CN1047847C - 过程控制温度变送器的校准 - Google Patents
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- 150000002739 metals Chemical class 0.000 description 1
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Abstract
一种变送器(10)在过程控制回路(12)中测量温度。一个校准器(60)包括一个已知的校准元件(64)连接到变送器(10)。变送器(10)中的软件将校准元件(64)测出的数值与校准元件(64)的实际数值比较,并相应地校准变送器(10)。校准器(60)包括一个用于耦合到变送器(10)的接线端子板(14)的温度校准传感器(70)。温度校准传感器(70)提供输入到变送器(10)的实际温度。变送器(10)测量接线端子板(14)的实际温度且将实际温度与接线端子板内置温度传感器(34)测出的温度相比较,并相应地校准内置温度传感器(34)。
Description
本专利文献披露的一部分包含有受版权保护的材料。版权所有人不反对任何人传真复制本专利文献或专利披露,例如像在专利商标事务所的专利文件或记录中所出现的那样。但除此以外,不管怎样均保留全部版权。
本发明涉及过程控制回路中使用的变送器。更具体地说,本发明涉及校准过程控制回路中使用的温度变送器。
过程控制变送器用于测量过程控制系统中的过程参数。基于变送器的微处理器包括一个传感器或传感器输入端,一个用于将传感器的输出转换为数字格式的模数转换器,一个用于补偿数字化输出的微处理器,以及一个用于传送已补偿输出的输出电路。这个传送一般都在过程控制回路例如4-20mA的电流回路上进行。一个示例参数就是通过测量RTD(电阻性热敏器件,也叫PRT-铂电阻温度计)传感器的电阻,或者热电偶传感器的电压输出而检出的温度。
用于检测参数的一种技术是靠将RTD的电阻与制造变送器时已经校准的变送器内部基准电阻水平相比较。例如,通过将RTD与已知基准电阻(RREF)串联并用两电阻的公共电流测量RTD的电阻。传感器的电阻(RINPUT)表示如下: 方程1式中:RREFNOM=基准电阻的标称电阻(欧姆)
RCAL1=制造期间决定的基准补偿值(欧姆)。这个数值表示已校准的基准电阻(RREF)和基准电阻的标称值之间的差值;
RCAL2=用户校准补偿值,
VRINPUT=输入端上的电压降;以及
VRREF=RREF两端的电压降。
方程1用作自动调零和自动补偿程序的一部分,是因为分子中VRINPUT的测量误差趋向和分母中VRREF的误差完全一样,因而互相抵销。
A/D转换器将方程1的电压数字化,微处理器接收数字化了的数值并根据方程1计算和补偿RINPUT,由微处理器使用查找表或适用的方程转换成相应的传感器温度数值。变送器的输出电路接收传感器的温度数值并以电流电平或者数字数值的形式向回路提供一个输出。可惜的是,RREF有时要偏离RREFNOM和RCAL1的校准值,导致温度测量的不精确性。
校准RREF的一个典型现有技术方法是将一个外接预定电阻连接到变送器的传感器输入端,并使变送器进入一个校准方式。变送器将预定电阻的期望值与测出的RINPUT数值相比较并通过调整RCAL2-用户微调的方法使用差值校准电子线路。一般预定电阻为有源电路或十进电阻箱。模拟电阻的有源线路通常都不精确并且一般地说,与固有安全环节不能相容,十进电阻箱相对于精密变送器而言不可重复且不准确,并在野外要求变送器脱离过程回路时难以操纵控制,因而被放进实验室中。它们还因大气温度的变化而产生阻值漂移。
热电偶也被变送器用来测量温度。名称为“具有冷结补偿的热偶变送器”并转让给本申请的同一受让人的美国专利No.4,936,490就叙述了这样一种测量。热偶结在结的两端产生一个与温度相关的电压。但是,在变送器的接线端子板处不同金属之间的连结会引进另一个的热偶电压。为了测量热电偶温度,必须测出接线端子板连接处的这个“冷结”的温度并补偿这个电压。一般,在基于变送器的微处理器中,温度传感器热耦合到接线端子板并通过A/D转换器连接到变送器的微处理器。微处理器根据PRT测得的冷结温度补偿热电偶电压。如果变送器测出的冷结温度不精确,热电偶温度测量的误差就上升。
