TW201040203A - Olefin resin, epoxy resin, curable resin composition, and material resulting from curing same - Google Patents

Abstract

Provided is a new alicyclic epoxy resin that is highly curable and, when cured, is highly transparent and has excellent heat- and light-resistance. Said alicyclic epoxy resin is obtained by epoxidizing the starting material thereof, which is an olefin resin represented by formula (1). (In the formula, the multiple instances of R and P each independently represent either hydrogen atoms or C1-15 alkyl groups.)

Description

201040203 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a novel epoxy resin and a maternity hydrocarbon resin which is a raw material thereof, and a curable resin composition suitable for electrical and electronic materials using the epoxy resin. Things. [Prior Art] 环氧树脂 ο Epoxy resin is cured by various hardeners, and is used as a cured product which is excellent in mechanical properties, water, chemical resistance, heat resistance, electrical properties, etc. A wide range of applications such as agents, coatings, laminates, forming materials, injection molding materials, and photoresists. In recent years, in particular, in the field of semiconductor-related materials, there are a large number of electronic devices such as camera functions, mobile phones, ultra-thin liquid crystal and plasma TVs, and light-duty personal computers, such as light, thin, and short keys. The characteristics that are represented by epoxy resin are very high. Especially the front-end package, its structure (4) ncedBGA (EnhancedBal = such as grid array) charm AlTay, enhanced spherical grid) and so on become a concave area facing down (cavhy d〇 need to carry out eight gold ±! m seal 'cannot correspond to transfer molding. Therefore, the development of liquid epoxy resin of 哗·" gong 。. For the same work # for composite materials, car body and the simplicity of its manufacturing method for years _ Tian Zhi,,, mouth material, near

Mo^ng, ^ S^M (Resin Transfer g tree moon 曰 transfer molding). The impregnation of ^ in such a composition is easy and ▲, (4) m fiber, etc., do not smash and smash, and it is expected to be low-viscosity, and it is light-thunder; In related fields, especially with the recent information on the rapid transmission and processing of huge information, the technology for generating optical signals has been developed to replace the previous signal transmission using electrical wiring. Among them, in the field of optical components such as optical waveguides, blue LEDs, and optical semiconductors, it is desired to develop a resin material having excellent transparency. In view of these requirements, alicyclic epoxy resins have attracted attention. The alicyclic epoxy resin is superior to the glycidyl ether type epoxy resin in terms of electrical insulation and transparency, and is therefore used in various places for transparent sealing materials. However, the alicyclic epoxy resin has the above-mentioned advantages, but on the other hand, there is a problem that the cured product is hard and the toughness is poor, and research has been made to improve the disadvantage (Patent Documents 1 and 2). In the case where an acid anhydride is used as a curing agent in a liquid resin composition, it is selected from methyl octahydrophthalic acid anhydride and hydrazine based on the fact that it is liquid at room temperature and is easy to handle. a carboxylic acid anhydride in tetrahydrophthalic anhydride, hexamethylene phthalic anhydride, tetrahydrophthalic anhydride or the like or a mixture thereof. Further, in the case where the lysine is used as a curing agent for an epoxy resin in a case where the amount of the compound having a low molecular weight is large, especially when it is thermally hardened in an open system, such rebellious (four) volatilization becomes a problem. If the ticked acid needle is volatilized into the atmosphere during the thermal hardening of the epoxy resin, it will not only cause temporary damage to the object. The environment caused by the release of substances into the atmosphere and the adverse effects on the human body, the sound of wood, causing pollution of the production line, and the absence of the carboxylic anhydride (hardener) of the θ t ^ 疋 in the hardened material The hardening of the composition of the epoxy resin cercaria is particularly effective, and it is a special product (patent document 3, patent document 4). In order to solve the above problems, the epoxy resin composition required for the hardening of the material (4) is required. The structure of the epoxy resin of the present invention is disclosed in Patent Document 5. Specifically, it is produced by a transesterification reaction of ethyl 3,4-epoxycyclohexanoate with bis(trihydroxydecylpropane). However, the tetrafunctional epoxy resin of the epoxy resin obtained by the present process has a low purity. For example, in the example 8 described in paragraph 32 of Patent Document 5, the purity of the tetrafunctional tetraether is 42. 5%, the remainder being a triepoxide, or a % oxygen, monoepoxide, which is a poor purity of the residual alcohol structure. Further, since this reaction is a reaction at a high temperature, a polymerization reaction of each of the epoxy groups is also caused. Therefore, a resin having a high viscosity is also caused, which may cause problems in workability. Further, the residual of the above-described alcohol structure is caused by, for example, curing with an acid anhydride, which causes a reaction with an acid anhydride at room temperature in the case of liquefaction, and the storage property is extremely poor. Further, the crosslink density is also low, which affects the hardened physical properties and is therefore unsatisfactory. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-52187 [Patent Document 2] Japanese Patent Laid-Open Publication No. Hei. No. Hei. Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Problem] An object of the present invention is to provide a new epoxy resin which provides 201044203 which is not only excellent in hardenability but also excellent in heat resistance and light resistance. [Means for Solving the Problem] The present inventors conducted intensive studies in view of the above-described actual circumstances, and as a result, completed the present invention. That is, the present invention relates to: (1) An olefin resin characterized by the following formula (!):

(1) (wherein there are a plurality of R, p points (four) standing in the ground, indicating a gas atom, or a carbon number of 1 to 15); (2) an epoxy resin, characterized by · Obtained by oxidizing a rare Fe resin as in the above item (1); (3) an epoxy resin according to the item (2), which is epoxidized using hydrogen peroxide or a peracid; (4) a curable resin composition, It is characterized in that it contains the epoxy wax, hardener and/or hardening catalyst of the above item (7) or (7), and the hardened material of the product, and the acquaintance of the acquaintance # 八符征: the system will be as before (4) The curable resin composition is hardened. [Effects of the Invention] The dilute hydrocarbon resin of the present invention is a raw material for providing a hard resin (epoxy resin of the present invention) excellent in heat resistance and light resistance. The hardening & sap structure of the present invention containing the epoxy resin of the present invention is excellent in hardenability and has less influence on the environment. The curable fat composition of the present invention containing the right epoxy resin of the present invention can be used for electrical + electric nipples, molding materials, injection molding materials, laminated materials, coating materials, coatings, and coatings. A wide range of applications such as adhesives and photoresists. Further, the epoxy resin of the present invention is excellent in transparency because it does not have a right _ _ _ _ * dan has a spear ring, and therefore is extremely useful for optical materials. [Embodiment] The olefin resin of the present invention is represented by the following formula (丨):

(wherein 'there are a plurality of atomic atoms or an alkyl group having 1 to 15 carbon atoms'), and P is independently present, and hydrogen is represented by cyclohexene f acid as cyclohexanecarboxylic acid represented by the above formula (1) The olefin resin is obtained by the reaction of a living organism with a bis(trimethylol alkane). 201040203 The derivative is a compound represented by the following formula (2)

υ(2) Ρ (wherein Ρ represents a hydrogen atom or an alkyl group having 1 to 15 carbon atoms. Further, X represents a hydroxyl group, an alkoxy group having 1 to 10 carbon atoms, or a halogen atom), and specific examples thereof include cyclohexenecarboxylic acid. Cyclohexene decanoate, cyclohexene carboxylic acid ethyl ethoxide, propyl cyclohexene carboxylate, butyl cyclohexene decanoate, cyclohexene hexyl methacrylate, cyclohexene carboxylic acid (cyclohexenyl fluorenyl) Ester, octyl cyclohexene decanoate, cyclohexene methyl hydrazine, cyclohexene methyl hydrazine, methyl cyclohexene decanoic acid, methyl methyl cyclohexenecarboxylate, ethyl decyl cyclohexenecarboxylate, hydrazine Butyl hexyl hexene hexanoate, methylcyclohexenecarboxylic acid (methylcyclohexenylmethyl) ester, decyl cyclohexene methyl hydrazine, etc. 'but is not limited thereto. These may be used alone or in combination of two or more. Further, the second (trimethylsulfonated hydrocarbon) of the present invention is a compound represented by the following formula: Η (\ /ΟΗ

R R (wherein R represents a hydrogen atom or an alkyl group having 1 to 15 carbon atoms). Specific examples of 201040203 include, for example, di(tri-methylpropane), di-U-methylbutyring, mono-(dimethylolpentane), di-(trimethylolhexane), and Trishydroxymethylheptane bis(trihydroxydecyloctane), etc. As a method for producing such a compound, it can be obtained by hydrating (or trimeric, metamorphic, etc.) The compound of the stone reptiles 1 to 15 is obtained by a reaction. (Examples &, as a reference patent document, Japanese Patent Laid-Open No. 2GG5_G23G67, Japanese Patent Laid-Open No. 2GG3-335717, Japanese Patent Laid-Open No. Q9_268l5 〇 公报 、 日本 日本 日本 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 。 The usual vinegarization reaction can be exemplified by using an acid catalyst Fischer (3) to give (10) 丨 (10) (Fisher esterification), a reaction under alkaline conditions, a fermentation reaction, a condensation reaction using various condensing agents, etc. ADVANCED ORGANIC CHEMISTRY PartB:

