びに電子機器
JPWO2005113645A1 (ja) * 2004-05-20 2008-03-27 東レ株式会社 ポリイミド樹脂、積層フィルム、金属層付き積層フィルム、および半導体装置
US7109591B2 (en) * 2004-06-04 2006-09-19 Hack Jonathan A Integrated circuit device
JP4165467B2 (ja) * 2004-07-12 2008-10-15 セイコーエプソン株式会社 ダイシングシート、半導体装置の製造方法
JP4642436B2 (ja) * 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
TWI286454B (en) * 2005-03-09 2007-09-01 Phoenix Prec Technology Corp Electrical connector structure of circuit board and method for fabricating the same
JP4876451B2 (ja) 2005-06-27 2012-02-15 日立化成工業株式会社 接着シート
JP4865312B2 (ja) 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
US7932615B2 (en) * 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
JP4844168B2 (ja) * 2006-02-28 2011-12-28 パナソニック株式会社 部品接合方法および部品積層方法
JP2007235022A (ja) * 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP4850625B2 (ja) * 2006-08-22 2012-01-11 日東電工株式会社 レーザ加工用粘着シート
JP2008166451A (ja) 2006-12-27 2008-07-17 Furukawa Electric Co Ltd:The チップ保護用フィルム
WO2008108131A1 (ja) * 2007-03-01 2008-09-12 Nitto Denko Corporation 熱硬化型ダイボンドフィルム
JP5196838B2 (ja) * 2007-04-17 2013-05-15 リンテック株式会社 接着剤付きチップの製造方法
JP4607153B2 (ja) * 2007-07-12 2011-01-05 株式会社日立製作所 微小電気機械システム素子の製造方法
KR20100065185A (ko) * 2007-10-09 2010-06-15 히다치 가세고교 가부시끼가이샤 접착 필름이 부착된 반도체칩의 제조 방법 및 이 제조 방법에 사용되는 반도체용 접착 필름, 및 반도체 장치의 제조 방법
JP2009237489A (ja) * 2008-03-28 2009-10-15 Sumitomo Chemical Co Ltd 表面保護フィルム付き偏光板の製造方法
JP2009277719A (ja) * 2008-05-12 2009-11-26 Nec Electronics Corp 半導体装置及びその製造方法
KR101485105B1 (ko) * 2008-07-15 2015-01-23 삼성전자주식회사 반도체 패키지
JP2010031183A (ja) 2008-07-30 2010-02-12 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム
JP5556070B2 (ja) 2008-08-20 2014-07-23 日立化成株式会社 ダイシングテープ一体型接着シートを用いた半導体装置の製造方法
US8748751B2 (en) * 2008-11-25 2014-06-10 Sumitomo Bakelite Co., Ltd. Electronic component package and method for producing electronic component package
US7642128B1 (en) * 2008-12-12 2010-01-05 Stats Chippac, Ltd. Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
US9082806B2 (en) * 2008-12-12 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
US9070662B2 (en) * 2009-03-05 2015-06-30 Volterra Semiconductor Corporation Chip-scale packaging with protective heat spreader
US9420707B2 (en) * 2009-12-17 2016-08-16 Intel Corporation Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
JP5501938B2 (ja) * 2009-12-24 2014-05-28 日東電工株式会社 フリップチップ型半導体裏面用フィルム
JP5419226B2 (ja) 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
US20130256269A1 (en) * 2012-03-29 2013-10-03 Apple Inc. Methods and apparatus for modifying surface energy of laminate stack up
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1671609A (zh) * 2002-07-30 2005-09-21 日立化成工业株式会社 粘接材料带及其连接方法、制造方法、压接方法、粘接材料带卷、粘接装置、粘接剂带盒、使用它们的粘接剂的压接方法及各向异性导电材料带

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