WO2014076968A1 - 電子部品装着システム - Google Patents

電子部品装着システム Download PDF

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Publication number
WO2014076968A1
WO2014076968A1 PCT/JP2013/006727 JP2013006727W WO2014076968A1 WO 2014076968 A1 WO2014076968 A1 WO 2014076968A1 JP 2013006727 W JP2013006727 W JP 2013006727W WO 2014076968 A1 WO2014076968 A1 WO 2014076968A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
component mounting
electronic component
substrate
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2013/006727
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
正幸 萬谷
輝明 西中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to US14/441,275 priority Critical patent/US9332681B2/en
Priority to CN201380051584.9A priority patent/CN104718808B/zh
Publication of WO2014076968A1 publication Critical patent/WO2014076968A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to an electronic component mounting system for mounting electronic components on a substrate.
  • An electronic component mounting system for manufacturing a mounting substrate by mounting an electronic component on a substrate is a solder printing apparatus that screen-prints solder onto the electrode of the substrate, and the electronic component is mounted on the electrode on which the solder is printed while being held by the mounting head.
  • a plurality of electronic component mounting devices such as an electronic component mounting device and a reflow device that heats the electronic component mounted substrate and solders the electronic component to the substrate, are connected.
  • the above-mentioned screen printing is performed by a squeezing operation in which solder is supplied onto a screen mask having a plurality of openings and the squeegee is slid on the screen mask.
  • the solder printed on the electrodes of the substrate does not satisfy a predetermined amount and is insufficient.
  • a printing state inspection device that inspects the printing state of solder is provided downstream of the solder printing device, and solder is added using a solder application means such as a syringe to places where it is determined that the amount of solder is insufficient.
  • coats is known.
  • the position of the solder printed on the electrode by the solder printing apparatus may not necessarily completely match the position of the electrode due to a processing error of the substrate or the screen mask. Therefore, in recent years, an electronic component mounting system having a function of correcting the mounting position of the electronic component based on the printing position of the solder printed on the substrate has been proposed. More specifically, the board after screen printing is inspected by a printing state inspection device to obtain a solder printing position, and an electronic component is mounted at the solder printing position.
  • the electronic component mounted on the misaligned solder After that, by reflowing the electronic component mounted on the misaligned solder, the electronic component is attracted to the electrode and properly aligned by the self-alignment effect of the molten solder, thereby realizing normal solder bonding without misalignment. be able to.
  • the present invention provides an electronic component mounting system having a function of correcting the mounting position of an electronic component based on the printing position of the solder printed on the electrode of the substrate.
  • An object of the present invention is to provide an electronic component mounting system capable of rationally performing a correction operation for additionally applying solder with high productivity.
  • the electronic component mounting system includes a screen printing unit that prints solder on an electrode of a circuit board by screen printing, a solder position detection unit that detects a position of the solder printed on the electrode by the screen printing unit, Solder amount inspection means for inspecting the amount of solder printed on the electrodes by the screen printing means, and a mounting position for obtaining a correction value of the mounting position of the electronic component based on the position of the solder detected by the solder position detection means
  • the electronic component mounting system comprising: a correcting unit; and an electronic component mounting unit that mounts the electronic component at a new component mounting position corrected based on the correction value obtained by the mounting position correcting unit.
  • the electronic component to be mounted on is mounted at the initial component mounting position without being corrected by the mounting position correcting means.
  • the electronic components are mounted at the initial component mounting position without correction by the mounting position correcting means. High-quality mounting using a function that corrects the mounting position of electronic components based on the printing position, and labor saving using a function that automatically applies additional solder to electrodes that lack solder Both can be realized.
  • Embodiment 1 Plan view of screen printing apparatus, solder coating apparatus, and electronic component mounting apparatus according to Embodiment 1
  • (A), (b) is a figure which shows the printing state of the solder part printed on the electrode of the board
  • FIG. The figure which shows the state of the solder additionally applied to the electrode of the board
  • (A), (b) is a block diagram which shows the structure of the control system of the solder application apparatus in this Embodiment 1, a high-order system, and an electronic component mounting apparatus.
  • FIG. Explanatory drawing of component mounting data in the first embodiment Flow chart showing a component mounting operation in the electronic component mounting apparatus according to the first embodiment.
  • (A), (b) is the figure which shows the state which mounted
  • (A) is a figure which shows the board
  • (b) is a figure which shows the coordinate system of the electronic component mounting apparatus in this Embodiment 2.
