CN103383996B - 聚酰亚胺微孔隔膜的制备方法 - Google Patents
聚酰亚胺微孔隔膜的制备方法 Download PDFInfo
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- CN103383996B CN103383996B CN201310262980.8A CN201310262980A CN103383996B CN 103383996 B CN103383996 B CN 103383996B CN 201310262980 A CN201310262980 A CN 201310262980A CN 103383996 B CN103383996 B CN 103383996B
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- inorganic
- polyimide
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- 239000004642 Polyimide Substances 0.000 title claims abstract description 107
- 229920001721 polyimide Polymers 0.000 title claims abstract description 107
- 239000011148 porous material Substances 0.000 title claims abstract description 42
- 238000002360 preparation method Methods 0.000 title claims abstract description 41
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 90
- 239000000178 monomer Substances 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000003960 organic solvent Substances 0.000 claims abstract description 25
- 230000003750 conditioning effect Effects 0.000 claims abstract description 13
- 239000002105 nanoparticle Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000004381 surface treatment Methods 0.000 claims abstract description 4
- 150000004985 diamines Chemical class 0.000 claims description 28
- 239000002131 composite material Substances 0.000 claims description 26
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims description 24
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 20
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 17
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 12
- 125000006159 dianhydride group Chemical class 0.000 claims description 11
- WFKAJVHLWXSISD-UHFFFAOYSA-N isobutyramide Chemical compound CC(C)C(N)=O WFKAJVHLWXSISD-UHFFFAOYSA-N 0.000 claims description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 6
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 6
- -1 γ-(methacryloxypropyl) propyl Chemical group 0.000 claims description 6
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical class ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 claims description 4
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 claims description 4
