CN104993803B - 振动片、振子、振荡器以及电子设备 - Google Patents
振动片、振子、振荡器以及电子设备 Download PDFInfo
- Publication number
- CN104993803B CN104993803B CN201510354535.3A CN201510354535A CN104993803B CN 104993803 B CN104993803 B CN 104993803B CN 201510354535 A CN201510354535 A CN 201510354535A CN 104993803 B CN104993803 B CN 104993803B
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- vibrating
- electrode
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- 235000014676 Phragmites communis Nutrition 0.000 title description 6
- 230000005284 excitation Effects 0.000 claims abstract description 46
- 230000010355 oscillation Effects 0.000 claims description 9
- 239000010453 quartz Substances 0.000 description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 62
- 239000000463 material Substances 0.000 description 18
- 239000013078 crystal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 230000008602 contraction Effects 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 229910000851 Alloy steel Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
- H03H9/215—Crystal tuning forks consisting of quartz
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2011-020414 | 2011-02-02 | ||
| JP2011020414A JP5685962B2 (ja) | 2011-02-02 | 2011-02-02 | 振動片、振動子、発振器及び電子機器 |
| CN201210020835.4A CN102629860B (zh) | 2011-02-02 | 2012-01-30 | 振动片、振子、振荡器以及电子设备 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210020835.4A Division CN102629860B (zh) | 2011-02-02 | 2012-01-30 | 振动片、振子、振荡器以及电子设备 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104993803A CN104993803A (zh) | 2015-10-21 |
| CN104993803B true CN104993803B (zh) | 2018-04-03 |
Family
ID=46576872
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510354535.3A Expired - Fee Related CN104993803B (zh) | 2011-02-02 | 2012-01-30 | 振动片、振子、振荡器以及电子设备 |
| CN201210020835.4A Expired - Fee Related CN102629860B (zh) | 2011-02-02 | 2012-01-30 | 振动片、振子、振荡器以及电子设备 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210020835.4A Expired - Fee Related CN102629860B (zh) | 2011-02-02 | 2012-01-30 | 振动片、振子、振荡器以及电子设备 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8525606B2 (enExample) |
| JP (1) | JP5685962B2 (enExample) |
| CN (2) | CN104993803B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130264913A1 (en) * | 2012-04-10 | 2013-10-10 | Seiko Epson Corporation | Vibrator element, vibration device and electronic apparatus |
| JP2014165573A (ja) * | 2013-02-22 | 2014-09-08 | Seiko Epson Corp | 振動片、振動子、電子デバイス、電子機器、および移動体 |
| JP6676403B2 (ja) * | 2016-02-23 | 2020-04-08 | エスアイアイ・クリスタルテクノロジー株式会社 | 圧電振動片、及び圧電振動子 |
| CN112567629B (zh) * | 2018-09-03 | 2024-10-01 | 株式会社村田制作所 | 谐振子以及具备该谐振子的谐振装置 |
| JP7728190B2 (ja) * | 2022-01-17 | 2025-08-22 | Tdk株式会社 | 振動デバイス |
| CN116094486B (zh) * | 2022-11-21 | 2023-11-21 | 成都泰美克晶体技术有限公司 | 一种音叉晶体振荡片及其制造方法和压电器件 |
| CN120979381A (zh) * | 2023-12-29 | 2025-11-18 | 天津大学 | 一种音叉型压电振动片及振荡器 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196891A (ja) * | 2000-01-07 | 2001-07-19 | Citizen Watch Co Ltd | 振動子 |