  • the electronic component mounting system includes a substrate supply device M1, a screen printing device M2, a solder coating device M3, electronic component mounting devices M4, M5, M6, a reflow device M7, and an electronic component mounting device of a substrate recovery device M8.
  • a substrate supply device M1 a screen printing device M2, a solder coating device M3, electronic component mounting devices M4, M5, M6, a reflow device M7, and an electronic component mounting device of a substrate recovery device M8.
  • the board supply device M1 is arranged at the head of the electronic component mounting line 1, and a circuit board 4 (hereinafter referred to as “substrate 4”) on which the electronic component 5 (see FIGS. 10A and 10B) is mounted. (See FIG. 2) is supplied to the screen printing apparatus M2.
  • the screen printing apparatus M2 prints solder on the plurality of electrodes 6 formed on the upper surface of the substrate 4 by screen printing.
  • the solder coating apparatus M3 has a function of inspecting the printing state (solder printing position and printing amount) of the solder printed on each electrode 6 of the substrate 4, and the solder printing amount satisfies a predetermined reference amount. Solder is added and applied to the electrodes 6 that are not.
  • the electronic component mounting apparatuses M4 to M6 mount the electronic component 5 on the substrate 4 on which the solder is printed on the electrode 6.
  • the reflow device M7 heats the substrate 4 after mounting the electronic component to melt the solder, and solders the electronic component 5 to the substrate 4.
  • the substrate recovery device M8 recovers the substrate 4 carried out from the reflow device M7.
  • Y-axis tables 11A and 11B having linear motion mechanisms using linear motors are arranged extending in the Y direction perpendicular to the X direction.
  • the Y-axis tables 11A and 11B are arranged in the X direction.
  • a frame member 12 extending in the direction of Y is movably installed in the Y direction.
  • a print head 13 provided with a squeegee (not shown) extending in the X direction so as to be movable up and down is attached to the frame member 12, and the print head 13 and the squeegee together with the frame member 12 are driven by driving the Y axis tables 11 A and 11 B. Move in the Y direction.
  • the Y axis tables 11A and 11B and the frame member 12 serve as squeegee moving means for moving the squeegee in the Y direction.
  • a mask plate 14 in which a plurality of pattern holes (not shown) corresponding to the print site of the substrate 4 is formed, and solder is supplied by a solder supply means such as a syringe (not shown). The upper surface is supplied.
  • a substrate transport mechanism 15 comprising a pair of transport conveyors for transporting the substrate 4 in the X direction is provided at the center of the base 10 and below the mask plate 14.
  • a substrate holding portion (not shown) that holds the substrate 4 from below is provided between the substrate 4 so as to be movable in the X direction, the Y direction, and the vertical direction.
  • Each mechanism described so far is operated by a control unit provided in the screen printing apparatus M2.
  • the control unit of the screen printing apparatus M2 moves the substrate holding unit in the X and Y directions to perform alignment in the plane direction with respect to the mask plate 14, and then raises the substrate holding unit to place the substrate 4 on the lower surface of the mask plate 14. Make contact.
  • the squeegee is horizontally moved in the Y direction at a predetermined speed along the surface of the mask plate 14 to which the solder is supplied to the upper surface.
  • the solder is screen-printed on the electrode 6 of the substrate 4 through the pattern hole.
  • the substrate 4 is conveyed to the solder application device M3.
  • the screen printing apparatus M2 is a screen printing unit that prints solder on the electrodes 6 of the substrate 4 by screen printing.
  • the individual solder printed for each printed portion of the substrate 4 is referred to as “solder portion 7” (see FIG. 4A).
  • a substrate transport mechanism 21 comprising a pair of transport conveyors for transporting the substrate 4 in the X direction and positioning it at a predetermined work position (the position of the substrate 4 shown in FIG. 2) is provided in the X direction. It is extended.
  • Y-axis tables 22A and 22B having linear motion mechanisms using linear motors are provided on both sides of the base 20 so as to extend in the Y direction.
  • the Y-axis tables 22A and 22B are similarly provided with linear motors.
  • Two X-axis tables 23A and 23B equipped with a linear motion mechanism are installed to be movable in the Y direction.
  • an inspection head 25 having an inspection camera 24 (see FIG. 3) with the imaging direction facing downward is mounted so as to be movable in the X direction.
  • a solder application head 27 having a dispenser 26 (see FIG. 3) for discharging solder downward is mounted on the X-axis table 23B so as to be movable in the X direction.
  • the Y-axis tables 22A and 22B and the X-axis table 23A are inspection head moving mechanisms 28 (see FIG. 3) that move the inspection head 25 in the XY directions.