Reaction and Synthesis, P135, 145~147, 151, etc.). Further, as a specific example, esterification of a carboxylic acid ester can be further carried out by utilizing an esterification reaction of an alcohol with a carboxylic acid (Tetrahedron vol. 36 p. 2409 (1980) ^ Tetrahedron Letter p. 4475 (1980)) The reaction was produced by the reaction (Japanese Patent Laid-Open Publication No. 2006-052187). The olefin resin of the above formula (丨) synthesized in the above manner is preferred. In the above formula (1), P is a hydrogen atom and an alkyl group having 1 to 5 carbon atoms, and more preferably a hydrogen atom, a decyl group, an ethyl group or a butyl group. Particularly, in the case where the substituent p is bonded to the olefin, in order to increase the reactivity, P bonded to the olefin is preferably any of a hydrogen atom and a fluorenyl group, and more preferably a hydrogen atom. The substituent R is an alkyl group having 1 to 5 carbon atoms, preferably 2 to 1 Å. Particularly preferred as the substituent R, a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group or a hexyl group is preferred, and an ethyl group, a propyl group and a butyl group are preferred, and an ethyl group is more preferred. Further, the olefin resin obtained in the above manner is a tetracyclohexanthene having at least a tetrafunctional dilute hydrocarbon having a main component thereof, and its purity is preferably 8 G area% (gel-permeation chr〇mat) 〇graphy), hereinafter referred to as the above) is more preferably 9% or more, more preferably %% or more. When the purity is less than 80% by area, in addition to the problem that it is easily hydrolyzed in the subsequent epoxidation step, when the obtained epoxy resin is used as the epoxy resin composition, especially if it is hardened with acid liver or the like The agent is liquefied, and 2 is poor in storage stability due to the influence of the reaction of the base in the acid liver and the epoxy resin at a normal temperature. The measurement conditions of the Gpc of the olefin resin of the present invention are as follows: the official column is a Sh〇dex SYSTEM_21 column (kf_8〇3l, kf 8〇2 5 ml/•root\KF·802), and the linked eluent is The four 1 ind S column has a dish size of 4 〇C, and the detection system is performed with RI (refractive B: X., refractive index), and the calibration curve (4) is made of standard polystyrene. The formula (1) does not have the invention. The olefin resin can be made into the epoxy resin of the present invention by oxidation. For example, a method of oxidizing a peracid such as an acid is used, and a method of oxidizing by emulsification of hydrogen water by air (oxygen) by air (oxygen) may be mentioned, but Limited to these. As a method of using the peracid, the epoxy resin is disclosed in JP-A No. 20〇6_52187, and the method described in the patent application is specifically mentioned. As the acid that can be used in 201040203, for example, it can be listed as 羸 羸. Tian Mis., 酉 酉, acetic acid, propionic acid, maleic acid, benzoic acid, m-chlorobenzoic acid, Zheng 苴 _ ^, Na- carboxylic acid, etc. Acid and the anhydrides. The A, the reaction with hydrogen peroxide to produce an organic peracid,

From the viewpoints of the reaction temperature, the simplicity of the selection of bamboo and the lL, and the economical efficiency, it is preferred to use formic acid, acetic acid, and stilbene-based anhydride, especially in terms of the simplicity of the reaction operation. It is preferred to use formic acid or acetic acid.

In the method of epoxidation using hydrogen peroxide water, various kinds of "body" and "sigma" can be applied, and Japanese Patent Laid-Open No. 59-108793 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Hereinafter, a method which is particularly preferable for obtaining the epoxy resin of the present invention is exemplified. First, the dilute hydrocarbon resin, the polyacid, and the quaternary salt of the present invention are reacted in an emulsion state of an organic substance and hydrogen peroxide water. The polyacid used in the present invention is not particularly limited as long as it is a compound having a polyacid structure, and is preferably a polyacid containing tungsten or molybdenum, more preferably a polyacid containing tungsten, and particularly preferably a tungstate. * As the specific polyacid and polyacid salt, a tether acid selected from the group consisting of tungstic acid, 12-tungsten-disc acid, 12-tungsoleic acid, 18-tartrate, and 12. A molybdenum-based acid selected from the group consisting of steel acid, phosphomolybdic acid, and the like, and the like. Examples of the counter cation of the salt include a quaternary ammonium ion, a soil test metal ion, and an alkali metal ion. 201040203 Specific examples include: tetramethyl-recording ions, sulfhydryl triethyl-recording ions, tridecyl thiol ammonium ion, di(12-decyl)dimethylammonium ion, trioctylmethyl sulphide, three Pyridylmethyl (mixture of octyl and sulfhydryl), money ion, tris(hexadecyl)methylammonium ion, trimethyloctadecyl ammonium ion, tetrapentyl ion, hexadecane Alkaline metal ions such as calcium ion, magnesium ion, etc., sodium, potassium, planing, etc. An alkali metal ion or the like is not limited thereto. Among them, sodium or potassium ions, calcium ions, and ammonium ions are exemplified as the anti-weighing cations. f is used as the amount of the polyacid, and is equivalent to the olefin oxime (functional equivalent) of the present invention in terms of a metal element (the number of moles of a turning atom in the case of a tungsten atom or a molybdic acid in the case of a tungstic acid). ~ 2 〇 millimoles, preferably 1 〇 ~ 2 〇 millimoles 'better than 2.5 to 15 millimoles. As the quaternary ammonium salt used for the reaction, it is preferred to use a quaternary ammonium salt having a total carbon number of 1 Å or more, more preferably 25 to 55, and particularly preferably an alkyl chain of all of which is an aliphatic chain. Specific examples thereof include a tridecylmethylammonium salt, a di(dodecyl)dimethyl group, an ammonium salt, a trioctylmethylammonium salt, and a trialkylmethyl group (an alkyl group is an octyl compound). a mixed type of a compound in which an alkyl group is a mercapto group, an ammonium salt, a tris(hexadecyl)methylammonium salt, a didecyloctadecyl ammonium salt, a tetraamyl ammonium salt, a hexadecyldimethylammonium salt Salt, benzyltributylammonium salt, di(hexadecyl)dimethylammonium salt, tris(hexadecyl)methylammonium salt, dihardened tallow alkyldimethylammonium salt, etc., but Not limited to these. Further, the type of the anion of the salt is not particularly limited, and specifically, it may be listed as 12, 2010, 203, 203: a halide ion, a nitrate ion, a sulfate ion, a hydrogen sulfate ion, an acetate ion, a carbonate ion, etc., but is not limited thereto. Wait. When the carbon number exceeds 100, the hydrophobicity becomes too strong, and the solubility of the quaternary ammonium salt in the organic layer may be deteriorated. When the carbon number is less than 10, the hydrophilicity becomes strong, and similarly, the compatibility of the quaternary ammonium salt in the organic layer is deteriorated, which is not preferable. The amount of the quaternary ammonium salt used is preferably determined by the number of valences of the polyacids (preferably tungstic acids) to be used, and is preferably 001 to 10 equivalents which are several times the price of the polyacids. More preferably, it is 5 to 6.0 times equivalent, more preferably 5 to 45 times u equivalent. For example, as long as it is tungstic acid, since H2W〇4 is divalent, the quaternary ammonium salt is preferably in the range of from 0 2 to 2 mol with respect to 1 mol of tungstic acid. Further, as long as it is a ruthenium, since it is trivalent, it is preferably 〇.〇3~3〇莫耳', as long as it is yttrium tungstic acid, since it is tetravalent, it is preferably 〇.04 〜 40 moles. When the amount of the quaternary ammonium salt is less than several times the valence of the polyacid, when the amount is 〇1 times, it is difficult to carry out the epoxidation reaction (the reaction may be accelerated depending on the case), and it is easy to generate. The problem of by-products. In the case of more than i 倍 double equivalent, not only is post-treatment difficult, but also the effect of suppressing the reaction is therefore poor. It is preferred to use a buffer in the reaction. Any one may be used as the buffer, and in the reaction, an aqueous phosphate solution is preferably used. As the pH, it is preferred that the pH is adjusted to be between 4 and 1 Torr, and more preferably the pH is 5 to 9. When the pH is less than 4, the hydrolysis reaction of the epoxy group and the polymerization reaction are easily carried out. Further, when the pH exceeds 1 Torr, the reaction becomes 13 201040203, which is extremely slow and the reaction time is too long. In particular, in the present invention, it is preferred to dissolve the polyacid oxime as a catalyst to adjust the pH to a value of 5 to 9. The method of using the hydrazine buffer is, for example, in the case of a linseed-salt aqueous solution as a preferred buffer, and the phase τ 祁 is used in the case of hydrogen peroxide, 0.1 to 10 mol% of the constitutive acid (or Go to the virtual cabin _ - - gas sodium scallops), with alkaline and & substances (such as sodium hydroxide, barium hydroxide, sodium citrate, sodium bicarbonate, potassium carbonate, etc.) for pH Adjust the square Mu lL. Here, it is preferred to add a moxibustion t p method in which the pH is the above-mentioned pH value when hydrogen peroxide is added. In addition, it is also possible to use sodium dihydrogen phosphate or acid hydrogen di-nano. The concentration of the preferred phosphate is from 0.1 to 60% by weight, preferably from 1 to 45% by weight. In addition, in this reaction, it is also possible to use 缓冲 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便 便醆 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇 暇, "Q~5 is preferably 0.2~4 mol% equivalent, and the better field is preferably 3.3~3 mol% equivalent. In this case, when it is more than 5 mol% equivalent to the peroxidation gas, and H is not equimolar, it is easy to carry out the hydrolysis of the epoxy resin which is easily formed, or the reaction becomes slow. Disadvantages. This reaction is epoxidized using hydrogen peroxide. As the peroxidation ammonia used in the reaction, in terms of ease of handling, an aqueous solution having a concentration of 1 〇 to 4 〇 by weight is preferably used. In the case where the concentration exceeds 40% by weight of 201040203%, in addition to becoming difficult to handle, it is also easy to form a decomposition reaction of the epoxy resin, which is not preferable. Ding Shengyu This reaction uses an organic solvent Η乍 as the organic page used 'relative to the dilute hydrocarbon resin i as the reaction substrate, preferably in a weight ratio of ~1 〇', preferably 0.3 to 50, more preferably " . In the case where the weight ratio is exceeded, the progress of the reaction becomes extremely slow, which is not preferable. Specific examples of the organic solvent that can be used include an alkane such as hexane or cyclohexylpyrene, an aromatic hydrocarbon compound such as toluene or xylene, and a::= alcohol: isopropanol, butanol, and An alcohol such as an alcohol or a cyclohexanol. In addition, depending on the situation, you can also use: methyl ethyl _, methyl isobutyl ketone, cyclopentyl hexyl yloids, etc., diacetyl, tetrazine cough, dioxin, etc. S曰, butyl acetate, carboxylic acid methyl acetate and other vinegar compounds, B guess and other compounds. The solvent which is particularly preferred is a hydrocarbon such as a burned hydrocarbon, a cyclohexane or a heptane, or an aromatic hydrocarbon compound such as a benzene or a toluene. As a specific reaction operation method, for example, in a batch type, the reaction daddy 'adds a rare hydrocarbon resin, a nitrogen peroxide (aqueous solution), a polyacid (catalyst), a buffer, a quaternary salt, and an organic solvent, The layers were stirred. There is no specific designation for the speed of the search. Since there are many cases where heat is generated during the addition of nitrogen peroxide, a method of slowly adding hydrogen peroxide after adding each component may be employed. f Use the following method: Add buffer (or water and linoleate), adjust the pH value of poly-type I, add quaternary ammonium salt, organic solvent and olefin compound, mix in two layers, then add Hydrogen peroxide. Alternatively, the method may be as follows: in the process of imparting water drop, organic solvent 15 201040203 agent and olefin compound, adding polyacids, phosphonium (or acid salt) for pH adjustment, and adding quaternary ammonium The salt was searched off in two layers and then hydrogen peroxide was added dropwise. The reaction temperature is not particularly limited, and is preferably 〇~9 (TC, more preferably 〇~75 ° C, particularly preferably 15 to 60 〇c. When the reaction temperature is too high, the hydrolysis reaction proceeds easily, if the reaction When the temperature is low, the reaction rate becomes extremely slow. 'Also, the reaction time depends on the reaction temperature, the amount of catalyst, etc., but from the viewpoint of industrial production, long-term reaction consumes a large amount of energy, so The preferred range is from 1 to 48 hours, preferably from 3 to 36 hours, more preferably from 4 to 24 hours. After the reaction is completed, excess hydrogen peroxide is quenched. The quenching treatment is carried out by the car. It is preferable to carry out a basic compound, and it is preferable to use a reducing agent together with the test compound. As a preferable processing method, the following method is used, and the neutral value of the ρΗ value is adjusted to 6 to 1 碱性 by the basic compound, and it is used. The reducing agent quenches the residual hydrogen peroxide. When the pH is less than 6, there is a possibility that the heat generated when the excess hydrogen peroxide is reduced is large, and a decomposition product is generated. Examples of the reducing agent include: Sodium sulfite, sodium thiosulfate, oxalic acid Vitamins · p # ,, ', Temple. The amount of use as a reducing agent, relative to the excess part of hydrogen peroxide installed in the number of ears 'usually 0.01 to 20 times the molar, more preferably 0. 05~1 〇倍草耳,,*, and further preferably 0.05 to 3 times mol. °Hay, etc. is preferably added as an aqueous solution, and its concentration is preferably 0.5 to 3 〇% by weight. 16 201040203 As an experimental compound, Listed······························································· As a result, i is transferred to an aromatic fumes such as water toluene or xylene (for example, r 呉 呉 纲 甲, 甲 甲 立 立 _ ketones, cyclohexanthene, gamma burning, xin burning, etc., methanol soil Among the various solvents such as hydrazine and the like, I彳I θ /, the molar number of hydrogen peroxide, etc., and the molar number of m 4 relative to the excess portion of the emulsified air, usually 0.01 to 20 times. Ear, 10 times Mo, and more preferably 0.05 to 3 times Mo ^ ^ 〇.05~ 丨口杲斗〇 These seven or the above organic solvent solution In addition, it may be added as a monomer. In the case of using a solid solution which is not dissolved in water or an organic solvent, the amount of the peroxidized gas remaining in the system t (4) is counted as the amount of the surface. Preferably used in weight ratio