- 239000012298 atmosphere Substances 0.000 claims description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- ZIXWTPREILQLAC-UHFFFAOYSA-N isoquinolin-8-ol Chemical compound C1=NC=C2C(O)=CC=CC2=C1 ZIXWTPREILQLAC-UHFFFAOYSA-N 0.000 claims description 4
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 claims description 4
- IVSZLXZYQVIEFR-UHFFFAOYSA-N m-xylene Chemical group CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 claims description 4
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- 230000001681 protective effect Effects 0.000 claims description 4
- 239000005711 Benzoic acid Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 3
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 3
- 150000002460 imidazoles Chemical class 0.000 claims description 3
- 239000011777 magnesium Substances 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 3
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- WLJVXDMOQOGPHL-PPJXEINESA-N 2-phenylacetic acid Chemical compound O[14C](=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-PPJXEINESA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 2
- 229910052749 magnesium Inorganic materials 0.000 claims description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 2
- 239000000347 magnesium hydroxide Substances 0.000 claims description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000003233 pyrroles Chemical class 0.000 claims description 2
- 239000011667 zinc carbonate Substances 0.000 claims description 2
- 235000004416 zinc carbonate Nutrition 0.000 claims description 2
- 229910000010 zinc carbonate Inorganic materials 0.000 claims description 2
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 claims description 2
- 229940007718 zinc hydroxide Drugs 0.000 claims description 2
- 229910021511 zinc hydroxide Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 37
- 239000012528 membrane Substances 0.000 abstract description 8
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- 239000011248 coating agent Substances 0.000 abstract description 2
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- 239000011259 mixed solution Substances 0.000 abstract 1
- 238000009210 therapy by ultrasound Methods 0.000 abstract 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 15