现有技术对校准热电偶多输入变送器的努力集中在用已知电压源校准变送器。但是,电源相对于精密变送器而言一般都不稳定。例如,一个精密热偶变送器具有实际值为0.04%的典型精度。而且,很少对校准冷结温度测量值给予注意。
现有技术缺少一个用于适当校准温度测量的机内校准装置。而且,现有技术缺少一种在高精密变送器的精度内稳定到足以符合NIST(国家标准技术学会)可跟踪标准的有效可跟踪装置。由于采用RTD,电压校准不精确并且不能稳定到像NIST可跟踪装置那样有用(例如不能稳定到足以保持校准状态很长时间)。
本发明是一个沿过程控制回路传送测出的温度的温度变送器。为了校准变送器,一个已知的NIST可跟踪电阻RNIST耦合到变送器的输入端供变送器作为RINPUT测量。RNIST的NIST已校准数值(RNISTCAL)供应给变送器的微处理器,随即相应地计算出一个校准数值RCAL3,用于后面的RINPUT和温度测量。在另一个不同的校准方式中,变送器耦合到一个供变送器测量的已知NIST可跟踪电压基准VNIST。VNIST的NIST已校准数值(VNISTCAL)供给变送器的输入电路并且变送器相应地计算出一个电压基准值VCAL3。在最后一种校准方式中,具有可跟踪校准功能的温度探头耦合到变速器的接线端子板,并且变送器测量出冷结温度,随后相应地校准内置冷结温度传感器。
一种适用于耦合到变送器的校准器包括NIST可跟踪电阻RNIST、NIST可跟踪电压VNIST以NIST中跟踪温度探头(PNIST)。在一个实施例中,校准器沿二线过程控制回路与变送器通信。
图1A是一个连接成用RTD传感器测量温度的温度变送器的方框图。
图1B类似图1A,是连接成用热偶传感器测量温度的温度变送器的方框图。
图2是校准器的一个实施例的方框图。
图3是校准器的另一个实施例的方框图。
图4是一个简图,示出一个耦合到变送器的校准器。
图5是温度变送器中的微处理器工作的一个流程图。
图1A是一个连接成用RTD传感器测量温度的温度变送器10的方框图。变送器10耦合到过程控制回路12,控制回路12向变送器10供电并沿着它传送和接收信息。变送器10包括接线端子板14,它具有用于耦合到例如RTD热敏传感器16或热电偶温度传感器18(示于图1B)的端子1至4。图1A示出了至RTD16的电连接。传感器16(以及传感器18)可以内接或外接到变送器10。变送器10包括受微处理器22控制的多路转换器20,微处理器则通过输入/输出(I/O)电路23耦合到控制回路12。多路转换器20将模拟信号(包括来自端子1至4的信号)的适当组合连接到差分放大器26的正负输入端,差分放大器又连接到高精度A/D转换器28。在一个实施例中,转换器28具有一个17比特的精度和一个14样本/秒的转换速率。在1987年6月25出版的“电子设计杂志”的109页,Thomas J.Mego的文章“使用电荷平衡ADC很容易分辨22比特”中叙述了一种实例转换技术。存储器30存储用于微处理器22(它以时钟32决定的速度工作)的指令和信息。多路转换器20有选择地将其输入端连接到差分放大器26的正负输入端。一个电阻38耦合到多路转换器20并与RTD16串联。
在工作时,变送器10测量传感器16的温度并沿控制回路传送温度的表示信息。变送器10使用下面方程式计算RTD16的温度: 方程2式中
RREFNOM=基准电阻的标称电阻值(欧姆)并/或存放在存储器30中;
RCAL1=制造期间决定的对RREFNOM的校准补偿值(欧姆),并/或存放在存储器30中。这个数值表示基准电阻的实际值RREF与基准电阻在制造时的标称值之间的差值;
RCAL2=存放在存储器30中的用户对RREFNOM的标准补偿值;
RCAL3=根据本发明的一个方面对RREFNOM的现场校准补偿值,存放在存储器30中。
VRINPUT=输入端上的电压降;以及
VRREF=RREF两端的电压降。
电流源50通过传感器16(经由端子1和4)和基准电阻器38提供电流Is。微处理器22测量端子2和3之间RTD16两端的电压降(VRINPUT)并通过MUX20测量电阻器38两端的电压降VRREF。从内存30检索出RREFNOM、RRCAL1、RRCAL2、和RRCAL3。如下所述,RCAL3用来精确校准测量值符合NIST标准。在诸如本例这样的四线电阻测量中,到端子2和3的引线由两端的电压降大体上消除,因为全部电流基本上在端子1和4之间流动,对测量精度没有什么影响。RINPUT借助存放在存储器30中的查找表或适当方程式转换成温度单位。通过使用存在存储器里的附加校准数据和微处理器的附加检索能力部分地达到了本发明的提高了的精度。
