CN104928730A - 锡或锡合金的电镀浴以及凸点的制备方法 - Google Patents

锡或锡合金的电镀浴以及凸点的制备方法 Download PDF

Info

Publication number
CN104928730A
CN104928730A CN201510115635.0A CN201510115635A CN104928730A CN 104928730 A CN104928730 A CN 104928730A CN 201510115635 A CN201510115635 A CN 201510115635A CN 104928730 A CN104928730 A CN 104928730A
Authority
CN
China
Prior art keywords
plating bath
tin
active agent
acid
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510115635.0A
Other languages
English (en)
Chinese (zh)
Inventor
生本雷平
辻本雅宣
加纳俊和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Publication of CN104928730A publication Critical patent/CN104928730A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201510115635.0A 2014-03-18 2015-03-17 锡或锡合金的电镀浴以及凸点的制备方法 Pending CN104928730A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-055266 2014-03-18
JP2014055266 2014-03-18

Publications (1)

Publication Number Publication Date
CN104928730A true CN104928730A (zh) 2015-09-23

Family

ID=54116147

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510115635.0A Pending CN104928730A (zh) 2014-03-18 2015-03-17 锡或锡合金的电镀浴以及凸点的制备方法

Country Status (5)

Country Link
US (1) US20150267310A1 (https=)
JP (1) JP2015193916A (https=)
KR (1) KR20150108767A (https=)
CN (1) CN104928730A (https=)
TW (1) TW201542886A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107630238A (zh) * 2016-07-18 2018-01-26 罗门哈斯电子材料有限责任公司 铟电镀组合物和用于电镀铟的方法
CN107779664A (zh) * 2016-08-31 2018-03-09 互进电镀科技有限公司 利用电镀的锡铋铅三元合金焊料组合物
CN110565126A (zh) * 2018-06-05 2019-12-13 丰田自动车株式会社 成膜用金属溶液以及金属被膜的成膜方法
CN111279020A (zh) * 2017-10-24 2020-06-12 三菱综合材料株式会社 锡或锡合金电镀液
CN112135929A (zh) * 2018-04-20 2020-12-25 巴斯夫欧洲公司 包含抑制剂的用于锡或锡合金电镀的组合物
CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液
CN114737228A (zh) * 2022-06-09 2022-07-12 深圳市板明科技股份有限公司 一种线路板电镀锡光亮剂及其应用
CN115003863A (zh) * 2020-01-27 2022-09-02 三菱综合材料株式会社 锡或锡合金电镀液、凸点的形成方法及电路基板的制造方法
CN116529428A (zh) * 2020-11-25 2023-08-01 三菱综合材料株式会社 锡合金镀液