  • the Y-axis tables 22A and 22B and the X-axis table 23B serve as a solder application head moving mechanism 29 (see FIG. 3) that moves the solder application head 27 in the XY direction.
  • the control unit 30 provided in the solder coating apparatus M3 includes an inspection camera control unit 31, a solder printing state inspection unit 32, a coating control unit 33, a coating target position storage unit 34, and a coating amount calculation unit 35.
  • the solder printing state inspection unit 32 includes a solder position inspection unit 32a and a solder amount inspection unit 32b.
  • the control unit 30 includes an inspection camera 24, an inspection head moving mechanism 28, a dispenser 26, a solder application head moving mechanism 29, a substrate transport mechanism 21, and a communication unit that transmits and receives various data to and from the host system 3 via the communication network 2. 36.
  • the inspection camera control unit 31 controls the inspection camera 24 and the inspection head moving mechanism 28 to image the substrate 4 after screen printing that has been transported and positioned at a predetermined work position by the substrate transport mechanism 21.
  • the acquired imaging data of the substrate 4 is used for various inspections by the solder printing state inspection unit 32. That is, the inspection camera 24 is an inspection unit that inspects the printed state of the solder printed on the electrode 6 of the substrate 4.
  • the solder print state inspection unit 32 processes the image data of the substrate 4 to inspect the print position and print amount of the solder portion 7 on the substrate 4, and based on the inspection result, the solder portion inspection data 37 (FIG. 7A). (See below). Details of the solder printing state inspection unit 32 (solder position inspection unit 32a, solder amount inspection unit 32b) will be described below with reference to FIGS. 4 (a) and 4 (b).
  • the solder position inspection unit 32a processes the image data of the substrate 4 imaged by the inspection camera 24, and sets a certain range for enclosing the electrode 6 as the inspection area E. And the solder part 7 which exists in the test
  • the solder amount inspection unit 32b measures the solder amount of each solder portion 7 based on the solder area calculated by the solder position inspection unit 32a, and inspects whether the solder amount satisfies a predetermined reference amount set in advance. To do. That is, the solder amount inspection unit 32b and the inspection camera 24 serve as solder amount inspection means for inspecting the amount of solder printed on the electrode 6 by the screen printing means.
  • the solder position detecting means and the solder amount detecting means include common inspection means (inspection camera 24).
  • FIG. 4A although the solder portion 7 is printed out of position with respect to the pair of electrodes 6, it is printed in the inspection area E and the solder amount satisfies a predetermined reference amount. It shows the state that was done.
  • FIG. 4B shows a state in which the amount of solder is insufficient for the electrode 6a and no solder is printed on the electrode 6b. For this electrode 6b, the printed solder amount is judged as “none”, and the solder position is judged as “none” or “zero”. A possible cause of such a print state is clogging of pattern holes formed in the mask plate 14.
  • solder portion inspection data 37 created in the solder print state inspection portion 32 will be described with reference to FIG.
  • the solder part inspection data 37 assigns individual numbers (solder part numbers) to the solder parts 7 printed on the respective electrodes 6 of the board 4, and various information including the printed state of the solder for each solder part No. It is converted into data.
  • the solder portion inspection data 37 includes a “reference amount” indicating the amount of solder to be printed on each solder portion No, a “solder amount” indicating the solder amount of the solder portion 7 measured by the solder amount inspection portion 32b, “Determination” indicating whether the solder amount of the solder portion 7 is acceptable or not based on the reference amount, “Position X”, “Position Y” indicating the coordinates of the solder position A with respect to the first recognition mark S1, and each solder portion No.
  • the information of “component mounting position No” indicating the component mounting position of the electronic component 5 corresponding to is included.
  • the solder part inspection data 37 is transmitted from the communication unit 36 to the host system 3 via the communication network 2.
  • the application control unit 33 controls the dispenser 26 and the solder application head moving mechanism 29 to add solder to the solder part No that has received a determination (NG) that the amount of solder is insufficient.
  • the application target position storage unit 34 stores a predetermined position of the electrode 6 corresponding to the solder part 7 that has been determined that the amount of solder is insufficient as the application target position.
  • the center position B of the electrode 6 (see FIG. 4B) is the application target position.
  • the application amount calculation unit 35 calculates an additional application amount of solder to the solder portion 7 to be additionally applied based on the solder amount indicated in the solder portion inspection data 37.
  • the application control unit 33 applies the application target position stored by the application target position storage unit 34, that is, the electrode 6 corresponding to the solder part 7 that has been determined to have an insufficient amount of solder.
