TW201542886A - 錫或錫合金之電鍍浴及凸塊之製造方法 - Google Patents

錫或錫合金之電鍍浴及凸塊之製造方法 Download PDF

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Publication number
TW201542886A
TW201542886A TW104105036A TW104105036A TW201542886A TW 201542886 A TW201542886 A TW 201542886A TW 104105036 A TW104105036 A TW 104105036A TW 104105036 A TW104105036 A TW 104105036A TW 201542886 A TW201542886 A TW 201542886A
Authority
TW
Taiwan
Prior art keywords
group
tin
salt
electroplating bath
acid
Prior art date
Application number
TW104105036A
Other languages
English (en)
Chinese (zh)
Inventor
生本雷平
辻本雅宣
加納俊和
Original Assignee
上村工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上村工業股份有限公司 filed Critical 上村工業股份有限公司
Publication of TW201542886A publication Critical patent/TW201542886A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01231—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition
    • H10W72/01233—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01235—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW104105036A 2014-03-18 2015-03-11 錫或錫合金之電鍍浴及凸塊之製造方法 TW201542886A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014055266 2014-03-18

Publications (1)

Publication Number Publication Date
TW201542886A true TW201542886A (zh) 2015-11-16

Family

ID=54116147

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104105036A TW201542886A (zh) 2014-03-18 2015-03-11 錫或錫合金之電鍍浴及凸塊之製造方法

Country Status (5)

Country Link
US (1) US20150267310A1 (https=)
JP (1) JP2015193916A (https=)
KR (1) KR20150108767A (https=)
CN (1) CN104928730A (https=)
TW (1) TW201542886A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707066B (zh) * 2017-10-24 2020-10-11 日商三菱綜合材料股份有限公司 錫或錫合金鍍敷堆積層之形成方法
US11268203B2 (en) 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102233334B1 (ko) * 2014-04-28 2021-03-29 삼성전자주식회사 주석 도금액, 주석 도금 장치 및 상기 주석 도금액을 이용한 반도체 장치 제조 방법
US20180016689A1 (en) * 2016-07-18 2018-01-18 Rohm And Haas Electronic Materials Llc Indium electroplating compositions and methods for electroplating indium
KR20180024765A (ko) * 2016-08-31 2018-03-08 주식회사 호진플라텍 전기도금을 이용한 주석-비스무트-납 삼원합금 솔더 조성물
US10407795B2 (en) 2016-11-16 2019-09-10 Eci Technology, Inc. Analysis of silver ion and complexing agent in tin-silver electrodeposition solution
CN110462108B (zh) * 2017-03-27 2022-02-01 三菱综合材料株式会社 电镀液
WO2019082884A1 (ja) 2017-10-24 2019-05-02 三菱マテリアル株式会社 錫又は錫合金めっき液
JP6620859B2 (ja) 2017-10-24 2019-12-18 三菱マテリアル株式会社 錫又は錫合金めっき堆積層の形成方法
JP2019140174A (ja) * 2018-02-07 2019-08-22 イビデン株式会社 プリント配線板およびプリント配線板の製造方法
US11053600B2 (en) 2018-03-20 2021-07-06 Mitsubishi Materials Corporation Tin or tin alloy plating solution and bump forming method
WO2019181905A1 (ja) 2018-03-20 2019-09-26 三菱マテリアル株式会社 錫又は錫合金のめっき液、バンプの形成方法、回路基板の製造方法
EP3781729B1 (en) * 2018-04-20 2024-09-25 Basf Se Composition for tin or tin alloy electroplating comprising suppressing agent
JP7035821B2 (ja) * 2018-06-05 2022-03-15 トヨタ自動車株式会社 成膜用金属溶液及び金属被膜の成膜方法
US11021786B2 (en) * 2018-12-04 2021-06-01 Texas Instruments Incorporated Copper passivation
US11109481B2 (en) * 2019-02-15 2021-08-31 Ibiden Co., Ltd. Method for manufacturing printed wiring board and printed wiring board
JP7276049B2 (ja) * 2019-09-27 2023-05-18 三菱マテリアル株式会社 めっき方法
CN111139462B (zh) * 2020-01-16 2021-12-28 常熟市普华电工材料有限公司 一种电镀锡处理工艺
KR20220132528A (ko) 2020-01-27 2022-09-30 미쓰비시 마테리알 가부시키가이샤 주석 또는 주석 합금 전해 도금액, 범프의 형성 방법, 및 회로 기판의 제조 방법
JP2021116473A (ja) * 2020-01-27 2021-08-10 三菱マテリアル株式会社 錫又は錫合金電解めっき液、バンプの形成方法、及び回路基板の製造方法
JP7064178B2 (ja) 2020-10-13 2022-05-10 三菱マテリアル株式会社 錫又は錫合金めっき液及び該液を用いたバンプの形成方法
CN112359380A (zh) * 2020-10-23 2021-02-12 珠海鑫通化工有限公司 一种被动元器件化学镀锡用电镀液
JP7140176B2 (ja) 2020-11-25 2022-09-21 三菱マテリアル株式会社 錫合金めっき液
CN114737228B (zh) * 2022-06-09 2022-08-26 深圳市板明科技股份有限公司 一种线路板电镀锡光亮剂及其应用
US12529159B2 (en) * 2023-07-12 2026-01-20 Hong Kong Applied Science and Technology Research Institute Company Limited Co-electroplating Sn—Bi alloy solder for 3D-IC low-temperature bonding
CN117238781B (zh) * 2023-11-16 2024-02-23 江苏芯德半导体科技有限公司 一种晶圆级超薄四边无引脚芯片封装方法及芯片封装结构
JP2025139964A (ja) * 2024-03-13 2025-09-29 三菱マテリアル株式会社 めっき液用微粒化剤補給液、および、錫系めっき材の製造方法
CN120060938A (zh) * 2025-03-03 2025-05-30 大连理工大学 一种中性光亮镀锡电镀液及其制备方法与应用

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
JP2001107287A (ja) * 1999-10-07 2001-04-17 Ebara Udylite Kk Ｓｎ−Ｃｕ合金めっき浴
TW583202B (en) * 2001-03-16 2004-04-11 Sumitomo Chemical Co Aqueous emulsion comprising ethylene-vinylester copolymer
JP2003293185A (ja) * 2002-04-02 2003-10-15 C Uyemura & Co Ltd 錫電気めっき浴及びこれを用いためっき方法
JP5158303B2 (ja) * 2006-04-14 2013-03-06 上村工業株式会社 錫電気めっき浴、錫めっき皮膜、錫電気めっき方法及び電子機器構成部品
MY158939A (en) * 2008-10-21 2016-11-30 Atotech Deutschland Gmbh Method to form solder deposits on substrates

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707066B (zh) * 2017-10-24 2020-10-11 日商三菱綜合材料股份有限公司 錫或錫合金鍍敷堆積層之形成方法
US11268203B2 (en) 2017-10-24 2022-03-08 Mitsubishi Materials Corporation Tin or tin alloy plating solution

Also Published As

Publication number Publication date
US20150267310A1 (en) 2015-09-24
KR20150108767A (ko) 2015-09-30
JP2015193916A (ja) 2015-11-05
CN104928730A (zh) 2015-09-23

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