图1B示出变送器10连接成用热偶传感器18来测量温度,热偶传感器建立一个跨在端子1和2之间的电压VTCINPUT。多路转换器20将差分放大器26的输入端耦合到端子2和1。图1B示出一个MUX20的电压基准(VTCREF)36以及一个电流源50。电压基准36包括连接成分压器的电阻器40和42以及一个齐纳二极管44。
变送器10借助下面的方程决定热偶电压VTC测出热偶传感器18的温度: 方程3式中
VTCINPUT=放大器26检测到的接线端子板14的端子1和2间的测出电压;
VTCREF=放大器26检测到的电压基准36生成的被测电压;
VTCREFNOM=存放在存储器30中的电压基准36的标称值;
VCAL1=在制造变送器10期间放在存储器30中的对VTCREFNOM的工厂校准补偿值;
VCAL2=存在存储器30中的对VTCREFNOM的用户微调校准补偿值;以及
VCAL3=存放在存储器30中的用于将变送器10校准至NIST可跟踪电压基准的对VTCREFNOM的基准补偿值。
但是,在端子1形成的两种不同金属之间的连结引进一个正比于结温的冷结误差电压。误差电压通过测量基于PRT(铂电阻温度计)传感器34的电阻的端子1的结温并随即使用一个标准方程或查找表决定冷结误差电压的方法来检测。传感器34的电阻,通过加上来自电流源50的电流Is使用方程2测量。PRT传感器34的电阻计算为:
RCJCPRT=RPRTEQ2+RPRTCAL方程4式中:
RCJCPRT=PRT传感器34的校准的电阻;
RPRTEQ2=用方程2算出的PRT的电阻;以及
RPRTCAL=存储在存储器30中的校准补偿值。
微处理器根据方程3计算VTC,并根据方程4计算RCJCPRT。然后,使用适当的查找表或方程从VTC中实际减去RCJCPRT。然后,所得到的传感器18的补偿温度经输出电路24耦合到回路12。
图2是根据本发明的校准器60的原理图。校准器60包括一个电压基准(VNIST)62,电阻基准(RNIST)64,组合开关66,连接器68a、68b和68c,以及包括一个NIST可跟踪PRT传感器72的连接器/探头70。RNIST应当选择对时间和温度均稳定的高精度电阻。同样,VNIST也应当是一个对时间和温度均稳定的精密电压基准,例如是一个对时间和温度均稳定的二极管两端的电压降。开关66包括联动开关66a至66d,动作一致并有选择地将连接器68a至68c和连接器/探头70分别合到基准电阻64、电压基准62以及PRT传感器72。探头70适于热耦合到变送器10的接线端子板14。在一个实施例中,探头70拧入到接线端子板14中。
在工作时,VNIST62和RNIST64以探头70被用一个标准的NIST实验室用可跟踪伏/欧表和一个校准到0℃冰点的温度标准校准到NIST可跟踪基准。基准电压62(VNISTCAL)、基准电阻64(RNISTCAL)以及PNISTCAL(0℃时RPROBE的NIST校准值)的精密校准数值注明在校准器60的记录单74上。校准器60被作为变送器10的配置并且连接器70,68c,68b和68a分别连接到端子1,2,3和4。开关66被控制得将电阻器RNIST64的一端连接到端子1和2以及接线端子板14。在这一位置上,RNIST64的连接方式与图1A所示RTD16的连接相似。变送器10接收回路12上的一个命令(例如HAPT命令)指令变送器10进入校准方式,并且操作员向变送器10提供RNIST 64的NIST校准数值(RNISTCAL)(如像在记录表74上指出的一样)。这个信息例如说使用手持通信机(如像在名称为“含有双主机的令牌通信系统”的美国专利No.4,988,990中所述那样的)通过双线回路提供给变送器10。微处理器22检测VRINPUT和VREFNOM并数字化,计算出RCAL3的新数值RCAL3 (NEW)如下: 方程5
RCAL3(NEW)作为RCAL3存放在存储器30中供后面测量用。
下一步,操作员将开关66放在合接线端子板14的端子1和2之间的电压基准VNIST62的位置就像对VTCINPUT一样。VNIST62的NIST校准数值(VNISTCAL)通过12提供给变送器10。VCAL3的新数值(VCAL (NEW))被确定: 方程6
