CN102983091A - Heater of batch-type heat treatment device - Google Patents
Heater of batch-type heat treatment device Download PDFInfo
- Publication number
- CN102983091A CN102983091A CN 201210356983 CN201210356983A CN102983091A CN 102983091 A CN102983091 A CN 102983091A CN 201210356983 CN201210356983 CN 201210356983 CN 201210356983 A CN201210356983 A CN 201210356983A CN 102983091 A CN102983091 A CN 102983091A
- Authority
- CN
- China
- Prior art keywords
- pipe
- heater
- cooling
- batch
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Abstract
The invention discloses a heater of a batch-type heat treatment device, the heater being suitable for the batch-type heat treatment device capable of performing heat treatment of a plurality of substrates simultaneously. The heater comprises: a first tube, a second tube, and a heating element. The second tube surrounds the first tube and has a certain distance to the first tube. The heating element is inserted into the first tube. Besides, the cooling gas flows through a space between the first and second tubes. According to the invention, the substrates loaded inside a cavity are heated by a plurality of the heaters corresponding to the substates, thereby realizing the effect of uniform heat treatment of the entire surface of a substrate.
Description
The application is that national applications number is 200980122777.2, to enter State Period date be on December 17th, 2010, denomination of invention dividing an application for the application for a patent for invention of " batch-type annealing device and the heater that is applicable to this annealing device ".
Technical field
The present invention relates to a kind of heater of batch-type annealing device, in more detail, relate to and a kind ofly can carry out even heat treatment to the whole area of the substrate of a plurality of substrates simultaneously, and for the chamber interior of heat of cooling processing unit and make the heater that cools off the batch-type annealing device of crossing with gas flow promptly after finishing heat treatment step.
Background technology
The annealing device that in the manufacturing of semiconductor, flat-panel monitor and solar cell, uses, be to the regulation film of evaporation on the substrate as silicon wafer, glass carry out the operations such as crystallization, phase change indispensable device of heat-treating step.
As representational annealing device, the silicon crystallization device that the non-crystalline silicon crystallization of evaporation on glass substrate is turned to polysilicon when making liquid crystal display or film-type crystal silicon solar energy battery is arranged.
In order to carry out aforesaid crystallization step (heat treatment step), the annealing device that can heat the substrate that is formed with the regulation film need to be arranged.For example, in order to make the non-crystalline silicon crystallization need at least 550 ℃ to 600 ℃ temperature.
Usually, annealing device has the one chip that can heat-treat a substrate and the batch-type that a plurality of substrates are heat-treated.Although one chip has the advantage simple in structure of device, there is the low shortcoming of productivity ratio.Therefore, batch-type is attracted attention as a large amount of production with recently.
Especially, along with the size large tracts of land of flat-panel monitor and solar battery glass substrate, the problems referred to above receive publicity more recently.Therefore, the needs exploitation is a kind of can carry out to the whole area of substrate even heat treated batch-type annealing device.
And annealing device in the past is owing to needing the long period with substrate from the step that annealing device unloads, so there is the problem of the productivity ratio that reduces heat treatment step after finishing heat treatment step.The phenomenon of this reduction productivity ratio is owing to following reason produces, namely, for the substrate damage that prevents that thermal shock from causing, just can unload carried base board after need to after finishing heat treatment step, being cooled to chamber interior below the set point of temperature, the process need long period of therefore reducing the chamber interior temperature.
Summary of the invention
Therefore, the present invention makes for the problem that solves above-mentioned prior art, its purpose is to provide a kind of heater that is applicable to the batch-type annealing device, when a plurality of substrates are heat-treated simultaneously, substrate is heated by a plurality of heaters corresponding with substrate, thereby can carry out even heat treatment to the whole area of substrate.
Also have, the present invention makes for the problem that solves above-mentioned prior art, its purpose is to provide a kind of heater that is applicable to the batch-type annealing device, cooling chamber is inner rapidly after finishing heat treatment step, thus in the time of can improving significantly manufacturing flat-panel monitor or solar cell etc. the productivity ratio of indispensable heat treatment step.
In order to achieve the above object, the heater that the present invention relates to is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, and wherein, described heater comprises can make cooling with the space of the described heater of gas flow inside.
In addition, in order to achieve the above object, the heater that the present invention relates to is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, and wherein, described heater comprises: the first pipe; The second pipe has predetermined distance with described the first pipe and centers on described the first pipe; And heater, be inserted into the inside of described the first pipe, cooling is flow through by the space between described the first pipe and described the second pipe with gas.
Also can be that the sectional area at the both ends of described heater is greater than the sectional area of central portion.
Also can be that described heater can separate from described the first pipe or described the second pipe.
The heater that the present invention relates to is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, and described heater comprises: the first pipe; The coil form heater wire is wrapped on the outer peripheral face of described the first pipe and arranges; And second the pipe, with described the first pipe have predetermined distance and around described first the pipe, and, make the cooling flow through with the central space of gas by described the first pipe.
Also have, in order to achieve the above object, the heater that the present invention relates to is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, and described heater comprises: the first pipe; The coil form heater wire is wrapped on the outer peripheral face of described the first pipe and arranges; The second pipe has predetermined distance with described the first pipe and centers on described the first pipe; And the 3rd pipe, have predetermined distance with described the second pipe and around described the second pipe, and, make cooling manage with the central space and described second of gas by described the first pipe and described the 3rd pipe between the space at least one spatial flow mistake.
Also can be that the spacing of described heater wire is identical with location independent ground on described the first pipe, perhaps changes according to the position on described the first pipe.
Also can be that the first pipe that is wound with described coil form heater wire can separate from described the second pipe or described the 3rd pipe.
Also can be at the two ends of described the 3rd pipe, to be provided with the first cooling end that flows through of cooling water that makes described the 3rd pipe of cooling.
Also can be at the two ends of described the 3rd pipe, also to be provided with the second cooling end that cooling is crossed by the spatial flow between described the second pipe and described the 3rd pipe with gas.
Also can be that described the first cooling end comprises: inside be formed with first main body in space; The cooling water that makes cooling water flow into the inner space of described the first main body flows into pipe; And make the inner space that flow into described the first main body cooling water flow out of cooling water flow out of pipe.
It also can be that described the second cooling end comprises: the second main body that is formed with the space in inside; And the flue that is connected with the inner space of described the second main body, wherein, the inner space of described the second main body with described second the pipe and described the 3rd pipe between the space be connected.
Also can be that heater of the present invention also comprises: to the portion of terminal of described heater wire supply power; And the insulation division that described portion of terminal is insulated.
Also can be that heater of the present invention also comprises the end that is arranged on described the second pipe and the locking cap that is connected with described heater wire.
Also can be that described portion of terminal comprises: be arranged on the contact tube that described the first pipe is upper and be connected with the power supply of outside; And the hold-down nut that makes the locking cap fluid-tight engagement of described contact tube and described heater.
Also can be, described insulation division comprises that inside is formed with the space and around the insulator cap of described portion of terminal, forms porose in a side of described insulator cap.
According to the present invention, be loaded into substrate in the chamber by corresponding with each substrate a plurality of heaters heating, thereby have the effect that to heat-treat equably the whole area of substrate.
In addition, according to the present invention, can heat-treat a plurality of substrates simultaneously, therefore, have the effect of the productivity ratio that improves flat-panel monitor and solar cell.
In addition, according to the present invention, owing to have the space that cooling is crossed with gas flow in heater inside, therefore the rapid chamber interior of heat of cooling processing unit after finishing heat treatment step, thereby shorten and to unload the required time of carried base board process, have improve significantly when making flat-panel monitor or solar cell etc. the effect of productivity ratio of indispensable heat treatment step.
