TW201120022A - Novel episulfide compounds, curable resin compositions containing the episulfide compounds, and cured products thereof - Google Patents

Novel episulfide compounds, curable resin compositions containing the episulfide compounds, and cured products thereof Download PDF

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TW201120022A
TW201120022A TW99126511A TW99126511A TW201120022A TW 201120022 A TW201120022 A TW 201120022A TW 99126511 A TW99126511 A TW 99126511A TW 99126511 A TW99126511 A TW 99126511A TW 201120022 A TW201120022 A TW 201120022A
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group
compound
curable resin
doc
resin composition
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TW99126511A
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Chinese (zh)
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TWI466878B (en
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Shunsuke Takahi
Naomi Sato
Hiroyuki Igarashi
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Adeka Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02Polythioethers
    • C08G75/06Polythioethers from cyclic thioethers
    • C08G75/08Polythioethers from cyclic thioethers from thiiranes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D331/00Heterocyclic compounds containing rings of less than five members, having one sulfur atom as the only ring hetero atom
    • C07D331/02Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D409/00Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms
    • C07D409/02Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings
    • C07D409/12Heterocyclic compounds containing two or more hetero rings, at least one ring having sulfur atoms as the only ring hetero atoms containing two hetero rings linked by a chain containing hetero atoms as chain links
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Provided are: compounds which exhibit excellent curability and transparency and are useful particularly for optical use; and curable resin compositions using the compounds. Specifically provided are episulfide compounds represented by general formula (I) or (II). In general formula (I), A1 and A2 are each an oxygen atom or a sulfur atom (with the proviso that A1 and A2 are not both oxygen atoms); Cy is C3-10 cycloalkyl; X and Z are each independently C1-10 alkyl or the like; n is 0 to 10; p is 0 to 5; and r is an integer of 0 to 4. In general formula (II), Y1 and Y2 are each C1-10 alkyl or the like; A1, A2, Z, n and r are each as defined for general formula (I); n is 0 to 10, q is 0 to 4, and q' is 0 to 8 (with the proviso that q' is equal to or below (x+y)2); and x is a number of 0 to 4 and y is a number of 0 to 4, with the sum of x and y being 2 to 4.

Description

201120022 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種新穎環硫化物化合物、含有該環硫化 物化合物與硬化劑及/或能量線敏感性陽離子起始劑之硬 化性樹脂組合物、及其硬化物。 【先前技術】* 先剛,透明且高折射率之硬化物係用於透鏡等之光學材 料。尤其是由於與硬化劑組合之樹脂硬化物之優異之電氣 特性、耐熱性、接著性、光學特性等,而於電子材料、光 學材料之領域中進行活躍之開發。例如,可列舉半導體密 封材’液晶顯示器等之抗反射膜,彩色滤光片之保護膜, 光波導官、照相機等光學設備中所使用之透鏡、鏡面及棱 1中報告有支鏈烧基硫化物型環硫化物化合 物,於專利文獻2中報告有直鍵烧基硫化物型環疏化物化 合物’於專利讀^報告有㈣㈣環硫化物化合物。然 〆等化σ物之耐熱性有問題。又,於專利文獻4中報 口有具有較高耐埶性夕i女 之具有第骨架之環硫化物化合物作為 先學材料。然而,存在斟 仔在對稀釋劑寻之溶解性較差,無法製 作用以獲得顧示ψ古 * ’ 问折射率之硬化物之樹脂組合物的問 7¾ ° * 先前技術文獻 專利文獻 專利文獻1 : 日本專利特開平9-07158〇號公報 I50139.doc 201120022 專利文獻2 :日本專利特開平9_丨丨〇979號公報 專利文獻3 :曰本專利特開平丨丨_丨2273號公報 專利文獻4 :日本專利特開2〇〇1_288177號公報 【發明内容】 . 發明所欲解決之問題 • 本發明之目的在於提供一種硬化性、透明性等優異尤 其是於光學用途中有用之化合物及使用該化合物之硬化性 樹脂組合物。 解決問題之技術手段 本發明者等反覆進行努力研究之結果發現,具有特定結 構之環硫化物化合物之溶解性優異,進而含有該環硫化物 化合物之硬化性樹脂組合物之保存穩定性優異,其硬化物 為高折射率且透明性優異,藉由使用其而解決上述課題。 本發明係基於上述見解而成者,其提供一種新穎環硫化 物化合物,其係以下述通式(I)或(II)所表示: [化1]201120022 VI. Description of the Invention: [Technical Field] The present invention relates to a novel episulfide compound, a curable resin composition containing the episulfide compound and a hardener and/or an energy ray-sensitive cationic initiator And its hardened matter. [Prior Art] * The first, transparent and high refractive index hardened material is used for optical materials such as lenses. In particular, it is actively developed in the fields of electronic materials and optical materials due to excellent electrical properties, heat resistance, adhesion, optical properties, and the like of a cured resin in combination with a curing agent. For example, a semiconductor sealing material, an antireflection film such as a liquid crystal display, a protective film of a color filter, a lens, a mirror surface, and an edge of an optical device such as an optical waveguide, a camera, etc., are reported to have a branched alkyl sulfide. The compound type episulfide compound is reported in Patent Document 2 as a direct bond-based sulfide-type cyclic compound compound. The patent discloses that there are (iv) (iv) episulfide compounds. However, the heat resistance of the yttrium is problematic. Further, in Patent Document 4, there is an episulfide compound having a skeleton having a high resistance to sputum, which is a precursor material. However, there is a problem that the clams are poorly soluble in the thinner, and it is impossible to produce a resin composition for obtaining a cured product of the refractive index of the present invention. [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 9- No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION The object of the present invention is to provide a compound which is excellent in curability, transparency, and the like, particularly useful in optical applications, and a compound which uses the same. A curable resin composition. The inventors of the present invention have found that the epoxy sulfide compound having a specific structure is excellent in solubility, and further, the curable resin composition containing the episulfide compound is excellent in storage stability. The cured product has a high refractive index and is excellent in transparency, and the above problems are solved by using it. The present invention is based on the above findings and provides a novel episulfide compound represented by the following general formula (I) or (II):

(式中’ A1及A2表示氧原子或硫原子(其中,A1及A2之至少 一個表示硫原子),〇表示碳原子數3〜1〇之環烧基,XAZ 分別獨立表示碳原子數卜1〇之烷基、碳原子數6〜20之芳 土炭原子數7〜20之芳基烷基、碳原子數2〜20之雜環基、 原子數3 1〇之裱烷基或鹵素原子,該烷基及芳基烷基中 150139.doc 201120022 -S-或雙鍵中斷, 之亞甲基以及該芳基之鍵結部可由 又,Z可由鄰接之Z彼此形成芳香環;該烷基、芳基、芳基 烧基、雜環基、環縣及由鄰接之2彼此所形成之芳香環 可由齒素原子取代,n表示〇〜1〇之整數,p表示〇〜5之= 數,r表示0〜4之整數;再者,n不為〇時所存在之光學異構 物可為任意異構物) [化2](wherein A1 and A2 represent an oxygen atom or a sulfur atom (wherein at least one of A1 and A2 represents a sulfur atom), 〇 represents a cycloalkyl group having a carbon number of 3 to 1 Å, and XAZ independently represents a number of carbon atoms; An alkyl group of fluorene, an arylalkyl group having 7 to 20 carbon atoms and a carbon atom number of 2 to 20, a heterocyclic group having 2 to 20 carbon atoms, an alkyl group having 3 to 3 atomic groups or a halogen atom, In the alkyl and arylalkyl group 150139.doc 201120022 -S- or a double bond interrupt, the methylene group and the bonding portion of the aryl group may be further, Z may form an aromatic ring with each other adjacent Z; the alkyl group, The aryl group, the arylalkyl group, the heterocyclic group, the ring county, and the aromatic ring formed by the adjacent two are substituted by a fang atom, n represents an integer of 〇~1〇, and p represents a 〇~5=number, r An integer representing from 0 to 4; in addition, the optical isomer present when n is not ruthenium may be any isomer) [Chemical 2]