  • the dispenser 26 and the solder application head moving mechanism 29 are controlled so that additional solder is applied to the central position B, and the amount of solder calculated by the application amount calculator 35 is discharged from the dispenser 26.
  • solder discharged from the dispenser 26 and additionally applied to the electrode 6 will be referred to as “solder 7 *”.
  • FIG. 5 shows a state in which solder 7 * is additionally applied to the pair of electrodes 6a and 6b (corresponding to FIG. 4B) determined to have an insufficient amount of solder. That is, the electrode 6a with an insufficient amount of solder is applied in a state where a part of the solder 7 * discharged from the dispenser 26 is overlapped with the solder portion 7. On the other hand, for the electrode 6b on which no solder is printed, a larger amount of solder 7 * is applied than the solder 7 * additionally applied to the electrode 6a.
  • the application control unit 33 controls the dispenser 26 and the solder application head moving mechanism 29 based on the application target position stored in the application target position storage unit 34 and the additional application amount calculated by the application amount calculation unit 35. By doing so, an appropriate amount of solder 7 * can be additionally applied with the center position B of the electrode 6 as a target regardless of the actual position of the solder portion 7.
  • the dispenser 26 and the solder application head moving mechanism 29 are related to the actual position of the solder for the electrode 6 determined by the solder amount inspection means that the amount of solder is insufficient with respect to the predetermined reference value.
  • a solder applying means for additionally applying solder to a predetermined position of the electrode 6 is provided.
  • Component supply units 42 are provided on both sides of the substrate transport mechanism 41, and a plurality of tape feeders 43 that supply the electronic components 5 are mounted on the component supply unit 42.
  • Y-axis tables 44A and 44B having linear motion mechanisms using linear motors are provided on both sides in the X direction of the base 40 so as to extend in the Y direction.
  • the linear motors are similarly provided on the Y-axis tables 44A and 44B.
  • the two X-axis tables 45A and 45B provided with the linear motion mechanism are constructed so as to be movable in the Y direction.
  • a mounting head 46 having a suction nozzle (not shown) for sucking and holding the electronic component 5 is mounted on the X-axis tables 45A and 45B so as to be movable in the X direction.
  • the mounting head 46 By driving the Y-axis table 44 and the X-axis table 45, the mounting head 46 moves in the XY direction, whereby the mounting head 46 takes out the electronic component 5 from the tape feeder 43 via the suction nozzle and puts it in a predetermined working position. It moves above the positioned substrate 4. Then, the electronic component 5 is mounted by lowering the suction nozzle with respect to the substrate 4.
  • the Y-axis tables 44A and 44B and the X-axis tables 45A and 45B serve as mounting head moving means for moving the mounting head 46 in the X and Y directions.
  • a component recognition camera 47 whose imaging direction is directed upward is disposed between the substrate transport mechanism 41 and the component supply unit 42, and the mounting head 46 that takes out the electronic component 5 from the component supply unit 42 is the component recognition camera.
  • the electronic component 5 held by the suction nozzle is imaged and recognized.
  • a substrate recognition camera 48 is attached to the mounting head 46, and moves together with the mounting head 46 above the substrate 4 positioned at a predetermined position, so that the first recognition mark S1 and the second recognition mark S1 on the substrate 4 are moved.
  • the recognition mark S2 is imaged and recognized.
  • the host system 3 includes a solder part inspection data storage unit 50, a correction data creation unit 51, and a correction data storage unit 52.
  • the control unit 53 provided in the electronic component mounting apparatuses M4 to M6 includes a component mounting data storage unit 54, a board recognition unit 55, a component mounting coordinate calculation unit 56, and a component mounting work unit 57. .
  • the solder part inspection data storage unit 50 stores solder part inspection data 37 transmitted from the communication unit 36 of the solder application apparatus M3 via the communication network 2.
  • the correction data creation unit 51 creates correction data 58 (see FIG. 7B) including information on the correction value of the designed mounting position (component mounting position) of the electronic component 5 (details will be described later).
  • the correction data storage unit 52 stores the correction data 58 created by the correction data creation unit 51.
  • the correction data 58 is generated by the correction data generating unit 51 before the component mounting operation by the electronic component mounting apparatuses M4 to M6.
  • this correction data 58 correction values in the X direction, Y direction, and ⁇ direction for each component mounting position No, and whether or not to apply the correction values to the component mounting position as “1 (valid) ) ”Or“ 0 (invalid) ”flag (correction valid flag).
