CN104981496B - 固化性组合物及其固化物、光学构件、以及光学装置 - Google Patents

固化性组合物及其固化物、光学构件、以及光学装置 Download PDF

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CN104981496B
CN104981496B CN201480007982.5A CN201480007982A CN104981496B CN 104981496 B CN104981496 B CN 104981496B CN 201480007982 A CN201480007982 A CN 201480007982A CN 104981496 B CN104981496 B CN 104981496B
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compound
solidification compound
solidification
group
ring
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CN104981496A (zh
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藤川武
久保隆司
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Daicel Corp
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Daicel Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Physics & Mathematics (AREA)
  • Optical Filters (AREA)
  • Polarising Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
CN201480007982.5A 2013-02-19 2014-02-10 固化性组合物及其固化物、光学构件、以及光学装置 Active CN104981496B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013029688 2013-02-19
JP2013-029688 2013-02-19
PCT/JP2014/053014 WO2014129343A1 (ja) 2013-02-19 2014-02-10 硬化性組成物及びその硬化物、光学部材、並びに光学装置

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CN104981496A CN104981496A (zh) 2015-10-14
CN104981496B true CN104981496B (zh) 2019-06-14

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JP (2) JP6474719B2 (https=)
KR (1) KR101839196B1 (https=)
CN (1) CN104981496B (https=)
TW (1) TWI652302B (https=)
WO (1) WO2014129343A1 (https=)

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CN104995230B (zh) * 2013-02-19 2019-05-07 株式会社大赛璐 晶片级透镜用固化性组合物、晶片级透镜的制造方法及晶片级透镜、以及光学装置
JP6653990B2 (ja) * 2014-10-27 2020-02-26 三星エスディアイ株式会社ＳＡＭＳＵＮＧ ＳＤＩ Ｃｏ．， ＬＴＤ． 偏光板及びこれを備える画像表示装置
KR20180045863A (ko) * 2015-08-27 2018-05-04 도레이 카부시키가이샤 에폭시 수지 조성물 및 이로부터 제조된 섬유 강화 복합 재료
JP6935260B2 (ja) * 2017-07-31 2021-09-15 東京応化工業株式会社 硬化性組成物、硬化膜、表示パネル又はｏｌｅｄ照明、並びに硬化物の製造方法
KR102293898B1 (ko) 2019-09-16 2021-08-26 주식회사 트리엘 신규한 트리아진 유도체 및 이를 포함하는 열경화성 또는 감광성 조성물
CN110927201B (zh) * 2019-12-11 2020-10-16 北京理工大学 一种基于dic的热膨胀相变测量方法
JP2021167396A (ja) * 2020-04-10 2021-10-21 東京応化工業株式会社 積層体の製造方法、マイクロレンズの製造方法、ｃｍｏｓイメージセンサーの製造方法、及び硬化性組成物
JP2024017249A (ja) * 2022-07-27 2024-02-08 株式会社ダイセル 硬化性組成物、硬化物、光学部材、および光学装置

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JP2004163490A (ja) * 2002-11-11 2004-06-10 Nippon Sheet Glass Co Ltd 光学素子及びその製造方法
JP2004163491A (ja) * 2002-11-11 2004-06-10 Nippon Sheet Glass Co Ltd 光学素子及びその製造方法
JP2004204228A (ja) * 2002-12-13 2004-07-22 Daicel Chem Ind Ltd 硬化性エポキシ樹脂組成物および硬化物
JP4723272B2 (ja) * 2004-04-02 2011-07-13 大阪瓦斯株式会社 光重合性樹脂組成物およびその硬化物
JP5354868B2 (ja) * 2006-07-06 2013-11-27 株式会社ダイセル 脂環式ジエポキシ化合物の製造方法、エポキシ樹脂組成物の製造方法、及び硬化物の製造方法
JP5078289B2 (ja) * 2006-06-23 2012-11-21 株式会社日本触媒 樹脂組成物及びその製造方法
JP5226223B2 (ja) * 2007-01-31 2013-07-03 株式会社ダイセル 透明封止材料及び透明封止物
JP5289713B2 (ja) * 2007-02-01 2013-09-11 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
JP5248790B2 (ja) * 2007-03-02 2013-07-31 株式会社ダイセル 繊維強化複合材料用エポキシ樹脂組成物及び繊維強化複合材料
WO2008143003A1 (ja) * 2007-05-24 2008-11-27 Sumitomo Bakelite Co., Ltd. 透明複合シート
CN101809055B (zh) * 2007-09-27 2013-10-23 株式会社日本触媒 成型体用固化性树脂组合物、成型体及其制造方法
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JPWO2010128568A1 (ja) * 2009-05-07 2012-11-01 旭化成株式会社 硬化性樹脂及び複合材料
JP5229165B2 (ja) 2009-09-02 2013-07-03 住友ベークライト株式会社 エポキシ樹脂組成物、透明複合シートおよび表示素子用基板
JP5486891B2 (ja) * 2009-10-08 2014-05-07 三菱レイヨン株式会社 連鎖硬化性樹脂組成物および繊維強化複合材料
JP2011132416A (ja) * 2009-12-25 2011-07-07 Nagase Chemtex Corp 熱硬化性樹脂組成物及び有機無機複合樹脂
JP5812993B2 (ja) * 2010-08-12 2015-11-17 株式会社ダイセル 低透湿性樹脂組成物及びその硬化物
JP5665445B2 (ja) * 2010-09-13 2015-02-04 キヤノン株式会社 有機無機複合組成物および光学素子
JP2012209453A (ja) * 2011-03-30 2012-10-25 Sumitomo Bakelite Co Ltd 液状樹脂組成物、半導体パッケージ、および半導体パッケージの製造方法
JP2013091710A (ja) * 2011-10-25 2013-05-16 Sumitomo Bakelite Co Ltd 透明樹脂複合体、透明複合シートおよび表示素子用透明基板

Patent Citations (2)

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CN1842557A (zh) * 2003-08-25 2006-10-04 大赛璐化学工业株式会社 热固性环氧树脂组合物和光学透明材料
US20100183870A1 (en) * 2009-01-21 2010-07-22 Panasonic Corporation Resin composition for hybrid optical element, and hybrid optical element

Also Published As

Publication number Publication date
JP2019052315A (ja) 2019-04-04
KR20150118162A (ko) 2015-10-21
CN104981496A (zh) 2015-10-14
TW201439191A (zh) 2014-10-16
KR101839196B1 (ko) 2018-03-15
JP6474719B2 (ja) 2019-02-27
WO2014129343A1 (ja) 2014-08-28
JP6700369B2 (ja) 2020-05-27
TWI652302B (zh) 2019-03-01
JPWO2014129343A1 (ja) 2017-02-02

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