Description of drawings
Fig. 1 and Fig. 2 are the stereograms of the batch-type annealing device structure that relates to of expression one embodiment of the invention;
Fig. 3 is the stereogram of configuration status of substrate, main heating unit and the auxiliary heating unit of the batch-type annealing device that relates to of expression one embodiment of the invention;
Fig. 4 is the stereogram of the brilliant boat structure of the batch-type annealing device that relates to of expression one embodiment of the invention;
Fig. 5 is the gas supply pipe of the batch-type annealing device that relates to of expression one embodiment of the invention and the stereogram of gas outlet pipe structure;
Fig. 6 is the schematic diagram of the gas supply pipe structure of presentation graphs 5;
Fig. 7 and Fig. 8 are the schematic diagrames of ordered state of the unit primary heater of the batch-type annealing device that relates to of one embodiment of the invention;
Fig. 9 is the stereogram of the heater structure that relates to of expression one embodiment of the invention;
Figure 10 and Figure 11 are cross-sectional perspective view and the sectional views of the heater structure that relates to of expression another embodiment of the present invention;
Figure 12 is the schematic diagram that is provided with the state of the first cooling end and the second cooling end, portion of terminal and insulation division on the heater end that relates to of expression one embodiment of the invention;
Figure 13 is illustrated in the first cooling end that heater end that one embodiment of the invention relate to arranges and the exploded perspective view of the second cooling end structure;
Figure 14 is illustrated in portion of terminal that heater end that one embodiment of the invention relate to arranges and the exploded perspective view of insulation division structure;
Figure 15, Figure 16 and Figure 17 are the schematic diagrames of the contact tube structure that relates to of expression one embodiment of the invention;
Figure 18 and Figure 19 be the expression one embodiment of the invention relate to first the protection nut structure schematic diagram;
Figure 20, Figure 21 and Figure 22 be one embodiment of the invention relate to second the protection nut structure schematic diagram;
Figure 23, Figure 24 and Figure 25 are the schematic diagrames of the insulator cap structure that relates to of expression one embodiment of the invention;
Figure 26 and Figure 27 are sectional block diagram and the cutaway views of the heater structure that relates to of expression another embodiment of the present invention.
Reference numeral
1: annealing device; 10: substrate;
12: support; 100: chamber;
102: framework; 104: door;
106: lid; 108: brilliant boat;
120: main heating unit; 140a: the first auxiliary heating unit;
140b: the second auxiliary heating unit; 150a: the first unit auxiliary heater;
150b: the second unit auxiliary heater; 160: gas supply pipe;
170: gas outlet pipe; 180: cooling water pipe;
200: the unit primary heater; 200a, 200b: heater;
220a, 220b: the first pipe; 240a, 240b: the second pipe;
260: the three pipes; 280: locking cap;
300: the first cooling ends; 310: the first main bodys;
320: cooling water flows into pipe; 330: cooling water flow out of pipe;
340: flange; 400: cooling end;
410: the second main bodys; 420: flue;
500: portion of terminal; 510,510b: contact tube;
520: the first hold-down nuts; 530: the first protection nuts;
540: the second protection nuts; 600: insulation division;
610: insulator cap; 620: the hole;
630: the second hold-down nuts.
Embodiment
Below, the formation that present invention will be described in detail with reference to the accompanying.
Fig. 1 and Fig. 2 are the stereograms of batch-type annealing device 1 structure that relates to according to one embodiment of the invention of expression.In Fig. 1 and Fig. 2, in order conveniently to have briefly showed the profile of unit primary heater 200, and be illustrated in the configuration status of the unit primary heater 200 in the batch-type annealing device 1.
Fig. 3 is the stereogram of configuration status of substrate 10, main heating unit 120 and the auxiliary heating unit 140 of the batch-type annealing device 1 that relates to according to one embodiment of the invention of expression.
At first, the material that is loaded into the substrate 10 on the batch-type annealing device 1 is not particularly limited, can glass-loaded, the substrate 10 of the various materials such as plastics, polymer, Silicon Wafer, stainless steel.Below, employing glass substrate of the most frequently used rectangular shape in the flat-panel monitor as liquid crystal display (LCD), organic lcd display (OLED), film-type silicon solar cell field describes.
With reference to Fig. 1, batch-type annealing device 1 comprises that the chamber 100 of the rectangular shape that heat treatment space is provided and the framework 102 of supporting chamber 100 consist of.The material of chamber 100 and framework 102 is preferably stainless steel, but is not limited thereto.
Be provided with for substrate 10 being loaded in the chamber 100 and the door 104 that opens and closes of direction up and down in a side of chamber 100.Under the state that door 104 opens wide, can utilize the substrate loading device (not shown) as transfer arm that substrate 10 is loaded in the chamber 100.On the other hand, after finishing heat treatment, can unload carried base board 10 from chamber 100 by door 104.The material of door 104 is preferably stainless steel, but is not limited thereto.
In order to repair and replace such as brilliant boat 108, gas supply pipe 160 and gas exhaust pipe 170 etc. that is arranged on chamber 100 inside, can be opened and closed to be provided with lid 106 at the upside of chamber 100.The material of lid 106 is preferably quartz, but is not limited to this.
Be provided with main heating unit 120 for direct heated substrates 10 in the inside of chamber 100, be used for preventing chamber 100 inside thermal loss auxiliary heating unit 140 and be used for finishing heat treatment after the cooling water pipe 180 of rapid cooling chamber 100 inside.
With reference to Fig. 2, main heating unit 120 comprises parallel with the short side direction of substrate 10 and has the unit primary heater 200 of predetermined distance.Unit primary heater 200 is generally the long bar-shaped heater of length, is the unit bodies that is inserted with heater in the inside of quartz ampoule and connects the main heating unit 120 of formation that external power source generates heat by the terminal that is arranged on two ends.Main heating unit 120 is made of 14 unit primary heaters 200 in the present embodiment, but the number that consists of the unit primary heater 200 of main heating unit 120 is to carry out numerous variations according to the size that is loaded into the substrate 10 in the chamber 100.
The spacing configuration is a plurality of in accordance with regulations along the stacked direction of substrate 10 for main heating unit 120.Substrate 10 is configured between a plurality of main heating units 120.In the present embodiment, have 3 substrates 10 and be configured in 4 structures between the main heating unit 120, but the number of main heating unit 120 is to carry out numerous variations according to the number that is loaded into the substrate 10 in the chamber 100.
The central authorities of substrate 10 preferred disposition between main heating unit 120.And, preferably will separate between substrate 10 and the main heating unit 120 so that the transfer arm of base board delivery device it moves unimpeded degree when being loaded into substrate 10 in the chamber 100.
As mentioned above, on the top of the substrate 10 of batch-type annealing device 10 and the bottom be provided with can covered substrate 10 main heating unit 120 whole area, that consisted of by 14 unit primary heaters 200, therefore, the whole area of substrate 10 is heated equably by 28 unit primary heaters 200, thereby can realize even heat treatment.
And with reference to Fig. 2, auxiliary heating unit 140 comprises along the first auxiliary heating unit 140a of the short side direction configured in parallel of substrate 10 with along the second auxiliary heating unit 140b of the long side direction of substrate 10 configuration.
The first auxiliary heating unit 140a is included in the both sides of main heating unit 120 and a plurality of first auxiliary heater 150a of unit of unit primary heater 200 configured in parallel.In the present embodiment, the first auxiliary heating unit 140a arranges respectively one in order to form the row as main heating unit 120 in the both sides of 4 main heating units 120, consists of by amounting to 8 the first auxiliary heater 150a.But the number that consists of the first auxiliary heater 150a of unit of the first auxiliary heating unit 140a is to carry out numerous variations according to the number that is arranged on the main heating unit 120 in the chamber 100.On the other hand, in order to improve the effect that arranges of auxiliary heating unit, the first auxiliary heating unit 140a can be made of 16 the first auxiliary heater 150a of unit that amount to that dispose respectively 24 main heating unit 120 both sides.
The second auxiliary heating unit 140b is included in the both sides of main heating unit 120 and a plurality of second auxiliary heater 150b of unit of unit primary heater 200 arranged perpendicular.In the present embodiment, be configured between a plurality of the second auxiliary heater 150b of unit that consist of the second auxiliary heating unit 140b for the unit's of making heating unit 120, the second auxiliary heating unit 140b is made of 10 the second auxiliary heater 150b of unit that amount to that dispose respectively 14 unit heating unit 120 both sides.But the number that consists of the second auxiliary heater 150b of unit of the second auxiliary heating unit 140b is to carry out numerous variations according to the number that is arranged on the main heating unit 120 in the chamber 100.The central authorities of main heating unit 120 preferred disposition between the second auxiliary heating unit 140b.
The first auxiliary heater 150a of unit preferably uses the primary heater device 200 common heater air flow pressure switch rods identical, that length is long with aforesaid unit with the second auxiliary heater 150b of unit.