| JP2009005022A (ja) * | 2007-06-20 | 2009-01-08 | Seiko Epson Corp | 音叉型振動子、発振器 |
| CN101488731A (zh) * | 2008-01-15 | 2009-07-22 | 爱普生拓优科梦株式会社 | 振动片的制造方法和振子的制造方法 |
| JP2010081156A (ja) * | 2008-09-25 | 2010-04-08 | Seiko Epson Corp | 圧電薄膜振動片、圧電薄膜振動片の製造方法、圧電薄膜振動子及び発振回路 |
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| JP2625511B2 (ja) | 1988-07-21 | 1997-07-02 | 株式会社クボタ | 穀粒選別装置用穀粒分布検出装置 |
| WO2000044092A1 (en) | 1999-01-20 | 2000-07-27 | Seiko Epson Corporation | Vibrator and electronic device with vibrator |
| JP3477618B2 (ja) | 2000-10-31 | 2003-12-10 | 有限会社ピエデック技術研究所 | 屈曲水晶振動子 |
| JP2002261575A (ja) | 2000-12-25 | 2002-09-13 | Seiko Epson Corp | 振動片、振動子、発振器及び電子機器 |
| EP1788702A3 (en) | 2000-12-25 | 2008-01-16 | Seiko Epson Corporation | Vibrating piece, vibrator, oscillator, and electronic equipment |
| JP4298322B2 (ja) | 2003-02-24 | 2009-07-15 | 日本電波工業株式会社 | 音叉型水晶振動子 |
| JP2005151423A (ja) | 2003-11-19 | 2005-06-09 | Seiko Epson Corp | 圧電振動片と圧電デバイスおよびこれらの製造方法、ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器 |
| JP2005318365A (ja) | 2004-04-30 | 2005-11-10 | Seiko Epson Corp | 圧電薄膜共振子、フィルタ及び圧電薄膜共振子の製造方法 |
| JP2005331485A (ja) | 2004-05-21 | 2005-12-02 | Sony Corp | 圧電素子および電気機械変換装置 |
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| JP4301200B2 (ja) * | 2004-10-20 | 2009-07-22 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
| JP4277818B2 (ja) * | 2005-03-22 | 2009-06-10 | セイコーエプソン株式会社 | 圧電振動片および圧電デバイス |
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| JP5050590B2 (ja) | 2007-03-15 | 2012-10-17 | ソニー株式会社 | 角速度センサ及び電子機器 |
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| JP2008224628A (ja) | 2007-03-15 | 2008-09-25 | Sony Corp | 角速度センサ及び電子機器 |
| JP5067034B2 (ja) | 2007-06-20 | 2012-11-07 | セイコーエプソン株式会社 | 音叉型振動子、発振器 |
| JP5067035B2 (ja) | 2007-06-20 | 2012-11-07 | セイコーエプソン株式会社 | 音叉型振動子、発振器 |
| JP5071058B2 (ja) * | 2007-11-07 | 2012-11-14 | セイコーエプソン株式会社 | 圧電振動片 |
| JP4636093B2 (ja) | 2008-02-20 | 2011-02-23 | セイコーエプソン株式会社 | 振動片、振動子、発振器及び振動片の製造方法 |
| JP5316748B2 (ja) | 2008-03-28 | 2013-10-16 | セイコーエプソン株式会社 | 振動片の製造方法 |
| JP5233466B2 (ja) | 2008-07-22 | 2013-07-10 | セイコーエプソン株式会社 | 振動子及び発振器、振動子の製造方法 |
| JP5168002B2 (ja) | 2008-07-22 | 2013-03-21 | セイコーエプソン株式会社 | 振動子及び発振器 |
| JP2010103805A (ja) | 2008-10-24 | 2010-05-06 | Seiko Epson Corp | 屈曲振動片、屈曲振動子、および圧電デバイス |
| US8067880B2 (en) * | 2008-12-27 | 2011-11-29 | Seiko Epson Corporation | Flexural vibration element and electronic component |
| JP2010187059A (ja) | 2009-02-10 | 2010-08-26 | Epson Toyocom Corp | ウォーク型振動片およびその製造方法 |
| JP5347546B2 (ja) | 2009-02-12 | 2013-11-20 | セイコーエプソン株式会社 | 振動片、振動片の製造方法および振動子 |
| JP5369741B2 (ja) | 2009-02-12 | 2013-12-18 | セイコーエプソン株式会社 | 振動片および振動子 |
| JP2010187195A (ja) | 2009-02-12 | 2010-08-26 | Epson Toyocom Corp | 振動片、振動片の製造方法および振動子 |
| JP5381149B2 (ja) * | 2009-02-20 | 2014-01-08 | セイコーエプソン株式会社 | 振動片および振動子 |
| JP2010252302A (ja) | 2009-03-25 | 2010-11-04 | Seiko Epson Corp | 屈曲振動片およびそれを用いた発振器 |