~ then times. When the material is dissolved in water or the organic material is W ,, the water layer and the organic layer described below may be separated from the organic layer and then quenched after the nitrogen peroxide (or 泮: 里: = the machine layer is not separated from the water layer) When the reaction is carried out, the above organic solvent is added, and then the extraction of the product is carried out. At this time, 1 water layer is used for the anti-fat, and the weight ratio is 0.H. The organic layer m is obtained by ion-exchange resin or metal oxidation as needed. The organic layer obtained by the organic layer is oxidized by ion exchange resin or metal as needed. (especially for tannin or alumina, etc.), activated carbon (particularly chemically activated carbon), composite metal salts (particularly alkaline composite gold salts), clay minerals (of which montmorillonite is especially preferred) After removing the impurities, such as layered clay minerals, and then washing with water and the like, the solvent is evaporated to obtain the desired epoxy resin. The epoxy resin obtained by the above method is represented by the formula (3). Molecule The main ingredients:

(wherein, a plurality of R and p are independently present, and represent hydrogen ', a sub, or an alkyl group having 1 to 15 carbon atoms), and 5 are compounds having various structures as shown in the formula (4): 18 201040203

The combination of (D) may be any combination. The same meaning of R and P).

The monohydroxyindole matrix and the dicyclooxy group of the P raw material are polymerized with each other.

(where (A)~ represents R in equation (3)