  • the correction data creation unit 51 refers to the solder part inspection data 37 stored in the solder part inspection data storage unit 50 and is mounted at the component mounting position No from the solder position of the solder part 7 corresponding to the component mounting position No.
  • the corrected mounting position of the electronic component is obtained.
  • the midpoint of the line segment connecting the solder positions A which are the positions of the center of gravity of each of the pair of solder portions 7, is set as the correction mounting position D of the electronic component.
  • component mounting data 59 (see FIG. 8) stored in a component mounting data storage unit 54 to be described later, a designed component mounting position C (a line segment connecting the center positions B of the pair of electrodes 6).
  • the misalignment amount of the corrected mounting position D from the middle point is calculated, and correction values in the X direction, the Y direction, and the ⁇ direction are obtained.
  • the correction value of the component mounting position No. (“C0134” shown in FIG. 7B) including at least one solder portion No. in which it is determined that no solder is applied is the value of the solder position that is the basis of the calculation. It is not calculated because there is no measurement result.
  • the correction data creation unit 51 corrects the component mounting position No (“R0023” shown in FIG. 7B) where the solder amount of all corresponding solder portions 7 satisfies a predetermined reference amount.
  • a flag “1” indicating that it is valid is assigned.
  • a flag “0” indicating that the correction is invalid is assigned to a component mounting position No (C0134) including at least one solder portion No. in which the solder amount does not satisfy the predetermined reference amount.
  • the correction data creation unit 51 is incorporated not in the host system 3 but in the electronic component mounting apparatuses M4 to M6, and the correction data is based on the solder part inspection data 37 transmitted from the host system 3. 58 may be created. In such a case, the created correction data 58 is stored in the component mounting data 59. In short, the correction data 58 may be generated before the component mounting operation in the electronic component mounting apparatuses M4 to M6.
  • the correction data creation unit 51 is a mounting position correction unit that obtains a correction value of the mounting position of the electronic component 5 based on the position of the solder detected by the solder position detection unit.
  • the component mounting data storage unit 54 indicates information on the designed component mounting position, more specifically, the coordinate values of the initial component mounting position set in advance on the substrate 4 based on the position of the electrode 6 in the order of the operation processing.
  • the component mounting data 59 (see FIG. 8) is stored.
  • the component mounting data 59 includes coordinate values in the XY direction indicating the designed component mounting position, an angle value in the ⁇ direction indicating the attitude (orientation) of the electronic component 5, and the name of the electronic component 5 to be mounted. (Part name) information is included.
  • the substrate recognition unit 55 detects the coordinates of the first recognition mark S1 and the second recognition mark S2 in the X and Y directions by recognizing the imaging data of the first recognition mark S1 and the second recognition mark S2. Then, by detecting the displacement amount (coordinates) of the first recognition mark S1 and the second recognition mark S2 in the substrate transport mechanism 41 from this detection result, the displacement of the substrate 4 positioned at a predetermined work position. That is, a correction value for each component mounting position is calculated.
  • the component mounting coordinate calculation unit 56 calculates the mounting coordinates (new component mounting position) of the electronic component 5 based on the correction data 58, the component mounting data 59, and the detection result of the positional deviation of the substrate 4 by the substrate recognition unit 55. That is, for the component mounting position No (R0023) to which the flag “1” is assigned on the correction data 58, the component mounting coordinates on the component mounting data 59 are corrected based on the positional deviation detection result of the board 4. Further, a new component mounting coordinate is obtained by adding the correction value on the correction data 58 to the corrected component mounting coordinate. The new component mounting coordinates obtained in this way are the same position as the corrected mounting position D (see FIG. 4A) on the substrate 4 positioned by the substrate transport mechanism 41.
  • a new component is detected by converting the component mounting coordinates on the component mounting data 59 based on the detection result of the positional deviation of the board 4.
  • Find component placement coordinates The new component mounting coordinates obtained in this way are the same position as the designed component mounting position C (see FIG. 4A) on the substrate 4 positioned by the substrate transport mechanism 41. If the correction value on the correction data 58 is zero, the component mounting coordinates on the component mounting data 59 are corrected based on the detection result of the positional deviation of the board 4, and the corrected component mounting coordinates are displayed on the correction data 58. Is taken into account.
  • the new component mounting coordinates in this case are also the same as the component mounting position C described above.
  • the component mounting operation unit 57 executes a component mounting operation for mounting the electronic component 5 on the board 4 based on the new component mounting position (component mounting coordinate) calculated by the component mounting coordinate calculation unit 56. That is, the electronic component 5 is mounted by adjusting the amount of movement of the mounting head 46 and lowering the suction nozzle to a new component mounting position.