As mentioned above, 4 peripheral parts at the main heating unit 120 of batch-type annealing device 1 are provided with the first auxiliary heating unit 140a that is made of 8 the first auxiliary heater 150a of unit and the second auxiliary heating unit 140b that is made of 10 the second auxiliary heater 150b of unit.Therefore, 4 peripheral parts of main heating unit 120 can be heated from 18 the auxiliary heater 150a of unit, 150b, thus the thermal loss of chamber 100 inside that occur inevitably when 4 peripheral parts that prevent main heating unit 120 contact with external environment condition.
Figure 3 illustrates the state that disposes substrate 10, main heating unit 120 and auxiliary heating unit 140 on the aforesaid batch-type annealing device 1.But, in Fig. 3, only show the situation that disposes respectively 2 the first auxiliary heater 150a of unit in the both sides of 4 main heating units 120.
In addition, with reference to Fig. 2, cooling water pipe 180 is configured between each the unit primary heater 200 that consists of main heating unit 120.In the present embodiment, cooling water pipe 180 is arranged between 56 unit primary heaters 200 that consist of 4 main heating units 120, be provided with altogether 52, but the number of cooling water pipe 180 can be carried out numerous variations according to being arranged on main heating unit 120 in the chamber 100 and the number of unit primary heater 200.And cooling water pipe 180 does not need necessarily to be configured between each unit primary heater 200, as long as the inside of cooling chamber 100 suitably also can be omitted in cooling water pipe 180 is set between part unit's primary heater 200.
As mentioned above, be provided with cooling water pipe 180 at batch-type annealing device 1, therefore, after finishing heat treatment, the heat of chamber 100 inside is delivered to chamber 100 outsides by cooling water pipe 180, thus rapid cooling chamber 100 inside.Since only after finishing heat treatment chamber 100 internal coolings to the unloading operation that can carry out substrate 10 below the set point of temperature, if the action therefore by cooling water pipe 180 is the inside of cooling chamber 100 rapidly, then can significantly improve the productivity ratio of flat-panel monitor and solar cell.
The material of cooling water pipe 180 is preferably copper, the stainless steel of high thermal conductivity.To cool off with gas or cool off with the inside of liquid supply to cooling water pipe 180.Cooling can be used air, helium, nitrogen, argon gas with gas.Cooling can make water with liquid.Cooling is preferably normal temperature with gas or cooling with the temperature of liquid, but can use as required gas or the liquid that is cooled to below the normal temperature.
Fig. 4 is the stereogram of brilliant boat 108 structures of the batch-type annealing device 1 that relates to according to one embodiment of the invention of expression.
With reference to Fig. 4, be provided with a plurality of brilliant boat 108 that is loaded into the substrate 10 of chamber 100 for supporting in the inside of chamber 100.Brilliant boat 108 preferably is arranged to the long side of supporting substrates 10.In the present embodiment, 3 brilliant boats 108 are set respectively, amount to 6 at two long sides of substrate 10, and for 10 supportings of stable support substrate can arrange number more than it, can also carry out numerous variations according to the size of substrate 10.The material of brilliant boat 108 is preferably quartz.
And with reference to Fig. 4, substrate 10 preferably is loaded on the brilliant boat 108 at the state on the support 12 to carry.In heat treatment process, when if heat treatment temperature reaches softening (softening) temperature of glass substrate, then because of the weight generation substrate downward direction buckling phenomenon of substrate self, particularly this buckling phenomenon becomes larger problem along with the large tracts of land of substrate.In order to address this is that substrate 10 lift-launchs are heat-treated under the state on the support 12.
Fig. 5 is the gas supply pipe 160 of the batch-type annealing device 1 that relates to according to one embodiment of the invention of expression and the stereogram of gas outlet pipe 170 structures, and Fig. 6 is the schematic diagram of gas supply pipe 160 structures of presentation graphs 5.
As shown in the figure, in chamber 100, be respectively arranged with a plurality of bar-shaped gas supply pipes 160 and bar-shaped gas outlet pipe 170, wherein, be formed with a plurality of the first pores 162 of discharging atmosphere gas for the atmosphere gas that will be used to form the heat treatment atmosphere is supplied to chamber 100 inside at this gas supply pipe 160, be formed with a plurality of the second pores (not shown) that employed waste gas flows in heat-treating atmosphere forms at this gas outlet pipe 170.Preferably gas supply pipe 160 and gas outlet pipe 170 are arranged on opposite to each other the long side of substrate 10.Heat-treating atmosphere forms and uses nitrogen, argon gas etc. with gas.
In the present embodiment, 4 gas supply pipes 160 and gas outlet pipe 170 are set respectively, but the number of gas supply pipe 160 and gas outlet pipe 170 can be carried out numerous variations according to the size of substrate 10.
The position that is formed on the first pore 162 on the gas supply pipe 160 approaches with substrate 10 as far as possible, and the atmosphere gas that sprays with toilet can directly contact with substrate 10.Therefore, the number of preferred the first pore 162 is identical with the number of substrate 10 in being loaded into chamber 100.Be formed on the gas outlet pipe 170 the second pore (not shown) too.
Fig. 7 and Fig. 8 are the figure of ordered state of the unit primary heater 200 of the batch-type annealing device 1 that relates to according to one embodiment of the invention.In the present invention, the arrangement of the unit primary heater 200 between the main heating unit 120 can be carried out numerous variations as required.
Fig. 7 is the schematic diagram of ordered state of the unit primary heater 200 between the main heating unit 120 that the present embodiment that describes adopts of seeing figures.1.and.2.As shown in the figure, the unit primary heater 200 that consists of some main heating unit 120a can be configured to and align adjacent to unit primary heater 200 this main heating unit 120a, that consist of main heating unit 120b.
On the other hand, with reference to Fig. 8, the unit primary heater 200 that consists of some main heating unit 120a can be configured to and be staggered adjacent to unit primary heater 200 this main heating unit 120a, that consist of main heating unit 120b.For example, in Fig. 8, the unit primary heater 200 that consists of main heating unit 120a is arranged on the centre position between the unit primary heater 200 that consists of main heating unit 120b.As shown in Figure 8, by changing the ordered state of the unit primary heater 200 between the main heating unit 120, can implement heat treatment to the whole area that is loaded into the substrate 10 in the chamber 100 more equably.
Below, as follows according to the action of batch-type annealing device 1 of the present invention with reference to description of drawings.
At first, as shown in Figure 1, the door 104 that the operator will be arranged on chamber 100 1 sides moves and opens to the bottom.
Afterwards, substrate 10 carried at the state on the support 12 be placed on the upper side of transfer arm (not shown) of base board delivery device, and the Mobile Transmission arm is loaded into chamber 100 inside with substrate.
Be loaded into the substrate 10 of chamber 100 inside, as shown in Figure 4, stack gradually on the brilliant boat 108 that is arranged on chamber 100 inside.In the present embodiment, 3 substrates 10 are laminated on the brilliant boat 108.
Subsequently, on brilliant boat 108, after the stacked complete substrate 10, door 104 is moved inside and the external environment condition isolation that makes chamber 100 to top, then main heating unit 120 is connected power supply, thereby can carry out the heat treatment to substrate 10.
Be arranged on 4 main heating units 120 in the chamber 100, separate the position of predetermined distance in the upper and lower of substrate 10 and arrange, therefore and 14 unit primary heaters 200 that each main heating unit 120 disposes by having predetermined distance consist of, and can carry out uniform heat treatment thereby the whole area of substrate 10 is heated equably.
On the other hand, start the first auxiliary heating unit 140a and the second auxiliary heating unit 140b on 4 peripheral parts that are arranged on main heating unit 120, prevent the thermal loss of contingent chamber 100 inside in heat-treating operation.Thus, can realize more uniformly heat treatment to substrate 10 whole areas.
In fact before heat-treating, with the chamber 100 inner heat-treating atmospheres that form.For this reason, by gas supply pipe 160 to chamber 100 internal feed nitrogen or the such atmosphere gas of argon gas.Be used in the waste gas that forms heat-treating atmosphere and be discharged to chamber 100 outsides by the gas outlet pipe 170 that arranges in opposite directions with gas supply pipe 160.