- 229910001416 lithium ion Inorganic materials 0.000 description 15
- 238000005406 washing Methods 0.000 description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- 229920000642 polymer Polymers 0.000 description 11
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
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- 230000004888 barrier function Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
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- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
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- 239000007864 aqueous solution Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 235000019253 formic acid Nutrition 0.000 description 3
- 229910052744 lithium Inorganic materials 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
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- 239000002904 solvent Substances 0.000 description 3
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
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- 239000002798 polar solvent Substances 0.000 description 2
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- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
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- 0 C*(*(CC1C2CC=C(*C(C)(C/*=*/C3)CC(C(N4)=O)=C3C4=O)C1)O)O*C2=O Chemical compound C*(*(CC1C2CC=C(*C(C)(C/*=*/C3)CC(C(N4)=O)=C3C4=O)C1)O)O*C2=O 0.000 description 1
- 229910012851 LiCoO 2 Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N O=C(c(cc1)c2cc1Oc(cc1C(O3)=O)ccc1C3=O)OC2=O Chemical compound O=C(c(cc1)c2cc1Oc(cc1C(O3)=O)ccc1C3=O)OC2=O QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- AYDYYOPBIZWXHB-UHFFFAOYSA-N OC(c1ccc(C(C(F)(F)F)(C(F)(F)F)c(cc2C(O3)=O)ccc2C3=O)cc11)OC1=O Chemical compound OC(c1ccc(C(C(F)(F)F)(C(F)(F)F)c(cc2C(O3)=O)ccc2C3=O)cc11)OC1=O AYDYYOPBIZWXHB-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
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- 238000005265 energy consumption Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
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- 238000000605 extraction Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
