WO2010008211A2 - Batch-type heat treatment device and heater used therein - Google Patents

Batch-type heat treatment device and heater used therein Download PDF

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Publication number
WO2010008211A2
WO2010008211A2 PCT/KR2009/003909 KR2009003909W WO2010008211A2 WO 2010008211 A2 WO2010008211 A2 WO 2010008211A2 KR 2009003909 W KR2009003909 W KR 2009003909W WO 2010008211 A2 WO2010008211 A2 WO 2010008211A2
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WO
WIPO (PCT)
Prior art keywords
tube
heater
unit
cooling
heat treatment
Prior art date
Application number
PCT/KR2009/003909
Other languages
French (fr)
Korean (ko)
Other versions
WO2010008211A3 (en
Inventor
허관선
강호영
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080069331A external-priority patent/KR101016061B1/en
Priority claimed from KR1020080069330A external-priority patent/KR101016058B1/en
Priority claimed from KR1020080069329A external-priority patent/KR101016048B1/en
Priority claimed from KR1020080110813A external-priority patent/KR101016064B1/en
Priority claimed from KR1020080110814A external-priority patent/KR101009990B1/en
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN200980122777.2A priority Critical patent/CN102067294B/en
Priority to JP2011518650A priority patent/JP5973728B2/en
Publication of WO2010008211A2 publication Critical patent/WO2010008211A2/en
Publication of WO2010008211A3 publication Critical patent/WO2010008211A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

Definitions

  • the present invention relates to a batch heat treatment apparatus and a heater for a batch heat treatment apparatus. More specifically, a plurality of substrates can be heat treated uniformly at the same time over the entire surface of the substrate, and after the heat treatment process is completed, the batch heat treatment apparatus flowing gas for cooling to quickly cool the inside of the chamber of the heat treatment apparatus And a heater applied thereto.
  • Annealing devices used in the manufacture of semiconductors, flat panel displays, and solar cells are responsible for the heat treatment steps necessary for processes such as crystallization and phase change for a predetermined thin film deposited on a substrate such as a silicon wafer or glass. to be.
  • Representative annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate with polysilicon when manufacturing a liquid crystal display or thin film crystalline silicon solar cell.
  • a heat treatment apparatus capable of heating a substrate on which a predetermined thin film is formed should be provided. For example, at least 550 to 600 ° C. temperature is required for the crystallization of amorphous silicon.
  • the heat treatment apparatus includes a sheet type that can perform heat treatment on one substrate and a batch type that can perform heat treatment on a plurality of substrates.
  • Single leaf type has the advantage of simple configuration of the device, but the disadvantage of low productivity has been in the spotlight for the recent mass production.
  • the conventional heat treatment apparatus takes a lot of time in the step of unloading the substrate in the heat treatment apparatus after finishing the heat treatment process has a problem of lowering the productivity of the heat treatment process.
  • This decrease in productivity is due to the time that the temperature inside the chamber is lowered due to the need to unload the substrate after the heat treatment process is completed and the chamber is cooled below a certain temperature in order to prevent damage to the substrate due to thermal shock. It happens because it takes a lot.
  • an object of the present invention is to solve the problems of the prior art as described above, the substrate is heated by a plurality of heaters corresponding to the substrate when heat treatment of the plurality of substrates at the same time to uniform heat treatment over the entire surface of the substrate
  • An object of the present invention is to provide a batch heat treatment apparatus and a heater applied thereto.
  • An object of the present invention is to provide a batch heat treatment apparatus and a heater applied thereto.
  • the substrate loaded in the chamber is heated by a plurality of heaters corresponding to each substrate, thereby effecting uniform heat treatment over the entire surface of the substrate.
  • the heat treatment of the plurality of substrates can be performed at the same time, thereby improving the productivity of the flat panel display and the solar cell.
  • a space in which the cooling gas flows is provided inside the heater, so that the inside of the chamber of the heat treatment apparatus can be quickly cooled after the heat treatment process is completed, thereby reducing the time required for the unloading process of the substrate. Therefore, there is an effect of dramatically improving the productivity of the heat treatment process required for manufacturing flat panel displays or solar cells.
  • FIG. 1 and 2 are perspective views showing the configuration of a batch heat treatment apparatus according to an embodiment of the present invention.
  • Figure 3 is a perspective view showing the arrangement of the substrate, the main heater unit and the auxiliary heater unit of the batch heat treatment apparatus according to an embodiment of the present invention.
  • Figure 4 is a perspective view showing the configuration of the boat of the batch heat treatment apparatus according to an embodiment of the present invention.
  • Figure 5 is a perspective view showing the configuration of the gas supply pipe and the gas discharge pipe of the batch heat treatment apparatus according to an embodiment of the present invention.
  • FIG. 6 is a diagram illustrating a configuration of a gas supply pipe of FIG. 5.
  • FIG 7 and 8 are views showing the arrangement of the unit main heater of the batch heat treatment apparatus according to an embodiment of the present invention.
  • FIG. 9 is a perspective view showing the configuration of a heater according to an embodiment of the present invention.
  • 10 and 11 are a cross-sectional perspective view and a cross-sectional view showing the configuration of a heater according to another embodiment of the present invention.
  • FIG. 12 is a view illustrating a state in which the first and second cooling units, the terminal unit, and the insulating unit are installed at ends of the heater according to the exemplary embodiment of the present invention.
  • FIG. 13 is an exploded perspective view showing the configuration of the first and second cooling units provided at the end of the heater according to an embodiment of the present invention.
  • FIG. 14 is an exploded perspective view showing the configuration of a terminal portion and an insulation portion provided at the end of the heater according to an embodiment of the present invention.
  • FIG 15, 16 and 17 are views showing the configuration of a conductive tube according to an embodiment of the present invention.
  • FIGS. 18 and 19 are views showing the configuration of the first protective nut according to an embodiment of the present invention.
  • 20, 21 and 22 are views showing the configuration of a second protective nut according to an embodiment of the present invention.
  • 23 and 24 is a view showing the configuration of an insulating cap according to an embodiment of the present invention.
  • 26 and 27 are a sectional perspective view and a sectional view showing the configuration of a heater according to another embodiment of the present invention.
  • the heat treatment apparatus is characterized in that the plurality of substrates can be heat treated at the same time, each substrate is heated by a plurality of heaters corresponding to the respective substrates.
  • the heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the chamber for providing a heat treatment space for the plurality of substrates; A boat on which the plurality of substrates are loaded and supported; And a plurality of main heater units disposed at predetermined intervals along the stacking direction of the substrate, wherein the main heater units include a plurality of unit main heaters; It includes, The substrate is characterized in that disposed between the plurality of main heater unit.
  • the substrate may be loaded into the boat while seated in a substrate holder.
  • the plurality of unit main heaters may be disposed at regular intervals in parallel with the short side direction of the substrate.
  • the unit main heater of any main heater unit may be arranged to be aligned with the unit main heater of the nearest main heater unit of the any main heater unit.
  • the unit main heater of any of the main heater units may be disposed to deviate from the unit main heater of the nearest main heater unit of the any of the main heater units.
  • the apparatus may further include a plurality of auxiliary heater units for preventing heat loss inside the chamber.
  • the plurality of auxiliary heater units may include a first auxiliary heater unit disposed in parallel with a short side direction of the substrate, and a second auxiliary heater unit disposed in parallel with a long side direction of the substrate.
  • the first auxiliary heater unit includes a plurality of first unit auxiliary heaters disposed on both sides of the main heater unit in parallel with the unit main heater, and the second auxiliary heater unit includes the units on both sides of the main heater unit. It may include a plurality of second unit auxiliary heaters disposed perpendicular to the main heater.
  • the apparatus may further include a plurality of cooling tubes for cooling the inside of the chamber.
  • the cooling tube may be disposed between the plurality of unit main heaters along a short side direction of the substrate.
  • Cooling gas flows into the cooling tube, and the cooling tube may be made of a material having high thermal conductivity.
  • the gas supply unit may further include a gas supply unit supplying a process gas into the chamber and a gas discharge unit configured to discharge waste gas from the inside of the chamber.
  • the gas supply part may include a gas supply pipe in which a plurality of first gas holes through which process gas flows is formed, and the gas discharge part may include a gas discharge pipe in which a plurality of second gas holes into which waste gas is introduced is formed.
  • the heater according to the present invention is a heater that can be applied to a batch type heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater is a gas for cooling flows into the heater It is characterized by including a space.
  • the heater according to the present invention a heater that can be applied to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater comprises: a first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a heating element inserted into the first tube, wherein the cooling gas flows through a space between the first tube and the second tube.
  • the cross-sectional area of both ends of the heating element may be larger than the cross-sectional area of the central portion.
  • the heating element may be detachable from the first tube or the second tube.
  • a heater applicable to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates comprising: a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; And a second tube surrounding the first tube at a predetermined distance from the first tube, and allowing a cooling gas to flow through the central space of the first tube.
  • a heater that can be applied to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater comprises: a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a third tube surrounding the second tube with a predetermined distance from the second tube, wherein at least one of a central space of the first tube and a space between the second tube and the third tube Through the cooling gas can be flowed through.
  • the pitch of the heating wire may be the same or change depending on the position on the first tube regardless of the position on the first tube.
  • the first tube around which the coiled heating wire is wound may be detachable from the second tube or the third tube.
  • Both ends of the third tube may be provided with a first cooling unit for allowing a cooling water to cool the third tube flows.
  • Both ends of the third tube may further be provided with a second cooling unit for the cooling gas flows through the space between the second tube and the third tube.
  • the first cooling unit may include a first body having a space formed therein; A coolant inflow pipe configured to allow coolant to flow into an internal space of the first body; And a coolant outlet pipe configured to allow the coolant introduced into the inner space of the first body to flow out.
  • the second cooling unit includes a second body having a space formed therein; And a gas pipe connected to an inner space of the second body, and the inner space of the second body may be connected to a space between the second pipe and the third pipe.
  • It may further include a fixing cap installed at the end of the second tube and connected to the heating wire.
  • the terminal portion is provided on the first tube and the conductive pipe is connected to the external power; And it may include a fixing nut for the conductive tube is in close contact with the fixing cap of the heater.
  • the insulating part may have a space formed therein and include an insulating cap surrounding the terminal part, and a hole may be formed at one side of the insulating cap.
  • FIG. 1 and 2 are perspective views showing the configuration of a batch heat treatment apparatus 1 according to an embodiment of the present invention.
  • the external shape of the unit main heater 200 is schematically illustrated for convenience and shows the arrangement state of the unit main heater 200 in the batch heat treatment device 1.
  • FIG 3 is a perspective view illustrating an arrangement state of the substrate 10, the main heater unit 120, and the auxiliary heater unit 140 of the batch heat treatment apparatus 1 according to the exemplary embodiment.
  • the material of the substrate 10 loaded in the batch heat treatment apparatus 1 is not particularly limited, and the substrate 10 of various materials such as glass, plastic, polymer, silicon wafer, stainless steel, and the like may be loaded.
  • the substrate 10 of various materials such as glass, plastic, polymer, silicon wafer, stainless steel, and the like may be loaded.
  • a description will be given assuming a rectangular glass substrate that is most commonly used in the field of flat panel displays such as LCDs and OLEDs or thin film silicon solar cells.
  • the batch heat treatment apparatus 1 includes a cuboid-shaped chamber 100 that provides a heat treatment space, and a frame 102 that supports the chamber 100.
  • the material of the chamber 100 and the frame 102 is preferably stainless steel, but is not necessarily limited thereto.
  • One side of the chamber 100 is provided with a door 104 that opens and closes in the vertical direction to load the substrate 10 in the chamber 100.
  • the substrate 10 may be loaded into the chamber 100 using a substrate loading device (not shown) such as a transfer arm. Meanwhile, after the heat treatment is completed, the substrate 10 may be unloaded from the chamber 100 through the door 104.
  • the material of the door 104 is preferably stainless steel, but is not necessarily limited thereto.
  • the cover 106 may be opened and closed at the upper side of the chamber 100 for repair and replacement of the boat 108, the gas supply pipe 160, the gas discharge pipe 170, and the like, which are installed inside the chamber 100. To be installed.
  • the material of the cover 106 is preferably quartz, but is not necessarily limited thereto.
  • Cooling tube 180 for quickly cooling the inside 100 is installed.
  • the main heater unit 120 includes a unit main heater 200 at regular intervals in parallel with the short side direction of the substrate 10.
  • the unit main heater 200 is a rod-shaped heater having a conventional long length, and the heating element is inserted into the quartz tube, and the main heater unit 120 generates heat by receiving external power through terminals installed at both ends. It is a unit.
  • the main heater unit 120 includes 14 unit main heaters 200, but the number of unit main heaters 200 constituting the main heater unit 120 is loaded in the chamber 100. It may be variously changed according to the size of (10).
  • the plurality of main heater units 120 are disposed at regular intervals along the stacking direction of the substrate 10.
  • the substrate 10 is disposed between the plurality of main heater units 120.
  • the three substrates 10 are configured to be disposed between the four main heater units 120, but the number of the main heater units 120 is the number of the substrates 10 loaded in the chamber 100. It may vary depending on the number.
  • the substrate 10 is preferably disposed at the center between the main heater units 120. In addition, it is preferable that the substrate 10 and the main heater unit 120 are spaced apart from each other so as not to interfere with the behavior of the transfer arm of the substrate transfer device when loading the substrate 10 into the chamber 100.
  • the batch type heat treatment apparatus 10 is provided with a main heater unit 120 composed of 14 unit main heaters 200 that can cover the entire area of the substrate 10 on the upper and lower portions of the substrate 10.
  • the substrate 10 may be uniformly heat-treated by uniformly applying heat from the 28 unit main heaters 200 over the entire area.
  • the auxiliary heater unit 140 is disposed along the long side direction of the first auxiliary heater unit 140a and the substrate 10 arranged in parallel along the short side direction of the substrate 10.
  • Auxiliary heater unit 140b is included.
  • the first auxiliary heater unit 140a includes a plurality of first unit auxiliary heaters 150a disposed in parallel with the unit main heater 200 on both sides of the main heater unit 120.
  • the first auxiliary heater unit 140a includes eight first unit auxiliary heaters, one on each side of the four main heater units 120 so as to form the same row as the main heater unit 120.
  • 150a the number of first unit auxiliary heaters 150a constituting the first auxiliary heater unit 140a is changed in various ways depending on the number of main heater units 120 installed in the chamber 100. Can be.
  • the first auxiliary heater unit 140a is all 16 first unit auxiliary heaters 150a which are disposed on both sides of the four main heater units 120. It may be configured as.
  • the second auxiliary heater unit 140b includes a plurality of second unit auxiliary heaters 150b disposed on both sides of the main heater unit 120 to be perpendicular to the unit main heater 200.
  • the second auxiliary heater unit 140b includes four main heaters such that the main heater unit 120 is disposed between the plurality of second unit auxiliary heaters 150b constituting the second auxiliary heater unit 140b.
  • the second unit auxiliary heater 150b constituting the second auxiliary heater unit 140b is formed of all ten second unit heaters 150b which are arranged one by one on both sides of the unit 120. It may be variously changed according to the number of the main heater unit 120 installed in the (100).
  • the main heater unit 120 is preferably disposed in the center between the second auxiliary heater unit 140b.
  • first unit auxiliary heater 150a and the second unit auxiliary heater 150b it is preferable to use a rod-shaped heater having the same general length as the unit main heater 200 as described above.
  • the batch type heat treatment apparatus 1 includes a first auxiliary heater unit 140a composed of eight first unit auxiliary heaters 150a and ten second unit auxiliary heaters at four outer circumferences of the main heater unit 120.
  • the second auxiliary heater unit 140b including the 150b the four outer circumferences of the main heater unit 120 receive heat from 18 unit auxiliary heaters 150a and 150b so that the main heater unit 120 4
  • the outer circumferential portion can be in contact with the external environment to prevent heat loss inside the chamber 100 inevitably occurring.
  • FIG. 3 illustrates a case where two first unit auxiliary heaters 150a are disposed at both sides of the four main heater units 120.
  • the cooling tube 180 is disposed between the unit main heaters 200 constituting the main heater unit 120.
  • 52 cooling tubes 180 are installed between each of the 56 unit main heaters 200 constituting the four main heater units 120, but the number of the cooling tubes 180 is the chamber. According to the number of the main heater unit 120 and the unit main heater 200 installed in the 100 may be variously changed.
  • the cooling tube 180 does not necessarily need to be disposed between the unit main heaters 200, and the cooling tube 180 may be disposed between some unit main heaters 200 as long as the interior of the chamber 100 may be properly cooled. You can also omit the installation of.
  • the cooling tube 180 is installed in the batch type heat treatment apparatus 1, the heat inside the chamber 100 is conducted to the outside of the chamber 100 through the cooling tube 180 after the heat treatment is completed, and thus, the chamber 100.
  • the interior can be cooled quickly. If the interior of the chamber 100 can be rapidly cooled by the operation of the cooling pipe 180 because the inside of the chamber 100 may be cooled to a temperature lower than a predetermined temperature after the end of the heat treatment. The productivity of flat panel displays and solar cells can be greatly improved.
  • the material of the cooling tube 180 is preferably copper and stainless steel having high thermal conductivity.
  • the cooling gas or the cooling liquid is supplied into the cooling tube 180.
  • As the cooling gas air, helium, nitrogen, argon may be used. Water may be used as the cooling liquid.
  • the temperature of the cooling gas or the cooling liquid is preferably about room temperature, a gas or liquid cooled to a temperature below the normal temperature may be used, if necessary.
  • FIG 4 is a perspective view showing the configuration of the boat 108 of the batch heat treatment apparatus 1 according to an embodiment of the present invention.
  • a plurality of boats 108 for supporting the substrate 10 loaded into the chamber 100 are installed in the chamber 100.
  • the boat 108 is preferably installed to support the long side of the substrate 10.
  • six boats 108 are provided on both sides of the board 10 in the three long sides.
  • the boats 108 may be installed in a larger number than the boat 10 in order to stably support the board 10. It can be changed in various ways.
  • the material of the boat 108 is preferably quartz.
  • the substrate 10 is preferably loaded in the boat 108 while being mounted in the holder 12.
  • the heat treatment temperature reaches the softening temperature of the glass substrate during the heat treatment process, a warp phenomenon occurs in the downward direction of the substrate due to the weight of the substrate itself. .
  • heat treatment is performed while the substrate 10 is mounted on the holder 12.
  • FIG. 5 is a perspective view showing the configuration of the gas supply pipe 160 and the gas discharge pipe 170 of the batch heat treatment apparatus 1 according to an embodiment of the present invention.
