CN104718808B - 电子部件安装系统 - Google Patents

电子部件安装系统 Download PDF

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Publication number
CN104718808B
CN104718808B CN201380051584.9A CN201380051584A CN104718808B CN 104718808 B CN104718808 B CN 104718808B CN 201380051584 A CN201380051584 A CN 201380051584A CN 104718808 B CN104718808 B CN 104718808B
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CN
China
Prior art keywords
solder
component mounting
electronic component
substrate
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380051584.9A
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English (en)
Chinese (zh)
Other versions
CN104718808A (zh
Inventor
万谷正幸
西中辉明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN104718808A publication Critical patent/CN104718808A/zh
Application granted granted Critical
Publication of CN104718808B publication Critical patent/CN104718808B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201380051584.9A 2012-11-19 2013-11-15 电子部件安装系统 Active CN104718808B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012252959A JP5884015B2 (ja) 2012-11-19 2012-11-19 電子部品装着システム
JP2012-252959 2012-11-19
PCT/JP2013/006727 WO2014076968A1 (ja) 2012-11-19 2013-11-15 電子部品装着システム

Publications (2)

Publication Number Publication Date
CN104718808A CN104718808A (zh) 2015-06-17
CN104718808B true CN104718808B (zh) 2017-10-24

Family

ID=50730899

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380051584.9A Active CN104718808B (zh) 2012-11-19 2013-11-15 电子部件安装系统

Country Status (4)

Country Link
US (1) US9332681B2 (enExample)
JP (1) JP5884015B2 (enExample)
CN (1) CN104718808B (enExample)
WO (1) WO2014076968A1 (enExample)

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KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
JP2016192456A (ja) * 2015-03-31 2016-11-10 パナソニックＩｐマネジメント株式会社 部品実装ラインおよび部品実装方法ならびに部品実装装置
EP3346813A4 (en) * 2015-09-01 2018-08-22 Fuji Machine Mfg. Co., Ltd. Required precision setting device
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP6643577B2 (ja) * 2016-06-01 2020-02-12 パナソニックＩｐマネジメント株式会社 印刷装置および半田管理システム
JP6660526B2 (ja) * 2016-07-28 2020-03-11 パナソニックＩｐマネジメント株式会社 部品実装装置および部品実装方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
JP7515093B2 (ja) * 2018-03-02 2024-07-12 パナソニックＩｐマネジメント株式会社 制御システム、基板製造システム、制御方法、及びプログラム
WO2019171582A1 (ja) * 2018-03-09 2019-09-12 株式会社Ｆｕｊｉ マスク印刷機
JP7261950B2 (ja) * 2018-04-12 2023-04-21 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品装着方法
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
WO2020121361A1 (ja) * 2018-12-10 2020-06-18 パナソニックＩｐマネジメント株式会社 部品実装システム
JP7535735B2 (ja) * 2019-03-28 2024-08-19 パナソニックＩｐマネジメント株式会社 生産データ作成装置および生産データ作成方法
JP7106761B2 (ja) * 2019-06-21 2022-07-26 株式会社Fuji 許容値設定システム、基板検査機、許容値設定方法、基板検査方法
WO2021144981A1 (ja) * 2020-01-17 2021-07-22 株式会社Ｆｕｊｉ 検査装置及び検査方法

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CN102450116A (zh) * 2009-10-08 2012-05-09 松下电器产业株式会社 部件组装系统及部件组装方法
CN102475000A (zh) * 2009-10-08 2012-05-23 松下电器产业株式会社 部件组装系统

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CN102475000A (zh) * 2009-10-08 2012-05-23 松下电器产业株式会社 部件组装系统

Also Published As

Publication number Publication date
CN104718808A (zh) 2015-06-17
JP2014103192A (ja) 2014-06-05
WO2014076968A1 (ja) 2014-05-22
US9332681B2 (en) 2016-05-03
US20150289426A1 (en) 2015-10-08
JP5884015B2 (ja) 2016-03-15

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