CN104379626B - 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 - Google Patents
含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 Download PDFInfo
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- CN104379626B CN104379626B CN201380030849.7A CN201380030849A CN104379626B CN 104379626 B CN104379626 B CN 104379626B CN 201380030849 A CN201380030849 A CN 201380030849A CN 104379626 B CN104379626 B CN 104379626B
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Classifications
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1488—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing phosphorus
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
- C08G59/3272—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing phosphorus
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L63/04—Epoxynovolacs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
- B32B2260/023—Two or more layers
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- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/07—Parts immersed or impregnated in a matrix
- B32B2305/076—Prepregs
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811147674.9A CN109293881B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
| CN201810193561.6A CN108314774B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
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| JP2012-135707 | 2012-06-15 | ||
| JP2012135707 | 2012-06-15 | ||
| PCT/JP2013/063865 WO2013187184A1 (ja) | 2012-06-15 | 2013-05-13 | リン含有エポキシ樹脂及び該エポキシ樹脂を必須成分とする組成物、硬化物 |
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| CN201810193561.6A Division CN108314774B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
| CN201811147674.9A Division CN109293881B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
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| CN201811147674.9A Active CN109293881B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
| CN201810193561.6A Active CN108314774B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
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| CN201811147674.9A Active CN109293881B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
| CN201810193561.6A Active CN108314774B (zh) | 2012-06-15 | 2013-05-13 | 含磷的环氧树脂和以该环氧树脂作为必须成分的组合物、固化物 |
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| CN (3) | CN104379626B (ja) |
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| TW (1) | TWI598371B (ja) |
| WO (1) | WO2013187184A1 (ja) |
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| JP6179446B2 (ja) * | 2014-04-14 | 2017-08-16 | 株式会社オートネットワーク技術研究所 | リアクトル |
| JP6670045B2 (ja) * | 2015-03-13 | 2020-03-18 | 日鉄ケミカル＆マテリアル株式会社 | オキサゾリドン環含有エポキシ樹脂、その製造方法、エポキシ樹脂組成物及び硬化物 |
| JP6770793B2 (ja) * | 2015-08-19 | 2020-10-21 | 日鉄ケミカル＆マテリアル株式会社 | 難燃性エポキシ樹脂組成物及びその硬化物 |
| EP3564289B1 (en) * | 2016-12-27 | 2022-08-03 | NIPPON STEEL Chemical & Material Co., Ltd. | Curable epoxy resin composition, and fiber-reinforced composite material using same |
| JP2019104821A (ja) * | 2017-12-12 | 2019-06-27 | 日鉄ケミカル＆マテリアル株式会社 | エポキシ樹脂組成物及びその硬化物 |
| CN112585189B (zh) * | 2018-08-27 | 2023-08-01 | 日铁化学材料株式会社 | 环氧树脂组合物、预浸体、层叠板、电路基板用材料、硬化物及含磷环氧树脂的制造方法 |
| JP7211744B2 (ja) * | 2018-09-19 | 2023-01-24 | 日鉄ケミカル＆マテリアル株式会社 | エポキシ樹脂組成物およびその硬化物 |
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| JP2823057B2 (ja) * | 1990-12-20 | 1998-11-11 | 日本化薬株式会社 | エポキシ樹脂の製造方法 |
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| JP3651843B2 (ja) * | 1999-12-16 | 2005-05-25 | 住友ベークライト株式会社 | フェノール樹脂の製造方法 |
| JP4588834B2 (ja) | 2000-04-06 | 2010-12-01 | パナソニック電工株式会社 | リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板 |
| JP2002012739A (ja) * | 2000-06-29 | 2002-01-15 | Nippon Kayaku Co Ltd | 難燃性エポキシ樹脂組成物及びその用途 |
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| JP4906020B2 (ja) | 2001-07-26 | 2012-03-28 | 新日鐵化学株式会社 | 含燐フェノール樹脂及び該フェノール樹脂を用いたエポキシ樹脂組成物 |
| JP4435791B2 (ja) * | 2001-11-16 | 2010-03-24 | 旭有機材工業株式会社 | ノボラック型フェノール樹脂の製造方法及びレジンコーテッドサンド |
| KR100866653B1 (ko) * | 2004-06-29 | 2008-11-04 | 아사히 가세이 케미칼즈 가부시키가이샤 | 난연성 에폭시 수지 조성물 |
| WO2006006593A1 (ja) * | 2004-07-13 | 2006-01-19 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| CN101883806B (zh) * | 2007-11-09 | 2013-08-14 | 新日铁住金化学株式会社 | 含磷环氧树脂及含磷环氧树脂组合物、其制造方法和使用该树脂及该树脂组合物的固化性树脂组合物及固化物 |
| JP5547386B2 (ja) * | 2008-09-25 | 2014-07-09 | パナソニック株式会社 | プリプレグ用エポキシ樹脂組成物、プリプレグ、および多層プリント配線板 |
| JP5441477B2 (ja) * | 2009-04-01 | 2014-03-12 | 新日鉄住金化学株式会社 | 難燃性リン含有エポキシ樹脂組成物及びその硬化物 |
| JP5686512B2 (ja) * | 2009-11-05 | 2015-03-18 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂、樹脂組成物、およびその難燃性硬化物 |
| JP5544184B2 (ja) * | 2010-02-08 | 2014-07-09 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂の製造方法、エポキシ樹脂組成物及びその硬化物 |
| JP5579008B2 (ja) * | 2010-09-29 | 2014-08-27 | 新日鉄住金化学株式会社 | リン含有エポキシ樹脂 |
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- 2013-05-13 KR KR1020147034499A patent/KR102038173B1/ko active IP Right Grant
- 2013-05-13 CN CN201380030849.7A patent/CN104379626B/zh active Active
- 2013-05-13 JP JP2014521221A patent/JP6067699B2/ja active Active
- 2013-05-13 WO PCT/JP2013/063865 patent/WO2013187184A1/ja active Application Filing
- 2013-05-13 CN CN201811147674.9A patent/CN109293881B/zh active Active
- 2013-05-13 CN CN201810193561.6A patent/CN108314774B/zh active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2013187184A1 (ja) | 2016-02-04 |
| WO2013187184A1 (ja) | 2013-12-19 |
| KR20150031237A (ko) | 2015-03-23 |
| TW201402632A (zh) | 2014-01-16 |
| KR102038173B1 (ko) | 2019-10-29 |
| CN108314774A (zh) | 2018-07-24 |
| CN104379626A (zh) | 2015-02-25 |
| CN109293881A (zh) | 2019-02-01 |
| JP6067699B2 (ja) | 2017-01-25 |
| SG11201408343TA (en) | 2015-01-29 |
| CN109293881B (zh) | 2021-04-13 |
| TWI598371B (zh) | 2017-09-11 |
| CN108314774B (zh) | 2021-02-12 |
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