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- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
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- 238000009776 industrial production Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
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- 239000005543 nano-size silicon particle Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000007774 positive electrode material Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 238000005287 template synthesis Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/20—Manufacture of shaped structures of ion-exchange resins
- C08J5/22—Films, membranes or diaphragms
- C08J5/2206—Films, membranes or diaphragms based on organic and/or inorganic macromolecular compounds
- C08J5/2218—Synthetic macromolecular compounds
- C08J5/2256—Synthetic macromolecular compounds based on macromolecular compounds obtained by reactions other than those involving carbon-to-carbon bonds, e.g. obtained by polycondensation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/58—Other polymers having nitrogen in the main chain, with or without oxygen or carbon only
- B01D71/62—Polycondensates having nitrogen-containing heterocyclic rings in the main chain
- B01D71/64—Polyimides; Polyamide-imides; Polyester-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
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- B01D67/00—Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus
- B01D67/0079—Manufacture of membranes comprising organic and inorganic components
- B01D67/00793—Dispersing a component, e.g. as particles or powder, in another component
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/14—Dynamic membranes
- B01D69/141—Heterogeneous membranes, e.g. containing dispersed material; Mixed matrix membranes
- B01D69/148—Organic/inorganic mixed matrix membranes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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Abstract
本发明涉及一种聚酰亚胺微孔隔膜的制备方法,包括以下步骤:采用柔性单体,以一步法制备可溶性聚酰亚胺,并形成聚酰亚胺溶液;提供无机模板剂,该无机模板剂为无机纳米颗粒,在有机溶剂中通过表面处理剂对该无机模板剂进行表面处理,使无机模板剂分散在该有机溶剂中,形成无机模板剂分散液;将该聚酰亚胺溶液和无机模板剂分散液混合并超声处理,形成制膜液;将该制膜液涂覆在基板表面并烘干,形成有机无机复合膜;以及将该有机无机复合膜置于模板脱除剂溶液中,该有机无机复合膜中的无机模板剂与该模板脱除剂反应,从而去除该有机无机复合膜中的无机模板剂,得到该聚酰亚胺微孔隔膜。
Description
技术领域