Further, depending on the reaction conditions, a compound having an alcohol structure such as a ruthenium matrix or a high molecular weight body or other side reactants is produced. The % oxygen resin of the present invention has a structure represented by the formula (3, the main _ π w VIII, 3) as a main component, and its purity is preferably 8 Å or more, more preferably 90 Å in the GPC measurement. . More than or equal to 95% by area. Further, the measurement conditions of Gpc of the epoxy resin of the present invention are as follows. The column is Sh〇dex SYSTEM_21 f column (κρ谢l, kf_8〇2 $ (x2 root), KF-802), the linked eluent is tetrahydrofuran, the flow rate is 1, the column temperature is 40t, and The detection system was performed with ri, and the calibration curve was performed using the standard polystyrene of Shodex. 201040203 It can be used as an epoxy acrylate cyclic carbonate compound or the like, an epoxy resin of the present invention obtained by, for example, a derivative thereof, or an n-phase compound or various resin raw materials. Hereinafter, the resin composition of the present invention is contained. The curable property of the present invention The epoxy resin composition of the present invention contains the epoxy resin of the present invention as an essential component. In the curable resin composition of the present invention, two methods of thermal curing (curable resin composition A) of the agent and cation hardening (curable resin composition B) using an acid as a curing catalyst can be applied. Curable resin composition # A and curable resin composition # B towel, the epoxy resin of the present invention can be used alone or in combination with other epoxy resins, and the epoxy resin of the present invention is used in the total epoxy resin. The proportion of the order is preferably 3% by mass or more, and particularly preferably 4 〇. the above. In the case where the epoxy resin of the present invention is used as a modifier for a curable resin composition, it may be added in a ratio of j to 3 % by mass. Examples of other epoxy resins which can be used together with the epoxy resin of the present invention include a novolac type epoxy resin, a bisphenol type epoxy resin, a biphenyl type epoxy resin, a triphenyldecane type epoxy resin, and a phenol. An aralkyl type epoxy resin or the like. Specific examples thereof include bisphenol A, bisphenol s, thiodiphenol, bismuth bisphenol, terpene diphenol '4,4'-biphenol, 2,2,-biphenol, 3,3,5,5 , - 四曱基联笨基]-4,4-Alcohol, p-Benzene, inter-phenylene, naphthalene, _(4_趣乌本基)曱, 1,1,2, 2_tetrakis(4-cyanophenyl)ethene, expectant (benzene, substituted phenol, naphthol, alkyl substituted naphthol, dihydroxy stupid, dipyridyl, etc.) and formaldehyde , acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o- 20 201040203 hydroxybenzaldehyde, p-hydroxyacetophenone, sugar ... double (chloromethyl qing, stupid, 4; the double bis (= ring quinone diphenyl, double (Chloromethyl)benzene or U•bis(methoxymethoxymethyl(4), a compound and these modified substances, four-fold double-dish soil), a polycondensed derivative of glycidol Cycloring ring 匕 匕 以及 以及 以及 以及 以及 以及 以及 uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf uf At least in the structure of the stone structure of the stone structure, there is a glycidyl group and a mixture of 5 The nipple of a solid or liquid epoxidized latex ring hexacene structure such as an oxy-resin is not limited to the above, and the second embodiment: the curable resin composition of the present invention is used for optical use. The epoxy resin and the alicyclic epoxy resin or the epoxy resin of the yoke structure are "❹. Especially in the case of the alicyclic ring oxime, it is preferred to have the epoxide ring burned structure on the skeleton. , dies, is a bismuth resin obtained by oxidation reaction of a compound having a cyclohexene structure. ° Formic acid:: a compound having a cyclohexene structure, which may be exemplified by cyclohexene and % The vinegarization reaction or the vinegarization reaction of cyclohexene methanol with a tickic acid (Tetrahedron νο1. 36 Ρ·2409 (10)0), Tetrahedron Letter ρ·4475 (1980), etc., or the pre-ecological reaction of cyclohexane (Tlshchenk0 reaction) (Japanese Patent Laid-Open Publication No. (10) No. 59, Japanese Patent Laid-Open Publication No. 2004-262871, etc.), and vinegar exchange reaction of cyclohexene carboxylic acid vinegar (Japanese Patent Laid-Open No. 2006) Manufactured by the method described in t-052187 or the like) As the alcohol, as long as it is a compound having an alcoholic trans group, there is no particular 21 201040203, and examples thereof include ethylene glycol, propylene glycol, hydrazine, 3-propylene glycol, anthracene, and 2-butanediol ' 1,4 -diols such as butanol, 15 pentanediol, Ik hexanediol, cyclohexanedimethanol, glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 2- Triols such as hydroxymethyl hydrazine and 4-butane diol, tetraols such as pentaerythritol, etc. Further, examples of the carboxylic acid include oxalic acid, maleic acid, fumaric acid, and phthalic acid. , 'm-phthalic acid, adipic acid, cyclohexanedioic acid, etc.' are not limited thereto. Further, the compound having a cyclohexene structure other than the above may, for example, be a cyclohexenal derivative or an acetal compound obtained by reacting an acetal with an alcohol. The reaction method can be produced by applying a usual acetalization reaction. For example, a method in which a reaction is carried out by azeotropic dehydration using a solvent such as toluene or xylene in a reaction medium is disclosed (U.S. Patent No. 2945008) a method of reacting a polyhydric alcohol in a concentrated hydrochloric acid, and slowly adding an aldehyde (Japanese Patent Laid-Open Publication No. SHO 48-96590), and a method of using water in a reaction medium (U.S. Patent No. 3,092,640) A method of using an organic solvent in the reaction medium (Japanese Patent Laid-Open No. Hei. No. 7.215979), a method using a solid acid catalyst (Japanese Patent Laid-Open Publication No. 2007-23〇992), and the like. It is preferably a cyclic acetal structure in terms of structural stability. Specific examples of such epoxy resins include erl_422i, UVR-61〇5, and ERL-4299 (all of which are trade names, either of which are manufactured by d〇w Chemical), Celloxide 2〇21ρ, Ερ〇ι_. Gt4〇i, EHPE3 1 50, EHPE3 1 50CE (all of which are trade names, either manufactured by MM Chemical Industries) and dicyclopentadiene diepoxide, etc. 22 201040203 However, it is not limited thereto (Ref.芩驮.4沦Epoxy resin basics] Ρ76-85 ) 〇 These may be used alone or in combination of two or more. Each of the curable resin compositions will be described below. The sclerosing tree composition (heat-hardening by a hardening agent). The hardening agent contained in the hardening (4) lipid filament A of this invention is an amine compound, a sour-patent compound, a amide type compound, and a hydrazine. Ο : a compound, a tickic acid compound, and the like. As the hardener which can be used, there are exemplified as: diaminodiphenyl^, di-extended ethyltriamine, tri-extension tetraamine, monoaminodiphenylsulfone, isophorol-diamine, double Cyanamide, a polymer of octadecanoic acid [diamine synthesis, such as a guanamine resin containing about 4 (amine amide compound), phthalic anhydride, trimellitic anhydride, tetrafic tetracarboxylic anhydride , maleic anhydride, tetrahydrophthalic anhydride, mercapto-gas, stearic-formic anhydride, methylic acid anhydride, acid anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic acid Phthalic anhydride, butane tetracarboxylic anhydride, bicyclo '2,1]heptane-2,3-dicarboxylic anhydride, methylbicyclo[2,2"]heptane_2,3 dicarboxylic acid, Wang Banyi 1 '4-dicarboxylic acid-3,4-hepatic acid anhydride; carboxylic acid tree obtained by the addition reaction of various alcohols, polyoxyl which is bought by Azure 8. Bisphenol F, bisphenol s, bismuth bisphenol, terpene diol, 4, 4, · 联, 2,2'-biphenol, 3,3,5,5,-tetramethyl- [1,1,-biphenyl]_4,4·-bisxihen-1 hydroquinone, resorcinol, naphthalenediol, tri-(4- Phenyl) decane, 5,2,2-tetrakis(4-hydroxyphenyl)ethane, phenols (thins, phenols, alkyl-substituted phenols, alkyl-substituted naphthols, Hydroxybenzene, dihydroxynaphthalene, etc.) with ruthenium, expectant, ethyl chain, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, 23 201040203 p-hydroxyacetophenone, o-hydroxyphenylacetamidine, dicyclopentadiene Furfural, hydrazine bis (chloromethylbiphenyl, 4,4.. bis(methoxymethyl hydrazine, hydrazine _ biphenyl, K bis (chloromethyl) benzene "M,, f oxymethyl) benzene, etc. The polycondensate and the modified substances of the above-mentioned four kinds of polyphenols such as tetrahydropyrene A and the like, (four) and various kinds of polycondensates, imidazole, boron difluoride and amine complex 'deuterium derivatives The compound or the like is not limited thereto. These may be used singly or in the present invention, and it is particularly preferable to have an acidity structure represented by the above-mentioned acid anhydride compound or acid-based compound, or The compound having an acid structure. The amount of the hardener used in the curable resin composition A of the present invention is preferably from 7 to 12 equivalents per equivalent of the epoxy group i equivalent of the epoxy resin. When the oxime equivalent is less than 7 equivalents, or when it exceeds 1.2 equivalents, the hardening becomes incomplete and the cured properties are not obtained. The hardenability of the present (4) The tree test substance Α + can also be used to promote the Μ (hardening catalyst) and the hardener - together. As a specific example of a hardening accelerator that can be used, it can be exemplified: 2_methylimidyl-based (four) and 2 _Ethyl 4 bismuth bis(2); =" succinyl, dimethylaminomethyl) phenyl or benzodiazepines, tertiary amines such as olefin-7, phosphines such as triphenylphosphine, Tetrabutyl salt, triisopropylmethyl salt, trimethyl sulfonium salt, hexavalent base = ammonium salt, hexadecane trimethyl ammonium hydroxide and other four-grade ammonium salt, triphenyl, Four grades of scale salts such as sulfhydryl scale salt, triphenylethyl scale salt, and tetrakilin scale salt (four:: the counter ion is a functional element, organic acid ion, hydroxide ion is not specified, especially good Organic acid ions, gas oxide ions), Xin 24 201040203 Metal compounds such as tin oxide. The hardening accelerator is used in an amount of 1 to 5 parts by weight based on 100 parts by weight of the epoxy resin. The curable resin composition of the present invention may contain a phosphorus-containing compound as a flame retardancy imparting component. As the phosphorus-containing compound, it may be either a reactive type or an additive type. Specific examples of the phosphorus-containing compound include tridecyl sulphate, triethyl phosphate, tricresyl phosphate, and tris(diphenyl) phosphate.

曱Phenylphenyl diphenyl phosphate, phenyl phenyl 2,6-bis(diphenylene) acrylate, j, bismuth bis(diphenylene phosphate), 1> Phosphate such as bis (phosphoric acid dichloride) and 4,4'-biphenyl (di(xylylene phosphate) phosphate; 9,1 〇, - gas-9-oxa-1 〇_phosphaphenanthrene 〇 氧化物 _ oxide or ι〇 (2,5 dihydroxy phenyl)-10H-9-oxa-10-phosphaphenanthrene 〇 氧化物 oxides; The phosphorus-containing epoxy resin, red & or the like obtained by reacting with the active hydrogen of the above-mentioned body is preferably a phosphate ester, a phosphine or a phosphorus-containing epoxy resin, and more preferably an I3·extension base double (phosphoric acid) Di(xylylene) ester), hydrazine, 4_phenylene bis(di(xylylene) phosphate), 4,4,-biphenyl (bis(diphenylene) phosphate) or phosphorus-containing epoxy