If heat treatment step finishes, rapid cooling chamber 100 inside then.For this reason, make such as cooling usefulness gas flow chamber 100 inside such as helium, nitrogen, argon gas by cooling water pipe 180.The heat of absorption chamber 100 inside when cooling is flow through with gas perforation chamber 100 inside, thus the temperature of chamber 100 inside is sharply descended.Thus, after finishing heat treatment step, within the very fast time, can carry out the unloading operation of substrate 10, thereby can improve the productivity ratio of heat treatment step.
At last, if the drop in temperature of chamber 100 inside, is then opened door 104 and utilize transfer arm to unload carried base board 10 from chamber 100 to proper level, thereby finally finish heat treatment step.
Have as above in the batch-type annealing device that consists of, the unit primary heater 200 (below be called " heater ") that consists of main heating unit 120 can be constructed as follows.
Fig. 9 is the stereogram of heater 200 structures that relate to according to one embodiment of the invention of expression.As shown in the figure, heater 200 forms and has the bar-shaped of specific length.With reference to Fig. 9, heater 200 is made of heater 202 and lid 204.Heater 200 is accepted outside power supply and is produced the heat required to the heat treatment of substrate 10.The material of heater 202 is preferably kanthal (kanthal).Lid 204 protection heaters 202, the material of lid 204 is preferably quartz.
In addition, the first auxiliary heater 150a of unit and the second auxiliary heater 150b can have shape and the structure identical with as shown in Figure 9 heater 200.
Figure 10 and Figure 11 are cross-sectional perspective view and the sectional views that represents the heater 200a structure that relates to according to another embodiment of the present invention.In Figure 10 and Figure 11, because shape and the structure of the both ends side of heater 200a are identical, therefore for a convenient end side that only illustrates heater 200a.
As shown in the figure, heater 200a has long bar-shaped of length on the whole, but is not limited thereto, and can carry out multiple variation according to the pattern of the batch-type annealing device that heater was suitable for.
With reference to Figure 10 and Figure 11, heater 200a comprises: the first pipe 220 with specific length; The second pipe 240 has specific length and is centered around the first pipe outside of 220; The 3rd pipe 260 has specific length and is centered around the second pipe outside of 240; And coil form heater wire 270, twine on the outer peripheral face that is arranged on the first pipe 220 with predetermined distance.
Because the first pipe the 220, second pipe the 240 and the 3rd pipe 260 all is applicable to annealing device, therefore the material of the first pipe the 220, second pipe the 240 and the 3rd pipe 260 is preferably the higher material of fusing point, and is for example quartzy.
The length of the first pipe the 220, second pipe the 240 and the 3rd pipe 260 is preferably all identical.But as shown in the figure, in order to be connected with the contact tube 510 of portion of terminal 500 described later, the length of the first pipe 220 can grow contact tube 510 length than the length of the second pipe the 240 and the 3rd pipe 260.And the first pipe the 220, second pipe the 240 and the 3rd pipe 260 preferably all has coaxial.But, also heater can be constituted as required the first pipe the 220 and second pipe 240 have coaxial, and the 3rd pipe 260 and the first pipe 220 and second manage 240 do not have coaxial.
Namely, the central shaft of the first pipe the 220, second pipe the 240, the 3rd pipe 260 that consists of heater 200a is unanimously formed, but because it is sagging that the first pipe the 220 and second pipe 240 might occur in the action way of heater 200a, may be damaged according to degree of sag the first pipe the 220 or second pipe 240, therefore in order to prevent breakage, preferably make the second pipe 240 be positioned at the bottom that is lower than the 3rd pipe 260 centers, can contact and be supported with the 3rd pipe 260 when sagging in order in course of action, occur.
The first pipe 220 preferred external diameters are roughly 10mm, and internal diameter is roughly 6mm, and thickness is about 2mm.Empty space 224 in the middle of the first pipe 220 himself has.
On the outer peripheral face of the first pipe 220, twining the heater wire 270 that is equivalent to heater with coil form.The material of heater wire 270 is preferably any in nickel or the kanthal.
The main component of kanthal is iron, belongs to the larger alloy of resistance, can be processed into wire rod as uses such as heaters.This kanthal belongs to iron-chrome-aluminum system, and standard analysis is chromium 23%, aluminium 6%, in addition contains 2% cobalt.
The diameter of heater wire 270 preferably has the scope of 0.6mm to 0.8mm.
When being wound into heater wire 270 on the first pipe 220, spacing and the caloric value of heater wire 270 have relation.That is it is larger that caloric value is compared in the zone that the zone that, the spacing of heater wire 270 is less and spacing are larger.For heated substrates equably, caloric value that need to be on the whole area of heater 220a is certain, and is for this reason, preferably all identical with the spacing of location independent heater wire 270 on the first pipe 220.But as required, the spacing of heater wire 270 can change according to the position on the first pipe 220.For example, compare the spacing (that is, the caloric value on the enlarged ends side) of the heater wire 270 that dwindles on the end side with the central side of the first pipe 220, thereby the end side that can replenish owing to heater 200a contacts the thermal loss that occurs with external environment condition.
In order to prevent that heater wire 270 breaks away from, and can arrange locking cap 280.Locking cap 280 structures are with aftermentioned.
The second pipe 240 is arranged to have certain spacing with the first pipe 220 and round the first pipe shape of 220.The second pipe 240 preferred external diameters are roughly 18mm, and internal diameter is 14mm roughly, about thickness 2mm.
The 3rd pipe 260 is arranged to have certain spacing with the second pipe 240 and round the second pipe shape of 240.The 3rd pipe 260 preferred external diameters are roughly 30mm, and internal diameter is 22mm roughly, about thickness 4mm.The second pipe the 240 and the 3rd pipe be formed with between 260 have 2mm roughly between left and right every the space 264 of sky.
End at the first pipe 220 is provided with contact tube 510, so that can be to heater wire 270 pluggeds on the outer peripheral face that is wrapped in the first pipe 220.Heater wire 270 is not particularly limited by the connected mode between contact tube 510 and external power source (not shown), omits its detailed description.
On the other hand, preferred heater 200a consists of from the second pipe the 240 or the 3rd pipe 260 removable structures with first pipe 220 that easily will be wound with heater wire 270.This structure has following advantage, namely, when the problem such as heater wire 270 broken strings occurs in the process of using heater 200a, place under repair or replace only separating the first pipe 220 that is wound with heater wire 270 among the heater 200a that is installed on the annealing device, thereby can repair simply or replace the heater 200a that breaks down.
In addition, although heater 200a is not limited thereto take the first pipe the 220, second pipe the 240 and the 3rd pipe 260 as basic comprising, consist of in order to simplify total also can omit the 3rd pipe 260.Only by the structure of the first pipe and the heater that consists of of the second pipe with aftermentioned.
As mentioned above, heater 200a comprises the space 224,264 that cooling can be flow through in heater 200a inside with gas.Therefore, after heat treatment step in annealing device 1 finishes, make cooling with the space 224,264 of gas through heater 200a, thereby can reduce rapidly the temperature of chamber interior when reducing rapidly the temperature of heater 200a self.Its result, can shorten after heat treatment step finishes in order to unload that carried base board 10 need to be reduced to the temperature of chamber interior below the set point of temperature and the required time, thus can significantly improve manufacturing flat-panel monitor and solar cell the productivity ratio of indispensable heat treatment step.
And, in order to cool off heater 200a the first cooling end 300, the second cooling end 400 can be set.In addition, for the action of heater 200a portion of terminal 500 and insulation division 600 can be set.
Figure 12 is the schematic diagram that is provided with the first cooling end 300 and the second cooling end 400, portion of terminal 500 and insulation division 600 on the end of the heater 200a that relates to according to one embodiment of the invention of expression;
Figure 13 is that expression is arranged on the first cooling end 300 on the heater end that relates to according to one embodiment of the invention and the exploded perspective view of the second cooling end 400 structures.
At first, locking cap 280 can be arranged on the both ends of the second pipe 240.Locking cap 280 prevents from being wrapped in heater wire 270 landings on the outer peripheral face of the first pipe 220.
Locking cap 280 forms has the cylindric of specific length.Locking cap 280 forms with ring-type, and it has at one end can be close to it after inboard insertion the second pipe 240, and the other end can seal the size that is formed on the space 244 between the first pipe the 220 and second pipe 240.Locking cap 280 is arranged on the second pipe end of 240, and an end that then is wrapped in the heater wire 270 on the outer peripheral face of the first pipe 220 contact with locking cap 280 and mobile being obstructed, and drop to the outside thereby can't manage 220 and second from first between managing 240.