VCAL3(NEW)作为VCAL3存放在存储器30中供后面使用。
经过校准电阻和电压测量之后,通过将开关66放置得使PRT传感器72的另一端耦合到端子1和2,另一端连到端子3和4。探头/连接器70热耦合到靠近传感器34的端子1,使得PRT传感器72的温度基本上与PRT内置传感器34的温度一样。例如,探头70可拧入端子1中。变送器10接收探头NIST数值PNISTCAL,通过测量PRT传感器72的电阻RPROBE,测量PRT传感器34的电阻RCJCPRT并应用方程式2开始PRT校准。在一个实施例中,微处理器22比较这些测量中的差值(表示传感器34偏离其以前校准值的漂移量)。这就提供了一个新的冷结校准值RPRTCAL(NEW)如下:
RPRTCAL(NEW)=RPROBE-RCJCPRT+(PNOM-PNIST)方程7
式中PNOM为标准PRT在0℃时的标称电阻。RPRTCAL(NEW)作为RPRTCAL存放在存储器30中。
图3是根据另一实施例的校准器80的方框图。校准器80包括基准电阻(RNIST)64,电压基准(VNIST)62,可跟踪探头PNIST70,以及连接器68a、68b、68c和70。微处理器82控制校准器80。微处理器82在显示器84上显示信息,把信息存放在存储器88中,通过键盘90从操作员那里接收信息,并经过输入/输出电路92在二线回路上通信。微处理器82使用多路转换开关(MUX)94有选择地使RNIST64、VNIST62和PRT传感器72(图3未示出)耦合到连接器68a至68c以及70,其工作与图2所示的开关66相似。
在工作中,操作员根据NIST可跟踪伏特/欧姆表和温度标准测量基准62和64以及探头70,并使用微处理器82和键盘90把这些数值(RNISTCAL、VNISTCAL和PNISTCAL)输入存储器88。校准器80通过连接器68a至68c以及70连接到变送器10,并通过输入/输出电路92耦合到回路12,以便校准器80按照标准通信技术例如HART协议与变送器10直接通信。操作员通过在键盘上输入命令来指令校准器80开始校准。微处理器82控制多路转换器94将电压基准64连接到变送器10。微处理器82穿过I/O电路92沿二线回路12发出一个适当的命令指令变送器10的微处理器22进入校准方式。微处理器82通过MUX94依次将电阻64和电压基准62连接到变送器10,并如上所述指令微处理器20校准电阻和电压。接线端子板14中的温度传感器34使用图3示出的传感器72(它经由多路转换器94耦合到变送器10)校准,并决定RPRTCAL(NEW)。在一个实施例中,变送器10输出其基准数值的漂移量以用于根据ISO9000要求显示。这可以在手持通信机上显示或者在校准器80上显示出来。
图4是过程控制系统100的方框图,系统包括变送器10,回路12,以及被模拟为电阻104和电压源106的控制器电子电路102 。图4示出耦合到回路12和通过分线盒108(它装有一个连接器110)耦合到RTD传感器16的校准器80。分线盒108是将连接器68a、68b、68c和70分别拧入接线端子板14的替代件。分线盒108允许校准器90通过连接器110直接耦合到接线端子板14。将连接器110插入分线盒108使开关112动作,从而提供了到接线端子板14的端子1至4的电连接并断开到传感器16的电连接。为了进行冷结温度传感器校准,传感器70连接到接线端子板14的端子1。分线盒108提供一个简单而又方便的接入接线端子板14的端子1至4的技术。由于电阻测量系使用四线连接法完成,故通过开关112引进的电阻不会降低校准精度。
图5是一个示出微处理器22根据存储器中的指令工作的流程图。流程图140在循环142中正常工作,该循环包括在程序块144测量和沿二线回路12传送温度,以及在程序块146检验回路12接收的校准开始命令。一接收到校准命令,微处理器22就在程序块148开始校准。
决定RCAL3(NEW)在程序块148开始。在送出开始校准的命令之前,操作员已经把NIST可跟踪电阻连接到接线端子板14。在程序块148,微处理器22测量并沿过程控制回路12传送RNIST。所传送的RNIST数值可显示在手持通信机或校准器80上。在程序块150,微处理器22从回路12上的校准器80得到RNISTCAL的数值。在程序块152,测量RINPUT和RREF的数值,并根据方程5算出一个新的校准值RCAL3(NEW)并在程序块154存储起来。在程序块156,再次测量RNIST并沿回路12传送其数值供手持机或校准器80接收。这个数值应当差不多与RNISTCAL的数值一样。