The content of the cerium 3 phosphorus compound is preferably 0.6 times or less the total amount of the % oxygen resin component in the curable resin composition A of the present invention. When it exceeds 〇.6 D, there is a concern that the hygroscopicity and dielectric properties of the cured product are adversely affected. Further, in the curable resin composition A of the present invention, a stone or a force antioxidant may be used as needed. Examples of the antioxidant that can be used include a phenol-based and a 1f human phosphorus-based anti-deuteration agent. Antioxidants can be used alone or in two groups at t ^ . The amount of the antioxidant to be used is usually 〇 008 to i weight 25 201040203 parts by weight, preferably 0.01 to 0.5 parts by weight, based on 100 parts by weight of the resin component of the curable resin of the present invention. As the antioxidant, for example, a phenolic antioxidant, a sulfur-based antioxidant, a phosphorus-based antioxidant, or the like can be listed. As a specific example of the antioxidant, it can be exemplified as .2,6-di-t-butyl-p-methyl, t-glycol, butyl hydroxyanisole, 2,6-di-third Butyl-p-ethylbenzene, 'Eoctadecyldi-tert-butyl-4-phenylphenyl)propionic acid vinegar, isooctyl_3_(3,5-di-tert-butyl-4-yl) Base) propionic acid vinegar, 2,4-bis-(n-octylthio)_6_(4_face group_3,5_di-t-butylanilino)-1,3,5·three-call, 2,4 _bis[(octylthio)methyl]• 甲甲盼等单相类; 2,2,- fluorenyl bis(4·methyldongthylene butyl benzene), 2,2, _, Bis(4-ethyl-6-tert-butylphenol), 4,4,-thiobis(3-methyl-6 tetrabutylphenol), 4,4,-butylene bis (3_ Methyl-6_t-butylphenol), triethylene glycol_bis[3 (3-second butyl_5_methyl_4_pyridylphenyl)propionic acid vinegar], ι,6_己Diol _ bis [3-(3,5-di-tert-butylhydroxyphenyl)propionate], ν, ν·-hexamethylene bis (3,5-t-butyl-4- -Phenylbenzamide), 2,2-thio-di-extension ethyl bis[3-(3,5-di-t-butyl-4-yl-phenyl)propionic acid g], 3, 5-di-t-butyl-4-hydroxybenzyl Acid ester-diethyl ester, 3,9_bis[!,][_didecyl_2_{stone_(3_t-butyl-4-hydroxy-5-methylphenyl)propenyloxy}B 2,4,8,10-tetraoxaspiro[5,5] eleven-burning, bis(3,5-di-t-butyl-4-yl)-based ethyl acetate Phenols; H3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 1,3,5-trimethyl-2,4,6-tris (3,5- Di-tert-butyl-4-ylhydroxybenzyl)benzene, tetra-[methylene_3_(3,5,2-di-tert-butyl-4,-hydroxyphenyl)propionate] methane, Bis[3,3,-bis-(4,-hydroxy-3'-t-butylphenyl)butanoic acid]diol, tris-(3,5·di-t-butyl-4-hydroxybenzyl) Base) _ iso-cyanuric acid, 1,3,5-tris(3',5--di-t-butyl-4,-hydroxybenzyl)-s-triazine-2,4,6-(1Η , 3Η, 5Η) 26 201040203 — Ketones, fertility and other molecular types. _ As a specific example of the sulfur-based antioxidant, 3, 3, thiodipropionate mono(-undecyl) ester, 3,3,- thiodipropionate di(tetradecyl) ester can be exemplified. And m dioctadecyl dipropionate and the like. Specific examples of the phosphorus-based antioxidant include triphenyl phosphite, di-p-isodecyl phosphite, phenyl diisononyl phosphite, tris(nonylphenyl) phosphite, and diisoindole. Pentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentane tetrakis(bis-octadecyl)phosphite vinegar, cyclic neopentane tetrayl Bis(2,4-di-t-butylphenyl)phosphite sorbate, cyclic neopentane tetrakis(bis(2,4-di-tert-butyl-4-ylphenyl)phosphite vinegar, ^[2-Ternyl_6_methyl·4_{2_(octadecyloxy)ethyl}phenyl]phosphite such as phosphite; 9,1〇_dihydrogen_ 9 oxa-1〇_phosphaphenanthrene oxide, U)-(3,5-di-t-butyl-4-ylhydroxyl group)_9,1〇•dihydro_9•oxa-ίο-phosphine Phenanthrene _10_oxide, 1〇_癸oxy·9,1〇_dihydro·9_oxa_ι〇_ phosphaphenanthrene-10-oxide and other oxaphosphorus phenanthrene oxides. G These antioxidants may be used alone or in combination of two or more. In the present invention, a phosphorus-based antioxidant is particularly preferred. Further, a light stabilizer may be added to the curable resin composition of the present invention as needed. The light stabilizer is preferably a hindered amine light stabilizer, and more preferably a HALS (Hindered Amine Light Stabilizer). The HALS is not particularly limited, and as a representative, dibutylamine/1,3,5·triazine/N,N,·bis(2,2,6,6-tetramethyl_4_per pipe Polycondensation of pyridine-based w,6-octadecyl-monoamine with N-(2,2,6,6-tetramethyl-4-piperidyl)butylamine 27 201040203, dimethyl succinate-1 -(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate, poly[{6-(1,1,3,3-tetramethylbutyl) Amino-1,3,5-trimethylhepta-2,4-yl}{(2,2,6,6-tetradecyl-4-bunkyl)imine}hexamethylene{( 2,2,6,6-tetramethyl-4-piperidinyl)imido}], bis(1,1-dimethylethyl)-4-hydroxyphenyl]indolyl]butylpropane Acidic bis(1,2,2,6,6-pentamethylpitrile) S, bis(2,2,6,6-tetradecyl-4-piperidyl) sebacate, bismuth Acidic bis(1'2,2,6,6-pentamethylene-7-η bottom base) ester, sebacic acid bis(ι_octyloxy-2,2,6,6-tetradecyl-4 -piperidinyl)ester, 2-(3,5-di-t-butyl-4-hydroxybenzyl)-2-n-butylpropionic acid bis(1,2,2,6,6-pentamethyl _4 piperidinyl) ester, etc. HALS may be used alone or in combination of two or more. Further, the curability of the present invention A binder resin may be added to the fat composition A as needed. Examples of the binder resin include butyral resin, acetal resin, acrylic resin, epoxy-nylon resin, and (Nunle-Butadiene Rubber, nitrile rubber). _ phenol resin, epoxy-NBR resin, polyamine resin, poly phthalimide resin, polyoxyn resin, etc., but is not limited thereto. The amount of the binder resin is preferably not impaired. The range of the flame retardancy and the heat resistance of the cured product is usually from 〇05 to 50 parts by weight, preferably from 〇〇.05 to 50 parts by weight, based on 1 part by weight of the resin component in the curable resin composition A of the present invention. 〇 5 to 20 parts by weight. Adding non-crystalline sulphur dioxide, sulphuric calcium carbonate, strontium carbide, talc, spinel, beads, etc., as needed, but the curable resin composition of the present invention A medium filler. As the inorganic filler, there may be mentioned: cerium oxide, aluminum oxide, zircon, calcium silicate, cerium nitride, boron nitride, zirconia, magnesia, titanium oxide, talc Wait for the powder or shape the ball. 28 201040203 and The content of the inorganic filler may be used alone or in an amount of 95% by mass or less based on the curable resin composition of the present invention = A. Further, the present invention is also used. The curable resin composition A may be added: a decane coupling agent, stearic acid, palmitic acid, calcium stearate, zinc carboxylate (zinc 2-ethylhexanoate, zinc stearate, zinc behenate, meat) Zinc acid or zinc phosphate (zinc octyl phosphate, zinc octadecyl phosphate, etc.), surfactant, dye, pigment, UV absorber, etc.

Various formulating agents, various thermosetting resins.

