CN103219301B - 功率半导体模块及其制造方法 - Google Patents
功率半导体模块及其制造方法 Download PDFInfo
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- CN103219301B CN103219301B CN201210385725.8A CN201210385725A CN103219301B CN 103219301 B CN103219301 B CN 103219301B CN 201210385725 A CN201210385725 A CN 201210385725A CN 103219301 B CN103219301 B CN 103219301B
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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| DE102012101666B3 (de) * | 2012-02-29 | 2013-05-16 | Infineon Technologies Ag | Leistungshalbleitermodulsystem mit Hinterschneidungsverbindung |
| JP2013232495A (ja) * | 2012-04-27 | 2013-11-14 | Mitsubishi Electric Corp | 半導体装置 |
| WO2014054212A1 (ja) * | 2012-10-01 | 2014-04-10 | 富士電機株式会社 | 半導体装置とその製造方法 |
| JP5801339B2 (ja) * | 2013-03-22 | 2015-10-28 | 株式会社東芝 | 半導体装置 |
| JP5799974B2 (ja) * | 2013-05-23 | 2015-10-28 | 株式会社デンソー | 電子装置 |
| JP6303623B2 (ja) * | 2014-03-07 | 2018-04-04 | 富士電機株式会社 | 半導体装置、半導体装置の製造方法、位置決め治具 |
| JP6407756B2 (ja) * | 2014-03-31 | 2018-10-17 | 株式会社東芝 | 半導体モジュールの製造方法 |
| DE102014106686B4 (de) * | 2014-05-12 | 2022-12-01 | Infineon Technologies Austria Ag | Elektronisches modul, elektronisches system und verfahren zum herstellen desselben |
| US10340816B2 (en) * | 2014-08-29 | 2019-07-02 | Mitsubishi Electric Corporation | Semiconductor device and multiphase semiconductor device |
| CN106716815B (zh) * | 2014-09-25 | 2019-03-15 | 日立汽车系统株式会社 | 电力变换装置 |
| JP6293030B2 (ja) * | 2014-10-09 | 2018-03-14 | 三菱電機株式会社 | 電力用半導体装置 |
| WO2016067930A1 (ja) * | 2014-10-29 | 2016-05-06 | 日立オートモティブシステムズ株式会社 | 電子機器及び電子機器の製造方法 |
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| DE112016006331B4 (de) | 2016-01-29 | 2021-07-22 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
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| US10074590B1 (en) * | 2017-07-02 | 2018-09-11 | Infineon Technologies Ag | Molded package with chip carrier comprising brazed electrically conductive layers |
| JP2019057576A (ja) | 2017-09-20 | 2019-04-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US10453777B2 (en) * | 2018-01-30 | 2019-10-22 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics assemblies with cio bonding layers and double sided cooling, and vehicles incorporating the same |
| US10957618B2 (en) * | 2018-05-29 | 2021-03-23 | Apex Microtechnology, Inc. | Thermally conductive electronic packaging |
| JP7010167B2 (ja) * | 2018-07-25 | 2022-01-26 | 株式会社デンソー | 半導体装置 |
| WO2020100899A1 (ja) * | 2018-11-14 | 2020-05-22 | 株式会社村田製作所 | 電子部品及びそれを備える電子部品モジュール |
| JP7155990B2 (ja) * | 2018-12-17 | 2022-10-19 | 株式会社デンソー | 半導体モジュール |
| US11682606B2 (en) * | 2019-02-07 | 2023-06-20 | Ford Global Technologies, Llc | Semiconductor with integrated electrically conductive cooling channels |
| JP7059970B2 (ja) * | 2019-03-11 | 2022-04-26 | 株式会社デンソー | 半導体装置 |
| JP7195208B2 (ja) * | 2019-04-12 | 2022-12-23 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| CN210379045U (zh) * | 2019-06-22 | 2020-04-21 | 深圳市奕通功率电子有限公司 | 一种功率模组 |
| EP3790047B1 (en) * | 2019-09-05 | 2022-03-02 | Infineon Technologies AG | Multi-chip-package |
| JP2021057534A (ja) * | 2019-10-01 | 2021-04-08 | 株式会社デンソー | 半導体装置 |
| US20220415763A1 (en) * | 2019-11-29 | 2022-12-29 | Ampleon Netherlands B.V. | Lead Frame Based Molded Radio Frequency Package |
| EP3869923B1 (en) * | 2020-02-20 | 2025-01-08 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Cooling profile integration for embedded power systems |
| US11735488B2 (en) * | 2020-04-07 | 2023-08-22 | Wolfspeed, Inc. | Power module |
| US11721617B2 (en) | 2020-04-07 | 2023-08-08 | Wolfspeed, Inc. | Power module |
| US11373941B2 (en) * | 2020-10-12 | 2022-06-28 | Renesas Electronics Corporation | Sense MOSFET electrically connected to a source pad via a plurality of source extraction ports |
| JP7552503B2 (ja) * | 2021-05-27 | 2024-09-18 | 株式会社デンソー | 半導体装置 |
| JP7563295B2 (ja) * | 2021-05-27 | 2024-10-08 | 株式会社デンソー | 半導体装置 |
| CN117941059A (zh) * | 2021-09-21 | 2024-04-26 | 株式会社电装 | 半导体装置及其制造方法 |
| JP7638193B2 (ja) * | 2021-10-26 | 2025-03-03 | 三菱電機株式会社 | 半導体装置および電力変換装置 |
| EP4231345A1 (en) * | 2022-02-22 | 2023-08-23 | Infineon Technologies Austria AG | Power semiconductor device |
| DE102022207270A1 (de) * | 2022-07-18 | 2024-01-18 | Zf Friedrichshafen Ag | Verfahren und Vorrichtung zum Herstellen einer Anschlussvorrichtung zum Anschließen zumindest eines elektrischen oder elektronischen Bauteils für ein elektrisches oder elektronisches Modul |
| DE102022207269A1 (de) * | 2022-07-18 | 2024-01-18 | Zf Friedrichshafen Ag | Verfahren und Vorrichtung zum Herstellen einer Anschlussvorrichtung zum Anschließen zumindest eines elektrischen oder elektronischen Bauteils für ein elektrisches oder elektronisches Modul |
| JP7784974B2 (ja) * | 2022-09-08 | 2025-12-12 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP2024057500A (ja) * | 2022-10-12 | 2024-04-24 | 株式会社デンソー | 半導体装置 |
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- 2012-10-12 CN CN201210385725.8A patent/CN103219301B/zh active Active
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Also Published As
| Publication number | Publication date |
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| US9059334B2 (en) | 2015-06-16 |
| DE102012222879A1 (de) | 2013-07-18 |
| CN103219301A (zh) | 2013-07-24 |
| US20130181228A1 (en) | 2013-07-18 |
| DE102012222879B4 (de) | 2023-05-04 |
| JP5661052B2 (ja) | 2015-01-28 |
| JP2013149730A (ja) | 2013-08-01 |
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