(式令,A1及A2表示氧原子或硫原子(其中,…及八2之至少 -個表示硫原子)’ γ丨、丫2及2分別獨立表示碳原子數H〇 之烷基、碳原子數6〜20之芳基、碳原子數7〜2〇之芳基烷 基、碳原子數2〜20之雜環基、碳原子數3〜1〇之環烷基或鹵 素原子,該烷基及芳基烷基中之亞甲基以及該芳基之鍵結 部可由-0-、-S·或雙鍵中斷,鄰接之…可相互鍵結而形成 %,s亥烷基、芳基、芳基烷基、雜環基及環烷基可由鹵素 原子取代,η表示〇〜10之整數,q表示〇〜4之整數,纩表示 0〜8之整數(其中’ q,為(χ+γ)χ2以下),r表示〇〜4之整數,X 表示0〜4之整數,y表示〇〜4之整數,乂與丫之合計為2〜4;再 者’ π不為0時所存在之光學異構物可為任意異構物)。 又,本發明提供一種硬化性樹脂組合物,其含有上述通 式(I)或(II)所示之新穎環硫化物化合物與硬化劑。 150139.doc 201120022 又’本發明提供一種硬化性樹脂組合物’其含有上述通 式⑴或(II)所示之新穎環硫化物化合物與能量線敏感性陽 離子起始劑。 又,本發明提供一種硬化物’其係對上述硬化性樹脂組 合物進行加熱及/或照射能量線而獲得者。 發明之效果 本發明之環硫化物化合物之溶解性優異,進而含有該環 瓜化物化合物之硬化性樹脂組合物之硬化性、保存穩定性 優異,可提供高折射率且透明性優異之硬化物。 【實施方式】 以下,基於較佳實施形態,對本發明之環硫化物化合 物、硬化性樹脂組合物及其硬化物詳細地進行說明。 本發明之環硫化物化合物為上述通式⑴或(ιι)所示之新 筹員化合物。 首先,對上述通式⑴所示之環硫化物化合物加以說明。 作為上述通式⑴中之cy ' X及z所示之碳原子數3〜10之 %烧基’例如可列舉環丙基、環丁基、環戊基、環己基、 甲基環己基、環庚基、環辛基、環壬基、環癸基等。 乍為上述通式⑴中之乂及2所示之碳原子數1〜10之烷 基,例如可列舉甲基、乙基、丙基、丁基、戊基、己基、 庚土辛基、壬基、癸基等,作為該烧基中之亞曱基由 -0-中斷之基,可列舉甲氧基、乙氧基、丙氧基、異丙氧 基、甲氧基曱基、乙氧基甲&、2-甲氧基乙基等,作為該 烷基中之亞曱基由-s-中斷之基’可列舉甲硫基、乙硫 150139.doc 201120022 基、丁硫基、戊硫基等’作為該烷基中之亞甲基由雙鍵中 斷之基’可列舉烯丙基、3 -丁稀基等。 作為上述通式(I)中之X及Z所示之碳原子數6〜2〇之芳 基,例如可列舉苯基、萘基、2_萘基、丨_蒽基、丨_菲 基、鄰甲苯基、間甲苯基、對甲苯基、3_荞基、9_苐基、 1-四氫萘基、2-四氫萘基、丨_二氫苊基、卜茚滿基、2_茚 滿基、聯苯基等,作為該芳基之鍵結部由中斷之基, 可列舉苯氧基、1-萘氧基、2·萘氧基、卜蒽氧基、】,菲氧 基、鄰甲苯氧基、間曱苯氧基、對甲苯氧基、9_苐氧基、 1- 茚滿氧基、2-茚滿氧基等,作為該芳基之鍵結部由_s_中 斷之基’可列舉苯硫基、! _萘硫基、2_萘硫基、i _蒽硫 基、1-菲硫基、鄰甲苯硫基、間甲苯硫基、對甲苯硫基、 9-第硫基、1-四氫萘硫基' 2_四氫萘硫基、卜節滿硫基、 2- 節滿硫基等’作為該芳基之鍵結部由雙鍵中斷之基,可 列舉苯乙烯基等。 作為上述通式⑴中之又及2所示之碳原子數7〜2〇之芳^ 烷基’例如可列舉节基、苯乙基、2_苯基丙基 '二苯基, 基、三苯基甲基等’作為該芳基烷基中之亞甲基由-cm 斷之基,可列舉节氧基、苯氧基甲基、苯氧基乙基'Η 基甲氧基2-萘基曱氧基、卜蒽基曱氧基等,作為該芳連 烧基中之亞甲基由中斷之基,可列舉节硫基、苯硫! 甲基、苯硫基乙基等,作為該芳基燒基中之亞甲基由雙命 中斷之基,可列舉苯烯丙基等。 作為上述通式⑴中之MZ所示之碳原子數2〜2〇之雜拜 150139.doc 201120022 基,例如可列舉吡咯基、吡啶基、嘧啶基、噠畊基、哌畊 基、哌啶基、吡喃基、吡唑基、三畊基、吡咯啶基、喹啉 基、異喹啉基、咪唑基、苯并咪唑基、三唑基、呋喃基 (furyl) '呋喃基(furanyl)、苯并呋喃基、噻吩*(thienyl)、 噻吩基(thiophenyl)、苯并噻吩基、噻二唑基、噻唑基、笨 并噻唑基、崎唑基、苯并噚唑基、異噻唑基、異嘮唑基、 吲哚基、吹咯啶基、咪啉基、硫代咪啉基、2_吡咯啶酮·卜 基、2-哌啶酮_ι·基、2,4-二氧代咪唑啶_3_基、2,4_二氧代 喝唑啶-3-基等。 作為上述通式(I)中之鄰接之Z彼此所形成之芳香環,可 列舉苯環、萘環、蒽環、菲環、芘環等。 作為上述通式⑴中之X及Z所示之鹵素原子、以及可取 代上述通式(I)中之X及Z所示之烷基、芳基、芳基烷基、 雜%基、環烷基及鄰接之z彼此所形成之芳香環的函素原 子’可列舉氟、氣、溴、碘。 上述通式(I)中之X及z所示之烷基、芳基、芳基烷基、 雜環基、環烷基及Z彼此所形成之芳香環可具有取代基, 例如可列舉曱基、乙基、丙基、異丙基、環丙基、丁基、 第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊 基環戊基、己基、2-己基、3 -己基、環己基、聯環己 基、1-曱基環己基、庚基、2_庚基、3-庚基、異庚基、第 三庚基、正辛基、異辛基、第三辛基、2-乙基己基、壬 基、異壬基、癸基等烷基;甲氧基、乙氧基、丙氧基、異 丙氧基、丁氧基、第二丁氧基、第三丁氧基、異丁氧基、 150139.doc -9- 201120022 戊氧基、異戊氧基、第三戊氧基、己氧基、環己氧基'庚 氧基、異庚氧基、第三庚氧基、正辛氡基、異辛氧基、第 三辛氧基、2-乙基己氧基、壬氧基、癸氧基等烷氧基;曱 硫基、乙硫基、丙硫基、異丙硫基、丁硫基、第二丁石宁 基、第二丁硫基、異丁硫基、戊硫基、異戊硫基、第三戊 硫基、己硫基、環己硫基、庚硫基、異庚硫基、第三庚硫 基、正辛硫基、異辛硫基、第三辛硫基、2_乙基己硫基等 烷硫基;乙烯基、1-曱基乙烯基、2-甲基乙烯基、2_丙烯 基、1-甲基-3-丙烯基、3-丁浠基、卜曱基·3_ 丁烯基、異丁 稀基、3-戊烯基、4-己烯基、環己烯基、二環己烯基、庚 烯基、辛烯基、癸烯基、十五烯基、二十烯基、二十三稀 基等烯基;苄基、苯乙基、二苯基甲基、三苯基甲基、笨 乙稀基、苯稀丙基等芳基院基;苯基、萘基等芳基;苯氧 基、萘氧基等芳氧基;苯硫基、萘硫基等芳硫基;乙醯 基、2-氣乙醯基、丙酿基、辛醯基、丙稀醯基、曱基丙稀 酿基、苯基幾基(苯曱醯基)、鄰苯二曱醯基、4-三氣曱基 苯曱醯基、三曱基乙醯基、鄰羥苯曱醯基、草醯基、十八 醯基、甲氧基羰基、乙氧基羰基、第三丁氧基羰基、正十 八烷氧基羰基、胺曱醯基等醯基;乙醯氧基、苯甲醯氧基 等醯氧基;胺基、乙基胺基、二甲基胺基、二乙基胺基、 丁基胺基、環戊基胺基、2-乙基己基胺基、十二烷基胺 基、苯胺基、氣苯基胺基、曱苯胺基、甲氧苯胺基、Ν-曱 基-苯胺基、二苯基胺基、萘基胺基、2-»比啶基胺基、甲氧 基羰基胺基、苯氧基羰基胺基、乙醯基胺基、苯甲醯基胺 150139.doc -10- 201120022 基、曱醯胺基'三曱基乙醯胺基、月桂醯胺基、胺曱醯胺 基、N,N-二甲基胺基羰基胺基、N,N-二乙胺基羰基胺基、 咮啉代羰基胺基、甲氧基羰基胺基、乙氧基羰基胺基、第 三丁氧基羰基胺基、正十八烷氧基羰基胺基、N-曱基-甲 氧基羰基胺基、苯氧基羰基胺基、胺磺醯胺基、N,N-二甲 基胺基磺醯胺基、甲基磺醯胺基、丁基磺醯胺基、苯基磺 醯胺基等經取代之胺基;磺醯胺基、磺醯基、羧基、氰 基、磺基、羥基、硝基、酼基、醯亞胺基、胺曱醯基、磺 酿胺基等’該等基可進而經取代。再者,於以具有碳原子 之取代基進行取代之情形時,使含有該取代基之上述通式 (I)中之X及Z所示之烷基、芳基、芳基烧基、雜環基、環 己基及鄰接之Z彼此所形成之芳香環的碳原子數滿足規定 之碳原子數之範圍。 於上述通式(I)所示之環硫化物化合物及後述之上述通式 (II)所不之環硫化物化合物中,n不為〇時有存在光學異構 物之情形,可為任意異構物,以下之本文中所示之化合物 並不限於特定之光學異構物。 作為上述通式⑴所示之環硫化物化合物,例如可列舉下 述化合物N。.卜版13所示之化合物。再者,下述化學式 中,n表示0〜10之數。然而,本發明並不受以下化合物任 何限制。 150139.doc 201120022 [化3] 化合物No.l(Formula, A1 and A2 represent an oxygen atom or a sulfur atom (wherein, and at least one of 八 and 2 represent a sulfur atom)' γ丨, 丫2 and 2 each independently represent an alkyl group having a carbon number H〇, a carbon atom An aryl group having 6 to 20 aryl groups, an arylalkyl group having 7 to 2 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, a cycloalkyl group having 3 to 1 ring of carbon atoms or a halogen atom; And the methylene group in the arylalkyl group and the bonding moiety of the aryl group may be interrupted by -0-, -S. or a double bond, and adjacent to each other may be bonded to each other to form a %, s-alkyl group, an aryl group, The arylalkyl group, the heterocyclic group and the cycloalkyl group may be substituted by a halogen atom, η represents an integer of 〇10, q represents an integer of 〇~4, and 纩 represents an integer of 0-8 (where 'q is (χ+γ) ) χ 2 or less), r represents an integer of 〇~4, X represents an integer of 0 to 4, y represents an integer of 〇~4, and the total of 乂 and 丫 is 2 to 4; and the case where 'π is not 0 The optical isomer can be any isomer). Further, the present invention provides a curable resin composition comprising the novel episulfide compound represented by the above formula (I) or (II) and a curing agent. Further, the present invention provides a curable resin composition which contains the novel episulfide compound represented by the above formula (1) or (II) and an energy ray-sensitive cation initiator. Further, the present invention provides a cured product which is obtained by heating and/or irradiating an energy ray to the curable resin composition. Advantageous Effects of Invention The epoxy sulfide compound of the present invention is excellent in solubility, and further, the curable resin composition containing the cyclic cucurbitide compound is excellent in curability and storage stability, and can provide a cured product having a high refractive index and excellent transparency. [Embodiment] Hereinafter, the episulfide compound, the curable resin composition and the cured product of the present invention will be described in detail based on preferred embodiments. The episulfide compound of the present invention is a novel compound represented by the above formula (1) or (ι). First, the episulfide compound represented by the above formula (1) will be described. Examples of the alkyl group having 3 to 10 carbon atoms represented by cy 'X and z in the above formula (1) include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a methylcyclohexyl group, and a ring. Heptyl, cyclooctyl, cyclodecyl, cyclodecyl and the like. The oxime is an alkyl group having 1 to 10 carbon atoms represented by the above formula (1) and 2, and examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptylene group, and a fluorene group. The base, the thiol group, etc., as the group of the fluorene group in the alkyl group, which is interrupted by -0, may, for example, be a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a methoxy group or an ethoxy group. The base group &, 2-methoxyethyl group, etc., as the base group of the alkylene group in the alkyl group interrupted by -s- can be exemplified by methylthio group, ethyl sulfide 150139.doc 201120022 group, butylthio group, pentane The thio group or the like 'as a group in which the methylene group in the alkyl group is interrupted by a double bond' may, for example, be an allyl group, a 3-butenyl group or the like. Examples of the aryl group having 6 to 2 carbon atoms represented by X and Z in the above formula (I) include a phenyl group, a naphthyl group, a 2-naphthyl group, a fluorenyl group, and a fluorenyl group. O-tolyl, m-tolyl, p-tolyl, 3 fluorenyl, 9-fluorenyl, 1-tetrahydronaphthyl, 2-tetrahydronaphthyl, anthracene-dihydroindenyl, diterpene, 2_ In the case of an indane group, a biphenyl group, etc., as a group in which the bonding moiety of the aryl group is interrupted, a phenoxy group, a 1-naphthyloxy group, a 2-naphthyloxy group, a diterpeneoxy group, or a phenoxy group is mentioned. , o-tolyloxy, m-nonyloxy, p-tolyloxy, 9-decyloxy, 1-indenyloxy, 2-indolyloxy, etc., as the bonding moiety of the aryl group by _s_ The base of the interruption is exemplified by phenylthio group! _Naphthylthio, 2_naphthylthio, i 蒽 thio, 1-phenanthyl, o-tolylthio, m-tolylthio, p-tolylthio, 9-thiol, 1-tetrahydronaphthalene The base '2-tetrahydronaphthylthio group, phenanthrenylthio group, 2-membered thio group, etc.' is a group in which the bonding moiety of the aryl group is interrupted by a double bond, and examples thereof include a styryl group and the like. Examples of the arylalkyl group having 7 to 2 carbon atoms represented by the above formula (1) and 2 are exemplified by a benzyl group, a phenethyl group, a 2-phenylpropyl 'diphenyl group, a triphenyl group. The methyl group or the like 'as a methylene group in the arylalkyl group is a group of -cm, and an oxy group, a phenoxymethyl group, a phenoxyethyl 'mercaptomethoxy 2-naphthyl anthracene The oxy group, the decyl fluorenyl group, etc., as a group in which the methylene group in the aryl group is interrupted, a sulfhydryl group and a benzene sulfide are mentioned! A methyl group, a phenylthioethyl group or the like is used as a group in which the methylene group in the aryl group is interrupted by a double life, and examples thereof include a phenallyl group. As a group of a carbon atom having a carbon number of 2 to 2 Å represented by MZ in the above formula (1), for example, a pyrrolyl group, a pyridyl group, a pyrimidinyl group, a ruthenium group, a piperylene group, or a piperidinyl group can be mentioned. , pyranyl, pyrazolyl, tri-nurgical, pyrrolidinyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl 'furanyl, Benzofuranyl, thienyl, thiophenyl, benzothienyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, iso Carbazolyl, fluorenyl, pyrrolidinyl, morpholinyl, thiomorpholinyl, 2-pyrrolidone, phenyl, 2-piperidone, 2,4-dioxoimidazole Acridine-3-yl, 2,4-dioxosoxazol-3-yl, and the like. The aromatic ring formed by the adjacent Z in the above formula (I) may, for example, be a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring or an anthracene ring. a halogen atom represented by X and Z in the above formula (1), and an alkyl group, an aryl group, an arylalkyl group, a hetero-alkyl group, a cycloalkane which may be substituted for X and Z in the above formula (I). Fluorine, gas, bromine, and iodine can be cited as the elemental atom of the aromatic ring formed by the base and the adjacent z. The aromatic ring formed by the alkyl group, the aryl group, the arylalkyl group, the heterocyclic group, the cycloalkyl group and the Z represented by the above X and z in the above formula (I) may have a substituent, and examples thereof include a mercapto group. , ethyl, propyl, isopropyl, cyclopropyl, butyl, second butyl, tert-butyl, isobutyl, pentyl, isopentyl, tert-amylcyclopentyl, hexyl, 2 -hexyl, 3-hexyl, cyclohexyl, bicyclohexyl, 1-decylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, isoheptyl, third heptyl, n-octyl, isooctyl , an alkyl group such as a third octyl group, a 2-ethylhexyl group, a decyl group, an isodecyl group or a fluorenyl group; a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, a second butoxy group Base, tert-butoxy, isobutoxy, 150139.doc -9- 201120022 pentyloxy, isopentyloxy, third pentyloxy, hexyloxy, cyclohexyloxy-heptyloxy, iso-heptane Alkoxy groups such as oxy, third heptyloxy, n-octyl decyl, isooctyloxy, trioctyloxy, 2-ethylhexyloxy, nonyloxy, decyloxy; thiol and ethylthio , propylthio, isopropylthio, butylthio, second butadiene, second Sulfur, isobutylthio, pentylthio, isopentylthio, third pentylthio, hexylthio, cyclohexylthio, heptylthio, isoheptylthio, third heptylthio, n-octyl sulfide Alkylthio such as isooctylthio, isooctylthio, 2-ethylhexylthio; vinyl, 1-mercaptovinyl, 2-methylvinyl, 2-propenyl, 1-methyl 3-ylpropenyl, 3-butenyl, indolyl 3-butenyl, isobutyl, 3-pentenyl, 4-hexenyl, cyclohexenyl, dicyclohexenyl, heptene Alkenyl group such as benzyl, octenyl, nonenyl, pentadecyl, eicosyl, and trisyl; benzyl, phenethyl, diphenylmethyl, triphenylmethyl, stupid An aryl group such as a dilute group or a phenylpropyl group; an aryl group such as a phenyl group or a naphthyl group; an aryloxy group such as a phenoxy group or a naphthyloxy group; an arylthio group such as a phenylthio group or a naphthylthio group; 2-oxetyl, propyl, octyl, acrylonitrile, mercaptopropyl, phenyl (phenyl phenyl), phthalic acid, 4-trimethyl decyl benzene Mercapto, trimethyl ethane, o-hydroxyphenyl fluorenyl, oxalyl, octadecyl, methoxycarbonyl, ethoxy a fluorenyl group such as a carbonyl group, a tert-butoxycarbonyl group, an n-octadecyloxycarbonyl group or an amine fluorenyl group; a decyloxy group such as an ethoxycarbonyl group or a benzhydryloxy group; an amine group, an ethylamino group and a dimethyl group; Amino, diethylamino, butylamino, cyclopentylamino, 2-ethylhexylamino, dodecylamino, anilino, phenylphenylamino, anthranilyl, A Oxanilide, anthracene-fluorenyl-anilino, diphenylamino, naphthylamino, 2-»-pyridylamino, methoxycarbonylamino, phenoxycarbonylamino, acetylamine Base, benzamidine amine 150139.doc -10- 201120022 base, guanylamino 'trimethyl ethinylamine, laurylamine, amine guanamine, N,N-dimethylaminocarbonyl Amine, N,N-diethylaminocarbonylamino, porphyrincarbonylamino, methoxycarbonylamino, ethoxycarbonylamino, tert-butoxycarbonylamino, n-octadecyloxy Alkylcarbonylamino, N-fluorenyl-methoxycarbonylamino, phenoxycarbonylamino, aminesulfonylamino, N,N-dimethylaminosulfonylamino, methylsulfonamide a substituted amine such as butylsulfonylamino, phenylsulfonylamino a group; a sulfonylamino group, a sulfonyl group, a carboxyl group, a cyano group, a sulfo group, a hydroxyl group, a nitro group, a decyl group, a quinone imine group, an amine sulfhydryl group, a sulfonylamino group, etc. . Further, in the case of substituting with a substituent having a carbon atom, an alkyl group, an aryl group, an aryl group, a heterocyclic ring represented by X and Z in the above formula (I) containing the substituent are used. The number of carbon atoms of the aromatic ring formed by the group, the cyclohexyl group and the adjacent Z satisfy the predetermined number of carbon atoms. In the case of the episulfide compound represented by the above formula (I) and the episulfide compound of the above formula (II), when n is not a quinone, an optical isomer may be present, which may be any difference. The structure, the compounds shown herein below are not limited to specific optical isomers. The episulfide compound represented by the above formula (1) is exemplified by the following compound N. The compound shown in Table 13. Further, in the following chemical formula, n represents a number of 0 to 10. However, the present invention is not limited by the following compounds. 150139.doc 201120022 [Chemical 3] Compound No.l

化合物No.2Compound No. 2

化合物No.3Compound No.3

化合物No.4Compound No. 4

化合物No.5Compound No. 5

150139.doc -12- 201120022 [化4] 化合物No.6150139.doc -12- 201120022 [Chemical 4] Compound No. 6

化合物No. 8Compound No. 8

化合物No.9Compound No. 9

150139.doc -13- 201120022 [化5] 化合物Ν〇.1()150139.doc -13- 201120022 [Chemical 5] Compound Ν〇.1()

化合物N〇<l2Compound N〇<l2

化合物Κίο l3Compound Κίο l3

上述通式⑴ 不之環硫化物化合物中,上述通式⑴中 為石反原子數之炫基或碳原子數6〜說芳基、以 為〇〜2、η為〇〜5之化合物之保存穩定性良好,故較佳,) 150139.doc -】4· 201120022 其疋下述i)〜iii)之化合物因原料容易獲得且生產性良好 故更佳。 〇下述通式(ΠΙ)所示之化合物。 [化6]In the above-mentioned cyclic sulfide compound of the above formula (1), in the above formula (1), the compound having a reverse atomic number of a stone or a carbon number of 6 to an aryl group is considered to be stable in storage of a compound of 〇2 and η of 〇5. Since it is good, it is preferable.) 150139.doc -]4·201120022 The compound of the following i) to iii) is more preferable because the raw material is easily obtained and the productivity is good. 〇 A compound represented by the following formula (ΠΙ). [Chemical 6]

(式中,A1、A2、Ζ、與上述通式⑴相同。再者’ η不 為〇時所存在之光學異構物可為任意異構物) ϋ)上述通式⑴中X為碳原子數6〜20之芳基、{)為〇或1、η為 0〜2之化合物。 iii)上述通式(III)中η為〇〜2之化合物。 上述通式(I)所示之環硫化物化合物之製造方法並無特別 限定,例如,藉由如下述反應式所示,使環氧衍生物〇)與 硫脲反應,可容易地製造上述通式⑴所示之環硫化物化合 物。 [化7](In the formula, A1, A2, Ζ are the same as the above formula (1). Further, the optical isomer present when 'n is not ruthenium may be any isomer) ϋ) X in the above formula (1) is a carbon atom The aryl group of 6 to 20, the compound of {) is hydrazine or 1, and η is 0 to 2. Iii) The compound of the above formula (III) wherein η is 〇~2. The method for producing the episulfide compound represented by the above formula (I) is not particularly limited. For example, by reacting the epoxy derivative oxime with thiourea as shown in the following reaction formula, the above-mentioned pass can be easily produced. An episulfide compound represented by the formula (1). [Chemistry 7]