本发明属于化学材料制备技术领域,具体涉及一种聚酰亚胺微孔隔膜的制备方法。
背景技术
随着锂离子电池在移动电话、电动车与能量储存系统等新能源应用领域的快速发展,锂离子电池的安全性问题显得尤为重要。基于对锂离子电池安全问题的原因分析,可以从以下几方面来提高锂离子电池的安全性:一是通过优化锂离子电池的设计和管理等,对锂离子电池充放电过程进行实时监控和处理,保证锂离子电池的使用安全,二是改进或开发新的电极材料,提高电池本征安全性能,三是使用新型安全性的电解质和隔膜体系,提高电池安全性能。
隔膜是锂离子电池结构中的关键的内层组件之一,其作用是能使电解质离子通过、分隔阴极与阳极接触防止短路。传统的锂离子电池隔膜是聚烯烃,如聚丙烯(PP)及聚乙烯(PE)经物理(如拉伸法)或化学(如萃取法)制孔工艺制备的多孔薄膜,如日本旭化成Asahi、东燃化学Tonen、宇部Ube、美国Celgard等外国公司的隔膜产品。作为隔膜的基体聚合物,聚烯烃具有强度高、耐酸碱性好、耐溶剂性好等优点,但缺点是熔点较低(聚乙烯熔点约为130℃,聚丙烯约为160℃),高温易收缩或熔断。当电池发生热失控,温度达到聚合物熔点附近,隔膜发生大幅收缩及熔融破裂,电池正负极短路,加速电池的热失控,进而导致电池起火、爆炸等安全事故。
因此,制备和使用耐高温的锂离子电池隔膜,是提高锂离子电池安全性能的重要措施之一。
发明内容
有鉴于此,确有必要提供一种耐高温的聚酰亚胺微孔隔膜的制备方法。
一种聚酰亚胺微孔隔膜的制备方法,包括以下步骤:采用柔性单体,以一步法制备可溶性聚酰亚胺,并形成聚酰亚胺溶液;提供无机模板剂,该无机模板剂为无机纳米颗粒,在有机溶剂中通过表面处理剂对该无机模板剂进行表面处理,使无机模板剂分散在该有机溶剂中,形成无机模板剂分散液;将该聚酰亚胺溶液和无机模板剂分散液混合并超声处理,形成制膜液;将该制膜液涂覆在基板表面并烘干,形成有机无机复合膜;以及将该有机无机复合膜置于模板脱除剂溶液中,该有机无机复合膜中的无机模板剂与该模板脱除剂反应,从而去除该有机无机复合膜中的无机模板剂,得到该聚酰亚胺微孔隔膜。该聚酰亚胺溶液的制备包括:在保护气氛下,将二酐单体及二胺单体加入有机溶剂形成混合液,搅拌该混合液使该二酐单体及二胺单体在该有机溶剂中溶解后,加入催化剂,在160℃至200℃温度下充分反应,生成聚酰亚胺,以及将所得聚酰亚胺溶于有机溶剂配置成聚酰亚胺溶液。
相较于现有技术,本发明提供的聚酰亚胺微孔隔膜的制备方法,以表面处理剂对无机模板剂进行表面修饰,使无机模板剂具有疏水性,然后将表面修饰后的无机模板剂与聚酰亚胺溶液混合,制备得到有机无机杂化膜,然后以模板脱除剂脱除该无机模板剂,烘干得到聚酰亚胺微孔隔膜。该聚酰亚胺微孔隔膜具有耐高温特性,在150℃热收缩率几乎为0,从而可以提高锂离子电池的安全性能。
附图说明
图1为聚酰亚胺微孔隔膜制备的2032型扣式电池倍率性能。
具体实施方式
下面将结合附图及具体实施例对本发明提供的聚酰亚胺微孔隔膜的制备方法作进一步的详细说明。
本发明实施例提供的所述聚酰亚胺微孔隔膜的制备方法包括以下步骤:
步骤一,采用柔性单体,以一步法制备可溶性聚酰亚胺,并形成聚酰亚胺溶液;
步骤二,提供无机模板剂,在有机溶剂中通过表面处理剂对该无机模板剂进行表面处理,使无机模板剂分散在该有机溶剂中,形成无机模板剂分散液;
步骤三,将该聚酰亚胺溶液和无机模板剂分散液混合并超声处理,形成制膜液;
步骤四,将该制膜液涂覆在基板表面并烘干,形成有机无机复合膜;以及
步骤五,将该有机无机复合膜置于模板脱除剂溶液中,该有机无机复合膜中的无机模板剂与该模板脱除剂反应,从而去除该有机无机复合膜中的无机模板剂,得到该聚酰亚胺微孔隔膜。
传统的聚酰亚胺多为两步法制备,首先二酐单体与二酸单体在常温下聚合得到中间体聚酰胺酸,然后在高温(如300℃至400℃)下热处理使聚酰胺酸亚胺化,得到聚酰亚胺。然而在高温处理时容易形成分子链间的交联,使该方法得到的聚酰亚胺多为难溶物质,不适于与无机模板剂复合得到复合膜。此外,单体选择也很重要,一些刚性较大的单体所制备得到的聚酰亚胺也是难溶的。
在步骤一中,本发明采用柔性单体,以中温一步法得到可溶性聚酰亚胺并形成聚酰亚胺溶液,具体包括以下步骤:
S11,在保护气氛下,将二酐单体及二胺单体加入有机溶剂形成混合液;
S12,搅拌该混合液使该二酐单体及二胺单体在该有机溶剂中充分溶解后,加入催化剂,在160℃至200℃温度下充分反应,生成聚酰亚胺;
S13,将所得聚酰亚胺溶于有机溶剂配置成聚酰亚胺溶液。
在步骤S11中,该保护气氛可以为氮气或惰性气体,如氩气,该二酐单体、二胺单体及溶剂的用量按照聚合体系的固含量为4-20wt%计算。该固含量是指聚合物的固含量,因为聚合物由两种单体聚合得到,聚合物后质量基本不变,因此固含量也是二胺单体和二酐单体的总重量占混合液总质量的质量百分比。
该二酐单体及二胺单体为柔性单体,该二酐单体为结构式由式(1-1)、式(1-2)及式(1-3)表示的化合物中的一种或几种的混合物。
(1-1)
(1-2)
(1-3)
所述二胺单体为结构式由式(2-1)、式(2-2)、式(2-3)、式(2-4)、式(2-5)、式(2-6)、式(2-7)、式(2-8)、式(2-9)及式(2-10)表示的化合物的一种或几种的混合物。
(2-1)
(2-2)
(2-3)
(2-4)