Locking cap 280 is preferably formed by stainless steel (SUS) material, so that the heater wire that the power supply that will connect from the outside can contact with locking cap 280 270 is connected.
First the pipe 220 by locking cap 280 central authorities and extend outward, be formed with screw thread on the periphery of institute extension, make with portion of terminal 500 described later to be connected easily.
The end of the first cooling end 300 cooling heater 200a.The first cooling end 300 utilizes the end of water quench heater 200a, i.e. cooling consists of the end of the 3rd pipe 260 of heater 200a, thereby can prevent that the 3rd pipe 260 is by fire damage.
The second cooling end 400 flows into refrigerating gas and is formed in the second space of managing between the 240 and the 3rd pipe 260.Cooling can be used air, helium, nitrogen, argon gas with gas.Cooling is preferably normal temperature with the temperature of gas, still, also can use as required to be cooled to the following gas of normal temperature.
The first cooling end 300 and the second cooling end 400 can be uniformly set on the two ends of the 3rd pipe 260 that consists of heater 200a.
Below, the structure of the first cooling end 300 is described.
The first cooling end 300 utilizes the end of water quench the 3rd pipe 260 of being supplied with by the outside.The first cooling end 300 is arranged on the both ends of the 3rd pipe 260 that consists of heater 200a.
The first cooling end 300 can and be arranged on cooling water on the side of the first main body 310 by the first main body 310 and flow into pipe 320 and cooling water flow out of pipe 330 and consist of.
The first main body 310 is accepted from the cooling water of outside supply.Be formed with the space of regulation in the inside of the first main body 310.The first main body 310 forms ring-type, is fixed on the cavity 100 by flange 340 described later in order to make it, and interior all diameters of its outer circumference diameter and flange 340 are suitable, and the outer circumference diameter of interior all diameters of the first main body 310 and the 3rd pipe 260 is suitable.
Because an end of the first main body 310 is close on the outer wall of chamber 100, therefore preferably dispose O type ring 312 to prevent Leakage Gas etc. at the face of being close to chamber 100.
Cooling water flows into pipe 320 and cooling water flow out of pipe 330 and can make the cooling water inflow and flow out the first main body 310 inner spaces, thereby cools off the end of the 3rd pipe 260.Cooling water flows into pipe 320 and cooling water flow out of pipe 330 and can separate the regulation angular distance to the central shaft of the first main body 310 and arrange.
On the both ends of the heater 200a that is provided with the first cooling end 300, can be provided with the second cooling end 400, so that the space 264 that cooling is managed between 260 with the second pipe the 240 and the 3rd of gas flow heater 200a.
Below, the structure of the second cooling end 400 is described.
The second cooling end 400 is made of the second main body 410 and the flue 420 of ring-type, and wherein, the inside of this second main body 410 is formed with the space, and this flue 420 is arranged on a side of the second main body 410, and is connected with the spaces that form in the second main body 410 inside.
One end of the second main body 410 opens wide, in order to can communicate with the space 264 that forms between the second pipe the 240 and the 3rd pipe 260.Therefore, the cooling that flows into by flue 420 can flow in the space 264 that forms between the second pipe the 240 and the 3rd pipe 260 by the second main body 410 with gas, and discharges to the outside by the second main body 410 after the cooling again.
The second cooling end 400 is separately positioned on the two ends of the 3rd pipe 260, therefore, when using gas by the flue 420 supply coolings of the second cooling end 400 on the end that is arranged on the 3rd pipe 260, cooling, can be discharged through the blast pipe 420 that is arranged on the second cooling end 400 on the 3rd pipe 260 other ends through after the space 264 that forms between the second pipe the 240 and the 3rd pipe 260 with gas again.
Below, the setting up procedure of the first cooling end 300 and the second cooling end 400 is described.
The first cooling end 300 can be close on the exterior face of chamber 100 and is fixed by flange 340.At this moment, preferably make the first cooling end 300 can be fixed on easily mode on chamber 100 outer walls.Therefore, in order to fix easily the first cooling end 300 by flange 340, the structure that an end of an end of flange 340 and the first main body 310 is blocked mutually.
For the stationary state that makes the first cooling end 300 and the 3rd pipe 260 under the state that is fixed on chamber 100 at the first cooling end 300 by flange 340 becomes firm, the O type ring 352 that can in be formed at the first main body 310 and the 3rd space of pipe between 260, dispose lasso (collar) 350 and be configured in lasso 350 two ends, and can dispose heater lid 360 at an end of lasso 350.
Issuable slit between lasso 350 and O type ring 352 sealing the first main bodys 310 and the 3rd pipe 260, thus can prevent that gas from flowing into chamber 100 inside, therefore, can keep the vacuum state of chamber 100 inside easily.
Arrange after the first cooling end 300, the second main body 410 is arranged on the first pipe 220 ends of extending by locking cap 280, and the end screw at the first pipe 220 connects portion of terminal 500 described later, and the portion of terminal 500 that connects is close on the end of the second main body 410, thereby fixes the second cooling end 400.In order to fix the second cooling end 400, heater lid 360 be connected main body 410 also preferred bolt connect.
Below, the setting up procedure of portion of terminal 500 and insulation division 600 is described.
Figure 14 is that expression is arranged on portion of terminal 500 on the heater 200a end that relates to according to one embodiment of the invention and the exploded perspective view of insulation division 600 structures.
Portion of terminal 500 structures are described.
Portion of terminal 500 can be made of contact tube 510 and the first hold-down nut 520.
Figure 15, Figure 16 and Figure 17 are the schematic diagrames of contact tube 510 structures that relate to according to one embodiment of the invention.
With reference to Figure 15, Figure 16 and Figure 17, an end of contact tube 510 contacts with the end of locking cap 280, and is connected with external power cord.Contact tube 510 can be connected with the end screw of the first pipe 220.In order to make easily locking cap 280 pluggeds, contact tube 510 can be formed by the SUS material the same with locking cap 280.The power line that is connected with contact tube 510 can be connected with a side of contact tube 510 by welding, also can connect between the first hold-down nut 520 described later and contact tube 510 by the end that makes power line.
In order to keep the connection status of contact tube 510 and locking cap 280, the first hold-down nut 520 is pressed an end of contact tube 510.The first hold-down nut 520 engages with the end screw of the first pipe 220.The first hold-down nut 520 can be formed by quartzy material.Because the first hold-down nut 520 has same structure with general nut, therefore omits its detailed icon.
The schematic diagram of Figure 18 and Figure 19 the first protection nut 530 structures that to be expression relate to according to one embodiment of the invention.And, the schematic diagram of Figure 20, Figure 21 and Figure 22 the second protection nut 540 structures that to be expression relate to according to one embodiment of the invention.
The first protection nut 530 and the second protection nut 540 can prevent from being subject to external impact so that contact tube 510 or the first pipe 220 damaged under the state of the end that contact tube 510 is combined in the first pipe 220.The first protection nut 530 and the second protection nut 540 can be arranged between locking cap 280 and the insulator cap 610 and center on the outside of contact tube 510.
Figure 23, Figure 24 and Figure 25 are the schematic diagrames of insulator cap 610 structures that relate to according to one embodiment of the invention of expression.
With reference to Figure 23, Figure 24 and Figure 25, insulator cap 610 plays the power supply that is switched to contact tube 510 and the effect of exterior insulation of making.Contact tube 510 be connected after hold-down nut 520 and the first pipe end of 220 be connected, insulator cap 610 can be managed 220 end screw and engages with first.At this moment, in the space that the inside that preferably makes contact tube 510 and the first hold-down nut 520 be located at insulator cap 610 forms, and inner circumferential surface separates with contact tube 510 and the first hold-down nut 520.
Form porosely 620 in a side of insulator cap 610, can make the contact tube 510 to insulator cap 610 inside provide the power line of power supply to pass through.The insulator cap 610 preferred quartz that utilize are made.
After insulator cap 610 was set on the first pipe 220, the second hold-down nut 630 can be kept the connection status of insulator cap 610.The second hold-down nut 630 can be arranged on the terminal part of the first pipe 220.