150139.doc -15- 201120022 又,藉由增減反應中所使用之硫脲之量或反應時間,可 任意地控制作為原料之環氧衍生物中之環氧乙烷環中之氧 原子取代為硫原子的比例(硫取代率),視目的亦可於殘留 作為一部分原料之環氧衍生物、或產物中殘留未經取代之 環氧乙烷環之狀態下用作本發明之環硫化物化合物。硫取 代率越高,硬化物之折射率越高,因此較好的是 50%〜1〇〇%’進而較好的是8〇%〜1〇〇0/〇。 其次’對上述通式(^彡所示之環硫化物化合物加以說 明。再者,以下之說明中,關於未特別說明之部分,可適 當使用上述通式(I)所示之環硫化物化合物中之說明之内 容。 作為上述通式(11)中之γ1、.丫2及2所示之碳原子數卜1〇之 ’元土 及”亥烧基中之亞曱基由-0-、-S -或雙鍵中斷之基, 可列舉上述通式(I)之說明中例示之基。 作為上述通式(Π)中之ΥΙ、"及2所示之碳原子數6〜2〇之 芳基、及該芳基之鍵結部由_〇·、_S_或雙鍵中斷之基可 列舉上述通式(I)之說明中例示之基。 作為上述通式(11)中之Υ1、γ2及Z所示之碳原子數7〜2〇之 芳基院基、及該芳基烷基中之亞曱基由-〇-、_S_或雙鍵中 斷之基’可列舉上述通式(1)之說明中例示之基。 作為上述通式(Π)中之Y丨、Y2及Z所示之碳原子數2〜2〇之 雜環基’可列舉上述通式⑴之說明中例示之基。 作為上述通式(II)中之、Y2及Z所示之碳原子數3〜1〇之 環烧基,可列舉上述通式(I)之說明中例示之基。 150139.doc -16- 201120022 作為上述通式(II)中之鄰接之γΙ鍵結所形成 構,除作為上述通式⑴中之芳香環而例示者以外,亦^ 舉核戍貌環、mu環、環㈣環κ環、味琳環、内 醋環、内醯胺環等5〜7員環,第環、危環、節滿環、举滿 環等縮合環。 作為上述通式(11)中之Υ»、丫心所示之函素原子、以及 可取代上述通式(II)中之Y1、丫2及2所示之烷基、芳基、芳 基烷基、雜環基、環烷基及鄰接之γι鍵結所形成之ς狀結 構的鹵素原子,可列舉上述通式⑴之說明中例示之基。 上述通式(II)中之Υ1、Υ2及ζ所示之烷基、芳基、芳基烷 基、雜環基、環烷基及鄰接之Υ!鍵結所形成之環狀結構可 具有取代基,作為該等取代基,可列舉上述通式⑴之說明 中例示之基,該等基可進而經取代。再者,於利用具有碳 原子之取代基進行取代之情形時,使含有該取代基之上述 通式(Π)中之γΐ、Υ2及Ζ所示之烷基、芳基、芳基烷基、雜 環基、環烧基 '及鄰接之Ζ彼此所形成之環狀結構的碳原 子數滿足規定之碳原子數之範圍。 作為上述通式(II)所示之環硫化物化合物,例如可列舉 下述化合物No. 14〜Νο_62所示之化合物。再者,不述化學 式中,η表示0〜10之數。然而,本發明不受以下化合物任 何限制。 150139.doc 17- 201120022 [化8] 化合物No.14150139.doc -15- 201120022 Further, by increasing or decreasing the amount of thiourea used in the reaction or the reaction time, the substitution of the oxygen atom in the oxirane ring in the epoxy derivative as a raw material can be arbitrarily controlled. The ratio of the sulfur atom (sulfur substitution ratio) may be used as the episulfide compound of the present invention in the state of remaining an epoxy derivative as a part of the raw material or an unsubstituted oxirane ring in the product, depending on the purpose. . The higher the sulfur substitution rate, the higher the refractive index of the cured product, so it is preferably 50% to 1%% and further preferably 8% to 1%. Next, the episulfide compound represented by the above formula (I) will be described. In the following description, the episulfide compound represented by the above formula (I) can be suitably used in the portion which is not particularly described. In the above formula (11), the number of carbon atoms represented by γ1, .2, and 2 in the above formula (11) and the fluorene group in the 'primary earth' and the halogen group are -0-, The base of the -S - or double bond interrupt is exemplified in the above description of the general formula (I). The carbon atom number 6 to 2 as shown in the above formula (Π), " and 2 The group in which the aryl group and the aryl group are interrupted by _〇·, _S_ or a double bond may be exemplified in the description of the above formula (I). The aryl group having 7 to 2 carbon atoms represented by γ2 and Z, and the group of the fluorene group in the arylalkyl group interrupted by -〇-, _S_ or a double bond can be exemplified by the above formula (1) The group exemplified in the above formula (1), wherein the heterocyclic group having 2 to 2 carbon atoms represented by Y丨, Y2 and Z in the above formula (Π) is exemplified in the description of the above formula (1) The basis. The cycloalkyl group having 3 to 1 ring carbon atoms represented by the above formula (II) and Y2 and Z may, for example, be exemplified in the description of the above formula (I). 150139.doc -16- 201120022 In addition to the exemplified γ Ι bond in the above formula (II), in addition to the exemplified as the aromatic ring in the above formula (1), the nucleus ring, the mu ring, the ring (tetra) ring κ ring, a ring of 5 to 7 members such as a ring of styrene, an internal vinegar ring, an inner guanamine ring, a condensed ring of a ring, a dangerous ring, a full ring, and a full ring. As the enthalpy in the above formula (11), a functional atom shown, and an alkyl group, an aryl group, an arylalkyl group, a heterocyclic group, a cycloalkyl group, and an adjacent γι bond which may be substituted for Y1, 丫2 and 2 in the above formula (II). Examples of the halogen atom of the fluorene structure formed by the nucleus include the groups exemplified in the description of the above formula (1). The alkyl group, the aryl group and the arylalkyl group represented by the oxime 1, oxime 2 and oxime in the above formula (II) a heterocyclic group, a cycloalkyl group, and a hydrazine adjacent thereto; the cyclic structure formed by the bonding may have a substituent, and examples of the substituents include the groups exemplified in the description of the above formula (1), and the groups Further, when it is substituted by a substituent having a carbon atom, the alkyl group, the aryl group, and the aryl group represented by the above formula (Π) containing the substituent are represented by γΐ, Υ2, and Ζ. The number of carbon atoms in the cyclic structure in which the alkyl group, the heterocyclic group, the cycloalkyl group and the adjacent fluorene form each other satisfies the predetermined number of carbon atoms. The episulfide compound represented by the above formula (II) For example, the compound represented by the following compound No. 14 to Νο_62 may be mentioned. Further, in the chemical formula, η represents a number of 0 to 10. However, the present invention is not limited to the following compounds. 150139.doc 17- 201120022 [Chemical 8] Compound No. 14

[化9] 化合物No.17[Chem. 9] Compound No. 17

150139.doc -18- 201120022 化合物No. 19150139.doc -18- 201120022 Compound No. 19

[化 10] 化合物No.22Compound No. 22

-19- 150139.doc 201120022-19- 150139.doc 201120022

[化 11] 化合物No.27Compound No.27

150139.doc -20- 201120022 化合物No.29150139.doc -20- 201120022 Compound No.29

[化 12] 化合物No.32[Chem. 12] Compound No. 32

Si 150139.doc -21 201120022 化合物No.34Si 150139.doc -21 201120022 Compound No.34

[化 13] 化合物No.37Compound No.37

150139.doc -22- 201120022 化合物No.39150139.doc -22- 201120022 Compound No.39

[化 14] 化合物No.42 s^0Compound No.42 s^0

化合物No.43Compound No.43

150139.doc -23 201120022 化合物No.44150139.doc -23 201120022 Compound No.44

[化 15] 化合物No.46Compound No.46

-24- 150139.doc 201120022 化合物No.49-24- 150139.doc 201120022 Compound No.49

[化 16] 化合物No. 5 1[Chem. 16] Compound No. 5 1

化合物No.52Compound No. 52

150139.doc -25- 201120022 化合物No.53150139.doc -25- 201120022 Compound No.53

化合物No.54Compound No.54

[化 17] 化合物No.55[Chem. 17] Compound No. 55

化合物No. 5 7Compound No. 5 7

150139.doc -26- 201120022 化合物No.58150139.doc -26- 201120022 Compound No.58

[化 18] 化合物No.60Compound No. 60

化合物No. 62Compound No. 62

150139.doc -27- 201120022 述通式(II)所示之環硫化物化合物中,以下之iv)〜ix) 之化Q物因原料容易獲得且生產性良好,可獲得高折射率 之硬化物,故較佳。 iv)上述通式(II)中,乂為2或3,_〇,γ1為碳原子數 之烷基、碳原子數6〜20之芳基或鄰接之Y〗彼此所形成之Jf 成為芳香環之基,Y\z為碳原子數卜1()之絲、碳原子々 數6〜20之芳基,q及r為〇〜2之化合物。 V)下述通式(IV)所示之化合物。 [化 19]150139.doc -27- 201120022 Among the episulfide compounds represented by the general formula (II), the following Q products of iv) to ix) are easily obtained from raw materials and have good productivity, and a cured product having a high refractive index can be obtained. Therefore, it is better. Iv) In the above formula (II), 乂 is 2 or 3, 〇, γ1 is an alkyl group having a carbon number, an aryl group having 6 to 20 carbon atoms, or a Jf formed by adjacency Y is an aromatic ring The base of Y/z is a compound having a carbon atom number of 1 (), an aryl group having a carbon number of 6 to 20, and q and r are 〇~2. V) a compound represented by the following formula (IV). [Chem. 19]

(IV) (式中,Y2’與上述通式(„)之Y2相同或表示氫原子,X,為 或2,A1及A2與上述通式师目同,γ1、z、n、仏與上划 通式(Π)相同。再者,η不為〇時所存在之光學異構物可# 任意異構物) vi)上述通式(II)或(ιν)中η為〇〜5之化合物。 νϋ)上述通式(II)或(IV)中γ2為苯基之化合物。 他)上述通式(11)或(IVK“〇5tl、當為碳原 子數1〜10之烷基或碳原子數6〜2〇之芳基之化合物。 、 lx)上述通式(II)中X為2、y為〇、Υ2為苯基' q為〇、^為 〇、q為1、r為0、η為〇〜2之化合物。 上述通式(II)所示之環硫化物化合物之製造方法並無特 150139.doc •28· 201120022 別限定’例如藉由如下述反應式所^,使環氧衍生物⑺與 硫脲反應’可容易地製造上述通式(„)所示之環硫化物化 合物。 [化 20](IV) (wherein Y2' is the same as Y2 of the above formula („) or represents a hydrogen atom, X is or 2, and A1 and A2 are the same as those of the above-mentioned general formula, γ1, z, n, 仏 and The formula (Π) is the same. Further, the optical isomer present when η is not 〇 may be any isomer) vi) the compound of the above formula (II) or (ιν) wherein η is 〇~5 Νϋ) a compound of the above formula (II) or (IV) wherein γ2 is a phenyl group. The above formula (11) or (IVK "〇5t, when it is an alkyl group having 1 to 10 carbon atoms or a carbon atom a compound of the aryl group of 6 to 2 。, lx) wherein X in the above formula (II) is 2, y is 〇, Υ 2 is phenyl 'q is 〇, ^ is 〇, q is 1, and r is 0. η is a compound of 〇~2. The method for producing the episulfide compound represented by the above formula (II) is not specifically limited to 150139.doc • 28·201120022. For example, the epoxy derivative (7) is reacted with thiourea by the following reaction formula. The episulfide compound represented by the above formula („) can be easily produced.