  • the electronic component mounting system has the above-described configuration.
  • a component mounting operation in the electronic component mounting apparatuses M4 to M6 will be described with reference to FIG.
  • the control unit 53 loads the substrate 4 that has completed various operations in the screen printing device M2 and the solder coating device M3 by the substrate transfer mechanism 41 and positions the substrate 4 at a predetermined work position (STB substrate loading step).
  • the control unit 53 reads the correction data 58 corresponding to the board 4 that has been loaded from the host system 3 (or the component mounting data storage unit 54 when the correction data 58 is created in the electronic component mounting apparatuses M4 to M6) ( ST2 correction data reading step).
  • the controller 53 images the substrate 4 with the substrate recognition camera 48, and recognizes the first recognition mark S1 and the second recognition mark S2 of the substrate 4 included in the acquired imaging data. (Substrate recognition execution step of ST3). And based on this recognition process result, the position shift of the board
  • the control unit 53 calculates the component mounting position based on the correction data 58, the component mounting data 59, and the positional deviation detection result of the board 4 (a mounting position calculation step in ST4). That is, using the coordinate conversion formula derived based on the amount of positional deviation at two points on the plane, the component mounting coordinates in the state of being positioned at a predetermined work position are obtained, and the correction value indicated in the correction data 58 is taken into account. New component mounting coordinates are obtained.
  • the coordinates corresponding to the corrected mounting position D on the board 4 positioned at the predetermined work position are new components. Calculated as mounting coordinates.
  • coordinates that coincide with the designed component mounting position C on the similarly positioned substrate 4 are obtained as new component mounting coordinates.
  • the control unit 53 mounts the electronic component 5 on the new component mounting position (coordinates) calculated in (ST4) (electronic component mounting work execution step of ST5). That is, since the component mounting position No (R0023) to which the correction value is applied has been replaced with the corrected mounting position D, the mounting operation of the electronic component 5 is performed on the corrected mounting position D (FIG. 10A). )reference). That is, for the solder part 7 whose solder amount satisfies the predetermined reference amount, the mounting operation of the electronic component 5 is performed in consideration of the position of the solder part 7 actually printed. As described above, the electronic component mounting apparatuses M4 to M6 mount the electronic component 5 at the new component mounting position corrected based on the correction value obtained by the mounting position correcting means.
  • the electronic component 5 corresponding to the component mounting position No (C0134) to which the correction value is not applied is mounted to the designed component mounting position C regardless of the position of the solder portion 7 on the substrate 4 (see FIG. 10 (b)). That is, for the solder portion 7 whose solder amount does not satisfy the predetermined reference amount, the mounting operation of the electronic component 5 based on the designed component mounting position C is performed.
  • the electronic component mounting apparatuses M4 to M6 are configured so that the electronic component 5 mounted on the electrode 6 to which the solder 7 * is applied by the solder applying unit is not subjected to the correction by the mounting position correcting unit. Install in position.
  • the control unit 53 After the mounting operation of the electronic component 5, the control unit 53 unloads the substrate 4 to the downstream reflow device M7 (substrate unloading process of ST6). And the board
  • the electrode determined to have insufficient solder in the electronic component mounting system having a function of correcting the mounting position of the electronic component based on the printing position of the solder, the electrode determined to have insufficient solder
  • the operation of additionally applying solder can be rationally performed with high productivity.
  • high-quality mounting using a function that corrects the mounting position of electronic components based on the solder printing position, and a function that automatically applies additional solder to electrodes that have insufficient solder All the labor savings can be achieved.
  • the component mounting position is corrected based on the position of the solder printed on each of the recognition marks S1 and S2.
  • the solder printed on the first recognition mark S1 is referred to as “solder reference mark T1”
  • the solder printed on the second recognition mark S2 is referred to as “solder reference mark T2” (see FIG. 15B).
  • FIG. 11 is a block diagram showing the configuration of the control system of the solder application apparatus M3A.
  • the solder printing state inspection unit 32A included in the control unit 30A includes a solder amount inspection unit 32b1.
  • the solder amount inspection unit 32b1 recognizes image data acquired by imaging the substrate 4 with the inspection camera 24, and sets a certain range surrounding the electrode 6 to the inspection area E (FIGS. 4A and 4B). Set as)).
  • inspection area E is detected, the area is calculated, and the amount of solder is measured based on a solder area. Then, it is inspected whether or not the measured solder amount satisfies a predetermined reference amount set in advance.
