CN103378816B - 基底基板、电子器件以及基底基板的制造方法 - Google Patents
基底基板、电子器件以及基底基板的制造方法 Download PDFInfo
- Publication number
- CN103378816B CN103378816B CN201310139770.XA CN201310139770A CN103378816B CN 103378816 B CN103378816 B CN 103378816B CN 201310139770 A CN201310139770 A CN 201310139770A CN 103378816 B CN103378816 B CN 103378816B
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- Prior art keywords
- hole
- electrode
- base substrate
- substrate
- intermediate layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 229910020684 PbZr Inorganic materials 0.000 description 1
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- 229910010413 TiO 2 Inorganic materials 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- 229910052712 strontium Inorganic materials 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012104087A JP6003194B2 (ja) | 2012-04-27 | 2012-04-27 | ベース基板、電子デバイスおよびベース基板の製造方法 |
| JPJP2012-104087 | 2012-04-27 | ||
| JP2012-104087 | 2012-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103378816A CN103378816A (zh) | 2013-10-30 |
| CN103378816B true CN103378816B (zh) | 2017-05-10 |
Family
ID=49463456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310139770.XA Expired - Fee Related CN103378816B (zh) | 2012-04-27 | 2013-04-22 | 基底基板、电子器件以及基底基板的制造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9148956B2 (enExample) |
| JP (1) | JP6003194B2 (enExample) |
| CN (1) | CN103378816B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6365111B2 (ja) * | 2013-11-12 | 2018-08-01 | セイコーエプソン株式会社 | 配線基板の製造方法、配線基板、素子収納用パッケージ、電子デバイス、電子機器および移動体 |
| JP5955300B2 (ja) * | 2013-11-13 | 2016-07-20 | 田中貴金属工業株式会社 | 貫通電極を用いた多層基板の製造方法 |
| JP5877932B1 (ja) | 2014-02-26 | 2016-03-08 | 日本碍子株式会社 | 貫通孔を有する絶縁基板 |
| CN104409364B (zh) * | 2014-11-19 | 2017-12-01 | 清华大学 | 转接板及其制作方法、封装结构及用于转接板的键合方法 |
| EP3170443B1 (en) * | 2015-06-16 | 2019-01-02 | Olympus Corporation | Imaging module, endoscope system, and method for manufacturing imaging module |
| CN107785475B (zh) * | 2015-07-17 | 2020-02-07 | 开发晶照明（厦门）有限公司 | 发光装置复合基板及具有该发光装置复合基板的led模组 |
| KR102504238B1 (ko) * | 2016-03-08 | 2023-03-02 | 주식회사 아모센스 | 세라믹 기판의 비아홀 충진 방법 |
| US11152911B2 (en) * | 2016-09-16 | 2021-10-19 | Daishinku Corporation | Piezoelectric resonator device |
| KR102369434B1 (ko) * | 2017-04-19 | 2022-03-03 | 삼성전기주식회사 | 체적 음향 공진기 및 이의 제조방법 |
| US11152294B2 (en) | 2018-04-09 | 2021-10-19 | Corning Incorporated | Hermetic metallized via with improved reliability |
| KR20210064266A (ko) | 2018-09-20 | 2021-06-02 | 재단법인 공업기술연구원 | 얇은 유리 상의 유리-관통 비아를 위한 구리 금속화 |
| JP7231368B2 (ja) * | 2018-09-26 | 2023-03-01 | 太陽誘電株式会社 | 弾性波デバイス |
| CN109688699A (zh) * | 2018-12-31 | 2019-04-26 | 深圳硅基仿生科技有限公司 | 陶瓷电路板及其制造方法 |
| CN113474311B (zh) | 2019-02-21 | 2023-12-29 | 康宁股份有限公司 | 具有铜金属化贯穿孔的玻璃或玻璃陶瓷制品及其制造过程 |
| WO2020213213A1 (ja) * | 2019-04-18 | 2020-10-22 | 株式会社村田製作所 | 共振装置及び共振装置製造方法 |
| CN110831351A (zh) * | 2019-10-12 | 2020-02-21 | 西安金百泽电路科技有限公司 | 一种大孔径孔铜pcb板的镀孔菲林制作方法 |
| CN111362715A (zh) * | 2020-03-16 | 2020-07-03 | 研创科技（惠州）有限公司 | 一种基于纳米金属的封装方法 |
| US20220394858A1 (en) * | 2021-06-04 | 2022-12-08 | Intel Corporation | Package substrate including core with trench vias and planes |
| CN113467136A (zh) * | 2021-06-18 | 2021-10-01 | Tcl华星光电技术有限公司 | 显示面板及其制作方法、显示装置 |
| JP7768396B2 (ja) * | 2022-07-29 | 2025-11-12 | 株式会社大真空 | 圧電振動デバイス |
| WO2025005000A1 (ja) * | 2023-06-26 | 2025-01-02 | 日本電気硝子株式会社 | インターポーザ基板、インターポーザ基板の製造方法、コア基板、及びコア基板の製造方法 |