本發明之環硫化物化合物除作為以下說明之硬化性樹脂 組合物、以及對該硬化性樹脂組合物進行加熱及,或昭射 能量線而獲得之硬化物之用途以外,亦可用於針對混凝 土、水泥砂聚、各種金屬、皮革、玻璃、橡膠、塑膠、 木、布、紙等之塗料或接著劑;包裝用膠帶、點著桿藏、 冷;東食品標籤、可移除標籤、p〇s〇w Sale,銷售點 標籤、黏著壁紙、點菩地搞M笼 + ’’) 言土,,氏㈣地板材荨之黏著劑;銅版紙、輕量 、佈紙m塗佈紙板、無碳複寫紙、浸潰紙等加工 等之隹★纖♦、合成纖維、玻璃纖維、碳纖維、金屬纖維 ^卜淀開抑制劑、加工劑等纖維處理劑;密封 混和劑、防水料建築材料;電子.電氣設備用 饮封劑4廣泛之用途。 150139.doc •29- 201120022 其-人,就含有上述通式⑴或(II)所示之新穎環硫化物化 合物與硬化劑的本發明之硬化性樹脂組合物(以下,亦稱 為第1硬化性樹脂組合物)加以說明。再者,於以下之說明 中,關於未特別說明之部分,可適當使用上述環硫化物化 合物中之說明之内容。 作為上述硬化劑,例如可列舉二伸乙三胺、二伸乙三 胺、四伸乙五胺等聚烷基聚胺類;聚氧化丙烯二胺、聚氧 化丙烯三胺等聚醚聚胺類;丨,2_二胺基環己烷、丨,4-二胺 基-3,6-二乙基環己烷、異佛爾酮二胺、薄荷烷二胺、降冰 片烯二胺、雙(4-胺基-3-甲基二環己基)甲烷、二胺二環己 曱烷、雙(胺基甲基)環己烷、N-胺基曱基哌啩、3,9-雙(3-胺基丙基)-2,4,8,10-四氧雜螺(5,5)十一烷等脂環式聚胺 類;間二甲苯二胺、α_(間/對胺基苯基)乙基胺、間笨二 胺、二胺基二苯基甲烷、二胺基二苯基砜、二胺基二乙基 二曱基二苯基曱烷、二胺基二乙基二苯基曱烷、二曱硫基 甲苯二胺、二乙基曱苯二胺、α,α,_雙(4_胺基苯基)對二異 丙基笨、二硫二苯胺等芳香族聚胺類等(以下,稱為聚胺 類)。又,可列舉:藉由常規方式使該等聚胺類與苯基縮 水甘油醚、丁基縮水甘油醚、雙酚Α_二縮水甘油醚、雙酚 F-縮水甘油醚等縮水甘油醚類或羧酸之縮水甘油酯類等各 種環氧樹脂進行反應所製造之聚環氧加成改性物;藉由常 規方式使該等聚胺類與鄰苯二甲酸、間苯二甲酸、二聚酸 等羧酸類進行反應所製造之醯胺化改性物;藉由常規方式 使該等聚胺類與甲醛等搭類及苯紛、甲酴、二甲苯紛、第 150139.doc -30· 201120022 一丁基笨紛、間苯二齡等於核中具有至少一個酸化反應性 部位之酚類進行反應所製造之曼尼希化改性物等(以下, 稱為聚胺類之改性物)。進而,亦可使用二氛基二醯胺、 酸酐、2-乙基-4·曱基咪唑等咪唑類等潛伏性硬化劑。特別 好的是上述聚胺類、上述聚胺類之改性物及咪唑類,就保 存穩定性及硬化性方面而言,更好的是咪唑類。 於第1硬化性樹脂組合物甲,上述硬化劑之含量相對於 上述環化物化合物1 〇 〇重量份,較好的是〇 _ 〇 1〜2 〇重量 份,更好的是0·1〜5重量份。若硬化劑之含量未滿〇〇1重量 伤,則硬化速度較慢,或硬化不充分,若超過20重量份, 則硬化物之強度不充分。 又,於第1硬化性樹脂組合物中,視需要亦可含有硬化 觸媒;環氧化合物、氧雜環丁烷化合物、鄰苯二甲酸二辛 酯、鄰苯二甲酸二丁酯、苯曱醇、煤焦油等反應性及/或 非反應性之稀釋劑(塑化劑);玻璃纖維、碳纖維 '纖維 素、石英砂、水泥、高嶺土 '黏土、氫氧化鋁、膨潤土、 滑石、二氧化矽、細粉末二氧化矽、二氧化鈦、碳黑、石 墨、氧化鐵、瀝青物質等填充劑或顏料;γ_胺基丙基三乙 氧基矽烷、Ν-β-(胺基乙基)_γ_胺基丙基三乙氧基矽烷、Ν_ β-(胺基乙基)-Ν’-β-(胺基乙基)_γ_胺基丙基三乙氧基矽烷、 γ-苯胺基丙基三乙氧基矽烷、γ_縮水甘油氧基丙基三乙氧 基矽烷、β-(3,4-環氧基環己基)乙基三乙氧基矽烷、乙烯 基三乙氧基矽烷、Ν-β-(Ν-乙烯基苄基胺基乙基胺基丙 基三乙氧基矽烷、γ-曱基丙烯醯氧基丙基三甲氧基矽烷、 150139.doc 201120022 γ-氣丙基三甲氧基石浅、疏基丙基 锶八逾丨.X而ω·々丨 氧基石夕貌#矽烷 偶合劑,界面活性劑;堪地里拉 租鼠巴西棕搁蠟、木蠟、 蟲虫敗、蜂壤、羊毛脂、録犧、 A ’由螺•、脂肪酸 蠛、脂肪_、脂肪㈣、芳香料、芳香躺等潤滑 劑,·增稍劑;觸變劑,·抗氧化劑;光敏劑;光穩定劑紫 外線吸收劑;阻燃劑;消泡劑;防錢劑;保存穩定劑;膠 體二氧化矽、膠體氧化鋁等常用之添加物,進而亦可併用 二甲苯樹脂、石油樹脂等黏著性之樹脂類。於第丨硬化性 樹脂組合物中,該等任意之添加物相對於上述環硫化物化 合物100質量份,較好的是合計為5〇〇質量份以下。 作為可用作上述反應性及/或非反應性之稀釋劑(塑化劑) 之環氧化合物,可列舉:氫化雙酚人二縮水甘油醚、3,4_ %氧%己基甲基_3,4-環氧環己烧羧酸酯、3,4_環氧_丨_甲基 環己基-3,4-環氧_1_甲基環己院竣酸酯、6_曱基_3,4_環氧環 己基曱基-6-甲基_3,4-環氧環己烧缓酸酯、3,4-環氧-3-甲基 環己基甲基-3,4-環氧-3-甲基環己烷羧酸酯' 3,4_環氧_5_曱 基環己基曱基-3,4-環氧-5-曱基環己烷羧酸酯、2-(3,4-環氧 基環己基-5,5-螺-3,4-環氧)環己烷·間二噚烷、雙(3,4-環氧 環己基甲基)己二酸酯、3,4-環氧-6-甲基環己基羧酸酯、 亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、伸 乙基雙(3,4-環氧環己烷羧酸酯)、環氧六氫鄰苯二甲酸二 辛醋、環氧六氫鄰苯二甲酸二-2-乙基己酯、ι,4-丁二醇二 縮水甘油醚、1,6_己二醇二縮水甘油醚、丙三醇之三縮水 甘油醚、三羥曱基丙烷之三縮水甘油醚、山梨糖醇之四縮 150139.doc -32- 201120022 κ甘油醚一季戊四醇之六縮水甘油醚、聚乙二醇之二縮 水甘油醚、聚丙二醇之二縮水甘油醚等多元醇之縮水甘油 -·、:又於丙一醇、二羥曱基丙烧、丙三醇等脂肪族多元醇 上加成1種或2種以上之環氧烷所獲得之聚醚多元醇之聚縮 水甘油_、脂肪族長鏈二元酸之二縮水甘油醋、脂肪族高 級醇之單縮水甘油趟或㈣、f⑲、丁基苯酴、又於該等 上加成環氧烷所獲得之聚醚醇之單縮水甘油醚、高級脂肪 酸之縮水甘油自旨、環氧化大豆油、環氧硬脂酸辛醋、環氧 硬月曰k 丁 S日、板氧化聚丁二稀等,作為可用作反應性及/ 或非反應性之稀釋劑(塑化劑)之氧雜環丁烷化合物,可列 舉3-乙基_3·羥甲基氧雜環丁烧、3_(甲基)稀丙氧基曱基小 ^基氧雜環丁烷、(3_乙基_3·氧雜環丁烷基甲氧基)甲基 苯、4-氟-[1-(3_乙基_3_氧雜環丁烷基甲氧基)甲基]苯、4· 甲乳基-[1-(3-乙基-3-氧雜環丁烷基甲氧基)甲基]苯、[h (3-乙基-3-氧雜環丁烷基甲氧基)乙基]苯基醚、異丁氧基甲 基(3·乙基·3·氧雜環丁烧基甲基)_、異冰片氧基乙基(3乙 基-3-氧雜環丁烷基甲基)醚、異冰片基(3_乙基_3_氧雜環丁 燒基甲基)ϋ、2-乙基己基(3-乙基_3·氧雜環丁院基甲基) 醚、乙基二乙二醇(3_乙基_3_氧雜環丁烷基甲基)醚、二環 戊二烯(3-乙基·3·氧雜環丁烧基甲基)喊、二環戊烯氧基乙 基(3-乙基-3-氧雜環丁烷基甲基)醚、二環戊烯基(3_乙基· 3-氧雜環丁烷基曱基)醚、四氫呋喃甲基(3•乙基_3•氧雜環 丁烧基甲基)ϋ、四漠.苯基(3_乙基_3_氧雜環丁烧基甲基) 醚、2-四溴苯氧基乙基(3_乙基_3_氧雜環丁烷基甲基)醚、 I50139.doc -33- 201120022 三溴苯基(3-乙基-3·氧雜環丁烷基甲基)醚、2·三溴苯氧基 乙基(3-乙基-3-氧雜環丁烷基甲基)醚、2_羥乙基(3_乙基_3_ 氧雜環丁烷基甲基)醚、2_羥丙基(3_乙基_3_氧雜環丁烷基 甲基)醚、丁氧基乙基(3_乙基_3_氧雜環丁烷基甲基)醚、五 氣苯基(3-乙基-3-氧雜環丁烷基甲基)醚、五溴苯基(3_乙 基-3-氧雜環丁烷基甲基)醚、冰片基(3_乙基_3_氧雜環丁烷 基甲基)醚、3,7-雙(3_氧雜環丁烷基)_5_氧基壬烷、3,3,_ (1’3-(2-曱烯基)丙二基雙(氧基亞甲基))雙_(3_乙基氧雜環 丁烧)、1,4-雙[(3 -乙基-3-氧雜環丁炫基甲氧基)曱基]苯、 1,2-雙[(3-乙基-3-氧雜環丁烷基曱氧基)曱基]乙烷、丨,3_雙 [(3 -乙基-3-氧雜環丁烧基甲氧基)曱基]丙烧、乙二醇雙(3· 乙基-3-氧雜環丁烷基甲基)醚、二環戊烯基雙(3_乙基_3_氧 雜環丁烷基甲基)醚、三乙二醇雙(3_乙基_3_氧雜環丁烷基 曱基)醚、四乙二醇雙(3_乙基_3_氧雜環丁烷基甲基)醚、三 %:癸一基一亞甲基(3-乙基-3-氧雜環丁烧基甲基)鱗、三經 曱基丙烷三(3-乙基-3-氧雜環丁烷基曱基)醚、丨,4雙(3_乙 基-3-氧雜環丁烷基曱氧基)丁烷、i,6_雙(3_乙基_3_氧雜環 丁烷基甲氧基)己烷、季戊四醇三(3_乙基_3_氧雜環丁烷基 甲基)醚、季戊四醇四(3-乙基-3-氧雜環丁烷基曱基)醚、聚 乙二醇雙(3-乙基-3-氧雜環丁烷基甲基)醚、二季戊四醇六 (3 -乙基-3-氧雜ί衣丁烧基曱基)謎、二季戍四醇五(3_乙基_ 3 -氧雜環丁烧基曱基)驗、二季戊四醇四(%乙基氧雜環 丁烷基曱基)醚、己内酯改性二季戊四醇六(3·乙基_3_氧雜 環丁烷基甲基)醚、己内酯改性二季戊四醇五(3_乙基_3_氧 150139.doc -34- 201120022 雜環丁炫基甲基)醚、二-三經甲基丙院四(3_乙基_3_氧雜環 丁烷基甲基)、驗、EO(ethylene oxide,環氧乙烷)改性雙酚a 雙(3 -乙基-3-氧雜% 丁烧基曱基)鱗、p〇(pr〇pyie.ne 〇xide, 環氧丙烷)改性雙酚A雙(3 -乙基-3·氧雜環丁烷基甲基)醚、 ΕΟ改性氫化雙酚Α雙(3-乙基-3-氧雜環丁烷基曱基)醚、ρ〇 改性氫化雙酚A雙(3-乙基-3-氧雜環丁烷基曱基)醚、E〇改 性雙酚F(3-乙基-3-氧雜環丁烷基曱基)醚等。 第1硬化性樹脂組合物中可不含溶劑。於此情形時,關 於溶劑之使用量,可使上述環硫化物化合物及上述硬化劑 之合計之含量於第1硬化性樹脂組合物中,成為較好的是 5〜90質量%、進而較好的是1〇〜5〇質量%之範圍。作為該溶 劑之具體例,例如可列舉:甲基乙基酮、甲基戊基酮、二 乙基酮、丙酮、甲基異丙基酮、曱基異丁基酮、環己酮等 酮類,乙醚、二噚烷、四氫呋喃、丨,2•二曱氧基乙烷、 1,2-一乙氧基乙烷、二丙二醇二曱醚等醚系溶劑;乙酸曱 酯、乙酸乙酯、乙酸正丙酯、乙酸異丙酯、乙酸正丁酯等 酯系溶劑;乙二醇單曱醚、乙二醇單乙醚、丙二醇單曱醚 乙酸酯等賽珞蘇系溶劑;甲肖、乙醇、異或正丙醇、異或 正丁醇、戊醇等醇系溶劑;苯、曱苯、二甲笨等Βτχ (benzene,toluene and xylene)系溶劑;己烷、庚烷、辛 烷、,己烷等脂肪族烴系溶劑:¾節油、D-擰檬烯、蒎烯 等帖烯系烴油;礦油精、Swaz〇l#310(C〇Sm〇 Matsuyama Oil股如有限公司)、s〇lvess〇#1〇〇(Exx〇n Chemical股份有 限公司)等石壞系溶劑;四氣化碳、氯仿、三氣乙烯、二 150139.doc -35· 201120022 氣甲烷等鹵化脂肪族烴系溶劑;氯苯等鹵化芳香族烴系溶 劑;卡必醇系溶劑、苯胺、三乙胺、吡啶、乙酸、猜/、 二硫化碳、N,N-二甲基曱醯胺' N_甲基吡咯啶酮等:其 中,較好的是酮類或赛珞蘇系溶劑。又,亦可不去除合成 上述環硫化物化合物時所使用之溶劑,使其直接含於第丄 硬化性樹脂組合物中。 第1硬化性樹脂組合物可藉由加熱處理而硬化。加熱處 理較好的是於100〜30(TC之範圍内加熱1〇〜24〇分鐘。. 其次,就含有上述通式⑴或(11)所示之新賴環硫化物化 合物與能量線敏感性陽離子聚合起始劑之本發明之硬化性 樹月曰、’且。物(以下’亦稱為第2硬化性樹脂組合物)加以說 明。再者’於以下之說明中’關於未特別說明之部分,可 適當使用上述環硫化物化合物及第!硬化性樹脂组合物中 之說明之内容。 上缝量線敏感性起始劑係藉由能量線敏感性照射、 具體而言藉由如下所述之能量線之照射而可釋出使陽離 聚合開始之物質的化合物。 作為上述能量線敏感性陽離子聚合起始劑而特別好者 可列舉作為藉由能量線敏感性照射而釋出路易士酸之鏽 之複鹽、或其衍生物1為該化合物之代表性者可列 通式[A] [B;p所示之陽離子與陰離子之鹽。 此處’陽離子[A]y+較好的是鏽類,其結構例如可 [(R)xQ]y+表示。 、八中尺係碳數為1〜60、可含有若干碳以外之原 150139.doc •36· 201120022 之有機基,x為1〜5之整數。χ個R分別獨立,可相同亦可不 同。又,較好的是X個R中之至少一個為芳香基。Q為選自 由 S、N、Se、Te、P、As、Sb、Bi、〇、I、Br、ci、j?及 N=N所組成之群中之原子或原子團。又,將陽離子[A]y+中 之Q之原子價設為z時’必須y=x-z之關係成立。 又’較好的是陰離子[B]y-為鹵化物錯合物,其結構例如 可以[LXs]y表示。 進而其中,L為作為鹵化物錯合物之中心原子之金屬戋 類金屬(Metalloid),且為 B、P、As、Sb、Fe、Sn、Bi、 A1、Ca、In、Ti、Zn、Sc ' V、Cr、Μη、Co 等。X 為鹵素 原子。s為3〜7之整數。又,將陰離子[B]y-中之[之原子價 設為t時’重要的是y = s_t之關係成立。 作為上述通式之陰離子[LXs]y-之具體例,可列舉四氟硼 酸根(BF4)·、六氟磷酸根(PL)-、六氟銻酸根(sbF6).、六氟 砷酸根(AsF6)-、六氣銻酸根(sbcu)-等,較好的是六氟銻 酸根(SbF6)_。 又,作為陰離子[B]y·,可使用[LXs-丨(〇H)]y-所示之結構 者。L、X、S與上述相同。又,作為其他可使用之陰離 子,可列舉過氯酸離子(cl〇4)_、三氟曱基亚硫酸離子 (CFsSO3)、氟磺酸離子(FS〇3)·、甲苯磺酸陰離子、三硝基 苯磺酸陰離子等。 又’作為陰離子[B]y· ’亦可使用四(五氟笨基)硼酸根。 本發明中,此種鑌鹽中,使用芳香族鏽鹽特別有效。其 中,杈好的是日本專利特開昭50-15 1997號公報、曰本專 150139.doc •37- 201120022 利特開昭5(M58680號公報中揭示之芳 專利特開昭50-151997號公報、曰本專利/㈣鹽’曰本 報日本專利特開昭52-30899號 么民 '日本專利特開昭56_5542〇號公報、日本專利特開昭 55-1251G5號公報等中揭示之via族芳香族鏽鹽,日本專利 特開昭5(M 58698號公報中揭示之VA族芳香族鏽鹽,日本 專利特開昭56_8428號公報、曰本專利特開昭56-149402號 公報、日本專利特開昭57·192429號公報等中揭示之氧代 氧化錄鹽’日本專利特開昭叫测號公報中揭示之芳香 知重氮鹽’美國專利第4139655號說明書中揭示之硫代吼 喃鏽鹽等。 ^等芳香族鐵鹽中特別好的是含有下述通式(ν)、(νυ或 (VII) [化 21]The episulfide compound of the present invention can be used for concrete, in addition to the curable resin composition described below, and the use of the curable resin composition to heat or to obtain a cured product obtained by irradiating an energy ray. Cement sand, various metals, leather, glass, rubber, plastic, wood, cloth, paper, etc. Coatings or adhesives; packaging tape, point-and-stick, cold; East food labels, removable labels, p〇s 〇w Sale, point of sale label, sticky wallpaper, point Bodhi engage M cage + '') 言土,, (4) 荨 荨 黏 adhesive; coated paper, lightweight, cloth paper m coated cardboard, carbonless copy paper , such as processing such as impregnating paper, such as fiber, synthetic fiber, glass fiber, carbon fiber, metal fiber, precipitation inhibitor, processing agent, etc.; fiber mixture agent for sealing mixture, waterproof material; electronic equipment Use a wide range of applications. 150139.doc • 29-201120022 The curable resin composition of the present invention containing the novel episulfide compound represented by the above formula (1) or (II) and a curing agent (hereinafter, also referred to as first hardening) The resin composition) is explained. Further, in the following description, the contents described in the above episulfide compound can be suitably used in the portions which are not particularly described. Examples of the curing agent include polyalkyl polyamines such as diethylenetriamine, diethylenetriamine, and tetraethyleneamine; polyether polyamines such as polyoxypropylene diamine and polyoxypropylene triamine. ;丨, 2_diaminocyclohexane, hydrazine, 4-diamino-3,6-diethylcyclohexane, isophoronediamine, menthanediamine, norbornene diamine, double (4-Amino-3-methyldicyclohexyl)methane, diamine dicyclohexanane, bis(aminomethyl)cyclohexane, N-aminomercaptopiperazin, 3,9-bis ( Alicyclic polyamines such as 3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane; m-xylylenediamine, α_(m-/p-aminobenzene) Ethylamine, m-diamine, diaminodiphenylmethane, diaminodiphenyl sulfone, diaminodiethyldidecyldiphenyl decane, diaminodiethyl benzene Aromatic polyamines such as decane, dithiol toluenediamine, diethyl phenylenediamine, α,α, bis(4-aminophenyl)-diisopropyl bromide, dithiodiphenylamine Classes and the like (hereinafter, referred to as polyamines). Further, examples of the polyamines include glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, bisphenol hydrazine diglycidyl ether, and bisphenol F-glycidyl ether, or A polyepoxy addition modification produced by reacting various epoxy resins such as carboxylic acid glycidyl ester; the polyamines and phthalic acid, isophthalic acid, dimer acid are conventionally obtained The imidization modification produced by the reaction of a carboxylic acid; the polyamines are mixed with formaldehyde by a conventional method, and the benzene, formazan, xylene, 150139.doc -30· 201120022 A mannated butyl group or a benzoic acid-containing modified product obtained by reacting a phenol having at least one acid-reactive site in the core (hereinafter referred to as a modified product of a polyamine). Further, a latent curing agent such as an imidazole such as diaryldiamine, an acid anhydride or 2-ethyl-4·mercaptopimidazole can also be used. Particularly, the above-mentioned polyamines, modified polyamines and imidazoles are more preferably imidazoles in terms of stability and hardenability. In the first curable resin composition A, the content of the curing agent is preferably 〇 〇 1 2 2 〇 〇 by weight, more preferably 0·1 〜5 by weight based on 1 part by weight of the cyclized compound. Parts by weight. If the content of the hardener is less than 1 weight, the curing rate is slow or insufficient, and if it exceeds 20 parts by weight, the strength of the cured product is insufficient. Further, the first curable resin composition may contain a curing catalyst as needed; an epoxy compound, an oxetane compound, dioctyl phthalate, dibutyl phthalate, benzoquinone Reactive and/or non-reactive diluents (plasticizers) such as alcohol and coal tar; glass fiber, carbon fiber 'cellulose, quartz sand, cement, kaolin' clay, aluminum hydroxide, bentonite, talc, cerium oxide , fine powder of ceria, titanium dioxide, carbon black, graphite, iron oxide, asphalt materials and other fillers or pigments; γ-aminopropyl triethoxy decane, Ν-β-(aminoethyl)_γ-amine Propyltriethoxydecane, Νβ-(aminoethyl)-Ν'-β-(aminoethyl)_γ-aminopropyltriethoxydecane, γ-anilinopropyltriethyl Oxydecane, γ-glycidoxypropyltriethoxydecane, β-(3,4-epoxycyclohexyl)ethyltriethoxydecane, vinyltriethoxydecane, Ν-β -(Ν-vinylbenzylaminoethylaminopropyltriethoxydecane, γ-mercaptopropenyloxypropyltrimethoxydecane, 150139.doc 2011200 22 γ-gas propyl trimethoxy stone shallow, sulfhydryl propyl 锶 丨 丨. X and ω · 々丨 石 夕 夕 矽 矽 矽 矽 矽 偶 偶 矽 矽 矽 矽 矽 矽 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Wax, insect damage, bee soil, lanolin, record sacrifice, A 'snails, fatty acids, fat _, fat (four), aromatic spices, aromatic lying and other lubricants, · additives; thixotropic agents, · anti- An oxidizing agent; a photosensitizer; a light stabilizer ultraviolet absorber; a flame retardant; a defoaming agent; an anti-money agent; a storage stabilizer; a colloidal cerium oxide, a colloidal alumina, and the like, and a xylene resin, In the ninth curable resin composition, it is preferable that the additive is a total of 5 parts by mass or less based on 100 parts by mass of the episulfide compound. Examples of the epoxy compound which can be used as the above-mentioned reactive and/or non-reactive diluent (plasticizer) include hydrogenated bisphenol human diglycidyl ether and 3,4% oxygen% hexylmethyl_3,4. - Epoxy cyclohexane carboxylate, 3,4_epoxy_丨_methylcyclohexyl-3,4-epoxy_ 1_Methylcyclohexyl phthalate, 6_mercapto-3,4_epoxycyclohexyldecyl-6-methyl-3,4-epoxycyclohexanone, 3,4-ring Oxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate '3,4_epoxy_5-decylcyclohexyldecyl-3,4-ring Oxy-5-nonylcyclohexanecarboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-dioxane, bis ( 3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylene bis(3,4-epoxycyclohexane), two Cyclopentadiene diepoxide, exoethyl bis(3,4-epoxycyclohexanecarboxylate), epoxy hexahydrophthalic acid dioctyl vinegar, epoxy hexahydrophthalic acid di- 2-ethylhexyl ester, iota, 4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerol, triglycidyl ether of trishydroxypropyl propane , sorbitol four shrink 150139.doc -32- 201120022 κ glyceryl ether pentaerythritol hexahydroglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether and other polyols glycidol - ,: again in C Polyglycidol of a polyether polyol obtained by adding one or more kinds of alkylene oxides to an aliphatic polyol such as an alcohol, a dihydroxymethyl propyl group or a glycerin, and an aliphatic long-chain dibasic acid Diglycidyl acetonate, monoglycidyl hydrazide of aliphatic higher alcohol or (d), f19, butyl benzoquinone, monoglycidyl ether of polyether alcohol obtained by adding alkylene oxide, and shrinkage of higher fatty acid Glycerin-based, epoxidized soybean oil, epoxy succinate, octyl sulphate, oxidized polybutylene, etc., as a diluent that can be used as a reactive and/or non-reactive ( The oxetane compound of the plasticizer) may, for example, be 3-ethyl-3-hydroxymethyl oxetane or 3-(methyl)-dipoxyfluorenyloxybutane. (3-ethyl-3-3 oxetanylmethoxy)methylbenzene, 4-fluoro-[1-(3-ethyl_3_oxetanylmethoxy)methyl] Benzene, 4·methyllacyl-[1-(3-ethyl-3-oxetanylmethoxy)methyl]benzene, [h (3-ethyl-3-oxetanyl) Methoxy)ethyl]phenyl ether, isobutoxymethyl (3·ethyl·3·oxacyclobutane) Methyl)-, isobornyloxyethyl (3 ethyl-3-oxetanylmethyl)ether, isobornyl (3-ethyl-3-oxybenzobutanylmethyl) hydrazine , 2-ethylhexyl (3-ethyl-3 oxetanyl methyl) ether, ethyl diethylene glycol (3_ethyl_3_oxetanylmethyl) ether, Dicyclopentadiene (3-ethyl·3·oxetanylmethyl) shunt, dicyclopentenyloxyethyl (3-ethyl-3-oxetanylmethyl)ether , Dicyclopentenyl (3_ethyl· 3-oxetanyl decyl) ether, tetrahydrofuran methyl (3•ethyl _3 • oxetanylmethyl) ϋ, Si Mo. Phenyl (3_ethyl_3_oxetanylmethyl)ether, 2-tetrabromophenoxyethyl (3_ethyl_3_oxetanylmethyl)ether, I50139 .doc -33- 201120022 Tribromophenyl (3-ethyl-3.oxetanylmethyl)ether, 2·tribromophenoxyethyl (3-ethyl-3-oxetane) Alkylmethyl)ether, 2-hydroxyethyl (3_ethyl_3_oxetanylmethyl)ether, 2-hydroxypropyl (3_ethyl_3_oxetanyl) Ether, butoxyethyl (3_ethyl_3_oxetanylmethyl)ether , penta-phenyl (3-ethyl-3-oxetanylmethyl) ether, pentabromophenyl (3-ethyl-3-oxetanylmethyl) ether, borneol ( 3_ethyl_3_oxetanylmethyl)ether, 3,7-bis(3-oxetanyl)-5-oxydecane, 3,3,_ (1'3- (2-decenyl)propanediylbis(oxymethylene))bis-(3-ethyloxetane), 1,4-bis[(3-ethyl-3-oxocycle) Butyl methoxy) fluorenyl] benzene, 1,2-bis[(3-ethyl-3-oxetanyloxy)indolyl]ethane, hydrazine, 3_bis[(3-B) Benzyl-3-oxetanylmethoxy)indolyl]propane, ethylene glycol bis(3·ethyl-3-oxetanylmethyl)ether, dicyclopentenyl double ( 3_ethyl_3_oxetanylmethyl)ether, triethylene glycol bis(3_ethyl_3_oxetanylalkyl)ether, tetraethylene glycol double (3_ Ethyl_3_oxetanylmethyl)ether, tris: fluorenyl-methylene (3-ethyl-3-oxetanylmethyl) scale, tris-propyl propane Tris(3-ethyl-3-oxetanyl)alkyl, hydrazine, 4bis(3-ethyl-3-oxetanyloxy)butane, i, 6_bis(3_ethyl_3_oxetanylmethoxy)hexane, pentaerythritol tris(3_ethyl_3_oxetanylmethyl)ether, pentaerythritol tetrakis(3- Ethyl-3-oxetanylalkyl)ether, polyethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, dipentaerythritol hexa(3-ethyl-3) - Oxide 衣 烧 烧 ) ) 谜 谜 谜 、 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二 二Mercapto)ether, caprolactone modified dipentaerythritol hexa(3·ethyl_3_oxetanylmethyl)ether, caprolactone modified dipentaerythritol penta(3_ethyl_3_oxygen 150139 .doc -34- 201120022 Heterocyclic Dingsylmethyl Ether, Di-Tris-methyl-propyl 4-(3-ethyl-3-(oxetanylmethyl), EO (ethylene oxide, epoxy) Ethane) modified bisphenol a bis(3-ethyl-3-oxaxanthylene) fluorene, p〇(pr〇pyie.ne 〇xide, propylene oxide) modified bisphenol A double 3-ethyl-3·oxetanylmethyl)ether, hydrazine-modified hydrogenated bisphenol bis(3-ethyl-3-oxetanyl fluorenyl)ether, ρ〇 Modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanyl fluorenyl) ether, E 〇 modified bisphenol F (3-ethyl-3-oxetanyl fluorenyl) Ether, etc. The first curable resin composition may contain no solvent. In this case, the content of the solvent is preferably from 5 to 90% by mass, more preferably from 5 to 90% by mass, based on the total of the above-mentioned episulfide compound and the above-mentioned curing agent. It is a range of 1〇~5〇% by mass. Specific examples of the solvent include ketones such as methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, decyl isobutyl ketone, and cyclohexanone. An ether solvent such as diethyl ether, dioxane, tetrahydrofuran, hydrazine, 2, dimethoxy ethane, 1,2-ethoxy ethane, dipropylene glycol dimethyl ether; decyl acetate, ethyl acetate, acetic acid An ester solvent such as n-propyl ester, isopropyl acetate or n-butyl acetate; a cellophane solvent such as ethylene glycol monoterpene ether, ethylene glycol monoethyl ether or propylene glycol monoterpene ether acetate; An alcohol solvent such as iso- or n-propanol, iso- or n-butanol or pentanol; a solvent such as benzene, toluene and xylene; hexane, heptane, octane, and Alkane and other aliphatic hydrocarbon solvents: 3⁄4 fuel, D-moneylene, terpene and other entrained hydrocarbon oils; mineral spirits, Swaz〇l #310 (C〇Sm〇Matsuyama Oil Co., Ltd.), s 〇lvess〇#1〇〇 (Exx〇n Chemical Co., Ltd.) and other stone bad solvents; four gasified carbon, chloroform, triethylene ethylene, two 150139.doc -35· 201120022 gas Halogenated aliphatic hydrocarbon solvent such as methane; halogenated aromatic hydrocarbon solvent such as chlorobenzene; carbitol solvent, aniline, triethylamine, pyridine, acetic acid, guess, carbon disulfide, N,N-dimethyl decylamine 'N-methylpyrrolidone and the like: Among them, a ketone or a celecoxime solvent is preferred. Further, the solvent used in the synthesis of the episulfide compound may not be removed and may be directly contained in the ninth curable resin composition. The first curable resin composition can be cured by heat treatment. The heat treatment is preferably carried out at a temperature of from 100 to 30 (the range of TC is from 1 Torr to 24 Torr.. Next, the new lysine sulfide compound represented by the above formula (1) or (11) and the energy ray sensitivity are contained. The sclerosing tree sputum of the present invention, which is a cationic polymerization initiator, and the following (also referred to as a second curable resin composition) will be described. In part, the above description of the episulfide compound and the curable resin composition can be suitably used. The upper slit line sensitivity initiator is irradiated by energy ray sensitivity, specifically, as described below. A compound capable of releasing a substance which initiates polymerization by irradiation of an energy ray. The above-mentioned energy ray-sensitive cationic polymerization initiator is particularly preferable as a Lewis acid released by energy ray-sensitive irradiation. The rust complex salt or its derivative 1 is a representative of the compound and can be listed as a salt of a cation and an anion represented by the formula [A] [B; p. Here, the cation [A]y+ is preferably Rust, its structure can be, for example, [(R)xQ]y+ The eight-foot scale has a carbon number of 1 to 60, and may contain an organic base other than a few carbons. The organic base of 150139.doc •36·201120022, x is an integer from 1 to 5. Each R is independent and can be the same. Further, it is preferred that at least one of the X R groups is an aromatic group. Q is selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, 〇, I, Br, ci, j? An atom or a group of atoms in a group consisting of N = N. Further, when the valence of Q in the cation [A]y+ is z, the relationship of y = xz is established. Further, the anion [B] Y- is a halide complex, and its structure can be represented, for example, by [LXs]y. Further, L is a metal ruthenium metal (Metalloid) which is a central atom of a halide complex, and is B, P, As, Sb, Fe, Sn, Bi, A1, Ca, In, Ti, Zn, Sc 'V, Cr, Μη, Co, etc. X is a halogen atom. s is an integer of 3 to 7. Further, an anion [B]y - In the case where the atomic valence of t is set to t, it is important that the relationship of y = s_t is established. Specific examples of the anion [LXs]y- of the above formula include tetrafluoroborate (BF4)··hexafluoro Phosphate (PL)-, hexafluoroantimonic acid (sbF6)., hexafluoroarsenate (AsF6)-, hexafluoroantimonate (sbcu)-, etc., preferably hexafluoroantimonate (SbF6)_. Also, as an anion [B]y·, can be used [ LXs-丨(〇H)]y- structure. L, X, and S are the same as above. Further, as other anions which can be used, perchloric acid ions (cl〇4)_, trifluoroantimony A sulfite ion (CFsSO3), a fluorosulfonate ion (FS〇3), a toluenesulfonic acid anion, a trinitrobenzenesulfonic acid anion, or the like. Further, tetrakis(pentafluorophenyl)borate can also be used as the anion [B]y·. In the present invention, the use of an aromatic rust salt in such an onium salt is particularly effective. Among them, the Japanese Patent Laid-Open No. 50-15, 1997, Sakamoto 150139.doc • 37-201120022 Lie Kaikai 5 (M5880 published in the bulletin No. 50-151997曰 专利 专利 专利 专利 专利 专利 专利 专利 专利 52 52 52 52 52 52 52 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 -30 Quaternary rust salt, the VA aromatic rust salt disclosed in Japanese Patent Laid-Open No. 5 (M58698), Japanese Patent Laid-Open Publication No. SHO 56-8428, Japanese Patent Laid-Open Publication No. SHO 56-149402, Japanese Patent Laid-Open The oxo-alked salt disclosed in the specification of the Japanese Patent No. 4139655, which is disclosed in the specification of the Japanese Patent No. 4139655, which is disclosed in the Japanese Patent Application Laid-Open No. Particularly preferred among aromatic iron salts is the following formula (ν), (νυ or (VII) [Chem. 21]