When the curable resin composition A of the present invention is used for a photo-semiconductor encapsulant, a phosphor may be added as needed. The phosphor is, for example, a person who forms white light by absorbing a portion of the blue light emitted from the blue LED element and emitting wavelength-converted yellow light. After the phosphor is previously dispersed in the curable resin composition, the photo-semiconductor is sealed. The phosphor is not particularly limited, and a conventionally known phosphor can be used, and examples thereof include an aluminate of a rare earth element, a thiogallate, an orthosilicate, and the like. More specifically, YAG (Yttrium Aluminum Garnet) phosphor, TAG ( Terbium Aluminum Garnet ' yttrium aluminum garnet) phosphor, orthosilicate phosphor, thiogallate Examples of the phosphor such as a salt phosphor or a sulfide phosphor include YA1〇3: Ce, γ3Αΐ5〇ΐ2: Ce, Y4A1209: Ce, Y202S: Eu, Sr5(P04)3Cl: Eu, (SrEu)O . Al2〇3 and so on. As the particle diameter of the phosphor, those having a particle diameter known in the art are used, and the average particle diameter ' is preferably from 1 to 250, particularly preferably from 2 to 5 Å " m. In the case of using such a phosphor, the amount thereof is preferably from 1 to 80 parts by weight, more preferably from 5 to 6 parts by weight, per 100 parts by weight of the resin component. 29 201040203 The curable resin composition A of the present invention is obtained by uniformly mixing the above components. The curable resin composition A of the present invention can be easily made into a cured product by the same method as previously known. For example, the cured product of the present invention can be obtained by using the epoxy resin and the hardener of the present invention and, if necessary, a hardening accelerator, a lining compound, a binder resin, an inorganic filler, and a compounding agent, if necessary, using extrusion. The kneading machine, the kneading machine, and the like are sufficiently mixed until uniform, and a curable resin composition is obtained, and the curable resin composition is poured and melted (there is no melting in the case of liquid), and is carried out by using an injection molding machine or a transfer molding machine. Molding, and then heating at 8 〇 to 2 ° ° C for 2 to 1 〇 hours. Further, the cured product of the curable resin composition A of the present invention can be obtained by dissolving the curable resin composition A of the present invention in toluene, diphenylbenzene, acetone, methyl ethyl ketone, and the like as needed. A curable resin composition varnish is prepared in a solvent such as isobutyl ketone, hydrazine, hydrazine dimethyl carbamide, hydrazine, hydrazine-dimercaptoacetamide or hydrazine decyl pyrrolidone. It is impregnated into a substrate such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber, or paper, heated and dried to obtain a prepreg, and the prepreg is hot pressed. The solvent at this time is usually used in the composition of the curable resin composition of the present invention and the solvent, and usually accounts for 丨〇7 〇 mass 0/. Preferably, it is a quantity of 丨5~质量〇乂. Further, in the case of a liquid composition, an epoxy resin-containing cured product containing carbon fibers can be directly obtained, for example, by RTM. Further, when the curable resin composition A of the present invention is used in the form of a crucible or a sheet, it has excellent properties such as flexibility in the B-stage. The film or sheet-shaped resin composition is obtained by applying the curable resin composition A of the present invention 30 201040203 to the above-mentioned curable resin composition varnish, and applying it to a release film under heating. After the solvent is removed, the B stage is carried out. The film or sheet-like resin composition can be used as an adhesive (interlayer insulating layer) in a multilayer substrate or the like. The curable resin composition B (hardened by the cation of the acidic curing catalyst) The curable resin composition B of the present invention which is cured by using an acidic curing catalyst contains a photopolymerization initiator or a thermal polymerization initiator as an acid-curing ruthenium. Further, various known compounds and materials such as a diluent, a polymerizable monomer, a polymerizable oligomer, a polymerization initiation aid, and a photosensitizer may be contained. Further, various known additives such as an inorganic filler, a coloring pigment, an ultraviolet absorber, an antioxidant, and a stabilizer may be contained as needed. The acid curing catalyst is preferably a cationic polymerization initiator, and more preferably a photocationic polymerization initiator. The cationic polymerization initiator may be a rust salt such as a lock salt, a sulfonium salt or a diazonium salt, and these may be used singly or in combination of two or more. Examples of ruthenium, active energy line cationic polymerization initiators are: metal fluoride boron mis-salt and boron trifluoride complex (U.S. Patent No. 3,375,653), bis(perfluoroalkylsulfonyl)methane metal salt (USA) Patent No. 3,586,616), aryldiazonium rust compound (U.S. Patent No. 3,708,296), aromatic rust salt of Group VIa element (U.S. Patent No. 4,058,400), aromatic rust salt of va group element (U.S. Patent No. 4,609,905) a dicarbonyl chelate of the ina~Va group element (U.S. Patent No. 4,406,091), a thiopurine salt (U.S. Patent No. 4,139,655), and a MF6-anion form of the VIb group element 31 201040203 (US Patent No. No. 4,161,478; lanthanide selected from phosphorus, lanthanum and arsenic), aryl sulfonium salt (U.S. Patent No. 4,231,951), aromatic sulfonium salt and aromatic sulfonium salt (U.S. Patent No. 4,256,828), and double Phenyl fluorenyl) phenyl] thioether-bis hexafluorometal salt (journal 〇fp〇lyiner Science,

Polymer Chemistry, Vol. 2, 1789 (1984)). Further, a mixed ligand metal salt of an iron compound and a stanol-aluminum complex may also be used. In addition, as a specific example, "Adeka Optomer SP150", "Adeka Optomer SP170" (any one is manufactured by Asahi Kasei Kogyo Co., Ltd.), "UVE-1014" (manufactured by General Electronics Co., Ltd.), "CD-1012" (manufactured by Sartomer Co., Ltd.), "RP-2074" (manufactured by Rhodia Corporation), etc. The cationic polymerization initiator is used in an amount of preferably from 0 to 50 parts by weight, more preferably from 10,000 to 1 part by weight, based on 100 parts by weight of the epoxy resin component. In the curable resin composition B of the present invention, one or two or more kinds of polymerization initiation aids may be used in combination with the cationic polymerization initiator, and a photosensitizer may be used as needed. Specific examples of the polymerization initiation aid include benzoin, diphenylethylenedione benzoin methyl ether, benzoin isopropyl ether, acetophenone, 2,2-dimethoxy-2-phenyl-acetophenone, 1,1-dioxaacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-mercapto-1-(4-methylthiophenyl)-2-morpholinol propane-1·one, N, N - dimethylamino stupyl, 2-mercaptopurine, 2-ethylhydrazine, 2_t-butylhydrazine, 1-chloroindole, 2-pentylhydrazine, 2-isopropyl Ketoxanone, 2,4-dimercaptothioxene 32 201040203 ketone, 2,4-diethylpyrone, 2,4-diisopropyl ketene, acetophenone didecyl ketal, Diphenyl ketone, 4-methylbenzophenone, 4,4'-dibenzobenzophenone, 4,4·-bis(diethylamino)benzophenone, Michler's (Michler's Ketone) and other polymerization initiators. The amount of the polymerization initiator to be used in the photo-radical polymerization is from 0.1 to 30 parts by mass, preferably from 0.1 to 10 parts by mass, per 100 parts by mass of the resin component which can be photo-radically polymerized. Further, specific examples of the photosensitizer include: hydrazine, 2-isopropylthioxanthone, 2,4-dimercaptothioxanthone, 2,4-diethylthioxanthone, 2,4-di Isopropyl Ο ° ketoxime, hydrazine. Ding, bite yellow, phosphine R, benzoflavin, thio- continuation, hydrazine, ethyl N,N-didecylaminobenzoate, hydrazine, hydrazine-dimethylaminobenzoic acid Valeric vinegar, triethanolamine, triethylamine, and the like. The amount of the photosensitizer to be used is 0.01 to 30 parts by mass, preferably 〇1 to 1 part by mass, based on 100 parts by mass of the epoxy resin component. Further, in the curable resin composition of the present invention, various preparation agents such as an inorganic filler, a decane coupling material, a release agent, and a pigment, and various types of thermosetting greases may be added as needed. As a specific example, ❹ is as described above. The curable resin composition of the present invention is obtained by uniformly mixing the components. Further, the curable resin composition of the present invention may be dissolved in an organic solvent such as polyethylene glycol monoethyl ether or cyclohexanone or butyrolactone, and then the solvent is removed by drying and used. The solvent at this time is usually from 1 to 7 〇% by mass, preferably from 15 to 70% by mass, based on the mixture of the curable resin composition of the present invention and the solvent. The curable resin composition of the present invention can be hardened by irradiation with heat and/or ultraviolet rays 33 201040203 (for example, 'Reference: General Epoxy Resin Volume 1 Basics Ip82-84), but the heat and/or at this time Since the amount of ultraviolet irradiation varies depending on the composition of the curable resin composition B, the curing conditions are determined according to the respective compositions. Basically, it is sufficient that the hardened material exhibits a hardening condition of the strength necessary for the purpose of use. In general, it is difficult to completely cure the composition of the cyclic pores, and it is necessary to completely cure the reaction by heating after the light irradiation in the application requiring heat resistance. Further, since the irradiation light at the time of photohardening must be penetrated to the fine portion, the epoxy resin and the curable resin composition B of the present invention are desired to have a compound having high transparency and a composition. When heating is performed after light irradiation, it can be carried out in the hardening temperature region of the usual hardenable tree sap composition B. For example, it is more suitable for a range of 30 minutes to 7 days at a normal temperature of ~1 C. Although the temperature is changed by the blending of the curable resin composition b, the more particularly the temperature zone $ is effective for the hardening promotion after light irradiation, and the heat treatment for a short period of time is effective. Again, the more

The lower the temperature, the longer the heat treatment is required. With such heat-hardening, the effect of aging treatment also occurs. The shape of the hardening t obtained by curing the curable resin composition B is also various (4), and is not particularly limited. For example, it can be formed into a film shape, a sheet shape, a block shape or the like. The method of forming may be based on the parts and components used, and the 'different' may be, for example, casting method, injection method, screen printing method, 雒泠i ^ 疋 coating method, spray method. , transfer method, dispenser, etc., but not limited to 兮笪 ' Μ 4 ', to use the method to obtain the desired shape. You can use the ground glass or hard stainless steel; 34 201040203 Grinding plate, polycarbonate plate, poly-p-formic acid diacetate plate, polymethyl methacrylate plate. Moreover, in order to improve the mold release property of the molding die and the curable resin composition B, a polyethylene terephthalate film, a polycarbonate film, a polyethylene film, a vinyl film, a polytetrafluoroethylene film, or the like can be used. A polypropylene film, a polyimide film, or the like. For example, when used in a cationic curable photoresist, first, it is hardened by dissolving in an organic solvent such as polyethyl ether monoethyl ether or cyclohexanone or butyrolactone.