  • 6 is a diagram illustrating a configuration of the gas supply pipe 160 of FIG. 5.
  • the chamber 100 has a rod-shaped gas supply pipe having a plurality of first gas holes 162 for discharging the atmosphere gas in order to supply the atmosphere gas for forming the heat treatment atmosphere into the chamber 100.
  • 160 and a plurality of rod-shaped gas discharge pipes 170 each including a plurality of second gas holes (not shown) through which waste gas used in the heat treatment atmosphere is introduced are provided.
  • the gas supply pipe 160 and the gas discharge pipe 170 are preferably provided to face the long side of the substrate 10. Nitrogen, argon, etc. are used for the heat processing atmosphere composition gas.
  • gas supply pipes 160 and four gas discharge pipes 170 are installed, but the number of the gas supply pipes 160 and the gas discharge pipes 170 is changed in various ways according to the size of the substrate 10. Can be.
  • the position of the first gas hole 162 formed in the gas supply pipe 160 may be as close to the substrate 10 as possible so that the injected atmospheric gas may directly contact the substrate 10. Therefore, the number of first gas holes 162 is preferably equal to the number of substrates 10 loaded in the chamber 100. The same applies to the second gas hole (not shown) formed in the gas discharge pipe 170.
  • FIG 7 and 8 are views showing the arrangement of the unit main heater 200 of the batch heat treatment apparatus 1 according to an embodiment of the present invention.
  • the arrangement of the unit main heaters 200 between the main heater units 120 may be variously changed as necessary.
  • FIG. 7 is a diagram illustrating an arrangement state of the unit main heaters 200 between the main heater units 120 employed in the present embodiment described with reference to FIGS. 1 and 2.
  • the unit main heater 200 constituting any one main heater unit 120a is the unit main heater 200 constituting the main heater unit 120b adjacent to the main heater unit 120a. It may be arranged to be aligned with.
  • the unit main heater 200 constituting any one main heater unit 120a includes the unit main heater constituting the main heater unit 120b adjacent to the corresponding main heater unit 120a. It may be disposed to deviate from 200.
  • the unit main heater 200 constituting the main heater unit 120a is aligned at an intermediate position between the unit main heaters 200 constituting the main heater unit 120b.
  • the heat treatment may be performed more uniformly over the entire area of the substrate 10 loaded in the chamber 100 by changing the arrangement state of the unit main heaters 200 between the main heater units 120.
  • the operator moves the door 104 installed on one side of the chamber 100 to the lower side to open.
  • the substrate 10 is mounted on the upper surface of the transfer arm (not shown) of the substrate transfer apparatus while being mounted on the holder 12, and the transfer arm is moved to load the substrate into the chamber 100.
  • the substrate 10 loaded into the chamber 100 is sequentially stacked on the boat 108 installed inside the chamber 100 as shown in FIG. 4. In this embodiment, three substrates 10 are stacked on the boat 108.
  • the door 104 is moved upward to isolate the interior of the chamber 100 from the external environment, and then the power is applied to the main heater unit 120. Allow heat treatment for (10) to proceed.
  • main heater units 120 installed in the chamber 100 are installed at positions spaced apart by a predetermined distance from the upper and lower portions of the substrate 10, and each main heater unit 120 has a predetermined interval 14 unit main heaters 200 are arranged, the heat is uniformly applied over the entire surface of the substrate 10 to perform a uniform heat treatment.
  • the chamber 100 Before actually performing the heat treatment, the chamber 100 is formed in a heat treatment atmosphere. To this end, an atmosphere gas such as nitrogen or argon is supplied into the chamber 100 through the gas supply pipe 160. The waste gas used for the heat treatment atmosphere composition is discharged to the outside of the chamber 100 through the gas discharge pipe 170 installed to face the gas supply pipe 160.
  • an atmosphere gas such as nitrogen or argon is supplied into the chamber 100 through the gas supply pipe 160.
  • the waste gas used for the heat treatment atmosphere composition is discharged to the outside of the chamber 100 through the gas discharge pipe 170 installed to face the gas supply pipe 160.
  • the chamber 100 is cooled quickly.
  • a cooling gas such as helium, nitrogen, and argon flows into the chamber 100 through the cooling tube 180.
  • the cooling gas flows through the inside of the chamber 100 and takes heat from the inside of the chamber 100 to drastically lower the temperature inside the chamber 100.
  • the heat treatment process is finally completed by opening the door 104 and unloading the substrate 10 from the chamber 100 using the transfer arm.
  • the unit main heater (hereinafter, referred to as a “heater”) constituting the main heater unit 120 may be configured as follows.
  • the heater 200 has a rod shape having a predetermined length.
  • the heater 200 includes a heating element 202 and a cover 204.
  • the heating element 202 is supplied with external power to generate heat for heat treatment of the substrate 10. It is preferable that the material of the heating element 202 is Kanthal.
  • the cover 204 protects the heating element 202.
  • the material of the cover 204 is preferably quartz.
  • first and second unit auxiliary heaters 150a and 150b may have the same shape and structure as the heater 200 illustrated in FIG. 9.
  • FIGS. 10 and 11 are cross-sectional perspective and sectional views showing the configuration of the heater 200a according to another embodiment of the present invention.
  • FIGS. 10 and 11 since the shape and structure of both end sides of the heater 200a are the same, only one end side of the heater 200a is illustrated for convenience.
  • the heater 200a has a long rod shape as a whole, but is not necessarily limited thereto, and may be variously changed according to the specifications of the batch heat treatment apparatus to which the heater is applied.
  • the heater 200a includes a first tube 220 having a predetermined length, a second tube 240 surrounding the outside of the first tube 220 while having a predetermined length, It comprises a coil-shaped hot wire 270 wound around the outer surface of the third tube 260 and the first tube 220 having a predetermined length and installed at regular intervals surrounding the outer side of the second tube 240. do.
  • the material of the first tube 220, the second tube 240, and the third tube 260 is that the first tube 220, the second tube 240, and the third tube 260 are all applied to the heat treatment apparatus. It is preferable that it is a material with high melting point, for example, quartz.
  • the lengths of the first tube 220, the second tube 240, and the third tube 260 are all substantially the same.
  • the length of the first tube 220 is greater than the length of the second tube 240 and the third tube 260 for connection with the conductive tube 510 of the terminal unit 500 to be described later. It may be as long as the length of the tube 510.
  • the first tube 220, the second tube 240 and the third tube 260 are preferably all coaxial, but if necessary, the first tube 220 and the second tube 240 is Although coaxial with each other, the third tube 260 may configure the heater so as not to have a coaxial with respect to the first tube 220 and the second tube 240.
  • the center axes of the first, second and third tubes 220, 240, and 260 constituting the heater 200a may be configured to coincide with each other, but the first and second tubes 220 may be in operation during the operation of the heater 200a. , 240 may occur and the first tube 220 or the second tube 240 may be damaged depending on the degree of deflection, so that the second tube 240 may be replaced with the third tube 260. It is preferable to be positioned below the center so that the deflection occurs during operation so that the third tube 260 can be contacted and supported.
  • the first tube 220 preferably has an outer diameter of about 10 mm, an inner diameter of about 6 mm, and a thickness of about 2 mm.
  • the first tube 220 itself has an empty space 224 in the center.
  • the heating wire 270 corresponding to the heating element is wound in a coil form on the outer circumferential surface of the first tube 220.
  • the material of the hot wire 270 is preferably any one of nichrome and Kanthal.
  • Kanthal is an alloy composed mainly of iron and has high electrical resistance. It is processed into wire and used as a heating element. It belongs to iron-chromium-aluminum system, and standard components include 23% chromium and 6% aluminum. It contains 2%.
  • the diameter of the hot wire 270 preferably has a range of 0.6 mm to 0.8 mm.
  • the pitch of the heating wire 270 is related to the amount of heat generated.
  • the heat generation amount of the heat wire 270 is small compared to the area of the large pitch. Therefore, in order to uniformly heat the substrate, the heat generation amount must be constant over the entire area of the heater 200a.
  • the pitch of the heating wire 270 is the same regardless of the position on the first tube 220. However, if necessary, the pitch of the heating wire 270 may be changed according to the position on the first tube 220.
  • the end side of the heater 200a is in contact with the external environment. It can compensate for the heat loss that occurs.
  • the fixing cap 280 may be installed to prevent the hot wire 270 from being separated.
  • the configuration of the fixed cap 280 will be described later.
  • the second tube 240 is installed in a form surrounding the first tube 220 while having a predetermined distance from the first tube 220.
  • the second tube 240 preferably has an outer diameter of about 18 mm, an inner diameter of about 14 mm, and a thickness of about 2 mm.
  • the third tube 260 is installed in a form surrounding the second tube 240 while having a predetermined distance from the second tube 240.
  • the third tube 260 is preferably configured to have an outer diameter of about 30 mm, an inner diameter of about 22 mm, and a thickness of about 4 mm.
  • An empty space 264 having an interval of about 2 mm is formed between the second tube 240 and the third tube 260.
  • a conductive tube 510 which will be described later to apply power to the heating wire 270 wound around the outer circumferential surface of the first tube 220.
  • the connection method between the heating wire 270 and the external power source (not shown) through the conductive tube 510 is not particularly limited and a detailed description thereof will be omitted.
  • the heater (200a) is preferably implemented so that the first tube 220 is wound around the heating wire 270 can be easily detached from the second tube 240 or the third tube (260). This is to separate only the first pipe 220 in which the heating wire 270 is wound from the heater 200a mounted on the heat treatment apparatus when a problem such as the heating wire 270 is cut off during the use of the heater 200a. By repairing or replacing, there is an advantage of simply repairing or replacing the defective heater 200a.
  • the heater (200a) has a basic configuration of the first tube 220, the second tube 240 and the third tube 260, but is not necessarily limited to this, and the third tube 260 to simplify the overall configuration May be omitted.
  • the structure of the heater which consists only of a 1st pipe
  • the heater 200a includes spaces 224 and 264 through which a cooling gas may flow into the heater 200a. Therefore, if the cooling gas flows through the spaces 224 and 264 of the heater 200a after the heat treatment process is completed in the heat treatment apparatus 1, the temperature of the heater 200a itself is rapidly lowered, and the temperature inside the chamber is further reduced. Can be dropped quickly. As a result, it is possible to shorten the time it takes to lower the temperature inside the chamber below a predetermined temperature for the unloading of the substrate 10 after the end of the heat treatment process, so that the productivity of the heat treatment process required for manufacturing flat panel displays and solar cells is reduced. Can greatly improve.
  • first and second cooling units 300 and 400 may be installed to cool the heater 200a.
  • the terminal unit 500 and the insulation unit 600 may be installed to operate the heater 200a.
  • FIG. 12 is a view illustrating a state in which the first and second cooling units 300 and 400, the terminal unit 500, and the insulation unit 600 are installed at ends of the heater 200a according to the exemplary embodiment of the present invention.
  • FIG. 13 is an exploded perspective view illustrating a configuration of the first and second cooling units 300 and 400 installed at the end of the heater according to the embodiment of the present invention.
  • the fixing cap 280 may be installed at both ends of the second tube 240.
  • the fixing cap 280 prevents the heating wire 270 wound around the outer circumferential surface of the first tube 220 to escape.
  • the fixing cap 280 is formed in a cylindrical shape having a predetermined length. Fixed cap 280 is formed so that one end can be in close contact with the second tube 240 is inserted into the inside, the other end is a space 244 formed between the first tube 220 and the second tube 240 It is formed in the shape of a ring that is large enough to be closed.
  • the fixing cap 280 is installed at the end of the second tube 240, one end of the heating wire 270 wound around the outer circumferential surface of the first tube 220 contacts the fixing cap 280 and is prevented from moving. Between the 220 and the second tube 240 can not escape to the outside.
  • the fixing cap 280 is preferably made of SUS material so that the power applied from the outside may be applied to the heating wire 270 in contact with the fixing cap 280.
  • the first tube 220 extends to the outside through the center of the fixing cap 280, the thread is formed on the outer periphery of the extended portion to facilitate the connection with the terminal portion 500 to be described later.
  • the first cooling unit 300 cools the end of the heater 200a.
  • the first cooling unit 300 cools an end portion of the heater 200a, that is, an end portion of the third tube 260 constituting the heater 200a by using the coolant, so that the third tube 260 is damaged. Can be prevented.
  • the second cooling unit 400 introduces the cooling gas into the space formed between the second tube 240 and the third tube 260.
  • the cooling gas air, helium, nitrogen, argon may be used.
  • the temperature of the gas for cooling is preferably about room temperature, but if necessary, a gas cooled to a temperature below room temperature may be used.
  • the first and second cooling units 300 and 400 may be equally installed at both ends of the third pipe 260 constituting the heater 200a.
  • the configuration of the first cooling unit 300 will be described.
  • the first cooling unit 300 cools an end portion of the third pipe 260 using cooling water supplied from the outside.
  • the first cooling unit 300 is installed at both ends of the third pipe 260 constituting the heater 200a.
  • the first cooling unit 300 may include a coolant inlet pipe 320 and a coolant outlet pipe 330 installed to one side of the first body 310 and the first body 310.
  • the first body 310 is supplied with cooling water from the outside.
  • the first body 310 has a predetermined space formed therein.
  • the first body 310 is formed in a ring shape, the outer circumferential diameter is formed to correspond to the inner circumferential diameter of the flange 340 to be fixed to the chamber 100 by the flange 340 to be described later, the first body
  • the inner diameter of the 310 may be formed at a level corresponding to the outer diameter of the third tube 260.
  • the O-ring 312 may be disposed on the surface closely contacting the chamber 100 to prevent gas leakage.
  • the coolant inlet pipe 320 and the coolant outlet pipe 330 may cool the end of the third pipe 260 by allowing the coolant to flow in and out of the space inside the first body 310.
  • the coolant inlet pipe 320 and the coolant outlet pipe 330 may be spaced apart from each other at a predetermined angular distance with respect to the central axis of the first body 310.
  • Cooling gas flows into the space 264 between the second tube 240 and the third tube 260 of the heater 200a at both ends of the heater 200a in which the first cooling unit 300 is installed.
  • the second cooling unit 400 may be installed.
  • the configuration of the second cooling unit 400 will be described.
  • the second cooling unit 400 is connected to a space formed inside the second body 410 by being installed at one side of the second body 410 and the second body 410 in a ring shape having a space formed therein.
  • the gas pipe 420 is formed.
  • One end of the second body 410 is open to allow flow to the space 264 formed between the second tube 240 and the third tube 260. Accordingly, the cooling gas introduced through the gas pipe 420 may be introduced into the space 264 formed between the second pipe 240 and the third pipe 260 through the second body 410, and may be cooled. Afterwards, it may be discharged to the outside through the second body 410 again.
  • the cooling gas is supplied through the gas pipe 420 of the second cooling unit 400 installed at one end of the third tube 260. After the gas for cooling passes through the space 264 formed between the second tube 240 and the third tube 260, the gas tube of the second cooling unit 400 installed at the other end of the third tube 260. May be exhausted through 420.
  • the first cooling unit 300 may be fixed to the outer surface of the chamber 100 by the flange 340. In this case, the first cooling unit 300 may be easily fixed to the outer wall of the chamber 100. Therefore, one end of the flange 340 and one end of the first body 310 is preferably configured to be caught by each other so that the first cooling unit 300 is easily fixed by the flange 340.
  • the flange 340 may be bolted to the outer wall of the chamber 100 in close contact with the outer wall of the chamber 100. If the first cooling unit 300 may be firmly fixed to the outside of the chamber 100, the fixing method of the flange 340 and the chamber 100 may be fixed in various ways in addition to the bolt fixing method.
  • the first main body 310 In order to secure the fixed state of the first cooling unit 300 and the third tube 260 in a state where the first cooling unit 300 is fixed to the chamber 100 by the flange 340, the first main body 310 is fixed. ) And an o-ring 352 disposed at both ends of the collar 350 and the collar 350 may be disposed as a space formed between the third tube 260 and one end of the collar 350.
  • the heater cover 360 may be disposed.
  • the collar 350 and the o-ring 352 may prevent the inflow of gas into the chamber 100 by closing a gap that may occur between the first body 310 and the third tube 260, It is easy to maintain the vacuum in the chamber 100.
  • the heater cover 360 may firmly fix the third tube 260 and the first body 310.
  • the heater cover 360 may be bolted to one end of the first body 310.
  • the outer circumference diameters of the collar 350 and the heater cover 360 are preferably formed to be in close contact with the inner circumferential surface of the first body 310.
  • the second body 410 is installed at the end of the first tube 220 extending through the fixing cap 280, the end of the first tube 220
  • the furnace is screwed to the terminal unit 500 to be described later, the connected terminal unit 500 is in close contact with one end of the second body 410, so that the second cooling unit 400 is fixed.
  • the heater cover 360 and the second body 410 may also be bolted.
  • FIG 14 is an exploded perspective view showing the configuration of the terminal unit 500 and the insulating unit 600 installed at the end of the heater 200a according to an embodiment of the present invention.
  • the configuration of the terminal unit 500 will be described.
  • the terminal unit 500 may be composed of a conductive pipe 510 and a first fixing nut 520.
  • one end of the conductive tube 510 is in contact with the end of the fixing cap 280 and the external power line is connected.
  • the conductive tube 510 may be screwed to the end of the first tube 220.
  • the conductive tube 510 may be formed of a SUS material such as the fixing cap 280 to facilitate the application of power to the fixing cap 280.
  • the power line connected to the conductive tube 510 may be connected to one side of the conductive tube 510 by welding, but the end of the power line may be positioned between the first fixing nut 520 and the conductive tube 510 which will be described later. You can also connect.
  • the first fixing nut 520 compresses one end of the conductive tube 510 so that the connection state between the conductive tube 510 and the fixing cap 280 is maintained.
  • the first fixing nut 520 is screwed to the end of the first tube 220.
  • the first fixing nut 520 may be formed of quartz material. Since the first fixing nut 520 has the same configuration as a general nut, a detailed illustration thereof will be omitted.
  • 18 and 19 are views showing the configuration of the first protective nut 530 according to an embodiment of the present invention.
  • 20, 21 and 22 are views showing the configuration of the second protective nut 540 according to an embodiment of the present invention.
  • the first and second protective nuts 530 and 540 are provided with an external impact in a state in which the conductive pipe 510 is coupled to the end of the first pipe 220 so that an external impact is applied to the conductive pipe 510 or the first pipe 220. To prevent damage.
  • the first and second protection nuts 530 and 540 may be installed to surround the outside of the conductive pipe 510 between the fixing cap 280 and the insulating cap 610.