〜K1 4為分別^ 子或者可含有氧原子或 亦可不同之氫原子、鹵素原 子之烴基、或可具有取代基 150139.doc •38· 201120022 之烷氧基,Ar為1個以上之氫原子可經取代之苯基)所示之 銕陽離子之化合物;含有(三異丙苯基)錤陽離子之化合 物;含有雙(第三丁基苯基)錤陽離子之化合物;含有三苯 基銃陽離子之化合物等。 例如可列舉:4-(4-苯曱醯基-苯硫基)苯基-二-(4-氟苯基) 銃六氟磷酸鹽;4,4’-雙[雙((β-羥乙氧基)苯基)鈒基]笨硫 醚-雙-六氟磷酸鹽、4,4’-雙[雙((β-羥乙氧基)苯基)鈒基]苯 硫醚-雙-六氟銻酸鹽;4,4'-雙[雙(氟苯基)疏基]苯硫醚-雙-六氟磷酸鹽、4,4’-雙[雙(氟苯基)銕基]苯硫醚-雙-六氟銻酸 鹽;4,4'-雙(二苯基銃基)笨硫醚-雙-六氟磷酸鹽、4,4'-雙 (二苯基锍基)苯硫醚-雙-六氟銻酸鹽;4-(4-苯曱醯基苯硫 基)苯基-二-(4-(β-羥乙氧基)苯基)銃六氟磷酸鹽、4-(4-苯 曱醯基苯硫基)苯基-二-(4-(β-羥乙氧基)苯基)銕六氟銻酸 鹽;4-(4-苯甲醯基苯疏基)苯基-二-(4-氟苯基)锍六氟磷酸 鹽、4-(4-苯曱醯基苯硫基)苯基-二-(4-氟苯基)锍六氟銻酸 鹽;4-(4-苯甲醯基苯硫基)苯基-二苯基锍六氟磷酸鹽、4-(4-苯甲醯基苯硫基)苯基-二苯基锍六氟銻酸鹽;4-(苯硫 基)苯基-二-(4-(β-羥乙氧基)苯基)锍六氟磷酸鹽、4-(苯硫 基)苯基-二-(4-(β-羥乙氧基)苯基)銃六氟銻酸鹽;4-(苯硫 基)苯基-二-(4-氟苯基)疏六氟磷酸鹽、4-(苯硫基)苯基-二-(4-氟苯基)銕六氟銻酸鹽;4-(苯硫基)苯基-二苯基鈒六氟 磷酸鹽、4-(苯硫基)苯基-二苯基銃六氟銻酸鹽;4-(2-氯-4-苯甲醯基苯硫基)苯基雙(4-氟苯基)銕六氟磷酸鹽、4-(2-氣-4-苯曱醯基苯硫基)苯基雙(4-氟苯基)锍六氟銻酸鹽;4- 150139.doc -39· 201120022 (2-氣-4-苯曱醯基苯硫基)苯基二苯基銃六氟磷酸鹽、4-(2-氯-4-苯曱醯基苯硫基)苯基二苯基銕六氟銻酸鹽;4-(2-氣-4-苯曱醯基苯硫基)苯基雙(4-羥苯基)疏六氟磷酸鹽、4-(2-氣-4-苯曱醯基苯硫基)苯基雙(4-羥苯基)疏六氟銻酸鹽;三 苯基銕六氟磷酸鹽、三苯基疏六氟銻酸鹽;(甲苯基異丙 苯基)錤六氟磷酸鹽、(曱苯基異丙苯基)鎭六氟銻酸鹽; (甲苯基異.丙苯基)錤四(五氟苯基)硼酸鹽;雙(第三丁基苯 基)錤六氟磷酸鹽、雙(第三丁基苯基)錤六氟銻酸鹽;雙 (第三丁基苯基)錤四(五氟苯基)硼酸鹽;苄基-4-羥苯基曱 基銃六氟磷酸鹽、节基-4-羥苯基曱基鈒六氟銻酸鹽;苄基 二甲基銃六氟磷酸鹽、苄基二曱基锍六氟銻酸鹽;對氣苄 基-4-羥苯基曱基疏六氟磷酸鹽、對氣节基-4-羥苯基曱基 銃六氟銻酸鹽;4-乙醯氧基苯基二曱基鈹六氟磷酸鹽、4-乙醯氧基苯基二曱基銃六氟銻酸鹽;4-甲氧基羰氧基苯基 二甲基锍六氟磷酸鹽、4-曱氧基羰氧基苯基二曱基銕六氟 銻酸鹽;4-乙氧基羰氧基苯基二曱基銃六氟磷酸鹽、4-乙 氧基羰氧基苯基二曱基銕六氟銻酸鹽;a-萘基曱基二曱基 銃六氟磷酸鹽、α-萘基甲基二曱基銃六氟銻酸鹽;(X-萘基 曱基四氫硫代銖六氟磷酸鹽、α-萘基甲基四氫硫代銖六氟 銻酸鹽;苯烯丙基二曱基锍六氟磷酸鹽、苯烯丙基二甲基 疏六氟銻酸鹽;苯烯丙基四氫硫代銖六氟磷酸鹽、苯烯丙 基四氫硫代銖六氟銻酸鹽;Ν-(α-苯基苄基)氰基吼啶鏽六 氟磷酸鹽、Ν-(α-苯基苄基)-2-氰基吼啶鏽六氟銻酸鹽;Ν-苯烯丙基-2-氰基。比啶鏽六氟磷酸鹽、N-苯烯丙基-2-氰基 150139.doc -40- 201120022 吡啶鏽六氟銻酸鹽;Ν_(α_萘基甲基)_2_氰基吡啶鑌六氟磷 酸鹽、Ν_(α_萘基甲基)-2-氰基°比啶钂六氟銻酸鹽;Ν_节 基-2-氰基。比啶鏽六氟磷酸鹽、Ν·苄基_2_氰基β比啶鏽六氟 銻酸鹽;(4-苯甲醯基苯硫基)苯基雙(4_氟苯基)鎳四(3乃_二 氟-4-甲氧基苯基)硼酸鹽等。 又,作為其他較好者,亦可列舉二甲苯_環戊二烯基鐵 (Π)六氟銻酸鹽、異丙苯-環戊二烯基鐵(11)六氟磷酸鹽、 一甲苯-環戊二烯基鐵(π)_5(三氟甲基磺醯基)曱烷化物等 鐵/芳烴錯合物、鋁錯合物/光分解矽化物系起始劑等。 上述能量線敏感性陽離子聚合起始劑可使用〗種或將2種 以上混合使用。又,亦可混合使用第丨硬化性樹脂組合物 中所使用之硬化劑。上述能量線敏感性陽離子聚合起始劑 之使用量或上述能量線敏感性陽離子聚合起始劑與硬化劑 之合計使用量,相對於上述環硫化物化合物1〇〇質量份, 為0.05〜20質量份。若該使用量未滿〇 〇5質量份則硬化性 樹脂組合物之硬化變得不充分,產生變形或不均或加熱時 產生龜裂,因此不理想。又,若該使用量超過5〇質量份, 則使硬化性樹脂組合物硬化所形成之接著層中之離子性物 質之含量會增加,因此硬化物之吸濕性變高,無法充分地 獲得耐久性能。上述能量線敏感性陽離子聚合起始劑之更 佳使用量,相對於上述環硫化物化合物i 質量份,為〇 5 質量份〜15質量份。 又’第2硬化性樹脂組合物中亦可添加第^更化性樹脂組 合物之說明中例示之任意之添加物。於第2硬化性樹脂組 150139.doc -41 - 201120022 口物中,該等任意之添加物相對於上述環硫化物化合物 100質量份較好的是合計為500質量份以下。 第2硬化性樹脂組合物中亦可含有溶劑。於此情形時, 關於浴劑之使用量,較好的是使上述環硫化物化合物、上 述旎S:線敏感性陽離子聚合起始劑及/或上述硬化劑之合 汁3里於第2硬化性樹脂組合物中為較好的是5〜9〇質量 %、進而較好的是10〜50質量%之範圍。作為該溶劑之具體 例可列舉第1硬化性樹脂組合物中例示之溶劑,其中, 車乂好的疋酮類或赛珞蘇系溶劑。又,亦可不去除合成上述 環硫化物化合物時所使用之溶劑,使其直接含於第2硬化 性樹脂組合物中。 第2硬化性樹脂組合物可藉由照射紫外線等能量線而通 常於0.1秒〜數分鐘後硬化為指觸乾燥狀態或溶劑不溶性之 狀態。作為適當之能量線,只要誘導陽離子聚合起始劑之 分解則可為任意者,較好的是利用由超高、高、中、低壓 水銀燈、4氣燈、碳弧燈、金屬齒素燈、螢光燈、鶴絲 燈、準分子燈、殺菌燈、準分子雷射 '氮雷射、氬離子雷 射、氦鎘雷射、氦氖雷射、氪離子雷射、各種半導體雷 射、YAG(Yttrium Aluminium Garnet,記鋁石權石)雷射' 發光二極體、CRT(Cath〇de Ray Tube,陰極射線管)光源等 獲得之具有2000埃至7000埃之波長的電磁波能量線或電子 束、X射線、放射線等高能量線。 又,第2硬化性樹脂組合物亦可藉由加熱處理而硬化。 較好的是若於能量線照射前後適當進行加熱處理,則可獲 150139.doc •42· 201120022 得品質良好之硬化物。 以上說明之第1及第2硬化性樹脂組合物除你* ’下為以下說明 之硬化物之用途以外,亦可用作墨水、保1 °又哄、塗料、塗 佈劑、接著劑、絕緣材、構造材、光碟、密4 封劑、光造形 其次,就對第1及/或第2硬化性樹脂組合物進行力孰 或照射能量線所獲得之本發明之硬化物加以 ^ °疋刊。再者, 於以下之說明中’關於未特別說明之部分, 週虽使用上 述環硫化物化合物以及第1及第2硬化性樹脂組合物中之說 明之内容。 關於加熱及能量線照射等之條件,如先前所說明。 本發明之硬化物之形狀並無特別限定,例如可列舉透鏡 狀、薄膜狀、稜鏡狀、板狀等。進而亦可藉由使其於其他 材料上硬化而包覆或密封其他材料。 本發明之硬化物於光學透鏡、光學薄膜、導光板、波導 官、光學元件、光連接器等光學零件中有用。 實施例 以下,例示實施例及比較例而進一步詳細地說明本發 明,但本發明並不限定於該等實施例等。實施例卜丨〜卜3 表示本發明之新穎環硫化物化合物之製造例,實施例2_ 2 8表不第丨及第2硬化性樹脂組合物之製造例及評估 例,比較例2-卜2-7表示比較硬化性樹脂組合物之製造例 及-平估例。實施例弘卜㈠表示使第】硬化性樹脂組合物硬 而成之硬化物之製造例及評估例比較例3 _ 1表示比較 150I39.doc •43- 201120022 硬化物之製造例及評估例。實施例4-1及4-2表示使第2硬化 性樹脂組合物硬化而成之硬化物之製造例及評估例,比較 例4-1〜4-3表示比較硬化物之製造例及評估例。 [實施例1-1]環硫化物化合物A—丨之製造 於附有攪拌裝置及溫度計之三口燒瓶中,加入1,1 _雙(4_ (2,3-環氧丙氧基)苯基)_3•苯基茚滿1〇〇〇 g、四氫呋喃2兄 g及乙醇60.0 g,充分地攪拌而使其溶解。向其中加入硫脲 44.2 g,加熱至45 C並攪拌18小時❾此後添加曱苯3〇〇 mL、乙酸乙醋200 mL及水3〇〇 mL,利用分液漏斗進行清 洗,廢棄水層。進而將有機層以1〇%食鹽水3〇〇 mL清洗2 次後,制無水硫酸錢其充分地乾燥,進行脫溶劑而獲 得粗產物。利用㈣管柱層析法(展開溶劑:甲苯)對該粗 產物進行分㈣化’以產率69%獲得73G g無色黏稠性固 體(環硫化物化合物(Α_1))β各種分析之結果,確認該 黏稍性固體為本發明之環硫化物化合 ㈣之化合物)。由元素分析值求得之環氧乙燒環取代= 硫乙烷環之硫取代率為98%»將分析妹果示於 [化22] 、、口不;下文。 之n=〇之化合物) 環硫化物化合物(化合物Ν〇.53中~K1 4 is a respective or a hydrocarbyl group which may contain an oxygen atom or a different hydrogen atom or a halogen atom, or an alkoxy group which may have a substituent 150139.doc •38·201120022, and Ar is one or more hydrogen atoms. a compound of a phosphonium cation represented by a substituted phenyl group; a compound containing a (triisopropylphenyl)phosphonium cation; a compound containing a bis(t-butylphenyl)phosphonium cation; and a triphenylphosphonium cation Compounds, etc. For example, 4-(4-phenylmercapto-phenylthio)phenyl-di-(4-fluorophenyl)phosphonium hexafluorophosphate; 4,4'-bis[double ((β-hydroxyl) Oxy)phenyl)indolyl] stupyl sulfide-bis-hexafluorophosphate, 4,4'-bis[bis((β-hydroxyethoxy)phenyl)indolyl]phenyl sulfide-bis-six Fluoride; 4,4'-bis[bis(fluorophenyl)) phenyl sulfide-bis-hexafluorophosphate, 4,4'-bis[bis(fluorophenyl)indenyl]benzenesulfide Ether-bis-hexafluoroantimonate; 4,4'-bis(diphenylfluorenyl) thioether-bis-hexafluorophosphate, 4,4'-bis(diphenylfluorenyl) phenyl sulfide - bis-hexafluoroantimonate; 4-(4-phenylmercaptophenylthio)phenyl-bis-(4-(β-hydroxyethoxy)phenyl)phosphonium hexafluorophosphate, 4-( 4-phenylmercaptophenylthio)phenyl-bis-(4-(β-hydroxyethoxy)phenyl)phosphonium hexafluoroantimonate; 4-(4-benzylidenebenzoyl)benzene -di-(4-fluorophenyl)phosphonium hexafluorophosphate, 4-(4-phenylmercaptophenylthio)phenyl-di-(4-fluorophenyl)phosphonium hexafluoroantimonate; -(4-Benzylmercaptophenylthio)phenyl-diphenylphosphonium hexafluorophosphate, 4-(4-benzylidenephenylthio)phenyl-diphenylphosphonium hexafluoroantimonate; 4 -(phenylthio)phenyl-bis-(4-(β-hydroxyethoxy)phenyl)phosphonium hexafluorophosphate, 4-(phenylthio)phenyl-di-(4-(β-hydroxyl) Ethoxy)phenyl)indole hexafluoroantimonate; 4-(phenylthio)phenyl-di-(4-fluorophenyl)phosphorus hexafluorophosphate, 4-(phenylthio)phenyl-di -(4-fluorophenyl)phosphonium hexafluoroantimonate; 4-(phenylthio)phenyl-diphenylphosphonium hexafluorophosphate, 4-(phenylthio)phenyl-diphenylphosphonium hexafluorophosphate Citrate; 4-(2-chloro-4-benzylidenephenylthio)phenylbis(4-fluorophenyl)phosphonium hexafluorophosphate, 4-(2- gas-4-phenylindole Phenylthio)phenylbis(4-fluorophenyl)phosphonium hexafluoroantimonate; 4-150139.doc -39· 201120022 (2-Ga-4-phenylmercaptophenylthio)phenyldiphenyl Hexafluorophosphate, 4-(2-chloro-4-phenylnonylphenylthio)phenyldiphenylphosphonium hexafluoroantimonate; 4-(2- gas-4-phenylmercaptobenzenesulfide Phenyl bis(4-hydroxyphenyl) hexafluorophosphate, 4-(2- gas-4-phenylmercaptophenylthio)phenyl bis(4-hydroxyphenyl) hexafluoroantimonic acid Salt; triphenylsulfonium hexafluorophosphate, triphenyl hexafluoroantimonate; (tolylcumyl) sulfonium hexafluorophosphate, Phenyl cumyl) hexafluoroantimonate; (tolyliso-propylphenyl) ruthenium tetrakis(pentafluorophenyl)borate; bis(t-butylphenyl)phosphonium hexafluorophosphate, double (t-butylphenyl)phosphonium hexafluoroantimonate; bis(t-butylphenyl)phosphonium tetrakis(pentafluorophenyl)borate; benzyl-4-hydroxyphenylindenylphosphonium hexafluorophosphate , benzyl 4-hydroxyphenyl fluorenyl hexafluoroantimonate; benzyl dimethyl sulfonium hexafluorophosphate, benzyl dimercapto hexafluoroantimonate; p-benzyl benzyl hydroxybenzene曱 曱 疏 六 氟 磷酸盐 、 对 对 对 对 对 对 对 对 -4- ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Phenyl phenyl fluorenyl hexafluoroantimonate; 4-methoxycarbonyloxyphenyl dimethyl sulfonium hexafluorophosphate, 4-decyloxycarbonyloxyphenyl ruthenium hexafluoroantimonate a salt; 4-ethoxycarbonyloxyphenyldifluorenylphosphonium hexafluorophosphate, 4-ethoxycarbonyloxyphenyldifluorenylphosphonium hexafluoroantimonate; a-naphthylfluorenyldifluorenyl Hexafluorophosphate, α-naphthylmethyldifluorenyl hexafluoroantimonate; (X-naphthylfluorenyltetrahydrothiophosphonium hexafluorophosphate Α-naphthylmethyltetrahydrothiophosphonium hexafluoroantimonate; phenylallyldimethylhydrazine hexafluorophosphate, phenylallyldimethyl hexafluoroantimonate; phenylallyl tetrahydrogen Thiophosphonium hexafluorophosphate, phenallyl tetrahydrothiophosphonium hexafluoroantimonate; Ν-(α-phenylbenzyl)cyanoguanidine rust hexafluorophosphate, Ν-(α-phenyl Benzyl)-2-cyanoguanidine rust hexafluoroantimonate; fluorenyl-phenylallyl-2-cyano. Pyridine hexafluorophosphate, N-phenylallyl-2-cyano 150139.doc -40- 201120022 Pyridine rust hexafluoroantimonate; Ν_(α_naphthylmethyl)_2-cyanopyridinium Fluorophosphate, Ν_(α_naphthylmethyl)-2-cyano-pyridinium hexafluoroantimonate; Ν_knotyl-2-cyano. Pyridine hexafluorophosphate, Ν·benzyl-2-cyanopyrene pyridyl hexafluoroantimonate; (4-benzylidene phenylthio)phenyl bis(4-fluorophenyl)nickel tetra (3 Na-difluoro-4-methoxyphenyl) borate. Further, as other preferred ones, xylene-cyclopentadienyl iron (rhodium) hexafluoroantimonate, cumene-cyclopentadienyl iron (11) hexafluorophosphate, mono-toluene- An iron/aromatic hydrocarbon complex such as a cyclopentadienyl iron (π)-5 (trifluoromethylsulfonyl) decane compound, an aluminum complex/photodecomposition telluride initiator, and the like. The above-mentioned energy ray-sensitive cationic polymerization initiator may be used in combination or in combination of two or more. Further, a curing agent used in the ninth curable resin composition may be used in combination. The amount of the energy ray-sensitive cationic polymerization initiator to be used or the total amount of the energy ray-sensitive cationic polymerization initiator and the hardener to be used is 0.05 to 20 by mass based on 1 part by mass of the above episulfide compound. Share. When the amount of use is less than 5 parts by mass, the curing of the curable resin composition is insufficient, and deformation or unevenness or cracking occurs during heating, which is not preferable. In addition, when the amount of use exceeds 5 parts by mass, the content of the ionic substance in the adhesive layer formed by curing the curable resin composition increases, so that the hygroscopic property of the cured product becomes high, and durability cannot be sufficiently obtained. performance. The amount of the energy-sensitive cationic polymerization initiator to be used is preferably from 5 parts by mass to 15 parts by mass based on the mass of the episulfide compound i. Further, any of the additives exemplified in the description of the second modified resin composition may be added to the second curable resin composition. In the second curable resin group 150139.doc -41 - 201120022, the above-mentioned optional additives are preferably 500 parts by mass or less based on 100 parts by mass of the above-mentioned episulfide compound. The second curable resin composition may also contain a solvent. In this case, it is preferred that the amount of the bathing agent used is such that the above-mentioned episulfide compound, the above-mentioned 旎S: line-sensitive cationic polymerization initiator, and/or the above-mentioned hardener are in the second hardening. The resin composition is preferably in the range of 5 to 9 % by mass, more preferably 10 to 50% by mass. Specific examples of the solvent include the solvents exemplified in the first curable resin composition, and the oxime or celecoxime-based solvent. Further, the solvent used in the synthesis of the above episulfide compound may not be removed and may be directly contained in the second curable resin composition. The second curable resin composition can be cured to a dry state or a solvent-insoluble state by irradiating an energy ray such as ultraviolet rays for usually from 0.1 second to several minutes. As an appropriate energy line, any decomposition can be carried out as long as the decomposition of the cationic polymerization initiator is induced, and it is preferred to use an ultra high, high, medium and low pressure mercury lamp, a 4-gas lamp, a carbon arc lamp, a metal gutta lamp, Fluorescent lamps, crane lamps, excimer lamps, germicidal lamps, excimer laser 'nitrogen lasers, argon ion lasers, cadmium cadmium lasers, helium lasing lasers, helium ion lasers, various semiconductor lasers, YAG (Yttrium Aluminium Garnet, Aluminium Stone) Laser Electromagnetic Energy Line or Electron Beam with a wavelength of 2000 Å to 7000 Å obtained from a light-emitting diode, CRT (Cath〇de Ray Tube) source, etc. High-energy lines such as X-rays and radiation. Further, the second curable resin composition may be cured by heat treatment. It is preferred that if the heat treatment is properly performed before and after the irradiation of the energy ray, a cured product of good quality can be obtained 150139.doc • 42· 201120022. The first and second curable resin compositions described above can be used as an ink, a coating, a coating agent, an adhesive, and an insulation, in addition to the use of the cured product described below. The material, the structural material, the optical disk, the dense sealant, and the light-cured material, and the hardened material of the present invention obtained by energizing or irradiating the first and/or second curable resin composition, . In the following description, the contents of the above-described episulfide compound and the first and second curable resin compositions are used for the portions which are not particularly described. Conditions regarding heating and energy line irradiation, etc., as previously explained. The shape of the cured product of the present invention is not particularly limited, and examples thereof include a lens shape, a film shape, a braid shape, and a plate shape. Further, other materials may be coated or sealed by hardening them on other materials. The cured product of the present invention is useful for optical components such as optical lenses, optical films, light guide plates, waveguides, optical elements, and optical connectors. EXAMPLES Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the invention is not limited to the examples and the like. EXAMPLES 丨 卜 卜 卜 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示 表示-7 shows a production example and a flat evaluation example of the comparative curable resin composition. (Example 1) A production example and evaluation example of the cured product obtained by hardening the sclerosing resin composition Comparative Example 3 _ 1 shows a comparison example and a evaluation example of the cured product of 150I39.doc • 43-201120022. Examples 4-1 and 4-2 show production examples and evaluation examples of the cured product obtained by curing the second curable resin composition, and Comparative Examples 4-1 to 4-3 show production examples and evaluation examples of the comparatively cured product. . [Example 1-1] An episulfide compound A-manufactured in a three-necked flask equipped with a stirring device and a thermometer, and 1,1 bis(4-(2,3-epoxypropoxy)phenyl) was added. _3•Phenylindene 1 〇〇〇g, tetrahydrofuran 2 brother g, and ethanol 60.0 g were thoroughly stirred to dissolve. 44.2 g of thiourea was added thereto, and the mixture was heated to 45 C and stirred for 18 hours. Thereafter, 3 〇〇 mL of hydrazine, 200 mL of ethyl acetate and 3 mL of water were added, and the mixture was washed with a separating funnel to discard the aqueous layer. Further, the organic layer was washed twice with 3 〇〇 mL of 1% aqueous saline, and then dried over anhydrous sulfuric acid to carry out desolvation to obtain a crude product. The crude product was subjected to (four) column chromatography (developing solvent: toluene) to obtain a result of various analyses of 73 g g of a colorless viscous solid (cyclosulfide compound (Α_1)) β in a yield of 69%. The viscous solid is a compound of the episulfide compound (4) of the present invention). Ethylene oxide ring substitution determined by elemental analysis value = sulfur substitution rate of thioethane ring is 98%»The analysis of the sister fruit is shown in [22], and the mouth is not; n=〇 compound) an episulfide compound (compound Ν〇.53)