  • solder portion inspection data 37A (see FIG. 13A) created based on the inspection result by the solder amount inspection portion 32b1 will be described.
  • the solder portion inspection data 37A here does not include information on the solder position. That is, as shown in FIG. 13A, the solder portion inspection data 37A includes a “reference amount” indicating the amount of solder to be printed on each solder portion No., and the solder of the solder portion 7 measured by the solder amount inspection portion 32b1. Information of “solder amount” indicating the amount, “determination” indicating pass / fail of the printed solder amount based on the reference amount, and “component mounting position No” indicating the mounting position of the electronic component 5 corresponding to each solder part No. Including.
  • the host system 3A includes a solder portion inspection data storage unit 50A, an additional application data creation unit 60, and an additional application data storage unit 61.
  • the control unit 53A of the electronic component mounting apparatuses M4A to M6A includes a component mounting data storage unit 54, a board recognition unit 55, a solder recognition unit 62, a component mounting coordinate calculation unit 56A, and a component mounting work unit 57A.
  • the solder part inspection data storage unit 50A stores solder part inspection data 37A that does not include information on the solder position transmitted from the solder application apparatus M3A.
  • the additional application data creating unit 60 includes additional application data 63 (FIG. 13) including information indicating whether or not the additional application of the solder 7 * has been performed on the electrode 6 corresponding to the component mounting position No. (See (b)). That is, a flag “1” is assigned to the component mounting position No (R0023) where the solder 7 * is not additionally applied to the corresponding electrode 6. On the other hand, a flag of “0” is assigned to the component mounting position No (C0134) where the solder 7 * is additionally applied to the corresponding electrode 6.
  • the above-described additional application data 63 is stored in the additional application data storage unit 61. Further, the additional application data 63 is transmitted to the electronic component mounting apparatuses M4A to M6A via the communication network 2.
  • the additional application data creation unit 60 may be incorporated in the electronic component mounting apparatuses M4A to M6A, and the additional application data 63 may be created based on the solder part inspection data 37A received from the host system 3A. In such a case, the created additional application data 63 is stored in the component mounting data storage unit 54.
  • the solder recognizing unit 62 recognizes the image data of the solder reference marks T1 and T2 acquired by imaging the substrate 4 with the substrate recognition camera 48, and performs the soldering reference mark T1 on the substrate 4 positioned on the substrate transport mechanism 41. The coordinates of T2 are detected. Then, the coordinates of the solder reference marks T1 and T2 are regarded as the coordinates of the first and second recognition marks S1 and S2, and the correction value of the component mounting coordinates is calculated by the same calculation method as the board recognition unit 55.
  • the positional deviation amount of the solder reference marks T1 and T2 in a state where the board 4 is positioned at a predetermined work position by the board conveying mechanism 41 is estimated as the positional deviation amount of the solder part 7 with respect to the electrode 6. Based on this positional deviation amount, a component mounting position to be described later is calculated. That is, the solder recognition unit 62 and the board recognition camera 48 are provided in the electronic component mounting apparatuses M4A to M6A, and serve as solder position detection means for detecting the position of the solder printed on the board 4 before mounting the electronic component 5. ing.
  • the component mounting coordinate calculation unit 56A generates new mounting coordinates of the electronic component 5 based on the additional application data 63, the component mounting data 59, the position shift detection result of the substrate 4, or the position shift detection results of the solder reference marks T1 and T2. (New component mounting position) is calculated.
  • a new component mounting position will be described with reference to FIGS.
  • FIG. 15A shows the design data of the substrate 4, and P1 and P2 indicate design component mounting positions No (R0023) and (C0134), respectively.
  • FIG. 15B shows a coordinate system of the electronic component mounting apparatuses M4 to M6.
  • new component mounting coordinates are obtained by the same calculation as in the first embodiment. That is, the detection result of the displacement of the substrate 4 in the state in which the substrate transport mechanism 41 is positioned at the predetermined work position at the component mounting coordinates (“P2” shown in 15 (a)) on the component mounting data 59 (first A new component mounting coordinate (“M2” shown in FIG. 15B) is calculated in consideration of the positional deviation amount of the recognition mark S1 and the second recognition mark S2.
  • new component mounting coordinates are calculated by a method different from that of the first embodiment. That is, by replacing the coordinates of the solder reference marks T1 and T2 with the coordinates of the first recognition mark S1 and the second recognition mark S2, new component mounting coordinates (FIG. 15B) are obtained by the same process as in the board recognition execution step. “Q1”) shown in FIG.