Have the first cooling end 300 and the second cooling end 400, portion of terminal 500 and the insulation division 600 that as above consist of and can carry out following action.
The substrate that utilizes a plurality of heater 200a heating to be loaded in the chamber 100 is heat-treated.The power supply of power supply is powered to the heater wire 270 of heater 200a by portion of terminal 500 in order to make heater 200a heating, thereby makes sustainable the carrying out of action of heater 200a, and can prevent power supply leaky in the Power supply process by insulation division 600.
Start in the process that heater 200a heat-treats, utilize the first cooling end 300 on the two ends that are arranged on heater 200a, make cooling water flow into the two ends of heater 200a, thus the end of cooling heater 200a.
After finishing heat treatment step, the second cooling end 400 that utilization is arranged on the heater 200a two ends makes cooling flow through by the space 264 in the heater 200a with gas, then can reduce rapidly the temperature of heater 200a self, and then can reduce rapidly the temperature of chamber 100 inside.Therefore, in order to unload carried base board 10 needs the temperature of chamber 100 inside is reduced to below the set point of temperature and the required time after can the shortening heat treatment process finishing according to annealing device 1 of the present invention and heater 200a, thus can significantly improve when making flat-panel monitor and solar cell the productivity ratio of indispensable heat treatment step.
On the other hand, owing to continue to use heater 200a to be damaged by the some pipes in the first pipe the 220, second pipe the 240 or the 3rd pipe 260.Need to replace the pipe of damage in order to proceed heat treatment, replace as follows.
The situation of replacing the first pipe the 220 and second pipe 240 is as follows.
At first, take insulation division 600 apart.Then, be arranged on portion of terminal 500 on the first pipe end of 220 because contact tube 510 is connected with the first pipe 220 screws, therefore, the contact tube 510 of removing the first pipe 220 two ends is removed the fixing of the first pipe 220, and then can replace first and manage 220.Afterwards, take locking cap 280 and the second cooling end 400 apart, then can separate the second pipe 240.As mentioned above, will after the pipe that the first pipe the 220 or second pipe need in 240 to replace is replaced by new pipe, get final product according to above-mentioned opposite sequence assembling of taking apart.
The situation of replacing the 3rd pipe 260 is as follows.
At first, the step of removing portion of terminal 500 and the second cooling end 400 in order to replace the first pipe the 220 and second pipe 240 is same as described above, so detailed.
Under the state that portion of terminal 500 and the second cooling end 400 are removed, to fixing also being disengaged of the 3rd pipe 260 ends, therefore, under this state, take lasso 350, O type ring 352 and heater lid 360 apart, then the 3rd pipe 260 can be replaced by new pipe.When replacing the operation of the 3rd pipe 260, also can use the method that the first main body 310 is fixed on the flange 340 of chamber 100 of taking apart, but because the operations of flange 340 being arranged point-blank when flange 340 is set to chamber 100 two ends again need the long period, therefore had better not take flange 340 apart.
The 3rd pipe 260 is replaced with after the new pipe, assembles and finish heater 200a according to above-mentioned opposite sequence of taking order apart.
Therefore, heater 200a of the present invention in some situations about sustaining damage, can only replace that pipe that sustains damage in the pipe that consists of heater 200a, so the repairing of heater and management become easy.
Figure 26 and Figure 27 are cross-sectional perspective view and the sectional views that represents the heater 200b structure that relates to according to another embodiment of the present invention.As a reference, in Figure 26 and Figure 27, because shape and the structure of the both ends side of heater 200b are identical, therefore for a convenient end side that only illustrates heater 200b.
As shown in the figure, heater 200b is long bar-shaped of length on the whole, but is not limited thereto, and can carry out multiple variation according to the pattern of the batch-type annealing device that heater was suitable for.
With reference to Figure 26 and Figure 27, heater 200b comprises that having first of specific length manages 220b, has specific length and manage the heater 270b that second of 220b manages 240b, is inserted into the first pipe 220b inside around first.
Because the first pipe 220b and the second pipe 240b all are applicable to annealing device, therefore the material of the first pipe 220b and the second pipe 240b preferably by the high material of fusing point for example quartz consist of.
First the pipe 220b and second the pipe 240b length in fact all identical, and preferred first the pipe 220b and second the pipe 240b coaxial.The first pipe 220b preferred external diameter is 10mm, internal diameter roughly about 6mm, thickness 2mm roughly.The second pipe 240b is arranged to manage the shape that 220b has certain interval and centers on the first pipe 220b with first.The second pipe 240b preferred external diameter is 18mm, internal diameter roughly about 14mm, thickness 2mm roughly.Between the first pipe 220b and the second pipe 240b, form have 2mm roughly between left and right every the space 246b that vacates.
Inside at the first pipe 220b is inserted with heater 270b.Heater 270b preferably has bar-shaped, but is not limited thereto.The material of heater 270b is preferably kanthal.
When heater 270b is inserted into the first pipe 220b, the inner peripheral surface of the first pipe 220b and the outer peripheral face of heater 270b are separated.If this is because the inner peripheral surface of the first pipe 220b when contact with the outer peripheral face of heater 270b, because of the first difference of managing the thermal coefficient of expansion of 220b and heater 270b, worry first is managed 220b by breakage in heat treatment step.Therefore, the thermal coefficient of expansion of consideration heater 270b determines the partition distance between the first pipe 220b inner peripheral surface and the heater 270b outer peripheral face.
In the end of heater 270b contact tube 510b is set, so that can be to heater 270b plugged.Be not particularly limited by the connected mode between contact tube 510b heater 270b and the external power source (not shown), their description is omitted.
In addition, as mentioned above, because the end of heater 270b is connected with external power source, so connection means such as the wire (copper cash) between heater 270b and the external power source of needing protection etc., in order to avoid be subject to the heat of heater 270b generation.For this reason, can make the diameter of heater 270b have different values at the central portion of heater 270b with the end.
That is, with reference to Figure 27, preferably the area of section with heater 270b consists of heater 270b at both ends greater than the mode of central portion.Because the heat that heater 270b produces and the area of section of heater 270b are inversely proportional to, therefore strengthen the area of section of heater 270b end, the heat that then results from heater 270b end diminishes, thereby can prevent that linkage unit between heater 270b and external power source is because of the heat damaged.
Feature structure according to heater 200b of the present invention has space 244b for managing between the 240b at the first pipe 220b and second, so that the inside of heater 200b is crossed in cooling with gas flow.That is, the space 244b of heater 200b inside is crossed in cooling with gas flow.Cooling is not particularly limited by the method that space 244b flows through with gas, omits its detailed description.Cooling can be used air, helium, nitrogen, argon gas with gas.Cooling is preferably normal temperature with the temperature of gas, but also can use the gas that is cooled to not enough normal temperature as required.
In addition, the preferred heater 270b of heater 200b consists of from the first pipe 220b or the second pipe 240b detachable mounted mode.This formation has the following advantages, namely, in the process of using heater 200b, occur in the situation of the problems such as heater 270b disconnection, among the heater 200b that is installed on the annealing device separating heating body 270b can be placed under repair or replace, thereby can repair simply or replace the heater 200b that breaks down.
Figure 26 can use in the mode identical with the heater 200, the 200a that illustrate previously with heater 200b shown in Figure 27.In addition, the first cooling end 300, the second cooling end 400 and portion of terminal 500 and insulation division 600 can be set on the two ends of heater 200b, these structures and effect are identical with the front, therefore omit its detailed description.
As mentioned above, the present invention is illustrated by preferred embodiments and drawings, but be not limited to described embodiment, in the scope that does not break away from purport of the present invention, the technical staff with general knowledge of the technical field of the invention can carry out various deformation and change.Will be understood that this variation and modification belong in the scope of the present invention and appended claim.
Claims (16)
1. the heater of a batch-type annealing device is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, it is characterized in that,
Described heater comprises the space that can make cooling use the described heater of gas flow inside.
2. the heater of a batch-type annealing device is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, it is characterized in that described heater comprises:
The first pipe;
The second pipe has predetermined distance with described the first pipe and centers on described the first pipe; And
Heater is inserted into the inside of described the first pipe,
And, cooling is flow through by the space between described the first pipe and described the second pipe with gas.
3. heater as claimed in claim 2 is characterized in that,
The sectional area at the both ends of described heater is greater than the sectional area of central portion.