下一步,操作员将NIST可跟踪电压基准连接到接线端子板14用于校准VCAL3(NEW)。在程序块158测出VNIST并沿二线回路传送。微处理器在程序块160从回路12上的校准器80得到VNISTCAL以及VTCINPUT与VTCRET。在程序块162,根据方程6算出VCAL3(NEW)的数值并存放在存储器中。在程序块164再次测量VNIST并沿回路传送其数值。这个数值应当差不多与VNISTCAL一样。这就完成了电压测量的校准过程,并将探头70连接到接线端子板14用于校准PRT传感器34。在程序块166,开始决定RPRTCAL(NEW)并且通过微处理器22从回路12上的校准器80得到PNISTCAL的数值。在程序块168,微处理器22测量PPROBE和RPRT。在程序块170,微处理器22用方程7算出RPRTCAL(NEW)并将此数值存放在存储器30中。程序块170表示校准过程的结束并回到程序块144。
虽然本发明是参照优选实施例叙述的,但熟悉这一技术的工作者将会承认,可以在形式和细节方面进行改动而不需要脱离本发明的精神和范围。例如,可以使用其他型式的基准并且这些基准的实际数值的通信可以借助任何适当的手段。例如,虽然所叙述的校准过程是参照二线变送器解释的,但三线和四线变送器同样完全可以使用本发明。例如,虽然叙述了四线电阻测量法,但本文提出的概念可以应用于二线或三线电阻测量法。
Claims (24)
1.过程控制回路中的一种温度变送器,包括:
一个传感器输入端;用于从温度传感器接收温度校准输入电阻供冷结复合校准。
一个基准温度传感器,用于测量传感器输入端的冷结电阻;
A/D转换电路,用于将传感器输入和被测电阻转换为数字数值;
耦合到过程控制回路的I/O电路,沿回路送出和接收信息;以及
耦合到A/D转换器的微处理器电路,用于根据校准输入电阻校准基准温度传感器。
2.权利要求1的变送器,其中校准输入是NIST可跟踪的。
3.权利要求1的变送器,包括一个与基准温度传感器串联耦合的电阻,并且其中微处理器根据该电阻两端的电压降低决定冷结温度。
4.过程控制回路中的一种温度变送器,包括:
一个接线端子板,用于连接到传感器电阻;
一个电流源,提供通过传感器电阻和通过与传感器电阻串联的基准电阻的电流;
一个A/D转换器,用于将传感器电阻和基准电阻两端的电压差转换为数字数值;
I/O电路,用于送出和接收信息:
存储器,含有基准电阻的数值RREF和电阻校准数值PCAL3;以及
微处理器,从I/O电路接收传感器电阻的实际数值,传感器电阻和基准电阻两端的电压差的数字数值以及来自存储器的基准电阻RREF的数值,并相应算出一个新的校准数值RCAL3(NEW),其中RCAL3(NEW)作为RCAL3存放在存储器中供后面在温度测量期间使用。
5.权利要求4的温度变送器,其中接线端子板适用连接到一个提供热偶电压的热电偶,存储器含有一个电压校准数值VCAL3,并且微处理器接收热偶电压的实际数值VACTUAL,来自A/D转换器的被检测热偶电压,以及电压校准数值VCAL3,并相应算出一个新的电压校准数值VCAL3 (NEW),其中VCAL3(NEW)作为VCAL3存放在存储器中供后面在温度测量期间使用。
6.权利要求4的温度变送器,包括一个热耦合到接线端子板的CJC温度传感器,提供一个接线端子板温度传感器输出RCJCPRT,并且微处理器根据接线端子板温度传感器输出RCJCPRT算出一个校准补偿值RPRTCAL3(NEW);以及一个热耦合到接线端子板上的探头,它提供一个通过I/O电路接收的电阻RPROBE;校准补偿值存放在存储器中供后面温度测量期间使用。
7.权利要求6的温度变送器,其中探头电阻RPROBE电连接到接线端子板上。
8.权利要求4的温度变送器,包括一个分线盒,用于将传感器电阻电连接到接线端子板上。
9.一种用于校准过程控制回路中的温度变送器的校准器,包括:
一个NIST可跟踪基准;
多个适用于电连接到变送器的接线端子板的电连接器;以及
一个连接开关,用于有选择地将NIST可跟踪基准耦合到多个电连接器。