  • the new component mounting coordinates calculated in this way are the same position as the corrected mounting position D (see FIG. 4A) on the substrate 4 positioned on the substrate transport mechanism 41.
  • the control unit 53A loads the substrate 4 that has finished the operations in the screen printing apparatus M2A and the solder coating apparatus M3A by the substrate transfer mechanism 41 and positions the substrate 4 at a predetermined work position (STB loading step in ST7).
  • the control unit 53A images the first recognition mark S1 and the second recognition mark S2 on the substrate 4 by the substrate recognition camera 48, and recognizes the acquired image data to be positioned at a predetermined work position.
  • the positional deviation of the substrate 4 in the detected state is detected (substrate recognition execution step of ST8).
  • control unit 53A recognizes the solder reference marks T1 and T2 from the above-described imaging data, regards the solder reference marks T1 and T2 as the first and second recognition marks S1 and S2, and the board. 4 is detected (STE solder recognition execution step in ST9).
  • the control unit 53A calculates the component mounting position based on the additional application data 63, the component mounting data 59, the positional deviation detection result of the substrate 4 or the positional deviation detection result of the solder reference mark (the mounting position calculation in ST10).
  • the component mounting position No (R0023) to which the flag “1” is given on the additional application data 63 the positional deviation of the solder reference marks T1 and T2 with respect to the component mounting coordinates on the component mounting data 59. Calculate the new component mounting position with the amount added.
  • the first recognition mark S1 and the second recognition mark are displayed at the component mounting coordinates on the component mounting data 59.
  • a new component mounting position is calculated in consideration of the positional deviation amount of the mark S2.
  • the control unit 53 mounts the electronic component 5 at the new component mounting position calculated in (ST10) (electronic component mounting operation execution process in ST11). That is, the component mounting position No (R0023) is corrected by the amount of positional deviation of the solder reference marks T1, T2 from the designed component mounting position C on the positioned substrate 4, and the corrected position (corrected mounting position D). ) Is mounted on the electronic component 5 (see FIG. 10A). That is, the mounting operation of the electronic component 5 in consideration of the printing position of the actually printed solder portion 7 is performed on the solder portion 7 whose solder amount satisfies a predetermined reference amount.
  • the component mounting position No (C0134) is not corrected based on the detection result of the positional deviation of the solder reference marks T1 and T2. Therefore, the electronic component 5 corresponding to the component mounting position No (C0134) is mounted to the designed component mounting position C on the positioned substrate 4 (see FIG. 10B).
  • the control unit 53A carries the substrate 4 to the downstream reflow device M7 (substrate carrying-out process of ST12). And the board
  • the solder reference marks T1 and T2 are regarded as the first recognition mark S1 and the second recognition mark S2, and the solder reference mark T1 on the substrate 4 positioned at a predetermined work position.
  • the component mounting position is corrected based on the detection result of the positional deviation at T2. Therefore, although the mounting accuracy of the electronic component 5 with respect to the midpoint of the line segment connecting the center of gravity (solder position A) of each of the pair of solder portions 7 is slightly inferior to that of the first embodiment, It is possible to achieve both high-quality mounting using the function to correct the mounting position of the component and labor saving using the function of automatically applying additional solder to the electrode where the amount of solder is insufficient. it can.
  • the electronic component mounting system only needs to include a screen printing device, a solder coating device, and at least one electronic component mounting device, and the configuration and arrangement of other electronic component mounting devices are the same as those in the first embodiment. It is not limited to two.
  • the design component mounting position is not necessarily set at the midpoint of the line segment connecting the center positions of the pair of electrodes, and a position in the vicinity of the midpoint may be selected.
  • a new component mounting position based on the actual printing position of the solder portion may be selected other than the midpoint on the line segment connecting the center of gravity positions of the pair of solder portions.
  • an arbitrary position on a line segment connecting the designed component mounting position and the midpoint may be set as a new component mounting position. The point is that the component mounting position may be corrected in consideration of the actual printing position of the solder portion.
  • the operation of additionally applying the solder to the electrode determined to be insufficient in the solder can be rationally performed with high productivity, and is useful in the field of electronic component mounting in which electronic components are mounted on a substrate.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2013/006727 2012-11-19 2013-11-15 電子部品装着システム Ceased WO2014076968A1 (ja)

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CN104718808A (zh) 2015-06-17
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US20150289426A1 (en) 2015-10-08
CN104718808B (zh) 2017-10-24

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