| JP2010226609A (ja) | 2009-03-25 | 2010-10-07 | Seiko Epson Corp | 振動片および振動子 |
| JP2010252303A (ja) | 2009-03-25 | 2010-11-04 | Seiko Epson Corp | 屈曲振動片およびそれを用いた発振器 |
| JP2010226608A (ja) | 2009-03-25 | 2010-10-07 | Seiko Epson Corp | 屈曲振動片およびそれを用いた発振器 |
| JP2011004035A (ja) | 2009-06-17 | 2011-01-06 | Seiko Epson Corp | 屈曲振動片および屈曲振動片の製造方法 |
| JP2011082945A (ja) | 2009-09-08 | 2011-04-21 | Seiko Epson Corp | 屈曲振動片、屈曲振動子、および電子デバイス |
| JP5482541B2 (ja) | 2009-10-01 | 2014-05-07 | セイコーエプソン株式会社 | 振動片、振動子、発振器、及び電子機器 |
| JP5375503B2 (ja) | 2009-10-07 | 2013-12-25 | セイコーエプソン株式会社 | 屈曲振動片 |
| JP2011087154A (ja) | 2009-10-16 | 2011-04-28 | Seiko Epson Corp | 圧電振動片、圧電振動子、発振器、圧電振動片の製造方法 |
| JP2011155629A (ja) | 2009-12-29 | 2011-08-11 | Seiko Epson Corp | 振動片、振動子、発振器、電子機器、および周波数調整方法 |
| JP5581887B2 (ja) | 2009-12-29 | 2014-09-03 | セイコーエプソン株式会社 | 振動片、振動子、発振器、電子機器、および周波数調整方法 |
| JP5482250B2 (ja) | 2010-02-02 | 2014-05-07 | セイコーエプソン株式会社 | 振動体および振動デバイス |
| JP2011191091A (ja) | 2010-03-12 | 2011-09-29 | Seiko Epson Corp | 音叉型振動片、振動子およびセンサー装置 |
| JP2011199454A (ja) | 2010-03-18 | 2011-10-06 | Seiko Epson Corp | 振動体および振動デバイス |
| JP2011199453A (ja) | 2010-03-18 | 2011-10-06 | Seiko Epson Corp | 振動体および振動デバイス |
| JP5531699B2 (ja) | 2010-03-19 | 2014-06-25 | セイコーエプソン株式会社 | 振動デバイス |
| JP2011223371A (ja) | 2010-04-12 | 2011-11-04 | Seiko Epson Corp | 振動片、振動デバイスおよび電子機器 |
| JP5549340B2 (ja) | 2010-04-13 | 2014-07-16 | セイコーエプソン株式会社 | 振動片、振動片の製造方法、振動デバイスおよび電子機器 |
| JP5552878B2 (ja) | 2010-04-14 | 2014-07-16 | セイコーエプソン株式会社 | 振動片、振動デバイスおよび電子機器 |
| JP2011228922A (ja) | 2010-04-20 | 2011-11-10 | Seiko Epson Corp | 振動片、振動片の製造方法、振動子および発振器 |
| JP2011228980A (ja) | 2010-04-21 | 2011-11-10 | Seiko Epson Corp | 振動片、振動子、発振器、および電子機器 |
| JP2011234072A (ja) | 2010-04-27 | 2011-11-17 | Seiko Epson Corp | 圧電振動片および圧電デバイス |
| JP2011232264A (ja) | 2010-04-29 | 2011-11-17 | Seiko Epson Corp | 圧電センサー、圧電センサー素子及び圧電振動片 |
-
2011
- 2011-02-02 JP JP2011020414A patent/JP5685962B2/ja active Active
-
2012
- 2012-01-30 CN CN201510354535.3A patent/CN104993803B/zh not_active Expired - Fee Related
- 2012-01-30 CN CN201210020835.4A patent/CN102629860B/zh not_active Expired - Fee Related
- 2012-02-01 US US13/363,483 patent/US8525606B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001196891A (ja) * | 2000-01-07 | 2001-07-19 | Citizen Watch Co Ltd | 振動子 |
| JP2009005022A (ja) * | 2007-06-20 | 2009-01-08 | Seiko Epson Corp | 音叉型振動子、発振器 |
| CN101488731A (zh) * | 2008-01-15 | 2009-07-22 | 爱普生拓优科梦株式会社 | 振动片的制造方法和振子的制造方法 |
| JP2010081156A (ja) * | 2008-09-25 | 2010-04-08 | Seiko Epson Corp | 圧電薄膜振動片、圧電薄膜振動片の製造方法、圧電薄膜振動子及び発振回路 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5685962B2 (ja) | 2015-03-18 |
| CN104993803A (zh) | 2015-10-21 |
| CN102629860B (zh) | 2015-07-15 |
| JP2012160996A (ja) | 2012-08-23 |
| US20120194285A1 (en) | 2012-08-02 |
| US8525606B2 (en) | 2013-09-03 |
| CN102629860A (zh) | 2012-08-08 |
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