  • the insulation unit 600 may be installed to prevent the power from leaking from the terminal unit 500 installed to apply the power to the hot wire 270 or the other conductor from contacting the terminal unit.
  • the configuration of the insulation unit 600 will be described.
  • the insulation unit 600 may include an insulation cap 610 and a second fixing nut 630.
  • 23, 24 and 25 are views showing the configuration of the insulating cap 610 according to an embodiment of the present invention.
  • the insulating cap 610 serves to insulate the power applied to the conductive tube 510 from the outside.
  • the insulating cap 610 may be screwed to the end of the first tube 220 after the conductive tube 510 and the first fixing nut 520 are connected to the end of the first tube 220.
  • the conductive tube 510 and the first fixing nut 520 are positioned in a space formed inside the insulating cap 610, and an inner circumferential surface thereof is spaced apart from the conductive tube 510 and the first fixing nut 520. It is desirable to be.
  • a hole 620 is formed at one side of the insulating cap 610, and a power line for applying power to the conductive tube 510 inside the insulating cap 610 may pass therethrough.
  • the insulating cap 610 is preferably manufactured using quartz.
  • the second fixing nut 630 allows the insulating cap 610 to be connected to the insulating cap 610 after the insulating cap 610 is installed in the first tube 220.
  • the second fixing nut 630 may be installed at the end of the first tube 220.
  • the first and second cooling units 300 and 400, the terminal unit 500, and the insulating unit 600 configured as described above may operate as follows.
  • Heat is performed by applying heat to the substrate loaded into the chamber 100 using a plurality of heaters 200a.
  • the power supplied for the heat generation from the heater 200a is supplied to the heating wire 270 of the heater 200a through the terminal unit 500 so that the operation of the heater 200a can be continuously performed and insulated while the power is supplied.
  • the leakage of power may be prevented by the unit 600.
  • the cooling water is introduced into both ends of the heater 200a by using the first cooling units 300 provided at both ends of the heater 200a to cool the end of the heater 200a. You can.
  • the heat treatment apparatus 1 and the heater 200a reduce the time taken to drop the temperature inside the chamber 100 below a predetermined temperature for the unloading of the substrate 10 after the heat treatment process is completed. Since it can shorten, productivity of the heat processing process required for manufacture of a flat panel display and a solar cell can be improved significantly.
  • damage to any one of the first tube 220, the second tube 240, and the third tube 260 may occur due to the continuous use of the heater 200a. In order to continue the heat treatment, the damaged tube needs to be replaced.
  • the insulation part 600 is disassembled.
  • the terminal portion 500 provided at the end of the first tube 220 removes the conductive tube 510 at both ends of the first tube 220.
  • the first tube 220 can be replaced.
  • the fixing cap 280 and the second cooling unit 400 are dismantled, the second tube 240 may be separated. As such, after replacing the tube requiring replacement of the first tube 220 or the second tube 240 with a new tube, it is assembled in the reverse order of dismantling.
  • the removal of the terminal unit 500 and the second cooling unit 400 for the replacement of the first tube 220 and the second tube 240 is the same as above, and thus a detailed description thereof will be omitted.
  • the fixing of the end of the third tube 260 is also released. In this state, the collar 350, the O-ring 352, and the heater cover 360 are removed. ), The third pipe 260 can be replaced with a new one.
  • a method of dismantling the flange 340 that fixes the first body 310 to the chamber 100 may be used, but the flange 340 may be replaced at both ends of the chamber 100. Since the installation of the flanges 340 takes a long time to align the flanges 340 with each other in a straight line, the flange 340 is preferably not dismantled.
  • the heater 200a is completed by assembling in the reverse order of the dismantling procedure.
  • the heater 200a of the present invention may replace only one damaged tube, thereby facilitating repair and management of the heater.
  • FIGS. 26 and 27 are a cross-sectional perspective view and a cross-sectional view showing the configuration of a heater 200b according to another embodiment of the present invention.
  • FIGS. 26 and 27 show only one end side of the heater 200b because the shape and structure of both end sides of the heater 200b are the same.
  • the heater 200b has a long rod shape as a whole, but is not necessarily limited thereto, and may be variously changed according to specifications of a batch heat treatment apparatus to which the heater is applied.
  • the heater 200b may include a first tube 220b having a predetermined length, a second tube 240b having a predetermined length, and a second tube 240b surrounding the first tube 220b. It is configured to include a heating element (270b) is inserted into the tube (220b).
  • the material of the first tube 220b and the second tube 240b is preferably a material having a high melting point, for example, quartz, since both the first tube 220b and the second tube 240b are applied to the heat treatment apparatus.
  • the lengths of the first tube 220b and the second tube 240b are substantially the same, and the first tube 220b and the second tube 240b may be coaxial.
  • the first tube 220b preferably has an outer diameter of about 10 mm, an inner diameter of about 6 mm, and a thickness of about 2 mm.
  • the second tube 240b is installed in a form surrounding the first tube 220b with a predetermined distance from the first tube 220b.
  • the second tube 240b preferably has an outer diameter of about 18 mm, an inner diameter of about 14 mm, and a thickness of about 2 mm.
  • An empty space 246b having an interval of about 2 mm is formed between the first tube 220b and the second tube 240b.
  • the heating element 270b is inserted into the first tube 220b.
  • the heating element 270b preferably has a rod shape, but is not necessarily limited thereto.
  • the material of the heating element 270b is preferably Kanthal.
  • the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b may be separated from each other. This is because if the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b come into contact with each other, the first tube 220b may be damaged due to a difference in thermal expansion coefficient between the first tube 220b and the heating element 270b during the heat treatment process. This is because there is concern. Therefore, the separation distance between the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b is preferably determined in consideration of the thermal expansion coefficient of the heating element 270b.
  • a conductive tube 510b is installed to apply power to the heating element 270b.
  • the connection method between the heating element 270b and the external power source (not shown) through the conductive tube 510b is not particularly limited, and a detailed description thereof will be omitted.
  • the connecting means between the heating element 270b and the external power source for example, a conductor (copper wire), etc.
  • the diameter of the heating element 270b may have different values at the center and the end of the heating element 270b.
  • the heating element 270b it is preferable to configure the heating element 270b such that the cross-sectional area of the heating element 270b is larger at both ends than the center portion. Since the amount of heat generated in the heat generating element 270b is inversely proportional to the cross-sectional area of the heat generating element 270b, increasing the cross-sectional area of the end portion of the heat generating element 270b decreases the amount of heat generated at the end of the heat generating element 270b, and thus the heat generating element 270b and the outside.
  • the connection means between the power sources can be prevented from being damaged by heat.
  • the heater 200b is characterized by having a space 244b between the first tube 220b and the second tube 240b so that the gas for cooling flows inside the heater 200b. That is, the gas for cooling flows through the space 244b inside the heater 200b.
  • the manner in which the cooling gas flows through the space 244b is not particularly limited, and a detailed description thereof will be omitted.
  • the cooling gas air, helium, nitrogen, argon may be used.
  • the temperature of the gas for cooling is preferably about room temperature, but if necessary, a gas cooled to a temperature below room temperature may be used.
  • the heater 200b is preferably implemented so that the heating element 270b can be easily detached from the first tube 220b or the second tube 240b.
  • the heater that is defective by removing only the heating element 270b from the heater 200b mounted on the heat treatment apparatus and repairing or replacing it.
  • the 200b can be easily repaired or replaced.
  • the heater 200b illustrated in FIGS. 26 and 27 may be used in the same manner as the heaters 200 and 200a described above.
  • the first and second cooling units 300 and 400, the terminal unit 500, and the insulating unit 600 may be installed at both ends of the heater 200b. Detailed description will be omitted.

Abstract

Disclosed are: a batch-type heat treatment device which can heat treat a plurality of substrates simultaneously, each of the substrate being heated by a plurality of heaters corresponding to the each substrate; and a heater used in the batch-type heat treatment device. The batch-type heat treatment device of the present invention comprises: a chamber (100) which provides a heat-treatment space for a plurality of substrates (10); a boat (108) for loading the plurality of substrates (10) therein and supporting the substrates (10); and a plurality of main heater units (120) disposed at predetermined intervals in the direction in which the substrates are stacked, each of the main heater units (120) comprising a plurality of individual main heaters (200), wherein the substrates (10) are disposed between the plurality of main heater units (120).

Description

배치식 열처리 장치 및 이에 적용되는 히터Batch heat treatment apparatus and heater applied thereto
본 발명은 배치식 열처리 장치 및 배치식 열처리 장치용 히터에 관한 것이다. 보다 상세하게는, 복수개의 기판을 기판의 전면적에 걸쳐 동시에 균일하게 열처리될 수 있고, 열처리 공정이 종료된 후에는 열처리 장치의 챔버 내부를 신속하게 냉각시킬 수 있도록 냉각용 가스가 흐르는 배치식 열처리 장치 및 이에 적용되는 히터에 관한 것이다.The present invention relates to a batch heat treatment apparatus and a heater for a batch heat treatment apparatus. More specifically, a plurality of substrates can be heat treated uniformly at the same time over the entire surface of the substrate, and after the heat treatment process is completed, the batch heat treatment apparatus flowing gas for cooling to quickly cool the inside of the chamber of the heat treatment apparatus And a heater applied thereto.
반도체, 평판 디스플레이 및 태양전지 제조에 사용되는 어닐링(annealing) 장치는 실리콘 웨이퍼나 글래스와 같은 기판 상에 증착되어 있는 소정의 박막에 대하여 결정화, 상 변화 등의 공정을 위하여 필수적인 열처리 단계를 담당하는 장치이다. Annealing devices used in the manufacture of semiconductors, flat panel displays, and solar cells are responsible for the heat treatment steps necessary for processes such as crystallization and phase change for a predetermined thin film deposited on a substrate such as a silicon wafer or glass. to be.
대표적인 어닐링 장치로는 액정 디스플레이 또는 박막형 결정질 실리콘 태양전지를 제조하는 경우 글래스 기판 상에 증착된 비정질 실리콘을 폴리 실리콘으로 결정화시키는 실리콘 결정화 장치가 있다. Representative annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate with polysilicon when manufacturing a liquid crystal display or thin film crystalline silicon solar cell.
이와 같은 결정화 공정(열처리 공정)을 수행하기 위해서는 소정의 박막이 형성되어 있는 기판의 히팅이 가능한 열처리 장치가 있어야 한다. 예를 들어, 비정질 실리콘의 결정화를 위해서는 최소한 550 내지 600℃의 온도가 필요하다.In order to perform such a crystallization process (heat treatment process), a heat treatment apparatus capable of heating a substrate on which a predetermined thin film is formed should be provided. For example, at least 550 to 600 ° C. temperature is required for the crystallization of amorphous silicon.
통상적으로 열처리 장치에는 하나의 기판에 대하여 열처리를 수행할 수 있는 매엽식과 복수개의 기판에 대하여 열처리를 수행할 수 있는 배치식이 있다. 매엽식은 장치의 구성이 간단한 이점이 있으나 생산성이 떨어지는 단점이 있어서 최근의 대량 생산용으로는 배치식이 각광을 받고 있다. Typically, the heat treatment apparatus includes a sheet type that can perform heat treatment on one substrate and a batch type that can perform heat treatment on a plurality of substrates. Single leaf type has the advantage of simple configuration of the device, but the disadvantage of low productivity has been in the spotlight for the recent mass production.
특히, 최근 평판 디스플레이 및 태양전지용 글래스 기판의 사이즈가 대면적화 됨에 따라 상술한 바와 같은 문제점이 더욱 주목을 받고 있으며, 따라서 기판의 전면적에 걸쳐서 균일한 열처리가 가능한 배치식 열처리 장치의 개발이 필요한 실정이다.In particular, as the size of a flat panel display and a glass substrate for a solar cell has recently increased in size, the above-mentioned problems are attracting more attention. Therefore, the development of a batch heat treatment apparatus capable of uniform heat treatment over the entire surface of the substrate is required. .
또한, 종래의 열처리 장치는 열처리 공정을 종료한 후 기판을 열처리 장치에서 언로딩하는 단계에서 많은 시간이 소요되어 열처리 공정의 생산성을 저하시키는 문제점이 있었다. 이와 같은 생산성이 저하되는 현상은 열 충격에 의한 기판 손상을 방지하기 위하여 열처리 공정이 끝나고 챔버 내부를 일정 온도 미만으로 냉각시킨 후 기판을 언로딩시켜야 하는 관계로 챔버 내부의 온도를 떨어뜨리는 과정에서 시간이 많이 걸리기 때문에 발생한다.In addition, the conventional heat treatment apparatus takes a lot of time in the step of unloading the substrate in the heat treatment apparatus after finishing the heat treatment process has a problem of lowering the productivity of the heat treatment process. This decrease in productivity is due to the time that the temperature inside the chamber is lowered due to the need to unload the substrate after the heat treatment process is completed and the chamber is cooled below a certain temperature in order to prevent damage to the substrate due to thermal shock. It happens because it takes a lot.
이에 본 발명의 목적은 상기와 같은 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 복수개의 기판을 동시에 열처리할 때 기판은 기판에 대응하는 복수개의 히터에 의해 가열됨으로써 기판 전면적에 걸쳐 균일한 열처리를 수행할 수 있는 배치식 열처리 장치 및 이에 적용되는 히터를 제공하는 것을 목적으로 한다.Accordingly, an object of the present invention is to solve the problems of the prior art as described above, the substrate is heated by a plurality of heaters corresponding to the substrate when heat treatment of the plurality of substrates at the same time to uniform heat treatment over the entire surface of the substrate An object of the present invention is to provide a batch heat treatment apparatus and a heater applied thereto.
또한, 상술한 바와 같은 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 열처리 공정의 종료 후에 챔버 내부를 신속하게 냉각시켜서 평판 디스플레이 또는 태양전지 등의 제조에 필요한 열처리 공정의 생산성을 획기적으로 향상시킬 수 있는 배치식 열처리 장치 및 이에 적용되는 히터를 제공하는 데에 목적이 있다.In addition, to solve the problems of the prior art as described above, after the end of the heat treatment process can quickly cool the inside of the chamber can significantly improve the productivity of the heat treatment process required for the manufacture of flat panel display or solar cell. An object of the present invention is to provide a batch heat treatment apparatus and a heater applied thereto.
본 발명에 따르면, 챔버에 로딩되는 기판은 기판마다 대응하는 복수개의 히터에 의해 가열됨으로써 기판의 전면적에 걸쳐 열처리가 균일하게 이루어지는 효과가 있다.According to the present invention, the substrate loaded in the chamber is heated by a plurality of heaters corresponding to each substrate, thereby effecting uniform heat treatment over the entire surface of the substrate.
또한, 본 발명에 따르면, 복수개의 기판에 대해 동시에 열처리가 가능함으로써 평판 디스플레이 및 태양전지의 생산성을 향상시키는 효과가 있다.In addition, according to the present invention, the heat treatment of the plurality of substrates can be performed at the same time, thereby improving the productivity of the flat panel display and the solar cell.
또한, 본 발명에 따르면, 히터 내부에 냉각용 가스가 흐를 수 있는 공간이 마련되어 열처리 공정이 종료된 후 열처리 장치의 챔버 내부를 신속하게 냉각시킬 수 있음으로써 기판의 언로딩 과정에 소요되는 시간이 단축되어 평판 디스플레이 또는 태양전지 등의 제조에 필요한 열처리 공정의 생산성을 획기적으로 향상시키는 효과가 있다.In addition, according to the present invention, a space in which the cooling gas flows is provided inside the heater, so that the inside of the chamber of the heat treatment apparatus can be quickly cooled after the heat treatment process is completed, thereby reducing the time required for the unloading process of the substrate. Therefore, there is an effect of dramatically improving the productivity of the heat treatment process required for manufacturing flat panel displays or solar cells.
도 1 및 도 2는 본 발명의 일 실시예에 따른 배치식 열처리 장치의 구성을 나타내는 사시도. 1 and 2 are perspective views showing the configuration of a batch heat treatment apparatus according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 배치식 열처리 장치의 기판, 메인 히터 유닛 및 보조 히터 유닛의 배치 상태를 나타내는 사시도.Figure 3 is a perspective view showing the arrangement of the substrate, the main heater unit and the auxiliary heater unit of the batch heat treatment apparatus according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 배치식 열처리 장치의 보트의 구성을 나타내는 사시도.Figure 4 is a perspective view showing the configuration of the boat of the batch heat treatment apparatus according to an embodiment of the present invention.
도 5는 본 발명의 일 실시예에 따른 배치식 열처리 장치의 가스 공급관과 가스 배출관의 구성을 나타내는 사시도. Figure 5 is a perspective view showing the configuration of the gas supply pipe and the gas discharge pipe of the batch heat treatment apparatus according to an embodiment of the present invention.
도 6은 도 5의 가스 공급관의 구성을 나타내는 도면.FIG. 6 is a diagram illustrating a configuration of a gas supply pipe of FIG. 5. FIG.
도 7과 도 8은 본 발명의 일 실시예에 따른 배치식 열처리 장치의 단위 메인 히터의 배열 상태를 나타내는 도면. 7 and 8 are views showing the arrangement of the unit main heater of the batch heat treatment apparatus according to an embodiment of the present invention.
도 9는 본 발명의 일 실시예에 따른 히터의 구성을 나타내는 사시도. 9 is a perspective view showing the configuration of a heater according to an embodiment of the present invention.
도 10과 도 11은 본 발명의 다른 실시예에 따른 히터의 구성을 나타내는 단면 사시도 및 단면도.10 and 11 are a cross-sectional perspective view and a cross-sectional view showing the configuration of a heater according to another embodiment of the present invention.
도 12는 본 발명의 일 실시예에 따른 히터의 단부에 제1 및 제2 냉각부, 단자부 및 절연부가 설치된 상태를 나타내는 도면. 12 is a view illustrating a state in which the first and second cooling units, the terminal unit, and the insulating unit are installed at ends of the heater according to the exemplary embodiment of the present invention.
도 13은 본 발명의 일 실시예에 따른 히터의 단부에 설치되는 제1 및 제2 냉각부의 구성을 나타내는 분해 사시도. 13 is an exploded perspective view showing the configuration of the first and second cooling units provided at the end of the heater according to an embodiment of the present invention.
도 14는 본 발명의 일 실시예에 따른 히터의 단부에 설치되는 단자부 및 절연부의 구성을 나타내는 분해 사시도.14 is an exploded perspective view showing the configuration of a terminal portion and an insulation portion provided at the end of the heater according to an embodiment of the present invention.