(分析結果) 150139.doc • 44- 201120022 (1) W-NMR之化學位移(DMSO-d6,35°C) : (ppm) 2.42-2.45 (m: 2H), 2.49-2.73 (m: 3H), 3.15-3.20 (m: 1H), 3.26-3.37 (m: 2H), 3.95-4.02 (m: 2H), 4.07-4.16 (m: 3H), 6.78 (d: 1H), 6.86-6.96 (m: 4H), 7.01-7.07 (m: 3H), 7.08-7.13 (m: 2H),7.15-7.26 (m: 5H), 7.30-7.35 (m: 2H)。 (2) 利用元素分析所獲得之硫含量(利用DIA Instruments公 司製造之TOX-100所獲得之測定含量) 實測值:12.1%、理論值:12.3%。 (3) IRCcm·1) 3027、2868、1605、1579、1507、1468、1454、1397、 1292、1245、1181、1118、1032、1011、828、779、 756 ' 736 > 701 [實施例1 -2]環硫化物化合物a-2之製造。 於附有攪拌裝置及溫度計之三口燒瓶中,加入丨,;! ·雙(4_ (2,3-環氧丙氧基)苯基)-3,5-二苯基茚滿5〇.〇 g、四氫呋喃 270 g及乙醇30_0 g,充分地攪拌而使其溶解。向其中加入 硫脲14.8 g,於室溫下攪拌48小時。此後添加甲笨1〇〇〇 mL 與水300 mL,利用分液漏斗進行清洗’廢棄水層。進而將 有機層以10%食鹽水300 mL清洗2次,利用無水硫酸鎂使 其充分地乾燥後,進行脫溶劑,以產率95%獲得5〇2 §無 色固體(環硫化物化合物(Α-2))β各種分析之結果確認該 無色固體為本發明之環硫化物化合物(化合物Ν〇.44中之 n=0之化合物)。由元素分析值求得 N仔之%氧乙烷環取代成環 硫乙烷環之硫取代率為96%。將分析結果示於下文。 150139.doc -45- 201120022 [化 23] 環硫化物化合物(化合物No.44中之n=0之化合物)(Analytical results) 150139.doc • 44- 201120022 (1) Chemical shift of W-NMR (DMSO-d6, 35 °C): (ppm) 2.42-2.45 (m: 2H), 2.49-2.73 (m: 3H) , 3.15-3.20 (m: 1H), 3.26-3.37 (m: 2H), 3.95-4.02 (m: 2H), 4.07-4.16 (m: 3H), 6.78 (d: 1H), 6.86-6.96 (m: 4H), 7.01-7.07 (m: 3H), 7.08-7.13 (m: 2H), 7.15-7.26 (m: 5H), 7.30-7.35 (m: 2H). (2) The sulfur content obtained by elemental analysis (measured by TOX-100 manufactured by DIA Instruments). Measured value: 12.1%, theoretical value: 12.3%. (3) IRCcm·1) 3027, 2868, 1605, 1579, 1507, 1468, 1454, 1397, 1292, 1245, 1181, 1118, 1032, 1011, 828, 779, 756 '736 > 701 [Example 1 - 2] Manufacture of episulfide compound a-2. In a three-necked flask equipped with a stirring device and a thermometer, 丨, ! bis(4_(2,3-epoxypropoxy)phenyl)-3,5-diphenylfluorene 5 〇.〇g 270 g of tetrahydrofuran and 30_0 g of ethanol were sufficiently stirred to dissolve. 14.8 g of thiourea was added thereto, and the mixture was stirred at room temperature for 48 hours. Thereafter, a solution of 1 〇〇〇 mL and 300 mL of water was added, and the waste water layer was cleaned by a separatory funnel. Further, the organic layer was washed twice with 300 mL of 10% saline solution, and sufficiently dried with anhydrous magnesium sulfate, and then subjected to solvent removal to obtain 5 〇2 in a yield of 95%. § Colorless solid (anthracene compound (Α- 2)) The results of various analyses of β confirmed that the colorless solid was the episulfide compound of the present invention (the compound of n = 0 in the compound 44. 44). From the elemental analysis value, the sulfur substitution rate of the N-oxygenethane ring substituted into the ring thioethane ring was 96%. The results of the analysis are shown below. 150139.doc -45- 201120022 [Chem. 23] an episulfide compound (a compound of n=0 in compound No. 44)