(2-5)
(2-6)
(2-7)
(2-8)
(2-9)
(2-10)
所述二胺单体总摩尔数与二酐单体总摩尔数比例为1:1至1:1.05。
所述有机溶剂为二甲基甲酰胺、二甲基乙酰胺、1,2-二氯乙烷、二甲基亚砜、二苯砜、环丁砜和N-甲基吡咯烷酮中的一种或多种。
在步骤S12中,该混合液可先在室温下搅拌,加入催化剂后,可缓慢的升温至160℃至200℃温度,然后搅拌反应12小时至48小时,如24小时。
通过选择柔性的二酐单体及二胺单体,并控制加热温度,该二酐单体及二胺单体可以通过在该160℃至200℃温度下的一步反应直接生成可溶性聚酰亚胺。该可溶性聚酰亚胺可溶于非质子性强极性溶剂。生成的聚酰亚胺为粘稠的聚合物溶液。
在该步骤S12后,可进一步将该可溶性聚酰亚胺提纯,具体为将该粘稠的聚合物溶液通过一洗涤试剂进行洗涤并烘干,得到可溶性聚酰亚胺固体。该催化剂溶于该洗涤试剂,而该聚酰亚胺在该洗涤试剂中不溶,从而形成沉淀。该洗涤试剂可以为水、甲醇水溶液或乙醇水溶液(甲醇或乙醇的浓度为5-99wt%)。
所述催化剂为苯甲酸、苯磺酸、甲基苯磺酸、苯乙酸、吡啶、喹啉、异喹啉、8-羟基异喹啉、吡咯、咪唑中的一种或多种,催化剂的加入量为二酐单体与二胺单体总质量的0.1-5wt%。
当该催化剂为碱性催化剂时,可进一步加入共沸脱水剂。
所述共沸脱水剂为苯、正己烷、甲苯、间二甲苯、对二甲苯、邻二甲苯中的一种或多种,共沸脱水剂加入质量为二酐单体与二胺单体总质量的2-20倍,酸性催化剂体系可不加共沸脱水剂。
在步骤S13中,该聚酰亚胺在溶液中的质量百分含量为5-20wt%。该步骤S13中的有机溶剂可以为非质子性强极性溶剂,具体可以为二甲基甲酰胺、二甲基乙酰胺、1,2-二氯乙烷、二甲基亚砜、二苯砜、环丁砜和N-甲基吡咯烷酮中的一种或多种。
所述步骤二具体可以包括:将该无机模板剂及表面处理剂在有机溶剂中均匀混合,升温至40℃至80℃度后超声处理2小时至8小时。
所述无机模板剂为无机纳米颗粒,材料可以为金属氧化物,且该金属氧化物与聚酰亚胺溶液不发生反应。具体地,该无机模板剂可以为纳米二氧化硅(SiO2) 颗粒、纳米二氧化钛(TiO2) 颗粒、纳米三氧化二铝(Al2O3)颗粒、纳米碳酸钙(CaCO3)颗粒、纳米氢氧化镁(Mg(OH)2)、纳米氧化镁(MgO)、纳米碳酸镁(MgCO3)、纳米碳酸钡(BaCO3)、纳米氢氧化锌(Zn(OH)2)、纳米碳酸锌(ZnCO3)中的一种或多种及不同粒径颗粒的混合物。该无机模板剂的与有机溶剂质量比可以为0.05:1至0.5:1。
所述表面处理剂作用是使无机模板剂具有疏水性,从而改善无机模板剂在有机体系中的分散性,所用表面处理剂可以为硅烷偶联剂。具体地,所述表面处理剂可以为乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-(甲基丙烯酰氧)丙基三甲氧基硅烷、γ-(甲基丙烯酰氧)丙基三乙氧基硅烷、甲基三甲氧基硅烷、3-缩水甘油醚氧基丙基三甲氧基硅烷、γ―氨丙基三乙氧基硅烷、异丁基三乙氧基硅及丁二烯基三乙氧基硅烷中的一种或多种。所述表面处理剂与无机模板剂的质量比为0.001:1 至0.05:1。
该步骤二所用的有机溶剂可以选用与步骤一同类的有机溶剂,即可以为二甲基甲酰胺、二甲基乙酰胺、1,2-二氯乙烷、二甲基亚砜、二苯砜、环丁砜和N-甲基吡咯烷酮中的一种或多种。
在所述步骤三中,该聚酰亚胺溶液和无机模板剂分散液混合后得到的溶液可通过超声分散处理,超声分散时间为0.5小时至8小时。所述聚酰亚胺溶液和无机模板剂分散液按照无机模板剂与聚酰亚胺干物质质量比为0.3:1至2:1混合。由于所述无机模板剂通过所述表面处理剂处理后具有疏水性,可以在有机体系中具有较好的分散性,因此当将聚酰亚胺溶液和无机模板剂分散液混合时,该无机模板剂可以均匀的分散在该聚酰亚胺溶液中。
在所述步骤四中,该制膜液可采用刮涂、喷涂、流延等方法涂覆在基板表面,在50 ℃至80 ℃温度下,保持0.5小时至24小时后,再在100 ℃至120 ℃温度下,烘干0.5小时至24小时后脱膜得到有机无机复合膜。该脱模的步骤可以是将该有机无机复合膜从该基板表面取下。该有机无机复合膜包括聚酰亚胺基体及分散在该聚酰亚胺基体中的无机模板剂。
在所述步骤五中,该模板脱除剂为与该无机模板剂发生化学反应使无机模板剂去除,且不与该聚酰亚胺发生反应的物质。具体地,该模板脱除剂可以为酸,包括盐酸、氢氟酸、硫酸、硝酸、乙酸及甲酸中的一种或多种的混合物。该酸可以溶于溶剂中形成溶液,如溶于水中。该酸溶液浓度为5-40wt%。
在该有机无机复合膜中,该无机模板剂为均匀分散在该聚酰亚胺基体中的纳米颗粒,则通过该无机模板剂与这些纳米颗粒的反应,可以使这些纳米颗粒从聚酰亚胺基体中去除,而聚酰亚胺不与该无机模板剂反应,结构保持不变,则在原有的纳米颗粒所在位置留下微孔,从而形成该聚酰亚胺微孔隔膜。
具体地,该有机无机复合膜可在该模板脱除剂溶液中,在30℃至80℃下处理0.5小时至24小时。得到的聚酰亚胺微孔隔膜可进一步纯化,具体可以用去离子水反复洗涤,在80℃至120℃下真空热处理1小时至24小时除水,得到聚酰亚胺微孔隔膜产品。