The resin composition B' is applied to a substrate such as a copper laminated board or a ceramic substrate or a glass substrate by a screen printing method, a spin coating method or the like at a film thickness of 5 to 160 " m to form a coating film at 60 to li. Prepare for drying under c. Hardening on the obtained substrate! The raw tree composition B' is irradiated with ultraviolet rays (for example, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, a gas lamp, a laser beam, etc.) by drawing a film of a desired pattern. , after exposure and baking treatment at 7 〇 to l2 (rc). 'Dissolve the unexposed portion by a solvent such as polyethylene glycol, and then, if necessary, irradiate with ultraviolet rays and / or heating (for example, 0.5 to 3 〇〇t for 0.5 to 3 hours) and sufficient hardening to obtain a modified product. The printed wiring board can also be obtained in the above manner. Further, the above method is based on a negative resist. In this case, the curable resin composition B of the present invention can also be used as a positive photoresist. The cured product of the curable resin composition 4 of the present invention and the hardenable resin composition can be used for optical use. The material of the part is representative of various uses. The term "optical material" generally refers to the material used in the use of light such as visible light, infrared light, purple X-rays and laser light, etc. More specifically, Light type, S Other than the LED sealing material such as the MD (surface_Mount Device, 35 201040203 surface-adhesive element) type, the substrate material of the liquid crystal display, the light guide plate, the cymbal sheet, the deflecting plate, the phase difference plate, and the viewing angle compensation are exemplified. A film, an adhesive, and a polarizing element protective film are representative of a liquid crystal film, etc., and are expected to be a sealing material, an antireflection film, an optical compensation film, a cover material, and a color PDP (Plasma Display Panel) of a next-generation flat panel display. Front glass protective film, front glass substitute material and adhesive; LED mold material used in LED display device, LED sealing material, front glass protective film, front glass substitute material and adhesive; etc.; plasma addressing Substrate materials, light guide plates, ruthenium plates, deflecting plates, phase difference plates, viewing angle compensation films, adhesives, and polarizing elements in liquid crystal (pALC) plasma display liquid crystal displays; organic EL (Electro-Luminescence) Luminescence) the protective film of the glass before the display, the front glass instead of the material and the adhesive; Various film substrates in the display (FED, Field Emission Display), protective film for front glass, front glass substitute materials and adhesives, etc. In the field of optical recording, VD (Video Disc), CD (Compact Disc) , CD-ROM (Read-Only Memory), CD-R (Recordable), RW (Rewritable), DVD (Digital Vedio Disk) - R/DVD-RAM (Random Access Memory), MO ( Magneto-Optical)/MD (Mini Disk), PD (Phase Change Disc) and Optical Card Use a disc substrate material, an optical disk drive to read a lens, a protective film, a sealing material, and an adhesive. 36 201040203 tIn the field of optical equipment, the lens material for static camera, finder mirror, target 稜鏡, viewfinder case and light sensor part; camera lens and viewfinder of camera; projection lens of projection TV And the sealing material and the adhesive agent for the j-film, the lens material for the light sensing device, the sealing material, the adhesive, and the film. In the field of optical components, the fiber material around the optical switch in the optical communication system, the lens, the optical waveguide, the sealing material of two pieces, the adhesive, and the like; the optical fiber material around the optical connector, the Ο ring, the sealing material, and Receptive agents, etc.; lenses in optical passive parts or optical circuit parts, optical waveguides, sealing materials for LEDs, sealing materials and adhesives for CCD (Charge, 'Charge Light Combination Components), etc.; Optoelectronics, OEIC, 〇 pt〇-Electronic Integrated Circuit) is a sheet of material, a fiber material, a sealing material for components, and an adhesive. In the field of Yuguang i, there are lighting, light guides, etc. for displays, sensors, display and marking for industrial use, and optical fibers for communication infrastructure and digital devices in the home. Examples of the material surrounding the semiconductor integrated circuit include a LSI (Large Scale Integration) or a photoresist material for lithography for ultra-LSI materials. Yuqi

In the field of delivery, the lamp reflector, the bearing retainer, the J wheel part, the #coating, the switch part, the headlight, the internal parts of the engine, and the electric

Si:, various internal and external components, drive engines, brake oil tanks, rust-proof steel plates for automobiles, interior decorative panels, inner packaging materials, protection/bundling, fuel hoses, automobile lamps and glass substitutes; Glass, etc.; the agent for the structural materials of the aircraft, the peripheral components of the engine, the harness for the compliance/bundling, and the resistance layer (four). In the field of construction, please refer to " 37 201040203 Packing/Processing Materials, Electrical Covers, Sheets, Glass Lions Films, Glass Substitutes, and Solar Cell Peripherals. For agricultural use, a film for greenhouse covering or the like can be cited. Examples of the lower-generation light and electronic functional organic materials include organic material peripheral materials, organic light-refracting elements, optical and optical conversion devices, that is, optical amplification devices, optical computing elements, substrate materials around organic solar cells, and fiber materials. , sealing materials for components and adhesives. Examples of the sealant include a capacitor, a transistor, a diode, a light-emitting diode, an IC (Integrated Circuit), and (3), etc., which are used for infusion, dipping, and transfer molding; UW type coffee (Chip 0n Board, on-chip package), c〇f ((3)卩〇nf, for example, flip-chip package) and TAB (Tape Aut〇mated Bon-) Underfill used in flip chip, etc.; BGA (Ball Grid Array) or (10) (Chip Scale Package') package for ic package mounting (enhanced underfill) Wait. For other uses of the material for optics, a general use of the curable resin composition A or the curable resin composition B is exemplified, and examples thereof include a binder, a coating material, a coating agent, and a molding material (including a sheet, a film, and the like). FRp (F^ Reinforced Plastics), insulating materials (including printed boards, wire coatings, etc.), sealants, and additives added to other resins. When the curable resin composition A or the curable resin composition B of the present invention is used as an additive to be added to other resins, for example, it can be used as a hardener in a sealing material or a cyanate resin composition for a substrate. In the case of the use of acrylic acid or the like as a photoresist 38 201040203. Examples of the adhesive include civil engineering, construction, Qin, medical, and electronic materials. In the case of the above-mentioned hardener, the adhesive for the electronic material is usually used for automobiles, and examples thereof include an interlayer adhesive for a multilayer substrate such as a build-up substrate, a semiconductor adhesive such as a die attach agent and a primer, BGa reinforcing underfill, anisotropic conductive film (Acf, Anisotropic conductive film), and an anisotropic conductive paste (Acp, Anis〇tr〇pic (10) paste), etc., such as an adhesive for mounting [Example]

Next, the present invention will be more specifically described by way of examples, and the parts are by weight unless otherwise specified. Furthermore, the invention is not limited to the embodiments. Further, in the examples, the epoxy equivalent was measured using US κ-7236 and the viscosity was at 25. (The measurement was carried out using a Ε-type viscometer. In addition, the gas chromatographic method (Gas Chromatography, hereinafter referred to as r gc)) was analyzed using HP5-MS (0.25 mm IDX15 m, membrane). Thickness 0 · 2 5 // m ) 'Set the column supply temperature to the initial temperature of 1 〇〇. 〇, raise the temperature at 15 ° C per minute, at 300. Hold for 90 minutes. Helium is used as a carrier gas. Further, gel permeation chromatography (Gel)

The measurement of Permeation Chromatography (hereinafter referred to as "GPC") is as follows. The column is Shodex SYSTEM-21 (KF_8〇3L, KF-802.5 (X2), KF-802), the eluent is tetrahydrofuran, the flow rate is 1 ml/min., the column temperature is 40 °C. Further, the detection system was performed with ri, and the calibration curve was made of standard polystyrene manufactured by Shodex. Example 1 With a stirrer, a reflux cooling tube, a stirring device, and a Dean-Stark 39 201040203, a nitrogen purge was carried out while 150 parts of toluene, 62.6 parts of the following formula (5) )

HCS / OH

Et Et (5) (manufactured by perst〇rp, bis(trimethylolpropane Di-TMP), 126 parts of 3-cyclohexenecarboxylic acid, 2 parts of p-toluene acid, removed by heat for 10 hours under I reflux After the reaction was completed, the mixture was washed twice with 50 parts of a 10% aqueous sodium hydrogencarbonate solution, and the obtained organic layer was washed twice with 50 parts of water, and then the organic solvent was concentrated by a rotary evaporator. Thus, 165 parts of the olefin resin of the present invention (D_〇 was obtained in a liquid form, and the purity obtained by gas chromatography was 92%, and the analysis result by gel permeation chromatography was confirmed to be 96%. Purification Example 2 In a crucible equipped with a stirrer, a reflux cooling tube, and a stirring device, while adding nitrogen gas, adding 5 parts of water, 0 95 parts of 12-tungstophosphoric acid, 0.78 parts of disodium hydrogen phosphate, and 2.7 parts. Di-hardened tallow alkyl dimercaptoacetic acid ammonium (manufactured by Lion Akzo, 50 〇 / 〇 hexane solution, Arquad 2HT-Acetate), after the formation of tungstic acid-based catalyst, 'add 90 parts of toluene, 85 parts of Example 1 The obtained olefin resin D-1 'heated the mixed solution to 50 ° C, and added 55 parts while stirring vigorously 3 5 wt% of hydrogen peroxide water was stirred for 13 hours under 50T: The reaction was confirmed by GC, and as a result, the conversion of the substrate after the end of the reaction 201040203 was >99%, and the peak of the raw material disappeared. After neutralization of the aqueous solution of sodium hydroxide, 25 parts of a 20% by weight aqueous solution of thiosulfate steel was added for 3 minutes, and then left to stand. The organic layer separated into 2 layers was taken out and 10 parts of silicone was added thereto (" Wakogel C-3 00 'and 姊 姊 进 · , , , , , , , , , , , , , , , , , , , , , , , , 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 Manufactured, Bengel SH), stirred at room temperature! After an hour, the sputum was filtered and filtered. The obtained filtrate was washed 3 times with 1 part of water, and the white post was steamed from the organic layer obtained from ^ Ο The organic solvent is removed, thereby obtaining 99 parts of the epoxy resin of the present invention containing the compound represented by the following formula (6) as a main component (Ερ^).