도 15, 16 및 도 17은 본 발명의 일 실시예에 따른 도전관의 구성을 나타내는 도면.15, 16 and 17 are views showing the configuration of a conductive tube according to an embodiment of the present invention.
도 18 및 도 19는 본 발명의 일 실시예에 따른 제1 보호 너트의 구성을 나타내는 도면. 18 and 19 are views showing the configuration of the first protective nut according to an embodiment of the present invention.
도 20, 도 21 및 도 22는 본 발명의 일 실시예에 따른 제2 보호 너트의 구성을 나타내는 도면.20, 21 and 22 are views showing the configuration of a second protective nut according to an embodiment of the present invention.
도 23, 도 24 및 도 25는 본 발명의 일 실시예에 따른 절연캡의 구성을 나타내는 도면.23, 24 and 25 is a view showing the configuration of an insulating cap according to an embodiment of the present invention.
도 26과 도 27은 본 발명의 또 다른 실시예에 따른 히터의 구성을 나타내는 단면 사시도 및 단면도.26 and 27 are a sectional perspective view and a sectional view showing the configuration of a heater according to another embodiment of the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
1: 열처리 장치 1: heat treatment device
10: 기판10: Substrate
12: 홀더12: holder
100: 챔버100: chamber
102: 프레임102: frame
104: 도어104: door
106: 커버106: cover
108: 보트 108: boat
120: 메인 히터 유닛120: main heater unit
140a: 제1 보조 히터 유닛140a: first auxiliary heater unit
140b: 제2 보조 히터 유닛140b: second auxiliary heater unit
150a: 제1 단위 보조 히터150a: first unit auxiliary heater
150b: 제2 단위 보조 히터150b: second unit auxiliary heater
160: 가스 공급관160: gas supply pipe
170: 가스 배출관170: gas discharge pipe
180: 냉각관180: cooling tube
200: 단위 메인 히터200: unit main heater
200a, 200b: 히터200a, 200b: heater
220a, 220b: 제1 관220a, 220b: first tube
240a, 240b: 제2 관240a, 240b: second tube
260: 제3 관260: third tube
280: 고정캡280: fixed cap
300: 제1 냉각부300: first cooling unit
310: 제1 본체310: first body
320: 냉각수 유입관320: cooling water inlet pipe
330: 냉각수 유출관330: coolant outlet pipe
340: 플랜지340: flange
400: 냉각부400: cooling unit
410: 제2 본체410: second body
420: 가스관420: gas pipe
500: 단자부500: terminal section
510, 510b: 도전관510, 510b: conductive tube
520: 제1 고정 너트520: first fixing nut
530: 제1 보호 너트530: first protective nut
540: 제2 보호 너트540: second protective nut
600: 절연부600: insulation
610: 절연캡610: insulation cap
620: 홀620: hall
630: 제2 고정 너트630: second fixing nut
상술한 목적을 달성하기 위하여, 본 발명에 따른 열처리 장치는, 복수개의 기판을 동시에 열처리할 수 있으며 각 기판은 상기 각 기판에 대응하는 복수개의 히터에 의해 가열되는 것을 특징으로 한다. In order to achieve the above object, the heat treatment apparatus according to the present invention is characterized in that the plurality of substrates can be heat treated at the same time, each substrate is heated by a plurality of heaters corresponding to the respective substrates.
또한, 상술한 목적을 달성하기 위하여, 본 발명에 따른 열처리 장치는, 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치로서, 상기 복수개의 기판에 대하여 열처리 공간을 제공하는 챔버; 상기 복수개의 기판이 로딩되어 지지되는 보트; 및 상기 기판의 적층 방향을 따라 일정 간격을 가지면서 배치되는 복수개의 메인 히터 유닛 - 상기 메인 히터 유닛은 복수개의 단위 메인 히터를 포함함 -; 을 포함하고, 상기 기판은 상기 복수개의 메인 히터 유닛 사이에 배치되는 것을 특징으로 한다. In addition, in order to achieve the above object, the heat treatment apparatus according to the present invention, a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the chamber for providing a heat treatment space for the plurality of substrates; A boat on which the plurality of substrates are loaded and supported; And a plurality of main heater units disposed at predetermined intervals along the stacking direction of the substrate, wherein the main heater units include a plurality of unit main heaters; It includes, The substrate is characterized in that disposed between the plurality of main heater unit.
상기 기판은 기판 홀더에 안착된 상태로 상기 보트에 로딩될 수 있다. The substrate may be loaded into the boat while seated in a substrate holder.
상기 복수개의 단위 메인 히터는 상기 기판의 단변 방향과 평행하게 일정 간격을 가지면서 배치될 수 있다. The plurality of unit main heaters may be disposed at regular intervals in parallel with the short side direction of the substrate.
임의의 메인 히터 유닛의 단위 메인 히터는 상기 임의의 메인 히터 유닛의 최인접 메인 히터 유닛의 단위 메인 히터와 정렬되게 배치될 수 있다. The unit main heater of any main heater unit may be arranged to be aligned with the unit main heater of the nearest main heater unit of the any main heater unit.
임의의 메인 히터 유닛의 단위 메인 히터는 상기 임의의 메인 히터 유닛의 최인접 메인 히터 유닛의 단위 메인 히터와 어긋나게 배치될 수 있다. The unit main heater of any of the main heater units may be disposed to deviate from the unit main heater of the nearest main heater unit of the any of the main heater units.
상기 챔버 내부의 열 손실을 방지하기 위한 복수개의 보조 히터 유닛을 더 포함할 수 있다. The apparatus may further include a plurality of auxiliary heater units for preventing heat loss inside the chamber.
상기 복수개의 보조 히터 유닛은 상기 기판의 단변 방향과 평행하게 배치되는 제1 보조 히터 유닛과, 상기 기판의 장변 방향과 평행하게 배치되는 제2 보조 히터 유닛을 포함할 수 있다. The plurality of auxiliary heater units may include a first auxiliary heater unit disposed in parallel with a short side direction of the substrate, and a second auxiliary heater unit disposed in parallel with a long side direction of the substrate.
상기 제1 보조 히터 유닛은 상기 메인 히터 유닛의 양측에 상기 단위 메인 히터와 평행하게 배치되는 복수개의 제1 단위 보조 히터를 포함하고, 상기 제2 보조 히터 유닛은 상기 메인 히터 유닛의 양측에 상기 단위 메인 히터와 수직으로 배치되는 복수개의 제2 단위 보조 히터를 포함할 수 있다. The first auxiliary heater unit includes a plurality of first unit auxiliary heaters disposed on both sides of the main heater unit in parallel with the unit main heater, and the second auxiliary heater unit includes the units on both sides of the main heater unit. It may include a plurality of second unit auxiliary heaters disposed perpendicular to the main heater.
상기 챔버 내부를 냉각시키기 위한 복수개의 냉각관을 더 포함할 수 있다. The apparatus may further include a plurality of cooling tubes for cooling the inside of the chamber.
상기 냉각관은 상기 기판의 단변 방향을 따라 상기 복수개의 단위 메인 히터 사이에 배치될 수 있다. The cooling tube may be disposed between the plurality of unit main heaters along a short side direction of the substrate.
상기 냉각관의 내부로는 냉각 가스가 흐르며 상기 냉각관은 열전도율이 높은 재질로 이루어질 수 있다. Cooling gas flows into the cooling tube, and the cooling tube may be made of a material having high thermal conductivity.
상기 챔버 내부에 공정 가스를 공급하는 가스 공급부와 상기 챔버 내부로부터 폐 가스를 배출하는 가스 배출부를 더 포함할 수 있다. The gas supply unit may further include a gas supply unit supplying a process gas into the chamber and a gas discharge unit configured to discharge waste gas from the inside of the chamber.
상기 가스 공급부는 공정 가스가 유출되는 복수개의 제1 가스 구멍이 형성되어 있는 가스 공급관을 포함하고, 상기 가스 배출부는 폐 가스가 유입되는 복수개의 제2 가스 구멍이 형성되어 있는 가스 배출관을 포함할 수 있다. The gas supply part may include a gas supply pipe in which a plurality of first gas holes through which process gas flows is formed, and the gas discharge part may include a gas discharge pipe in which a plurality of second gas holes into which waste gas is introduced is formed. have.
그리고, 상술한 목적을 달성하기 위하여, 본 발명에 따른 히터는, 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서, 상기 히터는 상기 히터 내부로 냉각용 가스가 흐를 수 있는 공간을 포함하는 것을 특징으로 한다. And, in order to achieve the above object, the heater according to the present invention is a heater that can be applied to a batch type heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater is a gas for cooling flows into the heater It is characterized by including a space.
그리고, 상술한 목적을 달성하기 위하여, 본 발명에 따른 히터는, 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서, 상기 히터는, 제1 관; 상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관; 및 상기 제1 관 내부에 삽입되는 발열체를 포함하며, 상기 제1 관과 상기 제2 관 사이의 공간을 통하여 냉각용 가스가 흐르도록 하는 것을 특징으로 한다. And, in order to achieve the above object, the heater according to the present invention, a heater that can be applied to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater comprises: a first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a heating element inserted into the first tube, wherein the cooling gas flows through a space between the first tube and the second tube.
상기 발열체의 양 단부의 단면적은 중앙부의 단면적보다 클 수 있다.The cross-sectional area of both ends of the heating element may be larger than the cross-sectional area of the central portion.
상기 발열체는 상기 제1 관 또는 상기 제2 관으로부터 분리 가능할 수 있다. The heating element may be detachable from the first tube or the second tube.
복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서, 상기 히터는, 제1 관; 상기 제1 관의 외주면에 감기면서 설치되는 코일형 열선; 및 상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관을 포함하며, 상기 제1 관의 중앙 공간을 통하여 냉각용 가스가 흐르도록 할 수 있다. A heater applicable to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater comprising: a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; And a second tube surrounding the first tube at a predetermined distance from the first tube, and allowing a cooling gas to flow through the central space of the first tube.
그리고, 상술한 목적을 달성하기 위하여, 본 발명에 따른 히터는, 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서, 상기 히터는, 제1 관; 상기 제1 관의 외주면에 감기면서 설치되는 코일형 열선; 상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관; 및 상기 제2 관과 일정한 간격을 가지면서 상기 제2 관을 둘러싸는 제3 관을 포함하며, 상기 제1 관의 중앙 공간 및 상기 제2 관과 상기 제3 관 사이의 공간 중 적어도 하나의 공간을 통하여 냉각용 가스가 흐르도록 할 수 있다. And, in order to achieve the above object, the heater according to the present invention, a heater that can be applied to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the heater comprises: a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a third tube surrounding the second tube with a predetermined distance from the second tube, wherein at least one of a central space of the first tube and a space between the second tube and the third tube Through the cooling gas can be flowed through.
상기 열선의 피치는 상기 제1 관 상의 위치에 관계없이 동일하거나 상기 제1 관 상의 위치에 따라 변경될 수 있다. The pitch of the heating wire may be the same or change depending on the position on the first tube regardless of the position on the first tube.
상기 코일형 열선이 감겨져 있는 제1 관은 상기 제2 관 또는 상기 제3 관으로부터 분리 가능할 수 있다. The first tube around which the coiled heating wire is wound may be detachable from the second tube or the third tube.
상기 제3 관의 양단에는 상기 제3 관을 냉각시키는 냉각수가 흐르도록 하는 제1 냉각부가 설치될 수 있다. Both ends of the third tube may be provided with a first cooling unit for allowing a cooling water to cool the third tube flows.
상기 제3 관의 양단에는 상기 제2 관과 상기 제3 관 사이의 공간을 통하여 냉각용 가스가 흐르도록 하는 제2 냉각부가 더 설치될 수 있다. Both ends of the third tube may further be provided with a second cooling unit for the cooling gas flows through the space between the second tube and the third tube.
상기 제1 냉각부는 내부에 공간이 형성되는 제1 본체; 상기 제1 본체의 내부 공간으로 냉각수가 유입되도록 하는 냉각수 유입관; 및 상기 제1 본체의 내부 공간에 유입된 냉각수가 유출되도록 하는 냉각수 유출관을 포함할 수 있다. The first cooling unit may include a first body having a space formed therein; A coolant inflow pipe configured to allow coolant to flow into an internal space of the first body; And a coolant outlet pipe configured to allow the coolant introduced into the inner space of the first body to flow out.
상기 제2 냉각부는 내부에 공간이 형성되는 제2 본체; 및 상기 제2 본체의 내부 공간으로 연결되는 가스관을 포함하고, 상기 제2 본체의 내부 공간은 상기 제2 관과 상기 제3 관 사이의 공간과 연결될 수 있다. The second cooling unit includes a second body having a space formed therein; And a gas pipe connected to an inner space of the second body, and the inner space of the second body may be connected to a space between the second pipe and the third pipe.
상기 열선으로 전원을 공급하는 단자부; 및 상기 단자부를 절연하는 절연부를 더 포함할 수 있다. A terminal unit for supplying power to the heating wire; And an insulating part for insulating the terminal part.
상기 제2 관의 단부에 설치되고 상기 열선과 연결되는 고정캡을 더 포함할 수 있다. It may further include a fixing cap installed at the end of the second tube and connected to the heating wire.
상기 단자부는 상기 제1 관 상에 설치되고 외부의 전원이 연결되는 도전관; 및 상기 도전관이 상기 히터의 고정캡에 밀착되도록 하는 고정 너트를 포함할 수 있다. The terminal portion is provided on the first tube and the conductive pipe is connected to the external power; And it may include a fixing nut for the conductive tube is in close contact with the fixing cap of the heater.
상기 절연부는 내부에 공간이 형성되고 상기 단자부를 둘러싸는 절연캡을 포함하고, 상기 절연캡의 일측에는 홀이 형성될 수 있다. The insulating part may have a space formed therein and include an insulating cap surrounding the terminal part, and a hole may be formed at one side of the insulating cap.
이하 첨부된 도면을 참조하여 본 발명의 구성을 상세하게 설명하도록 한다.Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.
도 1 및 도 2는 본 발명의 일 실시예에 따른 배치식 열처리 장치(1)의 구성을 나타내는 사시도이다. 참고로, 도 1 및 도 2에서, 단위 메인 히터(200)의 외형은 편의상 개략적으로 도시한 것으로서 배치식 열처리 장치(1)에서 단위 메인 히터(200)의 배치 상태를 나타내고 있다.1 and 2 are perspective views showing the configuration of a batch heat treatment apparatus 1 according to an embodiment of the present invention. For reference, in FIG. 1 and FIG. 2, the external shape of the unit main heater 200 is schematically illustrated for convenience and shows the arrangement state of the unit main heater 200 in the batch heat treatment device 1.
도 3은 본 발명의 일 실시예에 따른 배치식 열처리 장치(1)의 기판(10), 메인 히터 유닛(120) 및 보조 히터 유닛(140)의 배치 상태를 나타내는 사시도이다.3 is a perspective view illustrating an arrangement state of the substrate 10, the main heater unit 120, and the auxiliary heater unit 140 of the batch heat treatment apparatus 1 according to the exemplary embodiment.
먼저, 배치식 열처리 장치(1)에 로딩되는 기판(10)의 재질은 특별히 제한되지 않으며 글래스, 플라스틱, 폴리머, 실리콘 웨이퍼, 스테인레스 스틸 등 다양한 재질의 기판(10)이 로딩될 수 있다. 이하에서는 LCD나 OLED와 같은 평판 디스플레이나 박막형 실리콘 태양전지 분야에 가장 일반적으로 사용되는 직사각형 형상의 글래스 기판을 상정하여 설명한다.First, the material of the substrate 10 loaded in the batch heat treatment apparatus 1 is not particularly limited, and the substrate 10 of various materials such as glass, plastic, polymer, silicon wafer, stainless steel, and the like may be loaded. Hereinafter, a description will be given assuming a rectangular glass substrate that is most commonly used in the field of flat panel displays such as LCDs and OLEDs or thin film silicon solar cells.
도 1을 참조하면, 배치식 열처리 장치(1)는 열처리 공간을 제공하는 직육면체 형상의 챔버(100)와, 챔버(100)를 지지하는 프레임(102)을 포함하여 구성된다. 챔버(100) 및 프레임(102)의 재질은 스테인레스 스틸인 것이 바람직하나 반드시 이에 한정되는 것은 아니다.Referring to FIG. 1, the batch heat treatment apparatus 1 includes a cuboid-shaped chamber 100 that provides a heat treatment space, and a frame 102 that supports the chamber 100. The material of the chamber 100 and the frame 102 is preferably stainless steel, but is not necessarily limited thereto.
챔버(100)의 일측에는 챔버(100)에 기판(10)을 로딩하기 위하여 상하 방향으로 개폐되는 도어(104)가 설치된다. 도어(104)가 개방된 상태에서 트랜스퍼 암과 같은 기판 로딩 장치(미도시)를 이용하여 기판(10)을 챔버(100)로 로딩할 수 있다. 한편, 열처리가 종료된 후 도어(104)를 통하여 챔버(100)로부터 기판(10)을 언로딩할 수도 있다. 도어(104)의 재질은 스테인레스 스틸인 것이 바람직하나 반드시 이에 한정되는 것은 아니다.One side of the chamber 100 is provided with a door 104 that opens and closes in the vertical direction to load the substrate 10 in the chamber 100. With the door 104 open, the substrate 10 may be loaded into the chamber 100 using a substrate loading device (not shown) such as a transfer arm. Meanwhile, after the heat treatment is completed, the substrate 10 may be unloaded from the chamber 100 through the door 104. The material of the door 104 is preferably stainless steel, but is not necessarily limited thereto.
챔버(100)의 상측에는 챔버(100)의 내부에 설치되는, 예를 들어 보트(108), 가스 공급관(160) 및 가스 배출관(170) 등의 수리 및 교체를 위하여 커버(106)가 개폐 가능하도록 설치된다. 커버(106)의 재질은 석영인 것이 바람직하나 반드시 이에 한정되는 것은 아니다.The cover 106 may be opened and closed at the upper side of the chamber 100 for repair and replacement of the boat 108, the gas supply pipe 160, the gas discharge pipe 170, and the like, which are installed inside the chamber 100. To be installed. The material of the cover 106 is preferably quartz, but is not necessarily limited thereto.
챔버(100)의 내부에는 기판(10)을 직접 가열하기 위한 메인 히터 유닛(120)과, 챔버(100) 내부의 열 손실을 방지하기 위한 보조 히터 유닛(140)과, 열처리가 종료된 후 챔버(100) 내부를 신속하게 냉각시키기 위한 냉각관(180)이 설치된다. Inside the chamber 100, the main heater unit 120 for directly heating the substrate 10, the auxiliary heater unit 140 for preventing heat loss inside the chamber 100, and the chamber after the heat treatment is completed. Cooling tube 180 for quickly cooling the inside 100 is installed.