4. heater as claimed in claim 2 is characterized in that,
Described heater can separate from described the first pipe or described the second pipe.
5. the heater of a batch-type annealing device is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, it is characterized in that described heater comprises:
The first pipe;
The coil form heater wire is wrapped on the outer peripheral face of described the first pipe and arranges; And
The second pipe has predetermined distance with described the first pipe and centers on described the first pipe,
And, cooling is flow through with the central space of gas by described the first pipe.
6. the heater of a batch-type annealing device is applicable to the batch-type annealing device that can heat-treat a plurality of substrates simultaneously, it is characterized in that described heater comprises:
The first pipe;
The coil form heater wire is wrapped on the outer peripheral face of described the first pipe and arranges;
The second pipe has predetermined distance with described the first pipe and centers on described the first pipe; And
The 3rd pipe has predetermined distance with described the second pipe and centers on described the second pipe,
And, make and cool off with gas by the central space of described the first pipe and at least one the spatial flow mistake in the space between described the second pipe and described the 3rd pipe.
7. such as claim 5 or 6 described heaters, it is characterized in that,
The spacing of described heater wire is identical with location independent ground on described the first pipe, perhaps changes according to the position on described the first pipe.
8. heater as claimed in claim 6 is characterized in that,
The first pipe that is wound with described coil form heater wire can separate from described the second pipe or described the 3rd pipe.
9. heater as claimed in claim 6 is characterized in that,
At the two ends of described the 3rd pipe, be provided with the first cooling end that flows through of cooling water that makes described the 3rd pipe of cooling.
10. heater as claimed in claim 9 is characterized in that,
At the two ends of described the 3rd pipe, also be provided with the second cooling end that cooling is crossed by the spatial flow between described the second pipe and described the 3rd pipe with gas.
11. heater as claimed in claim 9 is characterized in that,
Described the first cooling end comprises:
Inside is formed with first main body in space;
The cooling water that makes cooling water flow into the inner space of described the first main body flows into pipe; And
Make the inner space that flow into described the first main body cooling water flow out of cooling water flow out of pipe.
12. heater as claimed in claim 10 is characterized in that,
Described the second cooling end comprises:
Be formed with second main body in space in inside; And
The flue that is connected with the inner space of described the second main body,
Wherein, the inner space of described the second main body with described second the pipe and described the 3rd pipe between the space be connected.
13. heater as claimed in claim 6 is characterized in that, also comprises:
Portion of terminal to described heater wire supply power; And
The insulation division that described portion of terminal is insulated.
14. heater as claimed in claim 13 is characterized in that,
Also comprise the end that is arranged on described the second pipe and the locking cap that is connected with described heater wire.
15. heater as claimed in claim 13 is characterized in that,
Described portion of terminal comprises:
Be arranged on the contact tube that described the first pipe is upper and be connected with the power supply of outside; And
Make the hold-down nut of the locking cap fluid-tight engagement of described contact tube and described heater.
16. heater as claimed in claim 13 is characterized in that,
Described insulation division comprises that inside is formed with the space and around the insulator cap of described portion of terminal,
Side at described insulator cap forms porose.
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080069331A KR101016061B1 (en) | 2008-07-16 | 2008-07-16 | Heater For Heat Treatment Apparatus |
| KR10-2008-0069330 | 2008-07-16 | ||
| KR1020080069329A KR101016048B1 (en) | 2008-07-16 | 2008-07-16 | Batch Type Heat Treatment Apparatus |
| KR10-2008-0069329 | 2008-07-16 | ||
| KR10-2008-0069331 | 2008-07-16 | ||
| KR1020080069330A KR101016058B1 (en) | 2008-07-16 | 2008-07-16 | Heater For Heat Treatment Apparatus |
| KR10-2008-0110814 | 2008-11-10 | ||
| KR1020080110814A KR101009990B1 (en) | 2008-11-10 | 2008-11-10 | Heater |
| KR10-2008-0110813 | 2008-11-10 | ||
| KR1020080110813A KR101016064B1 (en) | 2008-11-10 | 2008-11-10 | Heater |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980122777.2A Division CN102067294B (en) | 2008-07-16 | 2009-07-16 | Batch-type heat treatment device and be applicable to the heater of this annealing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102983091A true CN102983091A (en) | 2013-03-20 |
Family
ID=41550851
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980122777.2A Active CN102067294B (en) | 2008-07-16 | 2009-07-16 | Batch-type heat treatment device and be applicable to the heater of this annealing device |
| CN201510556057.4A Active CN105140157B (en) | 2008-07-16 | 2009-07-16 | Batch-type heat treatment device and the heater suitable for the annealing device |
| CN 201210356983 Pending CN102983091A (en) | 2008-07-16 | 2009-07-16 | Heater of batch-type heat treatment device |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980122777.2A Active CN102067294B (en) | 2008-07-16 | 2009-07-16 | Batch-type heat treatment device and be applicable to the heater of this annealing device |
| CN201510556057.4A Active CN105140157B (en) | 2008-07-16 | 2009-07-16 | Batch-type heat treatment device and the heater suitable for the annealing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP5973728B2 (en) |
| CN (3) | CN102067294B (en) |
| TW (1) | TWI508178B (en) |
| WO (1) | WO2010008211A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115077211A (en) * | 2021-03-11 | 2022-09-20 | 韩国光洋热电系统有限公司 | Exhaust duct integrated heater unit for heat treatment furnace |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011136604A2 (en) * | 2010-04-30 | 2011-11-03 | 주식회사 테라세미콘 | Substrate treating apparatus |
| KR101157192B1 (en) * | 2010-08-31 | 2012-06-20 | 주식회사 테라세미콘 | Batch type appartus for processing a substrate |
| KR101306751B1 (en) * | 2011-04-29 | 2013-09-10 | 주식회사 테라세미콘 | Holder for supporting substrate and apparatus for processing substrate using the same |
| KR101155813B1 (en) * | 2011-08-24 | 2012-06-12 | (주)써모니크 | Graphite furnace |
| KR101435454B1 (en) * | 2012-04-27 | 2014-08-28 | 주식회사 테라세미콘 | Apparatus for processing substrate |
| KR101982725B1 (en) * | 2012-12-26 | 2019-05-27 | 주식회사 탑 엔지니어링 | Heating Assembly for Substrate Thermal Treatment Device |
| KR101982724B1 (en) * | 2012-12-26 | 2019-05-27 | 주식회사 탑 엔지니어링 | Thermal Treatment Device for Substrate |
| KR101557037B1 (en) * | 2013-08-14 | 2015-10-02 | (주) 예스티 | Heat processing apparatus for large glass substrate |
| KR101527158B1 (en) * | 2013-10-24 | 2015-06-09 | 주식회사 테라세미콘 | Batch type apparatus for processing substrate |
| KR101479224B1 (en) | 2013-12-09 | 2015-01-05 | 포스코에너지 주식회사 | Thin plate mica heater |
| TWI698944B (en) * | 2013-12-23 | 2020-07-11 | 南韓商圓益Ｉｐｓ股份有限公司 | Batch type apparatus for processing substrate |
| KR102117421B1 (en) * | 2014-05-12 | 2020-06-02 | 주식회사 제우스 | Heater fixing device and substrate heat tretment apparatus using it |
