JP5884015B2 - 電子部品装着システム - Google Patents

電子部品装着システム Download PDF

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Publication number
JP5884015B2
JP5884015B2 JP2012252959A JP2012252959A JP5884015B2 JP 5884015 B2 JP5884015 B2 JP 5884015B2 JP 2012252959 A JP2012252959 A JP 2012252959A JP 2012252959 A JP2012252959 A JP 2012252959A JP 5884015 B2 JP5884015 B2 JP 5884015B2
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JP
Japan
Prior art keywords
solder
component mounting
electronic component
substrate
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012252959A
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English (en)
Japanese (ja)
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JP2014103192A (ja
JP2014103192A5 (enExample
Inventor
萬谷 正幸
正幸 萬谷
西中 輝明
輝明 西中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2012252959A priority Critical patent/JP5884015B2/ja
Priority to CN201380051584.9A priority patent/CN104718808B/zh
Priority to PCT/JP2013/006727 priority patent/WO2014076968A1/ja
Priority to US14/441,275 priority patent/US9332681B2/en
Publication of JP2014103192A publication Critical patent/JP2014103192A/ja
Publication of JP2014103192A5 publication Critical patent/JP2014103192A5/ja
Application granted granted Critical
Publication of JP5884015B2 publication Critical patent/JP5884015B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015Orientation; Alignment; Positioning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • B23K3/0638Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/163Monitoring a manufacturing process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/166Alignment or registration; Control of registration
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2012252959A 2012-11-19 2012-11-19 電子部品装着システム Active JP5884015B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012252959A JP5884015B2 (ja) 2012-11-19 2012-11-19 電子部品装着システム
CN201380051584.9A CN104718808B (zh) 2012-11-19 2013-11-15 电子部件安装系统
PCT/JP2013/006727 WO2014076968A1 (ja) 2012-11-19 2013-11-15 電子部品装着システム
US14/441,275 US9332681B2 (en) 2012-11-19 2013-11-15 Electronic component mounting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012252959A JP5884015B2 (ja) 2012-11-19 2012-11-19 電子部品装着システム

Publications (3)

Publication Number Publication Date
JP2014103192A JP2014103192A (ja) 2014-06-05
JP2014103192A5 JP2014103192A5 (enExample) 2014-11-27
JP5884015B2 true JP5884015B2 (ja) 2016-03-15

Family

ID=50730899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012252959A Active JP5884015B2 (ja) 2012-11-19 2012-11-19 電子部品装着システム

Country Status (4)

Country Link
US (1) US9332681B2 (enExample)
JP (1) JP5884015B2 (enExample)
CN (1) CN104718808B (enExample)
WO (1) WO2014076968A1 (enExample)

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JP6643577B2 (ja) * 2016-06-01 2020-02-12 パナソニックIpマネジメント株式会社 印刷装置および半田管理システム
JP6660526B2 (ja) * 2016-07-28 2020-03-11 パナソニックIpマネジメント株式会社 部品実装装置および部品実装方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
JP7515093B2 (ja) * 2018-03-02 2024-07-12 パナソニックIpマネジメント株式会社 制御システム、基板製造システム、制御方法、及びプログラム
WO2019171582A1 (ja) * 2018-03-09 2019-09-12 株式会社Fuji マスク印刷機
JP7261950B2 (ja) * 2018-04-12 2023-04-21 パナソニックIpマネジメント株式会社 部品実装システムおよび部品装着方法
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
WO2020121361A1 (ja) * 2018-12-10 2020-06-18 パナソニックIpマネジメント株式会社 部品実装システム
JP7535735B2 (ja) * 2019-03-28 2024-08-19 パナソニックIpマネジメント株式会社 生産データ作成装置および生産データ作成方法
JP7106761B2 (ja) * 2019-06-21 2022-07-26 株式会社Fuji 許容値設定システム、基板検査機、許容値設定方法、基板検査方法
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Also Published As

Publication number Publication date
CN104718808A (zh) 2015-06-17
JP2014103192A (ja) 2014-06-05
CN104718808B (zh) 2017-10-24
WO2014076968A1 (ja) 2014-05-22
US9332681B2 (en) 2016-05-03
US20150289426A1 (en) 2015-10-08

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