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233334B1 (ko) * 2014-04-28 2021-03-29 삼성전자주식회사 주석 도금액, 주석 도금 장치 및 상기 주석 도금액을 이용한 반도체 장치 제조 방법
US10407795B2 (en) 2016-11-16 2019-09-10 Eci Technology, Inc. Analysis of silver ion and complexing agent in tin-silver electrodeposition solution
CN110462108B (zh) * 2017-03-27 2022-02-01 三菱综合材料株式会社 电镀液
WO2019082884A1 (ja) 2017-10-24 2019-05-02 三菱マテリアル株式会社 錫又は錫合金めっき液
US11268203B2 (en) 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution
JP6620858B2 (ja) 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
JP2019140174A (ja) * 2018-02-07 2019-08-22 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
US11053600B2 (en) 2018-03-20 2021-07-06 Mitsubishi Materials Corporation Tin or tin alloy plating solution and bump forming method
WO2019181905A1 (ja) 2018-03-20 2019-09-26 三菱マテリアル株式会社 錫又は錫合金のめっき液、バンプの形成方法、回路基板の製造方法
US11021786B2 (en) * 2018-12-04 2021-06-01 Texas Instruments Incorporated Copper passivation
US11109481B2 (en) * 2019-02-15 2021-08-31 Ibiden Co., Ltd. Method for manufacturing printed wiring board and printed wiring board
JP7276049B2 (ja) * 2019-09-27 2023-05-18 三菱マテリアル株式会社 めっき方法
CN111139462B (zh) * 2020-01-16 2021-12-28 常熟市普华电工材料有限公司 一种电镀锡处理工艺
JP2021116473A (ja) * 2020-01-27 2021-08-10 三菱マテリアル株式会社 錫又は錫合金電解めっき液、バンプの形成方法、及び回路基板の製造方法
JP7064178B2 (ja) 2020-10-13 2022-05-10 三菱マテリアル株式会社 錫又は錫合金めっき液及び該液を用いたバンプの形成方法
US12529159B2 (en) * 2023-07-12 2026-01-20 Hong Kong Applied Science and Technology Research Institute Company Limited Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding
CN117238781B (zh) * 2023-11-16 2024-02-23 江苏芯德半导体科技有限公司 一种晶圆级超薄四边无引脚芯片封装方法及芯片封装结构
JP2025139964A (ja) * 2024-03-13 2025-09-29 三菱マテリアル株式会社 めっき液用微粒化剤補給液、および、錫系めっき材の製造方法
CN120060938A (zh) * 2025-03-03 2025-05-30 大连理工大学 一种中性光亮镀锡电镀液及其制备方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459185A (en) * 1982-10-08 1984-07-10 Obata, Doni, Daiwa, Fine Chemicals Co., Ltd. Tin, lead, and tin-lead alloy plating baths
US20030105216A1 (en) * 2001-03-16 2003-06-05 Sumitomo Chemical Company, Limited Aqueous emulsion comprising ethylene-vinylester copolymer
CN101421439A (zh) * 2006-04-14 2009-04-29 上村工业株式会社 锡电镀浴、镀锡膜、锡电镀方法及电子器件元件
CN102187749A (zh) * 2008-10-21 2011-09-14 埃托特克德国有限公司 用于在衬底上形成焊料沉积物的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
JP2001107287A (ja) * 1999-10-07 2001-04-17 Ebara Udylite Kk Ｓｎ−Ｃｕ合金めっき浴
JP2003293185A (ja) * 2002-04-02 2003-10-15 C Uyemura & Co Ltd 錫電気めっき浴及びこれを用いためっき方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459185A (en) * 1982-10-08 1984-07-10 Obata, Doni, Daiwa, Fine Chemicals Co., Ltd. Tin, lead, and tin-lead alloy plating baths
US20030105216A1 (en) * 2001-03-16 2003-06-05 Sumitomo Chemical Company, Limited Aqueous emulsion comprising ethylene-vinylester copolymer
CN101421439A (zh) * 2006-04-14 2009-04-29 上村工业株式会社 锡电镀浴、镀锡膜、锡电镀方法及电子器件元件
CN102187749A (zh) * 2008-10-21 2011-09-14 埃托特克德国有限公司 用于在衬底上形成焊料沉积物的方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107630238A (zh) * 2016-07-18 2018-01-26 罗门哈斯电子材料有限责任公司 铟电镀组合物和用于电镀铟的方法
CN107779664A (zh) * 2016-08-31 2018-03-09 互进电镀科技有限公司 利用电镀的锡铋铅三元合金焊料组合物
CN111279020A (zh) * 2017-10-24 2020-06-12 三菱综合材料株式会社 锡或锡合金电镀液
CN111279020B (zh) * 2017-10-24 2021-04-16 三菱综合材料株式会社 锡或锡合金电镀液
CN112135929A (zh) * 2018-04-20 2020-12-25 巴斯夫欧洲公司 包含抑制剂的用于锡或锡合金电镀的组合物
CN112135929B (zh) * 2018-04-20 2023-12-15 巴斯夫欧洲公司 包含抑制剂的用于锡或锡合金电镀的组合物
CN110565126A (zh) * 2018-06-05 2019-12-13 丰田自动车株式会社 成膜用金属溶液以及金属被膜的成膜方法
CN115003863A (zh) * 2020-01-27 2022-09-02 三菱综合材料株式会社 锡或锡合金电镀液、凸点的形成方法及电路基板的制造方法
CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液
CN116529428A (zh) * 2020-11-25 2023-08-01 三菱综合材料株式会社 锡合金镀液
CN114737228A (zh) * 2022-06-09 2022-07-12 深圳市板明科技股份有限公司 一种线路板电镀锡光亮剂及其应用

Also Published As

Publication number Publication date
US20150267310A1 (en) 2015-09-24
KR20150108767A (ko) 2015-09-30
JP2015193916A (ja) 2015-11-05
TW201542886A (zh) 2015-11-16

Similar Documents

Publication Publication Date Title
CN104928730A (zh) 锡或锡合金的电镀浴以及凸点的制备方法
JP5207968B2 (ja) 電子工学の製造分野での錫−銀ハンダ・バンプ
JP6133056B2 (ja) スズまたはスズ合金めっき液
KR101361555B1 (ko) 주석 전기도금욕, 주석 도금 피막, 주석 전기도금 방법 및 전자기기 구성 부품
JP3871013B2 (ja) 錫−銅合金電気めっき浴及びそれを使用するめっき方法
KR19980703455A (ko) 금속 착물 형성용 수용액, 주석-은 합금 도금욕 및 당해 도금욕을 사용하는 도금물의 제조방법
KR20190127814A (ko) 도금액
WO2013046731A1 (ja) スズめっき用酸性水系組成物
JP2000226686A (ja) 鉛および鉛／錫合金の電気めっき用電気めっき溶液
US6730209B2 (en) Solder electroplating bath including brighteners having reduced volatility
JP2000328285A (ja) 酸性錫−銅合金めっき浴
JP2019077949A (ja) 錫又は錫合金めっき液
KR102629674B1 (ko) 주석 합금 도금액
JP2021116461A (ja) 錫又は錫合金めっき液
JP7557627B2 (ja) 錫－銀めっき液及びそれを用いた錫－銀はんだバンプの形成方法
JP2016183410A (ja) スルホニウム塩を用いためっき液
JP2002339095A (ja) スズ−ビスマス−銅合金の析出方法
JPH08225985A (ja) ビスマス−スズ合金めっき浴
KR20250124512A (ko) 솔더 범프용 주석-은 도금액
JP2006348347A (ja) 電子部品の表面処理方法
TW202136587A (zh) 錫或錫合金電鍍液、凸塊之形成方法及電路基板之製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150923