도 2를 참조하면, 메인 히터 유닛(120)은 기판(10)의 단변 방향과 평행하게 일정한 간격을 가지면서 단위 메인 히터(200)를 포함한다. 단위 메인 히터(200)는 통상적인 길이가 긴 봉형의 히터로서 석영관 내부에 발열체가 삽입되어 있고 양단에 설치된 단자를 통하여 외부의 전원을 인가 받아 열을 발생시키는 메인 히터 유닛(120)을 구성하는 단위체이다. 본 실시예에서 메인 히터 유닛(120)은 14개의 단위 메인 히터(200)로 구성되어 있으나, 메인 히터 유닛(120)을 구성하는 단위 메인 히터(200)의 개수는 챔버(100)에 로딩되는 기판(10)의 크기에 따라 다양하게 변경될 수 있다. Referring to FIG. 2, the main heater unit 120 includes a unit main heater 200 at regular intervals in parallel with the short side direction of the substrate 10. The unit main heater 200 is a rod-shaped heater having a conventional long length, and the heating element is inserted into the quartz tube, and the main heater unit 120 generates heat by receiving external power through terminals installed at both ends. It is a unit. In the present exemplary embodiment, the main heater unit 120 includes 14 unit main heaters 200, but the number of unit main heaters 200 constituting the main heater unit 120 is loaded in the chamber 100. It may be variously changed according to the size of (10).
메인 히터 유닛(120)은 기판(10)의 적층 방향을 따라 일정 간격을 가지면서 복수개가 배치된다. 기판(10)은 복수개의 메인 히터 유닛(120) 사이에 배치된다. 본 실시예에서는 3개의 기판(10)이 4개의 메인 히터 유닛(120)의 사이에 배치되는 것으로 구성되어 있으나, 메인 히터 유닛(120)의 개수는 챔버(100)에 로딩되는 기판(10)의 개수에 따라 다양하게 변경될 수 있다. The plurality of main heater units 120 are disposed at regular intervals along the stacking direction of the substrate 10. The substrate 10 is disposed between the plurality of main heater units 120. In this embodiment, the three substrates 10 are configured to be disposed between the four main heater units 120, but the number of the main heater units 120 is the number of the substrates 10 loaded in the chamber 100. It may vary depending on the number.
기판(10)은 메인 히터 유닛(120) 사이의 중앙에 배치하는 것이 바람직하다. 또한, 기판(10)과 메인 히터 유닛(120) 사이는 챔버(100)에 기판(10)을 로딩할 때 기판 이송 장치의 트랜스퍼 암의 거동에 방해가 되지 않을 정도로 이격되어 있는 것이 바람직하다. The substrate 10 is preferably disposed at the center between the main heater units 120. In addition, it is preferable that the substrate 10 and the main heater unit 120 are spaced apart from each other so as not to interfere with the behavior of the transfer arm of the substrate transfer device when loading the substrate 10 into the chamber 100.
이와 같이, 배치식 열처리 장치(10)에는 기판(10)의 상부 및 하부에 기판(10)의 전면적을 커버할 수 있는 14개의 단위 메인 히터(200)로 구성되는 메인 히터 유닛(120)이 설치됨으로써, 기판(10)은 28개의 단위 메인 히터(200)로부터 전면적에 걸쳐서 균일하게 열을 인가 받아 열처리가 균일하게 이루어질 수 있다. In this way, the batch type heat treatment apparatus 10 is provided with a main heater unit 120 composed of 14 unit main heaters 200 that can cover the entire area of the substrate 10 on the upper and lower portions of the substrate 10. As a result, the substrate 10 may be uniformly heat-treated by uniformly applying heat from the 28 unit main heaters 200 over the entire area.
또한, 도 2를 참조하면, 보조 히터 유닛(140)은 기판(10)의 단변 방향을 따라 평행하게 배치되는 제1 보조 히터 유닛(140a)과 기판(10)의 장변 방향을 따라 배치되는 제2 보조 히터 유닛(140b)을 포함한다. In addition, referring to FIG. 2, the auxiliary heater unit 140 is disposed along the long side direction of the first auxiliary heater unit 140a and the substrate 10 arranged in parallel along the short side direction of the substrate 10. Auxiliary heater unit 140b is included.
제1 보조 히터 유닛(140a)은 메인 히터 유닛(120)의 양측에 단위 메인 히터(200)와 평행하게 배치되는 복수개의 제1 단위 보조 히터(150a)를 포함한다. 본 실시예에서 제1 보조 히터 유닛(140a)은 메인 히터 유닛(120)과 같은 열(row)을 이룰 수 있도록 4개의 메인 히터 유닛(120)의 양측에 1개씩 모두 8개의 제1 단위 보조 히터(150a)로 구성되어 있으나, 제1 보조 히터 유닛(140a)을 구성하는 제1 단위 보조 히터(150a)의 개수는 챔버(100)에 설치되는 메인 히터 유닛(120)의 개수에 따라 다양하게 변경될 수 있다. 한편, 본 발명에서 보조 히터 유닛의 설치 효과를 더 높이기 위하여 제1 보조 히터 유닛(140a)은 4개의 메인 히터 유닛(120)의 양측에 2개씩 배치되는 모두 16개의 제1 단위 보조 히터(150a)로 구성될 수도 있다.The first auxiliary heater unit 140a includes a plurality of first unit auxiliary heaters 150a disposed in parallel with the unit main heater 200 on both sides of the main heater unit 120. In the present embodiment, the first auxiliary heater unit 140a includes eight first unit auxiliary heaters, one on each side of the four main heater units 120 so as to form the same row as the main heater unit 120. Although it is configured as 150a, the number of first unit auxiliary heaters 150a constituting the first auxiliary heater unit 140a is changed in various ways depending on the number of main heater units 120 installed in the chamber 100. Can be. On the other hand, in order to further increase the installation effect of the auxiliary heater unit in the present invention, the first auxiliary heater unit 140a is all 16 first unit auxiliary heaters 150a which are disposed on both sides of the four main heater units 120. It may be configured as.
제2 보조 히터 유닛(140b)은 메인 히터 유닛(120)의 양측에 단위 메인 히터(200)와 수직으로 배치되는 복수개의 제2 단위 보조 히터(150b)를 포함한다. 본 실시예에서 메인 히터 유닛(120)이 제2 보조 히터 유닛(140b)을 구성하는 복수개의 제2 단위 보조 히터(150b)의 사이에 배치되도록 제2 보조 히터 유닛(140b)은 4개의 메인 히터 유닛(120)의 양측에 1개씩 배치되는 모두 10개의 제2 단위 보조 히터(150b)로 구성되어 있으나, 제2 보조 히터 유닛(140b)을 구성하는 제2 단위 보조 히터(150b)의 개수는 챔버(100)에 설치되는 메인 히터 유닛(120)의 개수에 따라 다양하게 변경될 수 있다. 메인 히터 유닛(120)은 제2 보조 히터 유닛(140b) 사이의 중앙에 배치하는 것이 바람직하다.The second auxiliary heater unit 140b includes a plurality of second unit auxiliary heaters 150b disposed on both sides of the main heater unit 120 to be perpendicular to the unit main heater 200. In the present embodiment, the second auxiliary heater unit 140b includes four main heaters such that the main heater unit 120 is disposed between the plurality of second unit auxiliary heaters 150b constituting the second auxiliary heater unit 140b. The second unit auxiliary heater 150b constituting the second auxiliary heater unit 140b is formed of all ten second unit heaters 150b which are arranged one by one on both sides of the unit 120. It may be variously changed according to the number of the main heater unit 120 installed in the (100). The main heater unit 120 is preferably disposed in the center between the second auxiliary heater unit 140b.
제1 단위 보조 히터(150a)와 제2 단위 보조 히터(150b)는 전술한 바와 같은 단위 메인 히터(200)와 동일한 통상적인 길이가 긴 봉형의 히터를 사용하는 것이 바람직하다.As the first unit auxiliary heater 150a and the second unit auxiliary heater 150b, it is preferable to use a rod-shaped heater having the same general length as the unit main heater 200 as described above.
이와 같이, 배치식 열처리 장치(1)에는 메인 히터 유닛(120)의 4 외주부에 8개의 제1 단위 보조 히터(150a)로 구성되는 제1 보조 히터 유닛(140a)과 10개의 제2 단위 보조 히터(150b)로 구성되는 제2 보조 히터 유닛(140b)이 설치됨으로써, 메인 히터 유닛(120)의 4 외주부는 18개의 단위 보조 히터(150a, 150b)로부터 열을 인가 받아 메인 히터 유닛(120)의 4 외주부가 외부 환경과 접함으로써 불가피하게 발생하는 챔버(100) 내부의 열 손실을 방지할 수 있다.In this way, the batch type heat treatment apparatus 1 includes a first auxiliary heater unit 140a composed of eight first unit auxiliary heaters 150a and ten second unit auxiliary heaters at four outer circumferences of the main heater unit 120. By installing the second auxiliary heater unit 140b including the 150b, the four outer circumferences of the main heater unit 120 receive heat from 18 unit auxiliary heaters 150a and 150b so that the main heater unit 120 4 The outer circumferential portion can be in contact with the external environment to prevent heat loss inside the chamber 100 inevitably occurring.
상술한 바와 같은 배치식 열처리 장치(1)에서 기판(10), 메인 히터 유닛(120) 및 보조 히터 유닛(140)의 배치 상태를 도 3에 나타내었다. 다만 도 3에서는 제1 단위 보조 히터(150a)가 4개의 메인 히터 유닛(120)의 양측에 2개씩 배치되는 경우를 나타내고 있다.The arrangement of the substrate 10, the main heater unit 120, and the auxiliary heater unit 140 in the batch heat treatment apparatus 1 as described above is illustrated in FIG. 3. 3 illustrates a case where two first unit auxiliary heaters 150a are disposed at both sides of the four main heater units 120.
또한, 도 2를 참조하면, 냉각관(180)은 메인 히터 유닛(120)을 구성하는 단위 메인 히터(200) 사이마다 배치된다. 본 실시예에서 냉각관(180)은 4 개의 메인 히터 유닛(120)을 구성하는 56개의 단위 메인 히터(200)의 사이마다 모두 52개가 설치되는 것으로 되어 있으나, 냉각관(180)의 개수는 챔버(100)에 설치되는 메인 히터 유닛(120) 및 단위 메인 히터(200)의 개수에 따라 다양하게 변경될 수 있다. 또한, 냉각관(180)은 반드시 단위 메인 히터(200) 사이마다 배치될 필요는 없으며 챔버(100)의 내부를 적절하게 냉각시킬 수만 있다면 일부 단위 메인 히터(200)의 사이에는 냉각관(180)의 설치를 생략할 수도 있다.In addition, referring to FIG. 2, the cooling tube 180 is disposed between the unit main heaters 200 constituting the main heater unit 120. In the present exemplary embodiment, 52 cooling tubes 180 are installed between each of the 56 unit main heaters 200 constituting the four main heater units 120, but the number of the cooling tubes 180 is the chamber. According to the number of the main heater unit 120 and the unit main heater 200 installed in the 100 may be variously changed. In addition, the cooling tube 180 does not necessarily need to be disposed between the unit main heaters 200, and the cooling tube 180 may be disposed between some unit main heaters 200 as long as the interior of the chamber 100 may be properly cooled. You can also omit the installation of.
이와 같이, 배치식 열처리 장치(1)에는 냉각관(180)이 설치됨으로써, 열처리 종료 후 챔버(100) 내부의 열이 냉각관(180)을 통하여 챔버(100) 외부로 전도되어 챔버(100) 내부를 신속하게 냉각시킬 수 있다. 열처리 종료 후 챔버(100) 내부가 소정의 온도 이하로 냉각되어야 기판(10)의 언로딩 작업이 진행될 수 있기 때문에 냉각관(180)의 작동으로 챔버(100)의 내부를 신속하게 냉각시킬 수 있다면 평판 디스플레이 및 태양전지의 생산성을 크게 향상시킬 수 있다.As such, since the cooling tube 180 is installed in the batch type heat treatment apparatus 1, the heat inside the chamber 100 is conducted to the outside of the chamber 100 through the cooling tube 180 after the heat treatment is completed, and thus, the chamber 100. The interior can be cooled quickly. If the interior of the chamber 100 can be rapidly cooled by the operation of the cooling pipe 180 because the inside of the chamber 100 may be cooled to a temperature lower than a predetermined temperature after the end of the heat treatment. The productivity of flat panel displays and solar cells can be greatly improved.
냉각관(180)의 재질은 열전도율이 높은 구리, 스테인레스 스틸인 것이 바람직하다. 냉각관(180)의 내부로 냉각용 가스 또는 냉각용 액체가 공급된다. 냉각용 가스로는 공기, 헬륨, 질소, 아르곤을 사용할 수 있다. 냉각용 액체로는 물을 사용할 수 있다. 냉각용 가스 또는 냉각용 액체의 온도는 대략 상온인 것이 바람직하나 필요에 따라서는 상온 미만의 온도로 냉각된 가스나 액체를 사용할 수도 있다.The material of the cooling tube 180 is preferably copper and stainless steel having high thermal conductivity. The cooling gas or the cooling liquid is supplied into the cooling tube 180. As the cooling gas, air, helium, nitrogen, argon may be used. Water may be used as the cooling liquid. Although the temperature of the cooling gas or the cooling liquid is preferably about room temperature, a gas or liquid cooled to a temperature below the normal temperature may be used, if necessary.
도 4는 본 발명의 일 실시예에 따른 배치식 열처리 장치(1)의 보트(108)의 구성을 나타내는 사시도이다.4 is a perspective view showing the configuration of the boat 108 of the batch heat treatment apparatus 1 according to an embodiment of the present invention.
도 4를 참조하면, 챔버(100)의 내부에는 챔버(100)로 로딩된 기판(10)을 지지하기 위한 복수개의 보트(108)가 설치되어 있다. 보트(108)는 기판(10)의 장변측을 지지하도록 설치되는 것이 바람직하다. 본 실시예에서 보트(108)는 기판(10)의 양 장변측에 3개씩 모두 6개가 설치되어 있으나, 기판(10)의 안정적인 지지를 위하여 그 이상의 개수로 설치될 수도 있으며 기판(10)의 크기에 따라 다양하게 변경될 수 있다. 보트(108)의 재질은 석영인 것이 바람직하다.Referring to FIG. 4, a plurality of boats 108 for supporting the substrate 10 loaded into the chamber 100 are installed in the chamber 100. The boat 108 is preferably installed to support the long side of the substrate 10. In the present embodiment, six boats 108 are provided on both sides of the board 10 in the three long sides. However, the boats 108 may be installed in a larger number than the boat 10 in order to stably support the board 10. It can be changed in various ways. The material of the boat 108 is preferably quartz.
또한, 도 4를 참조하면, 기판(10)은 홀더(12)에 탑재된 상태로 보트(108)에 로딩되는 것이 바람직하다. 열처리 과정 중에 열처리 온도가 글래스 기판의 연화(softening) 온도에 도달하면 기판 자체의 무게 때문에 기판의 아래 방향으로의 휨 현상이 발생하는데, 특히 이러한 휨 현상은 기판이 대면적화 됨에 따라 더 큰 문제가 된다. 이러한 문제점을 해결하기 위하여 기판(10)을 홀더(12)에 탑재한 상태로 열처리를 진행한다.In addition, referring to FIG. 4, the substrate 10 is preferably loaded in the boat 108 while being mounted in the holder 12. When the heat treatment temperature reaches the softening temperature of the glass substrate during the heat treatment process, a warp phenomenon occurs in the downward direction of the substrate due to the weight of the substrate itself. . In order to solve this problem, heat treatment is performed while the substrate 10 is mounted on the holder 12.
도 5는 본 발명의 일 실시예에 따른 배치식 열처리 장치(1)의 가스 공급관(160)과 가스 배출관(170)의 구성을 나타내는 사시도이다. 도 6은 도 5의 가스 공급관(160)의 구성을 나타내는 도면이다.5 is a perspective view showing the configuration of the gas supply pipe 160 and the gas discharge pipe 170 of the batch heat treatment apparatus 1 according to an embodiment of the present invention. 6 is a diagram illustrating a configuration of the gas supply pipe 160 of FIG. 5.
도시한 바와 같이, 챔버(100)에는 열처리 분위기를 조성하기 위한 분위기 가스를 챔버(100) 내부에 공급하기 위하여 분위기 가스를 배출하는 제1 가스 구멍(162)이 복수개로 형성된 봉 형태의 가스 공급관(160)과, 열처리 분위기 조성에 사용된 폐가스가 유입되는 제2 가스 구멍(미도시)이 복수개로 형성된 봉 형태의 가스 배출관(170)이 각각 복수개로 설치된다. 가스 공급관(160)과 가스 배출관(170)은 기판(10)의 장변측에 대향하여 설치하는 것이 바람직하다. 열처리 분위기 조성용 가스는 질소, 아르곤 등을 사용한다.As shown, the chamber 100 has a rod-shaped gas supply pipe having a plurality of first gas holes 162 for discharging the atmosphere gas in order to supply the atmosphere gas for forming the heat treatment atmosphere into the chamber 100. 160 and a plurality of rod-shaped gas discharge pipes 170 each including a plurality of second gas holes (not shown) through which waste gas used in the heat treatment atmosphere is introduced are provided. The gas supply pipe 160 and the gas discharge pipe 170 are preferably provided to face the long side of the substrate 10. Nitrogen, argon, etc. are used for the heat processing atmosphere composition gas.
본 실시예에서 가스 공급관(160)과 가스 배출관(170)은 각각 4개씩 설치되는 것으로 되어 있으나, 가스 공급관(160)과 가스 배출관(170)의 개수는 기판(10)의 크기에 따라 다양하게 변경될 수 있다.In this embodiment, four gas supply pipes 160 and four gas discharge pipes 170 are installed, but the number of the gas supply pipes 160 and the gas discharge pipes 170 is changed in various ways according to the size of the substrate 10. Can be.
가스 공급관(160)에 형성되는 제1 가스 구멍(162)의 위치는 분사되는 분위기 가스가 기판(10)에 바로 접촉할 수 있도록 가능한 기판(10)에 근접하도록 한다. 따라서, 제1 가스 구멍(162)의 개수는 챔버(100)에 로딩되는 기판(10)의 개수와 동일하게 하는 것이 바람직하다. 가스 배출관(170)에 형성되는 제2 가스 구멍(미도시)도 마찬가지이다.The position of the first gas hole 162 formed in the gas supply pipe 160 may be as close to the substrate 10 as possible so that the injected atmospheric gas may directly contact the substrate 10. Therefore, the number of first gas holes 162 is preferably equal to the number of substrates 10 loaded in the chamber 100. The same applies to the second gas hole (not shown) formed in the gas discharge pipe 170.