(分析結果) (l/H-NMR之化學位移(DMSO-d6,35。〇 : (ppm) 2.50 (d: 1H), 2.65 (d: 1H), 2.68-2.71 (m: 2H), 2.76-2.82 (m: 1H), 3.21-3.36 (m: 3H), 3.80-3.86 (m: 1H), 4.00-4.03 (m: 1H), 4.10-4.15 (m: 1H), 4.18-4.24 (m: 1H), 4.26-4.31 (m: 1H), 6.88-6.92 (m: 4H), 6.98 (s: 1H), 7.05-7.09 (m: 2H), 7.14-7.20 (m: 3H),7.25-7.41 (m: 8H),7.48-7.55 (m: 3H)。 (2) 利用元素分析所獲得之硫含量(利用dia Instruments公 司製造之TOX-100所獲得之測定含量) 實測值:10.3%、理論值:10.7%。 (3) IRCcm·1) 3027、2925、1604、1579、1508、1475、1298、1245、 1181、1035、914、830、763、701 [實施例1-3]環硫化物化合物A-3之製造。 於附有攪拌裝置及溫度計之三口燒瓶中,加入雙[4_ (2,3-環氧丙氧基)苯基]環己基(4-聯笨基)甲烷3〇〇 g、i ^ 二号烷150 g及乙醇30_0 g ’充分地攪拌而使其溶解。向其 中加入硫脲10.2 g,於5(TC下攪拌24小時,此後添加甲苯 150139.doc •46· 201120022 300 mL、乙酸乙酯200 mL及水3〇〇 mL,利用分液漏斗進 行清洗,廢棄水層。進而將有機層以】0%食鹽水之 清洗2次,利用無水硫酸鎂使其充分地乾燥後進行脫溶 劑,使白色粉末狀之結晶析出。將該結晶以甲苯與己院加 以清洗,充分地使其乾燥,以產率71%獲得22 5 g無色結 晶(環硫化物化合物(A-3))。各種分析之結果,確認該無色 結晶為本發明之環硫化物化合物(化合*N〇1中之n=〇之化 合物)。由元素分析值求得之環氧乙烷環取代成環硫乙烷 環之硫取代率為92% »將分析結果示於下文。 [化 24] 環硫化物化合物(化合物No.!中之n=〇之化合物)(Analytical results) (Chemical shift of l/H-NMR (DMSO-d6, 35. 〇: (ppm) 2.50 (d: 1H), 2.65 (d: 1H), 2.68-2.71 (m: 2H), 2.76- 2.82 (m: 1H), 3.21-3.36 (m: 3H), 3.80-3.86 (m: 1H), 4.00-4.03 (m: 1H), 4.10-4.15 (m: 1H), 4.18-4.24 (m: 1H ), 4.26-4.31 (m: 1H), 6.88-6.92 (m: 4H), 6.98 (s: 1H), 7.05-7.09 (m: 2H), 7.14-7.20 (m: 3H), 7.25-7.41 (m : 8H), 7.48-7.55 (m: 3H) (2) Sulfur content obtained by elemental analysis (measured by TOX-100 manufactured by dia Instruments) Measured value: 10.3%, theoretical value: 10.7 (3) IRCcm·1) 3027, 2925, 1604, 1579, 1508, 1475, 1298, 1245, 1181, 1035, 914, 830, 763, 701 [Example 1-3] episulfide compound A-3 Manufactured in a three-necked flask equipped with a stirring device and a thermometer, adding bis[4_(2,3-epoxypropoxy)phenyl]cyclohexyl(4-phenyl)methane, 3〇〇g, i ^ 150 g of dioxane and 30_0 g of ethanol were dissolved sufficiently to dissolve. 10.2 g of thiourea was added thereto, and stirred at 5 (TC for 24 hours, after which toluene was added 150139.doc • 46·201120022) 300 mL, 200 mL of ethyl acetate and 3 mL of water were washed with a separatory funnel to discard the aqueous layer. The organic layer was washed twice with 0% saline solution and dried thoroughly with anhydrous magnesium sulfate. Thereafter, the solvent was removed to precipitate a white powdery crystal. The crystal was washed with toluene and a house, and sufficiently dried to obtain 22 5 g of a colorless crystal (a sulfide compound (A-3) in a yield of 71%. )). As a result of various analyses, it was confirmed that the colorless crystal is the episulfide compound of the present invention (the compound of n=〇 in the compound *N〇1). The oxirane ring obtained by the elemental analysis value is substituted into a ring. The sulfur substitution rate of the thioethane ring is 92%. The results of the analysis are shown below. [Chemical 24] The episulfide compound (n=the compound of the compound No.!)

(分析結果) (1)丨H-NMR之化學位移(DMS〇_d6,25〇c广 0.99-1.10 1.30-1.52 (m:5H)j2.〇7 2.3〇 (d: 2H), 2.51 (d: 2H), 3.14-3.22 (m: 2H)5 3.80 (dd: 2H), 3.86 (s:㈤,2H),6.61_6.66 (m: 4H),6 86 6 % (m: _,7.2G.7.25 (m: 1H),7.31_7.37 (m: 2H),7 44 (d π), 7.57 (d: 2H)。 ⑺利用元素分析所獲得之硫含量(利用 insuu_ts公 司製造之τοχ-100所獲得之測定含量) 150139.doc •47· 201120022 實測值:10.1%、理論值:11.〇〇/。 (3) IR(cm*') 2929、2845、1606 ' 1508、1236、1181、1032、824、 764 ' 763 [實施例2-1-2-8及比較例2·1〜2-7]硬化性樹脂組合物 Ν 〇. 1 ~Ν 〇 · 8及比較硬化性樹脂組合物ν〇 · 9〜Ν〇. 15之製造 根據[表1 ]之調配比率將上述製造例1〜3中製造之環硫化 物化合物(Α-1)〜(Α-3)及稀釋劑(C-1)或(C-2)混合,加熱至 100°C進行攪拌而使其溶解後,降溫至60〇c,添加熱硬化 劑(D-ι)或陽離子聚合起始劑(D_2)攪摔1〇分鐘,分別製作 硬化性樹脂組合物No. 1〜No.8。又’根據[表2]之調配比 率,使用下述所示之比較化合物(B — i)〜(Β·3)代替本發明之 環硫化物化合物,利用相同之操作製作比較硬化性樹脂組 合物Νο·9〜Νο.15。評估所獲得之組合物之溶解性。將結果 示於[表1]及[表2]。 (Β-1)2,2-雙(4-(2,3-環硫基丙氧基)苯基)丙烧 (Β-2)9,9-雙(4-(2,3-環硫基丙氧基)苯基)苐 (B-3)l,l-雙(4-(2,3-環氧丙氧基)苯基)-3_苯基茚滿 (C-l)Adeka Resin EP-4100E(ADEKA股份有限公司製造): 雙酚A型環氧樹脂):稀釋劑 (C-2)環氧丙基苯基醚:稀釋劑 (D-1 )2-乙基-4-甲基咪唑:熱硬化劑 (D-2)4-(2-氣-4-苯甲醯基苯硫基)苯基雙(4•氟苯基)疏六氟 銻酸鹽(Adeka Optomer SP-172,ADEKA股份有限公司製 I50139.doc -48- 201120022 始劑(Analysis results) (1) Chemical shift of 丨H-NMR (DMS〇_d6, 25〇c wide 0.99-1.10 1.30-1.52 (m:5H)j2.〇7 2.3〇(d: 2H), 2.51 (d : 2H), 3.14-3.22 (m: 2H)5 3.80 (dd: 2H), 3.86 (s: (five), 2H), 6.61_6.66 (m: 4H), 6 86 6 % (m: _, 7.2G .7.25 (m: 1H), 7.31_7.37 (m: 2H), 7 44 (d π), 7.57 (d: 2H) (7) Sulfur content obtained by elemental analysis (using τοχ-100 manufactured by insuu_ts) The measured content obtained) 150139.doc •47· 201120022 Measured value: 10.1%, theoretical value: 11.〇〇/. (3) IR(cm*') 2929, 2845, 1606 ' 1508, 1236, 1181, 1032 824, 764 '763 [Example 2-1-2-8 and Comparative Example 2·1 to 2-7] Curable resin composition Ν 1. 1 ~ Ν 〇 · 8 and comparative curable resin composition ν 〇 - 9~Ν〇. 15 Production The episulfide compound (Α-1)~(Α-3) and the diluent (C-1) produced in the above Production Examples 1 to 3 were prepared according to the blending ratio of [Table 1]. Or (C-2) mixing, heating to 100 ° C, stirring to dissolve, cooling to 60 ° C, adding thermal hardener (D-I) or cationic polymerization initiator (D_2) to stir 1 〇 Each of the curable resin compositions No. 1 to No. 8 was produced, and the comparative compounds (B - i) to (Β·3) shown below were used instead of the present invention according to the blending ratio of [Table 2]. The epoxy resin compound was subjected to the same operation to prepare a comparatively curable resin composition Νο·9~Νο.15. The solubility of the obtained composition was evaluated. The results are shown in [Table 1] and [Table 2]. Β-1) 2,2-bis(4-(2,3-cyclothiopropoxy)phenyl)propan ((-2)9,9-bis(4-(2,3-cyclothio) Propoxy)phenyl)indole (B-3), l-bis(4-(2,3-epoxypropoxy)phenyl)-3_phenylindan (Cl) Adeka Resin EP-4100E (Manufactured by ADEKA Co., Ltd.): Bisphenol A type epoxy resin): Diluent (C-2) Epoxypropyl phenyl ether: Diluent (D-1) 2-Ethyl-4-methylimidazole: Thermal Hardener (D-2) 4-(2-Ga-4-Benzylsulfonylphenylthio)phenylbis(4•fluorophenyl) hexafluoroantimonate (Adeka Optomer SP-172, ADEKA) Ltd. I50139.doc -48- 201120022

造):能量線敏感性陽離子聚合起 f化 25JMade): energy line sensitive cationic polymerization from f 25J