10.权利要求9的校准器,其中NIST可跟踪基准是一个NIST可跟踪电阻。
11.权利要求9的校准器,其中NIST可跟踪基准是一个NIST可跟踪电压。
12.权利要求9的校准器,其中NIST可跟踪基准是一个温度探头。
13.权利要求9的校准器,包括用于耦合到过程控制回路以及向变送器传送NIST可跟踪基准的数值的电路。
14.权利要求9的校准器,包括一个适用于耦合到接线端子板上并测量冷结温度的NIST可跟踪温度探头。
15.一种校准过程控制回路中的变送器的方法,包括:
将变送器的输入端连接到一个NIST可跟踪基准;
将NIST可跟踪基准的数值通知给变送器;
将所通知的NIST可跟踪基准数值与所测出的NIST可跟踪基准数值相比较;以及
根据比较结果相应校准温度变送器。
16.权利要求15的方法,其中通知步骤包括沿过程控制回路向变送器传送信息。
17.权利要求15的方法,包括在校准之前传送所通知的NIST可跟踪基准数值以及在校准后传送所测出的NIST可跟踪基准数值。
18.权利要求15的方法,包括:
测量变送器的接线端子板的温度;
将所测出的温度通知变送器;
将所通知的温度与内部测出的接线端子板测试相比较;以及
根据比较结果校准变送器。
19.权利要求15的方法,其中NIST可跟踪基准是一个电阻。
20.权利要求15的方法,其中NIST可跟踪基准是一个电压。
21.权利要求15的方法,其中NIST可跟踪基准是一个温度探头。
22.一种分线盒,包括:
第一连接机构,用于连接到过程控制系统中的变送器的接线端子板;
第二连接机构,用于连接到传感器;
一个校准输入端,用于耦合到基准元件;
一个在第一位置(第一连接机构在此位置耦合到第二连接机构)和第二位置(第一连接机构在此位置连接到校准输入端)之间可移动的开关。
23.权利要求22的分线盒,其中开关在基准元件连接到校准输入端时动作。
24.权利要求22的分线盒,其中第二连接机构和校准输入端含有用于四线动作测量的四个连接机构。
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US08/313,452 US5669713A (en) | 1994-09-27 | 1994-09-27 | Calibration of process control temperature transmitter |
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-
1994
- 1994-09-27 US US08/313,452 patent/US5669713A/en not_active Expired - Lifetime
-
1995
- 1995-09-07 CN CN95195282.XA patent/CN1047847C/zh not_active Expired - Fee Related
- 1995-09-07 WO PCT/US1995/011433 patent/WO1996010166A1/en active Application Filing
- 1995-09-07 EP EP95931781A patent/EP0783674A1/en not_active Withdrawn
-
1997
- 1997-05-16 US US08/857,236 patent/US5829876A/en not_active Expired - Lifetime
-
1998
- 1998-10-23 US US09/177,414 patent/US6045260A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5829876A (en) | 1998-11-03 |
US5669713A (en) | 1997-09-23 |
EP0783674A1 (en) | 1997-07-16 |
US6045260A (en) | 2000-04-04 |
CN1159225A (zh) | 1997-09-10 |
WO1996010166A1 (en) | 1996-04-04 |
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