本发明实施例将该无机模板剂作为模板,通过模板法制备电池用耐高温聚酰亚胺微孔隔膜材料,首先,采用耐高温的聚酰亚胺基体制备隔膜材料,可使隔膜的耐温等级达到150℃以上;其次,采用可溶性聚酰亚胺制膜,可实现较低温度制膜,避免传统聚酰亚胺材料制备过程中的近400℃高温处理过程,降低生产复杂度及能耗,同时较低温度制膜可使有机无机组分避免高温处理时的热膨胀系数不同导致的隔膜有机无机分相问题,提高无机物掺杂量及分散均匀性;第三,柔性的单体结构及模板剂的表面改性,可大幅提高模板物质掺杂量,有效提高后续微孔隔膜的孔隙率。最终制备的隔膜孔隙率可达到50%,150℃热收缩率几乎为零,可大幅提高锂离子电池安全性能。所得微孔隔膜经电池测试表明具有良好的倍率性能。所制备的微孔隔膜在锂离子电池、钠离子电池、膜分离、传感器等领域具有重要应用价值。本发明使用的原料简单易得、成本较低,制备工艺过程易控制,适合于大规模工业生产。
实施例1
在氮气气氛保护下,将4.02g结构式为式(1-3)的二酐单体, 2.0g结构式为式(2-1)的二胺单体加入114g 二甲基乙酰胺/二苯砜(质量比1:1)中,室温搅拌0.5小时,待二酐单体及二胺单体充分溶解后,加入苯甲酸0.006g,缓慢升温至180℃,搅拌反应24小时,将所得粘稠聚合物溶液沉淀于过量水中,反复洗涤,烘干得到可溶性聚酰亚胺,将所得聚酰亚胺溶于N-甲基吡咯烷酮配置成20wt%聚酰亚胺溶液备用。
将纳米SiO2颗粒20g加入400g N-甲基吡咯烷酮,搅拌分散均匀,加入表面处理剂乙烯基三甲氧基硅烷0.02g,升温至60℃超声处理2小时,得到无机模板剂分散液备用。
取上述聚酰亚胺溶液5g和无机模板剂分散液42g,搅拌混合30分钟,超声分散0.5小时,得到制膜液。
将上述制膜液采用流延方法涂覆在基板表面,在50 ℃温度下,保持24小时后,再在120 ℃温度下,处理0.5小时后脱膜得到有机无机复合膜。
将上述有机无机复合膜置于5% 氢氟酸(HF)水溶液浴内,在30℃下处理24小时,然后用去离子水反复洗涤后,120℃下真空热处理1小时得到聚酰亚胺微孔隔膜,该聚酰亚胺微孔隔膜性能见表1。
实施例2
在氩气氛保护下,将31.0g结构式为式(1-2)的二酐单体, 20.5g结构式为式(2-2)的二胺单体和10.0g结构式为式(2-3)的二胺单体,加入240g 环丁砜中,室温搅拌1小时,待该二酐单体及二胺单体充分溶解后,加入苯磺酸0.6g,缓慢升温至200℃,搅拌反应24小时,将所得粘稠聚合物溶液沉淀于过量5wt%甲醇水溶液中,反复洗涤,烘干得到可溶性聚酰亚胺,将所得聚酰亚胺溶于二甲基乙酰胺,配置成5wt%聚酰亚胺溶液备用。
将纳米TiO2颗粒30g加入100g 二甲基亚砜中,搅拌分散均匀,加入1.5g丁二烯基三乙氧基硅烷,升温至80度超声处理8小时,得到无机模板剂分散液备用。
将上述无机模板剂分散液13g和聚酰亚胺溶液200g, 搅拌混合60分钟后,超声分散8小时,得到制膜液。
将上述制膜液采用流延法涂覆基板表面,在80℃温度下,保持0.5小时后,再在100 ℃下处理24小时后,脱膜得到有机无机复合膜。
将上述有机无机复合膜置于20wt%HF溶液内,在80℃下处理0.5小时,然后用去离子水反复洗涤后,80℃下真空热处理24小时得到聚酰亚胺微孔隔膜,该聚酰亚胺微孔隔膜性能见表1。
实施例3
在氩气氛保护下,将4.44 g结构式为式(1-1)的二酐单体, 3.36 g结构式为式(2-5)的二胺单体和4.28 g结构式为式(2-8)的二胺单体,加入288g二苯砜中,室温搅拌50分钟待该二酐单体及二胺单体充分溶解后,加入异喹啉0.24 g及二甲苯240g,缓慢升温至160℃,搅拌反应24小时,将所得粘稠聚合物溶液沉淀于过量99wt%乙醇水溶液中,反复洗涤,烘干得到可溶性聚酰亚胺,将适量上述聚酰亚胺溶于二甲基甲酰胺中,配置成10wt%聚酰亚胺溶液备用。
将纳米Al2O3颗粒20g加入40g 二甲基甲酰胺中,搅拌分散均匀,加入1.0g γ-(甲基丙烯酰氧)丙基三乙氧基硅烷,升温至60度后超声处理4小时,得到无机模板剂分散液备用。
将上述无机模板剂分散液30g和聚酰亚胺溶液 100g, 搅拌混合60分钟后,超声分散8小时,得到制膜液。
将上述制膜液采用流延法涂覆基板表面,在70℃温度下,保持5小时后,再在110 ℃下处理20小时后,脱膜得到有机无机复合膜。
将上述复合膜置于总酸浓度40wt%的HF/甲酸(HF与甲酸摩尔比为1:9)溶液内,在60℃下处理5小时,然后用去离子水反复洗涤后,100℃下真空热处理16小时得到聚酰亚胺微孔隔膜,该聚酰亚胺微孔隔膜性能见表1。
实施例4
在氩气氛保护下,将44.4 g结构式为式(1-1)的二酐单体, 31.0g结构式为式(1-2)的二酐单体,19.8 g结构式为式(2-9)的二胺单体和50.4 g结构式为式(2-10)的二胺单体,加入2000g环丁砜中,室温搅拌40分钟待该二酐单体及二胺单体充分溶解后,加入8羟基异喹啉3.0 g及甲苯500g,缓慢升温至190℃,搅拌反应24小时,将所得粘稠聚合物溶液沉淀于过量50wt%甲醇水溶液中,反复洗涤,烘干得到可溶性聚酰亚胺,将适量上述聚酰亚胺溶于二甲基乙酰胺中,配置成15wt%聚酰亚胺溶液备用。
将纳米Al2O3颗粒30g加入270g二甲基乙酰胺中,搅拌分散均匀,加入0.3g 3-缩水甘油醚氧基丙基三甲氧基硅烷,升温至50度超声处理7小时,得到无机模板剂分散液备用。