Servant 1/Chenglong|Multi-J Factory/] Measurement results, confirmation, pure in GC measurement

The G of Konghengzhi contains 98% of the compound of formula (6) and the compound degree is 90%. Also, the ring gas coil field 1 was 201 g/eq. Example 3 EIM) 105 parts of silicone rubber was used. Ethyl acetate: hexane was obtained for 15 parts of epoxy resin (Wakogel C-300, went to f Wako Pure Chemical Manufacturing Co., Ltd.) 201040203 ==1 : 3 developer, purified by column chromatography. The obtained epoxy resin (EP-2) was 10 parts, and the obtained epoxy resin was confirmed according to the measurement result of GPC. The purity is 98% or more of the skeleton of the above formula (6). Further, the purity in the GC is about 99%. Further, the epoxy equivalent is 1 89 g/eq. 〇 Synthesis Example 1 In the example 2, the method of the above-mentioned formula (7) is produced by changing the 85 parts of the olefin resin d-1 to 6 parts by the method of the above-mentioned Japanese Patent Publication No. Hei 7-7丨79. Olefin resin (D_2):

, N 〇 from only the comparison of j epoxy resin (EP_3). Further, for the epoxy tree obtained in 3G parts (BP-3), 21 〇 (4) glue was used (WakGgeic_ trace and pure chemical preparation method for purification. 5 developing agent, using the column) The epoxy obtained by the gentleman The resin (EP_4) is 7 parts, according to Gpc, ·,. Fruit Green recognizes that the purity of the epoxy resin contains 98 ′ > of the structure of the compound: the following U: 42 201040203

Further, the purity in the GC measurement was about 99%. Further, the epoxy equivalent was 137 g/eq. 〇 Examples 4 and 5, and Comparative Example 1 The epoxy resins (Ep_i, EP-2) of the present invention obtained in Examples 2 and 3, and Synthesis Example 1 were used. The epoxy resin (ep_4) obtained for comparison was prepared using mercaptohexahydrophthalic anhydride (manufactured by Nippon Chemical and Chemical Co., Ltd., Rikacid MH700G, hereinafter referred to as HI) as a hardener, using sixteen bases = Methyl hydrazine emulsification (manufactured by Toka Chemical Industries Co., Ltd., 25% sterol solution, referred to as C1) as a hardening accelerator (hardening catalyst), formulated at the blending ratio (parts by weight) shown in Table 1 below The defoaming was carried out for 20 minutes to obtain a curable resin composition of the present invention and comparative use. The curable resin composition obtained was tested for physical properties as described below, and the results are shown in the same table. Furthermore, the hardening conditions in the thermal property test and the thermomechanical property test were 150 ° C x 3 hours after the preliminary hardening of 丨 2 01 x 1 hour. (Heat resistance characteristic test) After the vacuum curing of the curable resin composition was carried out for 20 minutes in the examples and comparative shots, the mold was slowly injection molded at a width of 7 mm, a length of $, and a thickness of 43 201040203 degrees of about 800 ^/claw. The test piece was placed in a metal mold, and then the polyimide film was covered from above. The injection molded article was cured under the above conditions to obtain a test piece for dynamic viscoelasticity. Using these test pieces, a dynamic viscoelasticity test (DMA (Dynamic Mechanical Analysis) measurement test) was carried out under the conditions shown below. Determination conditions Dynamic viscoelasticity tester: manufactured by TA-instruments, DMA-2980 Measurement temperature range: -30 ° C ~ 28 (TC heating rate: 2 ° C / min Test piece size: using cut into 5 mm x 50 mm (thickness) About 8〇〇vm). Analysis conditions

Tg: The peak point of Tan- <5 in the DMA measurement is set to Tg. (Thermo-mechanical property test) The curable resin composition obtained in the examples and the comparative examples was subjected to vacuum defoaming for 20 minutes, and then injection molded in a 2 mm official Teflon (registered trademark) to make the injection molded article. The test piece was obtained by hardening under the above conditions. A thermomechanical property test (TMA (Thermo-Mechanical Analysis) test) was carried out using the following conditions. Measuring conditions Dynamic viscoelasticity measuring device: Vacuum engineering (stock) manufacturing, TM-7000 Measuring temperature range: 40 ° C ~ 250 ° C Heating rate: 2 ° C / min Test piece size: using cut ingredients 2 mm, 15 Mm. 44 201040203 (Thermal durability penetration rate test) The curable resin composition obtained in the examples and the comparative examples was subjected to vacuum defoaming for 20 minutes, and then slowly became 3 〇 mm x 2 〇 mm x height i claws. The injection molding is performed on a glass substrate in which a barrier is formed using a heat resistant tape. The injection molding is made at 120. (:><3 hours after the preliminary hardening, 15 (Γ(:1, hardening was performed for 1 hour, and a test piece for a transmittance of 1 mm in thickness was obtained. Using these test pieces, the measurement was performed by a spectrophotometer at 15 〇t> The penetration rate (measurement wavelength · 465 nm) was set in the oven for 96 hours, and the retention rate of the ruthenium transmittance was calculated. (Sturability test) The sclerosing property obtained in 1 mL of the examples and the comparative examples was taken. Resin composition 'measurement 15 (gel time under TC. Measurement machine gel timer: No. 153 Geltime Tester (manufactured by Yasuda Seiki Seisakusho Co., Ltd.) [Table 1] Item Example 4 Example 5 Comparative Example 1 Composition heat resistance: EP -1 5.03 EP-2 4.73 EP-4 3.43 Hardener (H1) 3.36 3.36 3.36 Hardening Catalyst (C1) 0.04 0.04 0.04 Temple DMA (tan <5 ) 211°C 224〇C 184〇C Thermomechanical Properties TMA (Tg) 180 ° C 187 〇 C 139 〇 C heat penetration rate retention (465 nm) 94% 42% gel # between 777 seconds 2234 seconds 〇 45 201040203 According to the above results, the epoxy resin of the present invention can provide a curable resin composition having a short gelation time and excellent hardening property, and A cured product excellent in heat resistance (heat resistance, thermomechanical properties, heat resistance and coloring resistance). Example 6 and Comparative Example 2 The epoxy resin (Ep_2), 3,4-ring of the present invention obtained in Example 2 Oxycyclohexanic acid-3,4-epoxycyclohexylmethyl ester (manufactured by D〇w Chemical, ERL-4221 (hereinafter referred to as epoxy resin (Ερ·5))), using hardener (m), hardening promotion The agent (curing catalyst) (C1) was prepared by blending at a mixing ratio (parts by weight) as shown in the following Table 2, and defoaming was carried out for 2 minutes to obtain a curable resin composition of the present invention and comparative use. The curable resin composition was tested for physical properties as described below, and the results are shown in Table 2. (Permeability test) After the vacuum curable resin composition obtained in the examples and the comparative examples was subjected to vacuum defoaming for 20 minutes, Slowly injection molding on a glass substrate made of a heat-resistant adhesive tape to form a barrier of 3 〇 mm x 2 〇 mm x height j. The injection molding was allowed to be 15 〇〇 C x 1 hour after 12 〇 t x 3 hours of preliminary hardening. Hardening was carried out to obtain a test piece for a transmittance of thickness 丨 mm. Using spectrophotometry The transmittance was compared. (Measurement wavelength: 4 〇〇 nm) (LED lighting test) The curable resin composition obtained in the examples and the comparative examples was subjected to vacuum defoaming for 20 minutes, and then filled in a syringe. In the surface mount type LED package (inner diameter 4.4 mm, outer wall height 46 201040203 1.25 mm) having an outer diameter of 5 111 square having a light-emitting element having an emission wavelength of 465 nm, a precision ejection device was used. Then, the LED for lighting test was obtained by hardening it under predetermined hardening conditions. The lighting test is a lighting test with a specified current of 3 〇. The detailed conditions are as follows. As a measurement item, the illuminance before and after the lighting for 200 hours was measured using an integrating sphere, and the illuminance retention rate of the test LED was calculated. Detailed lighting conditions Lighting wavelength: 465 nm Driving method: Constant current mode, 30 mA (lighting element specified current Ο 30 mA) Driving environment: 85 ° C, 85% Evaluation: Illuminance retention rate 〇 [Table 2]

Hardener (H1) hardening catalyst (C1)

According to the above results, the epoxy resin of the present invention can provide a cured product which is excellent in both hardenability and transparency (transparency): It is also known from the results of the illuminance retention rate. Heat deterioration resistance and deterioration resistance of the cured product of the invention

The use has excellent adaptability. The invention has been described in detail with reference to the specific aspects of the LEDs, but it will be understood by those skilled in the art that various changes and modifications can be made without departing from the invention. God and Fan Zai's 'This application is based on 2〇〇9年4: = Application (Special Wish 2___8), all of which are in the text, and all the contents quoted therein are [simplified description] 】 No [main component symbol description] No 48

Claims (1)

201040203 VII. Patent application scope: It is expressed by the following formula (1). 1. An olefin resin, characterized in that (wherein a plurality of R atoms or an alkyl group having 1 to 15 carbon atoms) p are independently present, and represent a hydrogen type 2 epoxy resin, characterized in that: one of the olefin resins is oxidized to obtain . It is epoxidized by applying the patent scope 3 · as claimed in the patent range 2 or peracid. The epoxy resin of the item is a hydrogen peroxide-based image-hardening resin composition, which is characterized in that it contains the oxy-resin and hardening of the second-party yoke Agent and / or hardening catalyst. The hardened material of the heart is characterized in that the curable resin composition of the fourth item of the patent range is hardened. VIII, schema no 49