도 7과 도 8은 본 발명의 일 실시예에 따른 배치식 열처리 장치(1)의 단위 메인 히터(200)의 배열 상태를 나타내는 도면이다. 본 발명에서는 필요에 따라 메인 히터 유닛(120)간의 단위 메인 히터(200)의 배열을 다양하게 변경할 수 있다.7 and 8 are views showing the arrangement of the unit main heater 200 of the batch heat treatment apparatus 1 according to an embodiment of the present invention. In the present invention, the arrangement of the unit main heaters 200 between the main heater units 120 may be variously changed as necessary.
도 7은 도 1과 도 2를 참조하여 설명한 본 실시예에서 채택하고 있는 메인 히터 유닛(120)간의 단위 메인 히터(200)의 배열 상태를 나타내는 도면이다. 도시한 바와 같이, 어느 하나의 메인 히터 유닛(120a)을 구성하는 단위 메인 히터(200)는 해당 메인 히터 유닛(120a)과 이웃하고 있는 메인 히터 유닛(120b)을 구성하는 단위 메인 히터(200)와 정렬되게 배치될 수 있다.FIG. 7 is a diagram illustrating an arrangement state of the unit main heaters 200 between the main heater units 120 employed in the present embodiment described with reference to FIGS. 1 and 2. As illustrated, the unit main heater 200 constituting any one main heater unit 120a is the unit main heater 200 constituting the main heater unit 120b adjacent to the main heater unit 120a. It may be arranged to be aligned with.
한편, 도 8을 참조하면, 어느 하나의 메인 히터 유닛(120a)을 구성하는 단위 메인 히터(200)는 해당 메인 히터 유닛(120a)과 이웃하고 있는 메인 히터 유닛(120b)을 구성하는 단위 메인 히터(200)와 어긋나게 배치될 수 있다. 예를 들어, 도 8에서, 메인 히터 유닛(120a)을 구성하는 단위 메인 히터(200)는 메인 히터 유닛(120b)를 구성하는 단위 메인 히터(200) 사이의 중간 위치에 정렬되어 있다. 도 8에서와 같이 메인 히터 유닛(120)간의 단위 메인 히터(200)의 배열 상태를 변경함으로써 챔버(100)에 로딩된 기판(10)의 전면적에 걸쳐 열처리가 보다 균일하게 이루어질 수 있다.Meanwhile, referring to FIG. 8, the unit main heater 200 constituting any one main heater unit 120a includes the unit main heater constituting the main heater unit 120b adjacent to the corresponding main heater unit 120a. It may be disposed to deviate from 200. For example, in FIG. 8, the unit main heater 200 constituting the main heater unit 120a is aligned at an intermediate position between the unit main heaters 200 constituting the main heater unit 120b. As shown in FIG. 8, the heat treatment may be performed more uniformly over the entire area of the substrate 10 loaded in the chamber 100 by changing the arrangement state of the unit main heaters 200 between the main heater units 120.
이하 본 발명에 따른 배치식 열처리 장치(1)의 동작을 도면을 참조하여 설명하면 다음과 같다. Hereinafter, the operation of the batch heat treatment apparatus 1 according to the present invention will be described with reference to the drawings.
먼저, 도 1에서와 같이, 작업자는 챔버(100)의 일측에 설치된 도어(104)를 하부로 이동시켜 개방한다. First, as shown in Figure 1, the operator moves the door 104 installed on one side of the chamber 100 to the lower side to open.
이후, 기판 이송 장치의 트랜스퍼 암(미도시)의 상부면에 기판(10)을 홀더(12)에 탑재한 상태로 안착시키고, 트랜스퍼 암을 이동시켜서 챔버(100) 내부로 기판을 로딩한다. Subsequently, the substrate 10 is mounted on the upper surface of the transfer arm (not shown) of the substrate transfer apparatus while being mounted on the holder 12, and the transfer arm is moved to load the substrate into the chamber 100.
챔버(100) 내부로 로딩되는 기판(10)은 도 4에 도시한 바와 같이 챔버(100) 내부에 설치되어 있는 보트(108)에 차례로 적층된다. 본 실시예에서는 3개의 기판(10)이 보트(108)에 적층된다.The substrate 10 loaded into the chamber 100 is sequentially stacked on the boat 108 installed inside the chamber 100 as shown in FIG. 4. In this embodiment, three substrates 10 are stacked on the boat 108.
이후, 보트(108)에 기판(10)의 적층이 완료되면 도어(104)를 상부로 이동시켜 챔버(100)의 내부를 외부 환경과 격리시킨 후 메인 히터 유닛(120)에 전원을 인가하여 기판(10)에 대한 열처리가 진행될 수 있도록 한다. Subsequently, when the stacking of the substrate 10 is completed on the boat 108, the door 104 is moved upward to isolate the interior of the chamber 100 from the external environment, and then the power is applied to the main heater unit 120. Allow heat treatment for (10) to proceed.
챔버(100)에 설치되어 있는 4개의 메인 히터 유닛(120)은 기판(10)의 상부와 하부에 소정 거리만큼 이격된 위치에 설치되어 있고, 각 메인 히터 유닛(120)은 일정 간격을 가지면서 배치되는 14개의 단위 메인 히터(200)로 이루어져 있어서, 기판(10)의 전면적에 걸쳐 균일하게 열이 인가되어 균일한 열처리가 진행되도록 한다. Four main heater units 120 installed in the chamber 100 are installed at positions spaced apart by a predetermined distance from the upper and lower portions of the substrate 10, and each main heater unit 120 has a predetermined interval 14 unit main heaters 200 are arranged, the heat is uniformly applied over the entire surface of the substrate 10 to perform a uniform heat treatment.
한편, 메인 히터 유닛(120)의 4 외주부에 설치된 제1 보조 히터 유닛(140a)과 제2 보조 히터 유닛(140b)을 작동시켜서 열처리 공정의 진행 중에 발생할 수 있는 챔버(100) 내부의 열 손실을 방지한다. 이로써 기판(10)의 전면적에 걸쳐 보다 균일한 열처리가 이루어질 수 있다.On the other hand, by operating the first auxiliary heater unit 140a and the second auxiliary heater unit 140b installed at the four outer circumferences of the main heater unit 120 to prevent heat loss inside the chamber 100 that may occur during the heat treatment process. prevent. As a result, a more uniform heat treatment may be performed over the entire surface of the substrate 10.
실제로 열처리를 진행하기 전에 챔버(100) 내부를 열처리 분위기로 조성한다. 이를 위하여 가스 공급관(160)을 통해 챔버(100) 내부로 질소 또는 아르곤과 같은 분위기 가스를 공급한다. 열처리 분위기 조성에 사용된 폐가스는 가스 공급관(160)과 대향하여 설치되어 있는 가스 배출관(170)을 통하여 챔버(100) 외부로 배출된다. Before actually performing the heat treatment, the chamber 100 is formed in a heat treatment atmosphere. To this end, an atmosphere gas such as nitrogen or argon is supplied into the chamber 100 through the gas supply pipe 160. The waste gas used for the heat treatment atmosphere composition is discharged to the outside of the chamber 100 through the gas discharge pipe 170 installed to face the gas supply pipe 160.
열처리 과정이 완료되면 챔버(100) 내부를 신속하게 냉각시킨다. 이를 위하여 냉각관(180)을 통해 챔버(100) 내부로 헬륨, 질소, 아르곤과 같은 냉각용 가스가 흐르도록 한다. 냉각용 가스는 챔버(100) 내부를 관통하여 흐르면서 챔버(100) 내부의 열을 빼앗아 챔버(100) 내부의 온도를 급격하게 하강시킨다. 이로써, 열처리 공정이 완료된 후 이른 시간 내에 기판(10)의 언로딩 작업을 진행할 수 있어서 열처리 공정의 생산성이 향상된다.When the heat treatment process is complete, the chamber 100 is cooled quickly. To this end, a cooling gas such as helium, nitrogen, and argon flows into the chamber 100 through the cooling tube 180. The cooling gas flows through the inside of the chamber 100 and takes heat from the inside of the chamber 100 to drastically lower the temperature inside the chamber 100. Thereby, unloading of the board | substrate 10 can be performed within the early time after a heat processing process is completed, and productivity of a heat processing process improves.
끝으로, 챔버(100) 내부의 온도가 적정 수준으로 하강하면, 도어(104)를 개방한 후 트랜스퍼 암을 이용하여 챔버(100)에서 기판(10)을 언 로딩하여 열처리 공정이 최종 완료된다.Finally, when the temperature inside the chamber 100 drops to an appropriate level, the heat treatment process is finally completed by opening the door 104 and unloading the substrate 10 from the chamber 100 using the transfer arm.
상기와 같이 구성된 배치식 열처리 장치에서 메인 히터 유닛(120)을 구성하는 단위 메인 히터(이하에서는 '히터'로 칭함)(200)는 다음과 같이 구성될 수 있다. In the batch heat treatment apparatus configured as described above, the unit main heater (hereinafter, referred to as a “heater”) constituting the main heater unit 120 may be configured as follows.
도 9는 본 발명의 일 실시예에 따른 히터(200)의 구성을 나타내는 사시도이다. 도시한 바와 같이, 히터(200)는 소정의 길이를 갖는 봉형으로 이루어져 있다. 도 9를 참조하면, 히터(200)는 발열체(202)와 커버(204)로 구성되어 있다. 발열체(202)는 외부의 전원을 공급받아 기판(10)의 열처리에 필요한 열을 발생시킨다. 발열체(202)의 재질은 칸탈(Kanthal)인 것이 바람직하다. 커버(204)는 발열체(202)를 보호한다. 커버(204)의 재질은 석영인 것이 바람직하다. 9 is a perspective view showing the configuration of a heater 200 according to an embodiment of the present invention. As shown in the drawing, the heater 200 has a rod shape having a predetermined length. Referring to FIG. 9, the heater 200 includes a heating element 202 and a cover 204. The heating element 202 is supplied with external power to generate heat for heat treatment of the substrate 10. It is preferable that the material of the heating element 202 is Kanthal. The cover 204 protects the heating element 202. The material of the cover 204 is preferably quartz.
또한, 제1 및 제2 단위 보조 히터(150a, 150b)는 도 9에 도시된 히터(200)와 동일한 형상 및 구조를 가질 수 있다.In addition, the first and second unit auxiliary heaters 150a and 150b may have the same shape and structure as the heater 200 illustrated in FIG. 9.
도 10과 도 11은 본 발명의 다른 실시예에 따른 히터(200a)의 구성을 나타내는 단면 사시도 및 단면도이다. 참고로, 도 10과 도 11에서, 히터(200a)의 양단부측의 형상 및 구조는 동일하므로 편의상 히터(200a)의 일단부측 만을 도시하였다. 10 and 11 are cross-sectional perspective and sectional views showing the configuration of the heater 200a according to another embodiment of the present invention. For reference, in FIGS. 10 and 11, since the shape and structure of both end sides of the heater 200a are the same, only one end side of the heater 200a is illustrated for convenience.
도시한 바와 같이, 히터(200a)는 전체적으로 길이가 긴 봉 형상을 하고 있으나 반드시 이에 한정되는 것은 아니고 히터가 적용되는 배치식 열처리 장치의 사양에 따라 다양하게 변경할 수 있다.As shown, the heater 200a has a long rod shape as a whole, but is not necessarily limited thereto, and may be variously changed according to the specifications of the batch heat treatment apparatus to which the heater is applied.
도 10과 도 11을 참조하면, 히터(200a)는 소정의 길이를 갖는 제1 관(220), 소정의 길이를 가지면서 제1 관(220)의 외부를 둘러싸는 제2 관(240), 소정의 길이를 가지면서 제2 관(240)의 외부를 둘러싸는 제3 관(260) 및 제1 관(220)의 외주면에 일정한 간격으로 감겨서 설치되는 코일형 열선(270)을 포함하여 구성된다.Referring to FIGS. 10 and 11, the heater 200a includes a first tube 220 having a predetermined length, a second tube 240 surrounding the outside of the first tube 220 while having a predetermined length, It comprises a coil-shaped hot wire 270 wound around the outer surface of the third tube 260 and the first tube 220 having a predetermined length and installed at regular intervals surrounding the outer side of the second tube 240. do.
제1 관(220), 제2 관(240) 및 제3 관(260)의 재질은 제1 관(220), 제2 관(240) 및 제3 관(260) 모두 열처리 장치에 적용되기 때문에 융점이 높은 재질, 예를 들어 석영인 것이 바람직하다.Since the material of the first tube 220, the second tube 240, and the third tube 260 is that the first tube 220, the second tube 240, and the third tube 260 are all applied to the heat treatment apparatus. It is preferable that it is a material with high melting point, for example, quartz.
제1 관(220), 제2 관(240) 및 제3 관(260)의 길이는 모두 실질적으로 동일한 것이 바람직하다. 다만, 도시한 바와 같이, 후술할 단자부(500)의 도전관(510)과의 연결을 위하여 제1 관(220)의 길이는 제2 관(240) 및 제3 관(260)의 길이보다 도전관(510)의 길이만큼 더 길 수도 있다. 또한, 제1 관(220), 제2 관(240) 및 제3 관(260)은 모두 동축을 갖도록 하는 것이 바람직하나, 필요에 따라서는 제1 관(220)과 제2 관(240)은 서로 동축을 가지지만 제3 관(260)은 제1 관(220)과 제2 관(240)에 대하여 동축을 가지지 않도록 히터를 구성할 수도 있다. It is preferable that the lengths of the first tube 220, the second tube 240, and the third tube 260 are all substantially the same. However, as shown in the drawing, the length of the first tube 220 is greater than the length of the second tube 240 and the third tube 260 for connection with the conductive tube 510 of the terminal unit 500 to be described later. It may be as long as the length of the tube 510. In addition, the first tube 220, the second tube 240 and the third tube 260 are preferably all coaxial, but if necessary, the first tube 220 and the second tube 240 is Although coaxial with each other, the third tube 260 may configure the heater so as not to have a coaxial with respect to the first tube 220 and the second tube 240.
즉, 히터(200a)를 구성하는 제1, 제2 및 제3 관(220, 240, 260)의 중심축은 일치되도록 구성될 수도 있지만, 히터(200a)의 동작 도중에 제1 및 제2 관(220, 240)의 처짐이 발생할 수 있고 처짐 정도에 따라서는 제1 관(220) 또는 제2 관(240)이 파손될 수 있으므로, 이를 방지하기 위해 제2 관(240)을 제3 관(260)의 중심보다 하부에 위치되도록 하여 동작 도중 처짐이 발생되면 제3 관(260)과 접촉되어 지지될 수 있도록 하는 것이 바람직하다. That is, the center axes of the first, second and third tubes 220, 240, and 260 constituting the heater 200a may be configured to coincide with each other, but the first and second tubes 220 may be in operation during the operation of the heater 200a. , 240 may occur and the first tube 220 or the second tube 240 may be damaged depending on the degree of deflection, so that the second tube 240 may be replaced with the third tube 260. It is preferable to be positioned below the center so that the deflection occurs during operation so that the third tube 260 can be contacted and supported.
제1 관(220)은 외경이 대략 10mm, 내경은 대략 6mm, 두께는 2mm 정도인 것이 바람직하다. 제1 관(220)은 그 자체로 중앙에 빈 공간(224)을 갖는다.The first tube 220 preferably has an outer diameter of about 10 mm, an inner diameter of about 6 mm, and a thickness of about 2 mm. The first tube 220 itself has an empty space 224 in the center.
제1 관(220)의 외주면에는 발열체에 해당하는 열선(270)이 코일 형태로 감겨져 있다. 열선(270)의 재질은 니크롬 또는 칸탈(Kanthal) 중 어느 하나인 것이 바람직하다. The heating wire 270 corresponding to the heating element is wound in a coil form on the outer circumferential surface of the first tube 220. The material of the hot wire 270 is preferably any one of nichrome and Kanthal.
칸탈은 철을 주체로 하고 전기저항이 큰 합금으로서, 선재(線材)로 가공되어 발열체 등으로 사용되며, 철-크롬-알루미늄계에 속하며, 표준 성분은 크롬 23%, 알루미늄 6%로 그 외에 코발트 2%를 함유한다. Kanthal is an alloy composed mainly of iron and has high electrical resistance. It is processed into wire and used as a heating element. It belongs to iron-chromium-aluminum system, and standard components include 23% chromium and 6% aluminum. It contains 2%.
열선(270)의 직경은 0.6mm 내지 0.8mm의 범위를 갖는 것이 바람직하다.The diameter of the hot wire 270 preferably has a range of 0.6 mm to 0.8 mm.
열선(270)을 제1 관(220) 상에 감을 때 열선(270)의 피치는 발열량과 관계가 있다. 즉, 열선(270)의 피치가 작은 영역은 피치가 큰 영역과 비교할 때 발열량이 크다. 따라서, 기판을 균일하게 가열하기 위해서는 히터(200a)의 전 면적에 걸쳐서 발열량이 일정해야 하며 이를 위해서는 제1 관(220) 상의 위치에 관계없이 열선(270)의 피치는 동일한 것이 좋다. 다만, 필요에 따라서는 열선(270)의 피치를 제1 관(220) 상의 위치에 따라 변경할 수도 있다. 예를 들어, 제1 관(220)의 중심부측보다 단부측에서 열선(270)의 피치를 적게 하여(즉, 단부측에서 발열량을 많게 하여) 히터(200a)의 단부측이 외부 환경과 접함으로써 발생하는 열 손실을 보충할 수 있다.When the heating wire 270 is wound on the first tube 220, the pitch of the heating wire 270 is related to the amount of heat generated. In other words, the heat generation amount of the heat wire 270 is small compared to the area of the large pitch. Therefore, in order to uniformly heat the substrate, the heat generation amount must be constant over the entire area of the heater 200a. For this purpose, the pitch of the heating wire 270 is the same regardless of the position on the first tube 220. However, if necessary, the pitch of the heating wire 270 may be changed according to the position on the first tube 220. For example, by making the pitch of the heating wire 270 smaller on the end side than on the central side of the first tube 220 (that is, increasing the amount of heat generated at the end side), the end side of the heater 200a is in contact with the external environment. It can compensate for the heat loss that occurs.