将上述无机模板剂分散液200g和聚酰亚胺溶液 40g, 搅拌混合60分钟后,超声分散7小时,得到制膜液。
将上述制膜液采用喷涂法涂覆基板上,在60 ℃温度下,保持12小时后,再在100 ℃下处理16小时后,脱膜得到有机无机复合膜。
将上述有机无机复合膜置于浓度6wt%的盐酸(HCl)溶液内,在65℃下处理6小时,然后用去离子水反复洗涤后,90℃下真空热处理18小时得到聚酰亚胺微孔隔膜,其性能见表1。
采用该实施例4的聚酰亚胺微孔隔膜组装成2032型扣式锂离子电池,正极活性材料为钴酸锂(LiCoO2),负极为锂片,该锂离子电池的倍率性能如图1所示。
表1.聚酰亚胺微孔隔膜的常规物化指标
膜厚度(μm) | 吸液率(%) | 拉伸强度(MPa) | 离子传导率(mS/cm) | 150℃热收缩率 | |
实施例1 | 36 | 79 | 19 | 0.80 | ~0 |
实施例2 | 29 | 52 | 27 | 0.35 | ~0 |
实施例3 | 25 | 65 | 22 | 0.51 | ~0 |
实施例4 | 32 | 70 | 18 | 0.65 | ~0 |
表1中隔膜性能测试方法本专业领域人员参照相关专业文献可以容易的获得。
另外,本领域技术人员还可在本发明精神内做其他变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。
Claims (10)
1.一种聚酰亚胺微孔隔膜的制备方法,包括以下步骤:
采用柔性单体,以一步法制备可溶性聚酰亚胺,并形成聚酰亚胺溶液,包括:
在保护气氛下,将二酐单体及二胺单体加入有机溶剂形成混合液,搅拌该混合液使该二酐单体及二胺单体在该有机溶剂中溶解后,加入催化剂,在160℃至200℃温度下充分反应,生成聚酰亚胺,以及
将所得聚酰亚胺溶于有机溶剂配置成聚酰亚胺溶液;
提供无机模板剂,该无机模板剂为无机纳米颗粒,在有机溶剂中通过表面处理剂对该无机模板剂进行表面处理,使无机模板剂分散在该有机溶剂中,形成无机模板剂分散液;
将该聚酰亚胺溶液和无机模板剂分散液混合并超声处理,形成制膜液;
将该制膜液涂覆在基板表面并烘干,形成有机无机复合膜;以及
将该有机无机复合膜置于模板脱除剂溶液中,该有机无机复合膜中的无机模板剂与该模板脱除剂反应,从而去除该有机无机复合膜中的无机模板剂,得到该聚酰亚胺微孔隔膜。
2.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述的二酐单体选自结构式为
中的至少一种。
3.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述的二胺单体选自结构式为
中的至少一种。
4.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述二胺单体总摩尔数与二酐单体总摩尔数的比例为1:1至1:1.05。
5.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述催化剂为苯甲酸、苯磺酸、甲基苯磺酸、苯乙酸、吡啶、喹啉、异喹啉、8-羟基异喹啉、吡咯和咪唑中的一种或多种。
6.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,当所述催化剂为碱性催化剂吡啶、喹啉、异喹啉、8-羟基异喹啉和咪唑中的一种或多种时,在该混合液中进一步加入共沸脱水剂,该共沸脱水剂为苯、正己烷、甲苯、间二甲苯、对二甲苯和邻二甲苯中的一种或多种。
7.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述无机模板剂为纳米二氧化硅颗粒、纳米二氧化钛颗粒、纳米三氧化二铝颗粒中、纳米碳酸钙颗粒、纳米氢氧化镁、纳米氧化镁、纳米碳酸镁、纳米碳酸钡、纳米氢氧化锌及纳米碳酸锌中的一种或多种,在该无机模板剂分散液中,所述无机模板剂与有机溶剂的质量比为0.05:1至0.5:1。
8.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述表面处理剂为乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、γ-(甲基丙烯酰氧)丙基三甲氧基硅烷、γ-(甲基丙烯酰氧)丙基三乙氧基硅烷、甲基三甲氧基硅烷、3-缩水甘油醚氧基丙基三甲氧基硅烷、γ―氨丙基三乙氧基硅烷、异丁基三乙氧基硅及丁二烯基三乙氧基硅烷中的一种或多种。
9.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,所述有机溶剂为二甲基甲酰胺、二甲基乙酰胺、1,2-二氯乙烷、二甲基亚砜、二苯砜、环丁砜和N-甲基吡咯烷酮中的一种或多种。
10.如权利要求1所述的聚酰亚胺微孔隔膜的制备方法,其特征在于,在所述制膜液中,所述无机模板剂与聚酰亚胺的质量比为0.3:1至2:1。
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US20160111696A1 (en) | 2016-04-21 |
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