<溶解性> 將所獲得之硬化性樹脂έ且A札K r Λ 曰、,且。物於60〇攪拌10分鐘後,冷 部至室溫,對溶解性進行評估。 丹有D子估標準係將即便 冷卻至室溫亦未發現析出物之情形設為〇,將加熱時溶解 但冷卻至室溫後1天發現析出物之情形設為△’將即便加熱 亦不溶解之情形設為X。 [表1] 實施例 2-1 2-2 2-3 2-4 2-5 2-6 2-7 硬化, 生樹脂組合物 No.l No.2 No.3 No.4 Νο·5 Νο.6 Νο.7 No 8 A-1 25 - • 25 50 33 A-2 - 25 - 33 調 配 A-3 - - 25 33 B-1 - # 看 B-2 - - - 里 量 W B-3 - - 一 C-1 75 75 1 75 75 50 C-2 ] - 67 67 67 D-1 1 1 1 1 1 1 D-2 - _ 2 2 溶解性 〇 〇 〇 〇 〇 〇 〇 〇 150139.doc •49· 201120022 [表2] 比較例 2-1 2-2 2-3 2-4. 2-5 2-6 2·7 比較< 硬化性樹脂組合物 No.9 No. 10 No. 11 No. 12 No. 13 No. 14 No. 15 A-1 - - - • A-2 • - - • 調 配 A-3 - - - B-1 - - 25 一 量 t 景 B-2 25 - - 25 33 B-3 _ - - • 25 C-1 C-2 75 100 75 75 75 100 —:_ 67 D-1 1 1 - _ ] D-2 每 - 2 2 2 2 溶解性 X 〇 〇 X 〇 〇 Δ 由[表1]及[表2]可知,使用比較化合物(B_2)之組合物之 溶解性及保存穩定性較差,相對於此,使用本發明之環硫 化物化合物之實施例2 _ i〜2 _ 8之組合物對稀釋劑之溶解性 優異。又,於比較例2_m4中未溶解,χ,於比較例Η 中冷部至室溫後析出結晶’因此未獲得硬化性樹脂組合 物。 [貫施例3 -1〜3 - 3及比較例3 · 1 ] /所獲得之硬化性樹脂組合物Nq1〜Μ及比較硬化性 气曰、。物Νο·1〇刀別加熱至⑽,塗佈於已實施脫模處 理之玻璃基板上。利用】_ · mm之間隔件與另一塊玻璃將 具夾入並貼合,於】如。广 收s 土 〇〇c加熱1小時,於i5〇t:加熱!小時, 將硬化者設為〇,將未硬 ^ 者°又為x,#估硬化性。又, 對作為硬化物而獲得者士 者6子估折射率及透明性。將結果示於 150139.doc -50- 201120022 [表 3]。 <折射率> 對於所獲得之硬化物,利用Atago股份有限公司製造之 阿貝折射計DR-M2,進行25°C下之D線及e線之折射率…及 - 1之測定。 .[表 3] 實施例3-1 實施例3-2 實施例3-3 比較例3-1 硬化性樹脂組合物 No.l No.2 No.3 No. 10 硬化性 〇 〇. 〇 〇 折射率(D線) 1.604 1.608 1.602 1.592 折射率(e線) 1.611 1.614 1.607 1.596 根據[表3 ]顯然,與包含稀釋劑與熱硬化劑之比較硬化 性樹脂組合物Νο·10(比較例3-1)之硬化物相比較,使用本 發明之環硫化物化合物Α-1〜Α-3之硬化性樹脂組合物 No. 1〜No.3(實施例3-1〜3-3)之硬化物之折射率較高。 [實施例4-1及4-2以及比較例4-1-4-3] 將所獲得之硬化性樹脂組合物Ν〇·4及ν〇·5以及比較硬化 性樹脂組合物No.ll、Νο·13&Ν〇14分別加熱至6〇。〇,塗 佈於已實施脫模處理之玻璃基板上。利用丨〇〇 之間隔 件與另一塊玻璃將其夾入並貼合,利用高壓水銀燈以3〇〇〇 樣m2(合計6000 mJ/cm2)對其玻璃單面進行曝光後於 150°C處理2小時’冷卻至室溫後自玻璃基板剝離。將作為 硬化物所獲得者設為〇,將未硬化者設為乂,評估硬化 性。又’對作為硬化物所獲得者評估折射率及透明性。將 結果示於[表4]〇 150139.doc •51 - 201120022 <折射率> 對於所獲得之硬化物’利用Atago股份有限公司製造之 阿貝折射計DR-M2,進行25°C之D線及e線之折射率!^及1 之測定。 <透明性> 利用日本電色工業股份有限公司製造之測霧計 NDH5000 ’測定所獲得之硬化物之全光線透過率。 [表4] 實施例4-1 實施例4-2 比較例4-1 比較例4-2 比較例4-3 硬化性樹脂組合物 No.4 No.5 No. 11 No. 13 No 14 硬化性 〇 〇 X 〇 〇 折射率(D線) 1.604 1.622 1,600 1 584 折射率(e線) 1.608 1.629 1.606 1 589 全光線透過率 88.9% 87.0% - 83.6% 42.9% 根據[表4]顯然,使用比較化合物(bj)之比較硬化性樹 脂組合物No.ll(比較例4 —丨)之溶解性良好,但硬化性較 差,使用比較化合物(Β·3)之硬化性樹脂組合物版13(比較 例4-2)、及包含稀釋劑與能量線敏感性陽離子聚合起始劑 之比較硬化性树脂組合物Ν〇.丨4(比較例4_3)之硬化性良 好,但折射率及透明性較差。 相對於此,使用本發明之環硫化物化合物A-丨之硬化性 樹脂組合物Νο·4及5(實施例4_4及4_5)之硬化性 '折射率及 透明性優異。 祀據乂上,.„員然’本發明之環硫化物化合物之溶解性優 異’且以含有該等化合物為特徵之本發明之硬化性樹脂組 I50139.doc •52· 201120022 合物可提供硬化性及透明性優異且具有高折射率之硬化 物,於光學材料用途中有用。 150139.doc -53-<Solubility> The obtained curable resin was kneaded and Az Kr Λ ,. The mixture was stirred at 60 ° C for 10 minutes, and then cooled to room temperature to evaluate the solubility. Dan has a D sub-estimation standard, and even if it is cooled to room temperature, no precipitate is found as 〇. When it is dissolved while heating, but it is cooled to room temperature, the precipitate is found to be △', even if it is heated. The case of dissolution is set to X. [Table 1] Example 2-1 2-2 2-3 2-4 2-5 2-6 2-7 Hardening, raw resin composition No. 1 No. 2 No. 3 No. 4 Νο·5 Νο. 6 Νο.7 No 8 A-1 25 - • 25 50 33 A-2 - 25 - 33 Mixing A-3 - - 25 33 B-1 - # 看B-2 - - - 里量 W B-3 - - A C-1 75 75 1 75 75 50 C-2 ] - 67 67 67 D-1 1 1 1 1 1 1 D-2 - _ 2 2 Solubility 〇〇〇〇〇〇〇〇150139.doc •49· 201120022 [Table 2] Comparative Example 2-1 2-2 2-3 2-4. 2-5 2-6 2·7 Comparison < Curable resin composition No. 9 No. 10 No. 11 No. 12 No 13 No. 14 No. 15 A-1 - - - • A-2 • - - • Provisioning A-3 - - - B-1 - - 25 One quantity t bokeh B-2 25 - - 25 33 B-3 _ - - • 25 C-1 C-2 75 100 75 75 75 100 —:_ 67 D-1 1 1 - _ ] D-2 per - 2 2 2 2 Solubility X 〇〇X 〇〇Δ From [Table 1] and [Table 2], it is understood that the composition using the comparative compound (B_2) has poor solubility and storage stability, whereas the embodiment 2 _i~2 _ 8 of the episulfide compound of the present invention is used. Composition versus thin The release agent is excellent in solubility. Further, in Comparative Example 2_m4, it was not dissolved, and in the comparative example, the crystal was precipitated in the cold portion to room temperature. Thus, the curable resin composition was not obtained. [Examples 3 to 1 to 3 - 3 and Comparative Example 3 · 1 ] / The obtained curable resin composition Nq1 to Μ and comparatively hardenable gas enthalpy. The object Ν1·1 is not heated to (10) and applied to the glass substrate on which the mold release treatment has been carried out. Use the spacer of _·mm to sandwich and fit the other piece of glass, for example. Wide collection s soil 〇〇c heating for 1 hour, at i5〇t: heating! In the hour, the hardening is set to 〇, and the harder one is x, and the hardening is evaluated. Further, the refractive index and transparency of the person who was obtained as a cured product were evaluated. The results are shown in 150139.doc -50- 201120022 [Table 3]. <Refractive Index> For the obtained cured product, the refractive index of the D line and the e line at 25 ° C was measured using an Abbe refractometer DR-M2 manufactured by Atago Co., Ltd. [Table 3] Example 3-1 Example 3-2 Example 3-3 Comparative Example 3-1 Curable resin composition No. 1 No. 2 No. 3 No. 10 Curability 〇〇. 〇〇 refracting Rate (D line) 1.604 1.608 1.602 1.592 Refractive index (e-line) 1.611 1.614 1.607 1.596 According to [Table 3], it is apparent that the curable resin composition Νο·10 (Comparative Example 3-1) is contained in comparison with the diluent and the heat hardener. The cured product of the curable resin composition No. 1 to No. 3 (Examples 3-1 to 3-3) of the episulfide compound Α-1 to Α-3 of the present invention is used as compared with the cured product of the present invention. The refractive index is higher. [Examples 4-1 and 4-2 and Comparative Example 4-1-4-3] The obtained curable resin compositions Ν〇·4 and ν〇·5 and comparative curable resin composition No. ll, Νο·13&Ν〇14 is heated to 6〇. Thereafter, it is applied to a glass substrate which has been subjected to mold release treatment. Using a spacer of the crucible and another glass to sandwich and fit it, using a high-pressure mercury lamp to expose one side of the glass with a sample of 3 m (total 6000 mJ/cm 2 ), and then processing at 150 ° C 2 After hours, it was peeled off from the glass substrate after cooling to room temperature. The person who was obtained as the cured product was set to 〇, and the uncured person was set to 乂, and the hardenability was evaluated. Further, the refractive index and transparency were evaluated for those who obtained the cured product. The results are shown in [Table 4] 〇150139.doc •51 - 201120022 <Refractive Index> For the obtained cured product', using the Abbe refractometer DR-M2 manufactured by Atago Co., Ltd., D at 25 ° C Determination of the refractive index of the line and the e line!^ and 1. <Transparency> The total light transmittance of the obtained cured product was measured by a fog meter NDH5000' manufactured by Nippon Denshoku Industries Co., Ltd. [Example 4] Example 4-2 Comparative Example 4-1 Comparative Example 4-2 Comparative Example 4-3 Curable resin composition No. 4 No. 5 No. 11 No. 13 No 14 Curability 〇〇X 〇〇Refractive index (D line) 1.604 1.622 1,600 1 584 Refractive index (e-line) 1.608 1.629 1.606 1 589 Total light transmittance 88.9% 87.0% - 83.6% 42.9% According to [Table 4] Obviously, using comparative compounds The comparatively curable resin composition No. ll (bj) (Comparative Example 4 - 丨) has good solubility, but has poor curability, and a curable resin composition plate 13 of Comparative Compound (Β·3) was used (Comparative Example 4) -2) and a comparative curable resin composition containing a diluent and an energy ray-sensitive cationic polymerization initiator Ν〇. 4 (Comparative Example 4-3) has good curability, but has a poor refractive index and transparency. On the other hand, the curable resin compositions Νο·4 and 5 (Examples 4-4 and 4-5) of the episulfide compound A-ruthenium of the present invention are excellent in the refractive index and transparency. According to the above, the member of the present invention is excellent in the solubility of the episulfide compound of the present invention, and the curable resin group of the present invention characterized by containing the compound I50139.doc • 52· 201120022 can provide hardening. A cured product excellent in properties and transparency and having a high refractive index, useful in optical materials. 150139.doc -53-

Claims (1)

201120022 七、申請專利範圍: i.-種環魏物化合物,其❹下述^⑴ [化1]201120022 VII. Patent application scope: i.- species of ring-wholesale compound, the following ^^(1) [Chemical 1] Τ,A及A表示氧原子或硫原子(其 、一小]、丹t,A1及A2之至 >'一個表示硫原子),Cy表示碳原子數3〜 =別獨立表示破原子數〜基、破原二 j 土、碳原子數7〜2〇之芳基院基、碳原子數WO之雜 子數3〜Μ之料基◎素科,妓基及芳 '元土之亞甲基以及該芳基之鍵結部可由 =鍵:斷’又,z可由鄰接之2彼此形成芳香環·該烧 土、方基、芳基烧基、雜環基、我基及由鄰接之2彼 此所形成之芳香環可由齒素原子取代,n表示〇〜1〇之整 =P表不0〜5之整數,r表示〇〜4之整數;再者,n不為〇 時所存在之光學異構物可為任意異構物)。 2. -種環硫化物化合物,其係以下述通式(Η)所表示. [化 2] ’Τ, A and A represent an oxygen atom or a sulfur atom (its, a small), dan t, A1 and A2 to > 'one represents a sulfur atom), and Cy represents a carbon number of 3 to = independently indicating the number of broken atoms ~ Base, broken original two j soil, carbon atom number 7~2〇 aryl base, carbon number WO miscellaneous number 3~Μ material base ◎Suco, 妓基和芳' meta-methane And the bonding moiety of the aryl group may be replaced by a = bond: ', z may form an aromatic ring from each other adjacent to each other. 2. The burnt earth, the aryl group, the arylalkyl group, the heterocyclic group, the yl group, and the adjacent 2 The formed aromatic ring may be replaced by a fang atom, n represents 〇~1〇, and the integer value of P is not an integer of 0 to 5, and r represents an integer of 〇~4; further, the optical difference existing when n is not 〇 The construct can be any isomer). 2. An episulfide compound represented by the following formula (Η). [Chemical 2] ’ I50139.doc 201120022 (式中’ A1及A2表示氧原子或硫原子(其中,…及^之至 少-個表示硫原子),Y、Yjz分別獨立表示碳原子數 卜10之院基、碳原子數6〜2G之芳基、碳原子數7〜20之芳 基院基、碳原子數2〜2〇之雜環基、碳原子數3〜1G之環院 基或函素原子,該烷基及芳基烷基中之亞f基以及該芳 基之鍵結部可由_〇·、_S_或雙鍵中斷,鄰接可相互 形成環,該烧基、芳基、芳基院基、雜環基及環 二了由齒素原子取代,η表示0〜10之整數,q表示〇〜4 數,q’表示0〜8之整數(其中,q,為(,)χ2以下卜 不0〜4之整數,X表终4之整數,#林4之整數,X 與y之合計為2〜4 ;再者, 可為任意異構物)。 時所存在之光學異構物 3. ^凊求項!之環硫化物化合物,其心下述通式㈣所表 [化3]I50139.doc 201120022 (wherein A1 and A2 represent an oxygen atom or a sulfur atom (wherein at least one of ... and ^ represents a sulfur atom), and Y and Yjz independently represent the number of carbon atoms and the number of carbon atoms An aryl group of 6 to 2G, an aryl group having 7 to 20 carbon atoms, a heterocyclic group having 2 to 2 carbon atoms, a ring-based group having a carbon number of 3 to 1 G, or a hydroxyl atom; The sub-f group in the arylalkyl group and the bond of the aryl group may be interrupted by _〇·, _S_ or a double bond, and adjacent to each other may form a ring, the alkyl group, the aryl group, the aryl group, and the heterocyclic group. And ring 2 is replaced by a fang atom, η represents an integer of 0 to 10, q represents a number of 〇~4, and q' represents an integer of 0 to 8 (where q is (,) χ2 is not 0~4 Integer, the integer of the final 4 of the X table, the integer of #林4, the total of X and y is 2~4; further, it can be any isomer). The optical isomers present at the time 3. The cyclic sulfide compound whose core is represented by the following formula (4) [Chemical 3] (m) ’ A1、A: (式中 不為 4.如 、Ζ、η&Γ與上述通式⑴相同;再 咬時所存在之光學異構物可為任意異構物)。 4項2之環硫化物化合物,其係以下述通式(IV)所表 150139.doc •2- 201120022 示: [化4] [>-^〇(m) 'A1, A: (wherein, 4., Ζ, η & Γ are the same as the above formula (1); the optical isomer present at the time of biting may be any isomer). 4 item 2 ring sulfide compounds, which are represented by the following formula (IV) 150139.doc •2- 201120022: [Chemical 4] [>-^〇 (W) (式中,Y2’與上述通式(II)之Y: A _ , 2 .相同或表示氫原子,… 或2 ’ A及A與上述通式(Π)相同,γΐ、 、+-、s 乙、n、q及r與上 ==目同;再者I不為0時所存在之光學異構物 叮為任意異構物)。 5. ^請求項4之環硫化物化合物,其中上述通式州之乂,為 環硫化 6. -種硬化性樹脂組合物’纟含有如請求項_之 物化合物與硬化劑。 7· 一種硬化性樹脂組合物’其含有如請求項…之環硫化 物化合物與能量線敏感性陽離子聚合起始劑。 8. —種硬化物,其係加埶如諳龙 , 或7之硬化性樹脂組合 物而獲仔者。 9. 一種硬化物,其係對如請求 尺項7之硬化性樹脂組 射能量線而獲得者。 … 150l39.doc 201120022 四、指定代表圖: (一) 本案指定代表圖為:(無) (二) 本代表圖之元件符號簡單說明: 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式: ,(Χ)ρ(W) (wherein Y2' is the same as or represented by Y: A _ , 2 of the above formula (II), or represents a hydrogen atom, ... or 2 'A and A are the same as the above formula (Π), γΐ, , + -, s B, n, q, and r are the same as above ==; in addition, the optical isomer present when I is not 0 is any isomer). 5. The episulfide compound of claim 4, wherein the oxime of the above-mentioned general formula is an episulfide 6. The curable resin composition 纟 contains the compound of claimant and a hardener. A curable resin composition which contains an episulfide compound as claimed in the claims and an energy ray-sensitive cationic polymerization initiator. 8. A hardened material obtained by adding a curable resin composition such as Snapdragon or 7 to a cured person. A cured product obtained by, for example, requesting a curable resin composition energy line of a ruler item 7. ... 150l39.doc 201120022 IV. Designated representative map: (1) The representative representative of the case is: (none) (2) The symbolic symbol of the representative figure is simple: 5. If there is a chemical formula in this case, please reveal the characteristics that can best show the invention. Chemical formula: ,(Χ)ρ (I ) v^+Q-〇X°--^+Q-°> (Z)r (Z)r n Wr (Z)r \_a2(I ) v^+Q-〇X°--^+Q-°> (Z)r (Z)r n Wr (Z)r \_a2 150139.doc150139.doc
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