열선(270)의 이탈을 방지하기 위해 고정캡(280)이 설치될 수 있다. 고정캡(280)의 구성은 후술하기로 한다. The fixing cap 280 may be installed to prevent the hot wire 270 from being separated. The configuration of the fixed cap 280 will be described later.
제2 관(240)은 제1 관(220)과 일정한 간격을 가지면서 제1 관(220)을 둘러싸는 형태로 설치된다. 제2 관(240)은 외경이 대략 18mm, 내경은 대략 14mm, 두께는 2mm 정도인 것이 바람직하다.The second tube 240 is installed in a form surrounding the first tube 220 while having a predetermined distance from the first tube 220. The second tube 240 preferably has an outer diameter of about 18 mm, an inner diameter of about 14 mm, and a thickness of about 2 mm.
제3 관(260)은 제2 관(240)과 일정한 간격을 가지면서 제2 관(240)을 둘러싸는 형태로 설치된다. 제3 관(260)은 외경이 대략 30mm, 내경은 대략 22mm, 두께는 4mm 정도로 구성되는 것이 바람직하다. 제2 관(240)과 제3 관(260) 사이에는 대략 2mm 정도의 간격을 갖는 빈 공간(264)이 형성된다.The third tube 260 is installed in a form surrounding the second tube 240 while having a predetermined distance from the second tube 240. The third tube 260 is preferably configured to have an outer diameter of about 30 mm, an inner diameter of about 22 mm, and a thickness of about 4 mm. An empty space 264 having an interval of about 2 mm is formed between the second tube 240 and the third tube 260.
제1 관(220)의 단부에는 제1 관(220)의 외주면에 감겨있는 열선(270)으로 전원을 인가할 수 있도록 후술하는 도전관(510)이 설치된다. 도전관(510)을 통한 열선(270)과 외부 전원(미도시)간의 연결 방식은 특별하게 제한되지 않으며 이에 대한 상세한 설명은 생략한다.At the end of the first tube 220 is provided a conductive tube 510 which will be described later to apply power to the heating wire 270 wound around the outer circumferential surface of the first tube 220. The connection method between the heating wire 270 and the external power source (not shown) through the conductive tube 510 is not particularly limited and a detailed description thereof will be omitted.
한편, 히터(200a)는 열선(270)이 감겨져 있는 제1 관(220)이 제2 관(240) 또는 제3 관(260)으로부터 용이하게 탈착이 가능하도록 구현되는 것이 바람직하다. 이는 히터(200a)의 사용 도중에 열선(270)이 끊어지는 등의 문제점이 발생한 경우에 열처리 장치에 장착되어 있는 히터(200a)에서 열선(270)이 감겨져 있는 제1 관(220)만을 분리시켜 이를 수리 또는 교체함으로써 불량이 난 히터(200a)를 간단하게 수리 또는 교체할 수 있는 이점이 있다.On the other hand, the heater (200a) is preferably implemented so that the first tube 220 is wound around the heating wire 270 can be easily detached from the second tube 240 or the third tube (260). This is to separate only the first pipe 220 in which the heating wire 270 is wound from the heater 200a mounted on the heat treatment apparatus when a problem such as the heating wire 270 is cut off during the use of the heater 200a. By repairing or replacing, there is an advantage of simply repairing or replacing the defective heater 200a.
한편, 히터(200a)는 제1 관(220), 제2 관(240) 및 제3 관(260)을 기본적인 구성으로 하고 있으나 반드시 이에 한정되는 것은 아니고 전체적인 구성의 간략화를 위해 제3 관(260)을 생략하여 구성할 수도 있다. 제1 관과 제2 관으로만 구성되어 있는 히터의 구성에 대하여는 후술하기로 한다. On the other hand, the heater (200a) has a basic configuration of the first tube 220, the second tube 240 and the third tube 260, but is not necessarily limited to this, and the third tube 260 to simplify the overall configuration May be omitted. The structure of the heater which consists only of a 1st pipe | tube and a 2nd pipe | tube is mentioned later.
상술한 바와 같이, 히터(200a)는 히터(200a) 내부로 냉각용 가스가 흐를 수 있는 공간(224, 264)을 포함하고 있다. 따라서, 열처리 장치(1)에서 열처리 공정이 종료된 후에 히터(200a)의 공간(224, 264)을 통하여 냉각용 가스를 흘려 주면 히터(200a) 자체의 온도를 신속하게 떨어뜨리고 나아가 챔버 내부의 온도를 신속하게 떨어뜨릴 수 있다. 그 결과, 열처리 공정 종료 후에 기판(10)의 언로딩을 위하여 챔버 내부의 온도를 소정의 온도 미만으로 떨어뜨리는 데에 걸리는 시간을 단축할 수가 있어서 평판 디스플레이 및 태양전지의 제조에 필요한 열처리 공정의 생산성을 크게 향상시킬 수 있다.As described above, the heater 200a includes spaces 224 and 264 through which a cooling gas may flow into the heater 200a. Therefore, if the cooling gas flows through the spaces 224 and 264 of the heater 200a after the heat treatment process is completed in the heat treatment apparatus 1, the temperature of the heater 200a itself is rapidly lowered, and the temperature inside the chamber is further reduced. Can be dropped quickly. As a result, it is possible to shorten the time it takes to lower the temperature inside the chamber below a predetermined temperature for the unloading of the substrate 10 after the end of the heat treatment process, so that the productivity of the heat treatment process required for manufacturing flat panel displays and solar cells is reduced. Can greatly improve.
한편, 히터(200a)의 냉각을 위해 제1 및 제2 냉각부(300, 400)가 설치될 수 있다. 또한, 히터(200a)의 동작을 위해 단자부(500) 및 절연부(600)가 설치될 수 있다. Meanwhile, the first and second cooling units 300 and 400 may be installed to cool the heater 200a. In addition, the terminal unit 500 and the insulation unit 600 may be installed to operate the heater 200a.
도 12는 본 발명의 일 실시예에 따른 히터(200a)의 단부에 제1 및 제2 냉각부(300, 400), 단자부(500) 및 절연부(600)가 설치된 상태를 나타내는 도면이다. 12 is a view illustrating a state in which the first and second cooling units 300 and 400, the terminal unit 500, and the insulation unit 600 are installed at ends of the heater 200a according to the exemplary embodiment of the present invention.
도 13은 본 발명의 일 실시예에 따른 히터의 단부에 설치되는 제1 및 제2 냉각부(300, 400)의 구성을 나타내는 분해 사시도이다.FIG. 13 is an exploded perspective view illustrating a configuration of the first and second cooling units 300 and 400 installed at the end of the heater according to the embodiment of the present invention.
우선, 고정캡(280)이 제2 관(240)의 양 단부에 설치될 수 있다. 고정캡(280)은 제1 관(220)의 외주면에 감겨있는 열선(270)이 빠져 나오는 것을 방지한다. First, the fixing cap 280 may be installed at both ends of the second tube 240. The fixing cap 280 prevents the heating wire 270 wound around the outer circumferential surface of the first tube 220 to escape.
고정캡(280)은 소정의 길이를 갖는 원통형으로 형성된다. 고정캡(280)은 일단이 제2 관(240)이 내측으로 삽입된 후 밀착될 수 있도록 형성되고, 타단은 제1 관(220)과 제2 관(240) 사이에 형성된 공간(244)을 폐쇄할 수 있을 정도의 크기를 갖는 링 형태로 형성된다. 고정캡(280)이 제2 관(240)의 단부에 설치되면 제1 관(220)의 외주면에 감겨있는 열선(270)의 일단이 고정캡(280)에 접촉하며 이동이 방지되어 제1 관(220)과 제2 관(240)의 사이에서 외부로 이탈하지 못하게 된다. The fixing cap 280 is formed in a cylindrical shape having a predetermined length. Fixed cap 280 is formed so that one end can be in close contact with the second tube 240 is inserted into the inside, the other end is a space 244 formed between the first tube 220 and the second tube 240 It is formed in the shape of a ring that is large enough to be closed. When the fixing cap 280 is installed at the end of the second tube 240, one end of the heating wire 270 wound around the outer circumferential surface of the first tube 220 contacts the fixing cap 280 and is prevented from moving. Between the 220 and the second tube 240 can not escape to the outside.
고정캡(280)은 SUS 재질로 형성하여 외부에서 인가되는 전원을 고정캡(280)에 접촉하는 열선(270)으로 인가할 수 있도록 하는 것이 바람직하다. The fixing cap 280 is preferably made of SUS material so that the power applied from the outside may be applied to the heating wire 270 in contact with the fixing cap 280.
제1 관(220)은 고정캡(280)의 중앙을 통과하여 외부로 연장되고, 연장된 부분의 외주에는 나사산이 형성되어 후술하는 단자부(500)와의 연결을 용이하게 한다. The first tube 220 extends to the outside through the center of the fixing cap 280, the thread is formed on the outer periphery of the extended portion to facilitate the connection with the terminal portion 500 to be described later.
제1 냉각부(300)는 히터(200a)의 단부를 냉각한다. 제1 냉각부(300)는 냉각수를 이용하여 히터(200a)의 단부, 즉, 히터(200a)를 구성하는 제3 관(260)의 단부를 냉각시킴으로써 제3 관(260)이 열손상을 입는 것을 방지할 수 있다. The first cooling unit 300 cools the end of the heater 200a. The first cooling unit 300 cools an end portion of the heater 200a, that is, an end portion of the third tube 260 constituting the heater 200a by using the coolant, so that the third tube 260 is damaged. Can be prevented.
제2 냉각부(400)는 제2 관(240)과 제3 관(260) 사이에 형성된 공간으로 냉각 가스를 유입시킨다. 냉각용 가스로는 공기, 헬륨, 질소, 아르곤을 사용할 수 있다. 냉각용 가스의 온도는 대략 상온인 것이 바람직하나 필요에 따라서는 상온 미만의 온도로 냉각된 가스를 사용할 수도 있다.The second cooling unit 400 introduces the cooling gas into the space formed between the second tube 240 and the third tube 260. As the cooling gas, air, helium, nitrogen, argon may be used. The temperature of the gas for cooling is preferably about room temperature, but if necessary, a gas cooled to a temperature below room temperature may be used.
제1 및 제2 냉각부(300, 400)는 히터(200a)를 구성하는 제3 관(260)의 양단에 동일하게 설치될 수 있다. The first and second cooling units 300 and 400 may be equally installed at both ends of the third pipe 260 constituting the heater 200a.
제1 냉각부(300)의 구성을 살펴보기로 한다. The configuration of the first cooling unit 300 will be described.
제1 냉각부(300)는 외부에서 공급받은 냉각수를 이용하여 제3 관(260)의 단부를 냉각한다. 제1 냉각부(300)는 히터(200a)를 구성하는 제3 관(260)의 양 단부에 설치된다. The first cooling unit 300 cools an end portion of the third pipe 260 using cooling water supplied from the outside. The first cooling unit 300 is installed at both ends of the third pipe 260 constituting the heater 200a.
제1 냉각부(300)는 제1 본체(310)와 제1 본체(310)의 일측으로 설치되는 냉각수 유입관(320) 및 냉각수 유출관(330)으로 구성될 수 있다. The first cooling unit 300 may include a coolant inlet pipe 320 and a coolant outlet pipe 330 installed to one side of the first body 310 and the first body 310.
제1 본체(310)는 외부에서 냉각수를 공급받는다. 제1 본체(310)는 내부에 소정의 공간이 형성되어 있다. 제1 본체(310)는 링 형태로 형성되고, 후술하는 플랜지(340)에 의해 챔버(100)에 고정될 수 있도록 외주 직경은 플랜지(340)의 내주 직경에 해당하는 정도로 형성되고, 제1 본체(310)의 내주 직경은 제3 관(260)의 외주 직경에 해당하는 수준으로 형성될 수 있다. The first body 310 is supplied with cooling water from the outside. The first body 310 has a predetermined space formed therein. The first body 310 is formed in a ring shape, the outer circumferential diameter is formed to correspond to the inner circumferential diameter of the flange 340 to be fixed to the chamber 100 by the flange 340 to be described later, the first body The inner diameter of the 310 may be formed at a level corresponding to the outer diameter of the third tube 260.
제1 본체(310)의 일단은 챔버(100)의 외벽에 밀착되므로, 챔버(100)에 밀착되는 면에 오 링(312)을 배치하여 가스 누출 등이 방지될 수 있도록 하는 것이 바람직하다. Since one end of the first body 310 is in close contact with the outer wall of the chamber 100, the O-ring 312 may be disposed on the surface closely contacting the chamber 100 to prevent gas leakage.
냉각수 유입관(320) 및 냉각수 유출관(330)은 제1 본체(310) 내부의 공간으로 냉각수를 유입 및 유출이 가능하게 하여 제3 관(260)의 단부를 냉각할 수 있다. 냉각수 유입관(320) 및 냉각수 유출관(330)은 제1 본체(310)의 중심축에 대하여 소정의 각거리를 두고 이격되어 설치될 수 있다. The coolant inlet pipe 320 and the coolant outlet pipe 330 may cool the end of the third pipe 260 by allowing the coolant to flow in and out of the space inside the first body 310. The coolant inlet pipe 320 and the coolant outlet pipe 330 may be spaced apart from each other at a predetermined angular distance with respect to the central axis of the first body 310.
제1 냉각부(300)가 설치되어 있는 히터(200a)의 양 단부에는 히터(200a)의 제2 관(240)과 제3 관(260) 사이의 공간(264)으로 냉각용 가스가 흐르도록 하는 제2 냉각부(400)가 설치될 수 있다. Cooling gas flows into the space 264 between the second tube 240 and the third tube 260 of the heater 200a at both ends of the heater 200a in which the first cooling unit 300 is installed. The second cooling unit 400 may be installed.
제2 냉각부(400)의 구성을 살펴보기로 한다. The configuration of the second cooling unit 400 will be described.
제2 냉각부(400)는 내부에 공간이 형성되어 있는 링 형태의 제2 본체(410)와 제2 본체(410)의 일측으로 설치되어 제2 본체(410)의 내부에 형성되는 공간과 연결되는 가스관(420)으로 구성된다. The second cooling unit 400 is connected to a space formed inside the second body 410 by being installed at one side of the second body 410 and the second body 410 in a ring shape having a space formed therein. The gas pipe 420 is formed.
제2 본체(410)의 일단은 제2 관(240)과 제3 관(260)의 사이에 형성된 공간(264)과 유통할 수 있도록 개방되어 있다. 따라서, 가스관(420)을 통해 유입된 냉각용 가스가 제2 본체(410)를 통해 제2 관(240)과 제3 관(260)의 사이에 형성된 공간(264)으로 유입될 수 있고, 냉각 후에는 다시 제2 본체(410)를 통해 외부로 배출될 수 있다. One end of the second body 410 is open to allow flow to the space 264 formed between the second tube 240 and the third tube 260. Accordingly, the cooling gas introduced through the gas pipe 420 may be introduced into the space 264 formed between the second pipe 240 and the third pipe 260 through the second body 410, and may be cooled. Afterwards, it may be discharged to the outside through the second body 410 again.
제2 냉각부(400)는 제3 관(260)의 양단에 각각 설치되므로, 제3 관(260) 일단에 설치된 제2 냉각부(400)의 가스관(420)을 통해 냉각용 가스가 공급된다면, 냉각용 가스는 제2 관(240)과 제3 관(260)의 사이에 형성된 공간(264)을 통과한 후, 제3 관(260)의 타단에 설치된 제2 냉각부(400)의 가스관(420)을 통해 배기될 수 있다.Since the second cooling unit 400 is installed at both ends of the third tube 260, respectively, the cooling gas is supplied through the gas pipe 420 of the second cooling unit 400 installed at one end of the third tube 260. After the gas for cooling passes through the space 264 formed between the second tube 240 and the third tube 260, the gas tube of the second cooling unit 400 installed at the other end of the third tube 260. May be exhausted through 420.
제1 및 제2 냉각부(300, 400)의 설치 과정에 대하여 살펴보기로 한다. The installation process of the first and second cooling units 300 and 400 will be described.
제1 냉각부(300)는 플랜지(340)에 의해 챔버(100)의 외부면에 밀착되어 고정될 수 있다. 이때, 제1 냉각부(300)가 챔버(100)의 외벽에 용이하게 고정될 수 있도록 하는 것이 바람직하다. 따라서, 플랜지(340)에 의해 제1 냉각부(300)의 고정이 용이하도록 플랜지(340)의 일단과 제1 본체(310)의 일단은 서로 걸릴 수 있도록 구성되는 것이 바람직하다. The first cooling unit 300 may be fixed to the outer surface of the chamber 100 by the flange 340. In this case, the first cooling unit 300 may be easily fixed to the outer wall of the chamber 100. Therefore, one end of the flange 340 and one end of the first body 310 is preferably configured to be caught by each other so that the first cooling unit 300 is easily fixed by the flange 340.
플랜지(340)는 챔버(100)의 외벽에 밀착된 상태에서 챔버(100)의 외벽에 볼트 고정될 수 있다. 제1 냉각부(300)가 챔버(100)의 외부에 견고하게 고정될 수 있다면, 플랜지(340)와 챔버(100)의 고정 방식은 볼트 고정 방식 이외에도 다양한 방법으로 고정될 수 있다. The flange 340 may be bolted to the outer wall of the chamber 100 in close contact with the outer wall of the chamber 100. If the first cooling unit 300 may be firmly fixed to the outside of the chamber 100, the fixing method of the flange 340 and the chamber 100 may be fixed in various ways in addition to the bolt fixing method.
제1 냉각부(300)가 플랜지(340)에 의해 챔버(100)에 고정된 상태에서 제1 냉각부(300)와 제3 관(260)의 고정 상태를 견고히 하기 위해, 제1 본체(310)와 제3 관(260)의 사이에 형성된 공간으로는 칼라(collar)(350) 및 칼라(350)의 양단으로 배치되는 오 링(352)이 배치될 수 있고, 칼라(350)의 일단으로는 히터 커버(360)가 배치될 수 있다. In order to secure the fixed state of the first cooling unit 300 and the third tube 260 in a state where the first cooling unit 300 is fixed to the chamber 100 by the flange 340, the first main body 310 is fixed. ) And an o-ring 352 disposed at both ends of the collar 350 and the collar 350 may be disposed as a space formed between the third tube 260 and one end of the collar 350. The heater cover 360 may be disposed.
칼라(350) 및 오 링(352)은 제1 본체(310)와 제3 관(260) 사이에 발생될 수 있는 틈새를 밀폐시킴으로써 챔버(100) 내부로의 가스의 유입을 방지할 수 있으므로, 챔버(100) 내부의 진공 유지를 용이하게 할 수 있다. Since the collar 350 and the o-ring 352 may prevent the inflow of gas into the chamber 100 by closing a gap that may occur between the first body 310 and the third tube 260, It is easy to maintain the vacuum in the chamber 100.