| KR101753376B1 (en) | 2015-08-24 | 2017-07-04 | 주식회사 하이원시스 | Pre-heater including 4-direction sliding doors on ceiling |
| JP2019027623A (en) * | 2017-07-26 | 2019-02-21 | 株式会社Ｓｃｒｅｅｎホールディングス | Heating device and heating method |
| JP2019029102A (en) * | 2017-07-26 | 2019-02-21 | 株式会社Ｓｃｒｅｅｎホールディングス | Heating apparatus |
| TWI709203B (en) * | 2018-09-11 | 2020-11-01 | 大陸商北京北方華創微電子裝備有限公司 | Chamber cooling device and semiconductor processing equipment |
| WO2020112608A1 (en) * | 2018-11-30 | 2020-06-04 | Lam Research Corporation | Ceramic pedestal with multi-layer heater for enhanced thermal uniformity |
| WO2020241488A1 (en) * | 2019-05-31 | 2020-12-03 | 株式会社九州日昌 | Heating device and heating method |
| JP7079044B2 (en) * | 2019-05-31 | 2022-06-01 | 株式会社九州日昌 | Heating device and heating method |
| JP2021197448A (en) * | 2020-06-15 | 2021-12-27 | 光洋サーモシステム株式会社 | Thermal treatment device |
| US20220397354A1 (en) * | 2021-06-09 | 2022-12-15 | Watlow Electric Manufacturing Company | Cold conduit insulation device |
| CN114485170B (en) * | 2021-12-27 | 2024-04-30 | 江苏邑文微电子科技有限公司 | Heating system of rapid annealing furnace and temperature control method |
| KR102508123B1 (en) * | 2022-10-28 | 2023-03-10 | (주)삼양세라텍 | Heat treatment apparatus |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5548400Y2 (en) * | 1974-08-15 | 1980-11-12 | ||
| JPS5996691A (en) * | 1982-11-24 | 1984-06-04 | 東レ株式会社 | Resistance heating furnace |
| JPS6162395U (en) * | 1984-09-28 | 1986-04-26 | ||
| JPS63137416A (en) * | 1986-11-29 | 1988-06-09 | Furendotetsuku Kenkyusho:Kk | Vacuum heat insulating furnace |
| JPH0641355Y2 (en) * | 1988-02-16 | 1994-10-26 | 富士電波工業株式会社 | Water-cooled electrode for electric furnace |
| JPH0379985A (en) * | 1989-08-22 | 1991-04-04 | Deisuko Haitetsuku:Kk | Controlling method for temperature of electric furnace |
| JPH05290953A (en) * | 1992-04-10 | 1993-11-05 | Matsushita Electric Ind Co Ltd | Electric heating device |
| KR100203782B1 (en) * | 1996-09-05 | 1999-06-15 | 윤종용 | Heat treatment apparatus for semiconductor wafer |
| JP3844274B2 (en) * | 1998-06-25 | 2006-11-08 | 独立行政法人産業技術総合研究所 | Plasma CVD apparatus and plasma CVD method |
| JP3058282U (en) * | 1998-10-07 | 1999-06-18 | 株式会社八光電機製作所 | Cartridge heater with cooling function |
| JP3929239B2 (en) * | 2000-12-06 | 2007-06-13 | 株式会社ノリタケカンパニーリミテド | Far-infrared thin heater and substrate heating furnace |
| JP2002221394A (en) * | 2001-01-24 | 2002-08-09 | Showa Mfg Co Ltd | Heating device for electronic component |
| JP2002289549A (en) * | 2001-03-28 | 2002-10-04 | Hitachi Kokusai Electric Inc | Wafer treatment device |
| TWI232509B (en) * | 2001-07-25 | 2005-05-11 | Tokyo Electron Ltd | Processing apparatus and processing method |
| JP4262908B2 (en) * | 2001-08-10 | 2009-05-13 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
| JP3667270B2 (en) * | 2001-10-12 | 2005-07-06 | 松下電器産業株式会社 | Substrate heat treatment method and furnace equipment therefor |
| JP3575009B2 (en) * | 2001-12-03 | 2004-10-06 | 坂口電熱株式会社 | Heater terminal equipment for heating furnace |
| JP2003194478A (en) * | 2001-12-26 | 2003-07-09 | Koyo Thermo System Kk | Heat treatment device |
| KR100498609B1 (en) * | 2002-05-18 | 2005-07-01 | 주식회사 하이닉스반도체 | Batch type atomic layer deposition equipment |
| JP2005056725A (en) * | 2003-08-06 | 2005-03-03 | Nikko Materials Co Ltd | Heating element made of mosi2 and its manufacturing method |
| JP2004179672A (en) * | 2003-12-12 | 2004-06-24 | Hitachi Kokusai Electric Inc | Substrate heater and method for forming semiconductor circuit |
| JP3917994B2 (en) * | 2004-08-24 | 2007-05-23 | 株式会社石井表記 | Coating film drying oven |
| JP4734885B2 (en) * | 2004-10-08 | 2011-07-27 | ウシオ電機株式会社 | Heating unit |
| JP2006112762A (en) * | 2004-10-18 | 2006-04-27 | Tdk Corp | Baking furnace |
| JP4530896B2 (en) * | 2005-03-31 | 2010-08-25 | 株式会社ノリタケカンパニーリミテド | Plate type far infrared heater for vacuum heating furnace |
| JP2007200798A (en) * | 2006-01-30 | 2007-08-09 | Matsushita Electric Ind Co Ltd | Exothermic formation, exothermic unit, and heating device |
| JP2008028305A (en) * | 2006-07-25 | 2008-02-07 | Hitachi Kokusai Electric Inc | Substrate processing device |
| KR100817400B1 (en) * | 2006-11-09 | 2008-03-27 | 권상환 | Heat treatment equipment |
-
2009
- 2009-07-06 TW TW098122760A patent/TWI508178B/en active
- 2009-07-16 JP JP2011518650A patent/JP5973728B2/en active Active
- 2009-07-16 CN CN200980122777.2A patent/CN102067294B/en active Active
- 2009-07-16 CN CN201510556057.4A patent/CN105140157B/en active Active
- 2009-07-16 WO PCT/KR2009/003909 patent/WO2010008211A2/en active Application Filing
- 2009-07-16 CN CN 201210356983 patent/CN102983091A/en active Pending
-
2014
- 2014-03-06 JP JP2014043704A patent/JP2014146815A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115077211A (en) * | 2021-03-11 | 2022-09-20 | 韩国光洋热电系统有限公司 | Exhaust duct integrated heater unit for heat treatment furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI508178B (en) | 2015-11-11 |
| WO2010008211A2 (en) | 2010-01-21 |
| CN105140157B (en) | 2018-05-29 |
| CN105140157A (en) | 2015-12-09 |
| JP2014146815A (en) | 2014-08-14 |
| WO2010008211A3 (en) | 2010-03-25 |
| JP2011528501A (en) | 2011-11-17 |
| CN102067294B (en) | 2016-10-19 |
| TW201007847A (en) | 2010-02-16 |
| JP5973728B2 (en) | 2016-08-23 |
| CN102067294A (en) | 2011-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102983091A (en) | Heater of batch-type heat treatment device | |
| CN101371331B (en) | Magnetic annealing tool heat exchange system and processes | |
| TWI433254B (en) | Heating unit and substrate processing apparatus having the same | |
| US20120264072A1 (en) | Method and apparatus for performing reactive thermal treatment of thin film pv material | |
| KR101527158B1 (en) | Batch type apparatus for processing substrate | |
| CN103000552A (en) | Substrate cooling device, substrate cooling method and heat treatment apparatus | |
| KR101016064B1 (en) | Heater | |
| KR101009990B1 (en) | Heater | |
| KR101016061B1 (en) | Heater For Heat Treatment Apparatus | |
| KR101508752B1 (en) | Heat Treatment Chamber of Substrate with Easy Maintenance, and Heat Treatment Apparatus and Method of Substrate Having the Same | |
| KR20100083221A (en) | Roll to roll thin film metalizing system using hnb | |
| CN116206846A (en) | Superconducting magnet for magnetically controlled Czochralski single crystal and cooling method thereof | |
| CN1946871B (en) | Device equipped with cooling means and cooling method | |
| JP2001257253A (en) | Wafer processing device and method of manufacturing wafer | |
| KR101440955B1 (en) | Apparatus for heat processing of substrate | |
| CN102301461A (en) | Batch-type substrate-processing apparatus | |
| KR101016058B1 (en) | Heater For Heat Treatment Apparatus | |
| KR101561875B1 (en) | Heater assembly adopted temperature control system | |
| KR101544005B1 (en) | Improved Heat Treatment Chamber and Apparatus of Substrate | |
| CN217280694U (en) | High-vacuum ultra-low-temperature semiconductor wafer rapid cooling platform | |
| KR102068253B1 (en) | System of high-pressure CO2 vlave maniford box line | |
| KR20090115309A (en) | Heater apparatus and substrate processing equipment and substrate processing method using the same | |
| KR20170001990A (en) | Heater assembly adopted temperature control system | |
| CN114068369A (en) | High-vacuum ultra-low-temperature semiconductor wafer rapid cooling platform | |
| KR20060058867A (en) | Cassette chamber with a cooling system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130320 |