| CN117353691B (zh) * | 2023-11-29 | 2024-04-12 | 荣耀终端有限公司 | 一种体声波滤波器的制造方法、体声波滤波器及通信设备 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11177199A (ja) * | 1997-12-05 | 1999-07-02 | Matsushita Electric Ind Co Ltd | プリント配線板およびその製造方法 |
| CN1825581A (zh) * | 2005-02-25 | 2006-08-30 | 三星电机株式会社 | 印刷电路板,倒装芯片球栅阵列板及其制造方法 |
| JP2006287019A (ja) * | 2005-04-01 | 2006-10-19 | Hitachi Metals Ltd | 貫通電極付基板およびその製造方法 |
| JP2011205010A (ja) * | 2010-03-26 | 2011-10-13 | Kyocera Corp | 配線基板およびその製造方法 |
| CN102318060A (zh) * | 2009-02-19 | 2012-01-11 | 日本电气株式会社 | 真空密封封装、具有真空密封封装的印刷电路基板、电子仪器以及真空密封封装的制造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989002697A1 (en) | 1987-09-14 | 1989-03-23 | Hughes Aircraft Company | Induced metallization process by way of dissociating aluminum nitride ceramic |
| JPH02209798A (ja) | 1989-02-09 | 1990-08-21 | Matsushita Electric Ind Co Ltd | 厚膜回路基板のスルーホール形成方法 |
| JPH03205891A (ja) | 1990-01-08 | 1991-09-09 | Fujitsu Ltd | セラミック回路基板 |
| US5517758A (en) * | 1992-05-29 | 1996-05-21 | Matsushita Electric Industrial Co., Ltd. | Plating method and method for producing a multi-layered printed wiring board using the same |
| JP2001119139A (ja) * | 1999-10-21 | 2001-04-27 | Denso Corp | プリント配線板の製造方法 |
| EP1672970B1 (en) * | 1999-10-26 | 2011-06-08 | Ibiden Co., Ltd. | Multi-layer printed circuit board and method of manufacturing multi-layered printed circuit board |
| TWI224382B (en) * | 2001-07-12 | 2004-11-21 | Hitachi Ltd | Wiring glass substrate and manufacturing method thereof, conductive paste and semiconductor module used for the same, and conductor forming method |
| JP2004022643A (ja) * | 2002-06-13 | 2004-01-22 | Murata Mfg Co Ltd | 基板の製造方法 |
| KR100907841B1 (ko) * | 2004-09-24 | 2009-07-14 | 이비덴 가부시키가이샤 | 도금 방법 및 도금 장치 |
| JP2007180924A (ja) | 2005-12-28 | 2007-07-12 | Kyocera Kinseki Corp | 水晶振動子容器の封止方法 |
| WO2009066504A1 (ja) * | 2007-11-20 | 2009-05-28 | Murata Manufacturing Co., Ltd. | 部品内蔵モジュール |
| JP4926094B2 (ja) | 2008-02-27 | 2012-05-09 | 京セラ株式会社 | セラミック基板およびセラミック基板の製造方法 |
| US8191248B2 (en) * | 2008-09-17 | 2012-06-05 | Unimicron Technology Corp. | Method for making an embedded structure |
| JP5278044B2 (ja) | 2009-02-27 | 2013-09-04 | 株式会社大真空 | パッケージ部材および該パッケージ部材の製造方法および該パッケージ部材を用いた圧電振動デバイス |
| KR20110089631A (ko) | 2010-02-01 | 2011-08-09 | 삼성전기주식회사 | 다층 세라믹 기판 및 이의 제조 방법 |
-
2012
- 2012-04-27 JP JP2012104087A patent/JP6003194B2/ja not_active Expired - Fee Related
-
2013
- 2013-04-22 CN CN201310139770.XA patent/CN103378816B/zh not_active Expired - Fee Related
- 2013-04-23 US US13/868,471 patent/US9148956B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11177199A (ja) * | 1997-12-05 | 1999-07-02 | Matsushita Electric Ind Co Ltd | プリント配線板およびその製造方法 |
| CN1825581A (zh) * | 2005-02-25 | 2006-08-30 | 三星电机株式会社 | 印刷电路板,倒装芯片球栅阵列板及其制造方法 |
| JP2006287019A (ja) * | 2005-04-01 | 2006-10-19 | Hitachi Metals Ltd | 貫通電極付基板およびその製造方法 |
| CN102318060A (zh) * | 2009-02-19 | 2012-01-11 | 日本电气株式会社 | 真空密封封装、具有真空密封封装的印刷电路基板、电子仪器以及真空密封封装的制造方法 |
| JP2011205010A (ja) * | 2010-03-26 | 2011-10-13 | Kyocera Corp | 配線基板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US9148956B2 (en) | 2015-09-29 |
| US20130286610A1 (en) | 2013-10-31 |
| CN103378816A (zh) | 2013-10-30 |
| JP2013232546A (ja) | 2013-11-14 |
| JP6003194B2 (ja) | 2016-10-05 |
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