히터 커버(360)는 제3 관(260)과 제1 본체(310)의 고정을 견고히 할 수 있다. 히터 커버(360)는 제1 본체(310)의 일단에 볼트 고정될 수 있다. 히터 커버(360)의 고정 상태를 견고히 하기 위해 칼라(350)와 히터 커버(360)의 외주 직경은 제1 본체(310)의 내주면에 밀착되는 정도로 형성되는 것이 바람직하다. The heater cover 360 may firmly fix the third tube 260 and the first body 310. The heater cover 360 may be bolted to one end of the first body 310. In order to secure the fixing state of the heater cover 360, the outer circumference diameters of the collar 350 and the heater cover 360 are preferably formed to be in close contact with the inner circumferential surface of the first body 310.
제1 냉각부(300)의 설치가 완료된 후, 고정캡(280)을 통해 연장되어 있는 제1 관(220)의 단부에 제2 본체(410)를 설치하고, 제1 관(220)의 단부로는 후술하는 단자부(500)를 나사 연결하며, 연결된 단자부(500)는 제2 본체(410)의 일단에 밀착시킴으로써, 제2 냉각부(400)가 고정되도록 한다. 제2 냉각부(400)의 고정을 위해 히터 커버(360)와 제2 본체(410)도 볼트 결합되는 것이 바람직하다.After the installation of the first cooling unit 300 is completed, the second body 410 is installed at the end of the first tube 220 extending through the fixing cap 280, the end of the first tube 220 The furnace is screwed to the terminal unit 500 to be described later, the connected terminal unit 500 is in close contact with one end of the second body 410, so that the second cooling unit 400 is fixed. In order to fix the second cooling unit 400, the heater cover 360 and the second body 410 may also be bolted.
단자부(500)와 절연부(600)의 설치 과정에 대하여 살펴보기로 한다.The installation process of the terminal unit 500 and the insulation unit 600 will be described.
도 14는 본 발명의 일 실시예에 따른 히터(200a)의 단부에 설치되는 단자부(500) 및 절연부(600)의 구성을 나타내는 분해 사시도이다.14 is an exploded perspective view showing the configuration of the terminal unit 500 and the insulating unit 600 installed at the end of the heater 200a according to an embodiment of the present invention.
단자부(500)의 구성을 살펴보기로 한다. The configuration of the terminal unit 500 will be described.
단자부(500)는 도전관(510)과 제1 고정 너트(520)로 구성될 수 있다. The terminal unit 500 may be composed of a conductive pipe 510 and a first fixing nut 520.
도 15, 16 및 도 17은 본 발명의 일 실시예에 따른 도전관(510)의 구성을 나타내는 도면이다.15, 16 and 17 are views showing the configuration of the conductive pipe 510 according to an embodiment of the present invention.
도 15, 16 및 도 17을 참조하면, 도전관(510)은 일단이 고정캡(280)의 단부에 접촉하며 외부의 전원선이 연결된다. 도전관(510)은 제1 관(220)의 단부에 나사 연결될 수 있다. 도전관(510)은 고정캡(280)으로의 전원 인가를 용이하게 하기 위해 고정캡(280)과 같은 SUS 재질로 형성될 수 있다. 도전관(510)으로 연결되는 전원선은 도전관(510)의 일측에 용접에 의해 연결할 수도 있지만, 후술하는 제1 고정 너트(520)와 도전관(510)의 사이에 전원선의 단부를 위치시켜 연결할 수도 있다. 15, 16 and 17, one end of the conductive tube 510 is in contact with the end of the fixing cap 280 and the external power line is connected. The conductive tube 510 may be screwed to the end of the first tube 220. The conductive tube 510 may be formed of a SUS material such as the fixing cap 280 to facilitate the application of power to the fixing cap 280. The power line connected to the conductive tube 510 may be connected to one side of the conductive tube 510 by welding, but the end of the power line may be positioned between the first fixing nut 520 and the conductive tube 510 which will be described later. You can also connect.
제1 고정 너트(520)는 도전관(510)과 고정캡(280)의 연결 상태가 유지될 수 있도록 도전관(510)의 일단을 압착한다. 제1 고정 너트(520)는 제1 관(220)에 단부에 나사 결합된다. 제1 고정 너트(520)는 석영 재질로 형성될 수 있다. 제1 고정 너트(520)는 일반적인 너트와 동일한 구성이므로 이에 대한 상세한 도시는 생략한다. The first fixing nut 520 compresses one end of the conductive tube 510 so that the connection state between the conductive tube 510 and the fixing cap 280 is maintained. The first fixing nut 520 is screwed to the end of the first tube 220. The first fixing nut 520 may be formed of quartz material. Since the first fixing nut 520 has the same configuration as a general nut, a detailed illustration thereof will be omitted.
도 18 및 도 19는 본 발명의 일 실시예에 따른 제1 보호 너트(530)의 구성을 나타내는 도면이다. 또한, 도 20, 도 21 및 도 22는 본 발명의 일 실시예에 따른 제2 보호 너트(540)의 구성을 나타내는 도면이다. 18 and 19 are views showing the configuration of the first protective nut 530 according to an embodiment of the present invention. 20, 21 and 22 are views showing the configuration of the second protective nut 540 according to an embodiment of the present invention.
제1 및 제2 보호 너트(530, 540)는 도전관(510)을 제1 관(220)의 단부에 결합시킨 상태에서 외부의 충격이 인가되어 도전관(510) 또는 제1 관(220)을 손상시키는 것을 방지한다. 제1 및 제2 보호 너트(530, 540)는 고정캡(280)과 절연캡(610) 사이에 도전관(510)의 외부를 둘러싸는 형태로 설치될 수 있다. The first and second protective nuts 530 and 540 are provided with an external impact in a state in which the conductive pipe 510 is coupled to the end of the first pipe 220 so that an external impact is applied to the conductive pipe 510 or the first pipe 220. To prevent damage. The first and second protection nuts 530 and 540 may be installed to surround the outside of the conductive pipe 510 between the fixing cap 280 and the insulating cap 610.
열선(270)으로 전원을 인가하기 위해 설치되는 단자부(500)에서 전원이 누설되거나 다른 도전체가 단자부에 닿는 것을 방지할 수 있도록 절연부(600)가 설치되는 것이 바람직하다. The insulation unit 600 may be installed to prevent the power from leaking from the terminal unit 500 installed to apply the power to the hot wire 270 or the other conductor from contacting the terminal unit.
절연부(600)의 구성을 살펴보기로 한다. The configuration of the insulation unit 600 will be described.
절연부(600)는 절연캡(610) 및 제2 고정 너트(630)를 포함하여 구성될 수 있다. The insulation unit 600 may include an insulation cap 610 and a second fixing nut 630.
도 23, 도 24 및 도 25는 본 발명의 일 실시예에 따른 절연캡(610)의 구성을 나타내는 도면이다.23, 24 and 25 are views showing the configuration of the insulating cap 610 according to an embodiment of the present invention.
도 23, 도 24 및 도 25을 참조하면, 절연캡(610)은 도전관(510)으로 인가되는 전원이 외부와 절연되도록 하는 역할을 수행한다. 절연캡(610)은 제1 관(220)의 단부에 도전관(510)과 제1 고정 너트(520)가 연결된 후, 제1 관(220)의 단부에 나사 결합될 수 있다. 이때, 절연캡(610)의 내부에 형성되어 있는 공간에는 도전관(510)과 제1 고정 너트(520)가 위치되도록 하고 그 내주면은 도전관(510)과 제1 고정 너트(520)와 이격되는 것이 바람직하다. Referring to FIGS. 23, 24, and 25, the insulating cap 610 serves to insulate the power applied to the conductive tube 510 from the outside. The insulating cap 610 may be screwed to the end of the first tube 220 after the conductive tube 510 and the first fixing nut 520 are connected to the end of the first tube 220. In this case, the conductive tube 510 and the first fixing nut 520 are positioned in a space formed inside the insulating cap 610, and an inner circumferential surface thereof is spaced apart from the conductive tube 510 and the first fixing nut 520. It is desirable to be.
절연캡(610)의 일측으로는 홀(620)이 형성되어, 절연캡(610) 내부의 도전관(510)으로 전원을 인가하기 위한 전원선이 통과할 수 있다. 절연캡(610)은 석영을 이용하여 제작하는 것이 바람직하다. A hole 620 is formed at one side of the insulating cap 610, and a power line for applying power to the conductive tube 510 inside the insulating cap 610 may pass therethrough. The insulating cap 610 is preferably manufactured using quartz.
제2 고정 너트(630)는 절연캡(610)이 제1 관(220)에 설치된 후, 절연캡(610)의 연결 상태가 유지될 수 있도록 한다. 제2 고정 너트(630)는 제1 관(220)의 종단부에 설치될 수 있다. The second fixing nut 630 allows the insulating cap 610 to be connected to the insulating cap 610 after the insulating cap 610 is installed in the first tube 220. The second fixing nut 630 may be installed at the end of the first tube 220.
상기와 같이 구성된 제1 및 제2 냉각부(300, 400), 단자부(500) 및 절연부(600)는 다음과 같이 작동할 수 있다. The first and second cooling units 300 and 400, the terminal unit 500, and the insulating unit 600 configured as described above may operate as follows.
챔버(100)로 로딩된 기판에 대하여 복수개의 히터(200a)를 이용하여 열을 가하여 열처리를 수행한다. 히터(200a)에서의 발열을 위해 공급되는 전원은 단자부(500)를 통해 히터(200a)의 열선(270)으로 공급되어 히터(200a)의 동작이 지속적으로 이루어질 수 있고, 전원이 공급되는 도중 절연부(600)에 의해 전원의 누설이 방지될 수 있다. Heat is performed by applying heat to the substrate loaded into the chamber 100 using a plurality of heaters 200a. The power supplied for the heat generation from the heater 200a is supplied to the heating wire 270 of the heater 200a through the terminal unit 500 so that the operation of the heater 200a can be continuously performed and insulated while the power is supplied. The leakage of power may be prevented by the unit 600.
히터(200a)를 동작시켜 열처리가 진행되는 도중, 히터(200a)의 양단에 설치된 제1 냉각부(300)를 이용하여 히터(200a)의 양단으로 냉각수를 유입시켜 히터(200a)의 단부를 냉각시킬 수 있다.While the heat treatment is performed by operating the heater 200a, the cooling water is introduced into both ends of the heater 200a by using the first cooling units 300 provided at both ends of the heater 200a to cool the end of the heater 200a. You can.
열처리 공정이 종료된 후에, 히터(200a)의 양단에 설치된 제2 냉각부(400)를 이용하여 히터(200a) 내의 공간(264)을 통하여 냉각용 가스를 흘려 주면 히터(200a) 자체의 온도를 신속하게 떨어뜨리고, 나아가 챔버(100) 내부의 온도를 신속하게 떨어뜨릴 수 있다. 따라서, 본 발명에 의한 열처리 장치(1)와 히터(200a)는 열처리 공정 종료 후에 기판(10)의 언로딩을 위하여 챔버(100) 내부의 온도를 소정의 온도 미만으로 떨어뜨리는 데에 걸리는 시간을 단축할 수가 있어서 평판 디스플레이 및 태양전지의 제조에 필요한 열처리 공정의 생산성을 크게 향상시킬 수 있다.After the heat treatment process is completed, when the cooling gas flows through the space 264 in the heater 200a using the second cooling units 400 installed at both ends of the heater 200a, the temperature of the heater 200a itself is increased. The temperature may be dropped quickly, and further, the temperature inside the chamber 100 may be rapidly dropped. Therefore, the heat treatment apparatus 1 and the heater 200a according to the present invention reduce the time taken to drop the temperature inside the chamber 100 below a predetermined temperature for the unloading of the substrate 10 after the heat treatment process is completed. Since it can shorten, productivity of the heat processing process required for manufacture of a flat panel display and a solar cell can be improved significantly.
한편, 히터(200a)의 계속적인 사용에 의해 제1 관(220), 제2 관(240) 또는 제3 관(260) 중 어느 하나의 관에 손상이 발생될 수 있다. 열처리의 진행을 계속 하기 위해서는 손상된 관의 교체가 필요하고 다음과 같은 과정을 거쳐서 교체하도록 한다. Meanwhile, damage to any one of the first tube 220, the second tube 240, and the third tube 260 may occur due to the continuous use of the heater 200a. In order to continue the heat treatment, the damaged tube needs to be replaced.
제1 관(220)과 제2 관(240)을 교체하는 경우에는 다음과 같다. When replacing the first tube 220 and the second tube 240 is as follows.
우선, 절연부(600)를 해체한다. 그리고, 제1 관(220)의 단부에 설치된 단자부(500)는 도전관(510)이 제1 관(220)과 나사 연결되어 있으므로, 제1 관(220) 양단의 도전관(510)을 제거하여 제1 관(220)에 대한 고정을 해제하면, 제1 관(220)을 교체할 수 있다. 이후, 고정캡(280)과 제2 냉각부(400)를 해체하면 제2 관(240)을 분리할 수 있다. 이와 같이 제1 관(220) 또는 제2 관(240) 중 교체가 필요한 관을 새로운 관으로 교환한 후, 상기한 해체의 역순으로 조립하도록 한다. First, the insulation part 600 is disassembled. In addition, since the conductive tube 510 is screw-connected with the first tube 220, the terminal portion 500 provided at the end of the first tube 220 removes the conductive tube 510 at both ends of the first tube 220. By releasing the fixing on the first tube 220, the first tube 220 can be replaced. Thereafter, when the fixing cap 280 and the second cooling unit 400 are dismantled, the second tube 240 may be separated. As such, after replacing the tube requiring replacement of the first tube 220 or the second tube 240 with a new tube, it is assembled in the reverse order of dismantling.
제3 관(260)을 교체하는 경우에는 다음과 같다. When replacing the third tube 260 is as follows.
우선, 제1 관(220)과 제2 관(240)의 교체를 위해 단자부(500) 및 제2 냉각부(400)를 제거하는 것은 상기와 동일하므로 상세한 설명은 생략한다. First, the removal of the terminal unit 500 and the second cooling unit 400 for the replacement of the first tube 220 and the second tube 240 is the same as above, and thus a detailed description thereof will be omitted.
단자부(500) 및 제2 냉각부(400)가 제거된 상태에서는 제3 관(260)의 단부에 대한 고정도 해제되므로, 이 상태에서 칼라(350), 오 링(352) 및 히터 커버(360)를 해체하면 제3 관(260)을 새로운 것으로 교체할 수 있다. 제3 관(260)의 교체 작업시, 제1 본체(310)를 챔버(100)에 고정하는 플랜지(340)를 해체하는 방법도 사용될 수 있으나, 플랜지(340)를 챔버(100) 양단에 재 설치할 때 플랜지(340)를 일직선상에 서로 정렬하는 작업에는 많은 시간이 소요되는 관계로 플랜지(340)는 해체하지 않는 것이 바람직하다. In the state in which the terminal portion 500 and the second cooling portion 400 are removed, the fixing of the end of the third tube 260 is also released. In this state, the collar 350, the O-ring 352, and the heater cover 360 are removed. ), The third pipe 260 can be replaced with a new one. In the replacement of the third tube 260, a method of dismantling the flange 340 that fixes the first body 310 to the chamber 100 may be used, but the flange 340 may be replaced at both ends of the chamber 100. Since the installation of the flanges 340 takes a long time to align the flanges 340 with each other in a straight line, the flange 340 is preferably not dismantled.
제3 관(260)을 새로운 것으로 교체한 후에는 상기한 해체 순서의 역순으로 조립하여 히터(200a)를 완성한다.After replacing the third tube 260 with a new one, the heater 200a is completed by assembling in the reverse order of the dismantling procedure.
따라서, 본 발명의 히터(200a)는 히터(200a)를 구성하는 관 중 어느 하나가 손상을 입었을 경우에는 손상을 입은 관 하나만을 교체할 수 있으므로 히터의 수리 및 관리가 용이해질 수 있다. Therefore, when any one of the tubes constituting the heater 200a is damaged, the heater 200a of the present invention may replace only one damaged tube, thereby facilitating repair and management of the heater.
도 26과 도 27은 본 발명의 또 다른 실시예에 따른 히터(200b)의 구성을 나타내는 단면 사시도 및 단면도이다. 참고로, 도 26과 도 27에서, 히터(200b)의 양단부측의 형상 및 구조는 동일하므로 편의상 히터(200b)의 일단부측 만을 도시하였다. 26 and 27 are a cross-sectional perspective view and a cross-sectional view showing the configuration of a heater 200b according to another embodiment of the present invention. For reference, FIGS. 26 and 27 show only one end side of the heater 200b because the shape and structure of both end sides of the heater 200b are the same.
도시한 바와 같이, 히터(200b)는 전체적으로 길이가 긴 봉 형상을 하고 있으나 반드시 이에 한정되는 것은 아니고 히터가 적용되는 배치식 열처리 장치의 사양에 따라 다양하게 변경할 수 있다. As shown, the heater 200b has a long rod shape as a whole, but is not necessarily limited thereto, and may be variously changed according to specifications of a batch heat treatment apparatus to which the heater is applied.
도 26과 도 27을 참조하면, 히터(200b)는 소정의 길이를 갖는 제1 관(220b), 소정의 길이를 가지면서 제1 관(220b)을 둘러싸는 제2 관(240b), 제1 관(220b) 내부에 삽입되는 발열체(270b)를 포함하여 구성된다.Referring to FIGS. 26 and 27, the heater 200b may include a first tube 220b having a predetermined length, a second tube 240b having a predetermined length, and a second tube 240b surrounding the first tube 220b. It is configured to include a heating element (270b) is inserted into the tube (220b).
제1 관(220b) 및 제2 관(240b)의 재질은 제1 관(220b) 및 제2 관(240b) 모두 열처리 장치에 적용되기 때문에 융점이 높은 재질, 예를 들어 석영인 것이 바람직하다.The material of the first tube 220b and the second tube 240b is preferably a material having a high melting point, for example, quartz, since both the first tube 220b and the second tube 240b are applied to the heat treatment apparatus.
제1 관(220b) 및 제2 관(240b)의 길이는 모두 실질적으로 동일하며, 제1 관(220b) 및 제2 관(240b)은 모두 동축을 갖도록 하는 것이 좋다. 제1 관(220b)은 외경이 대략 10mm, 내경은 대략 6mm, 두께는 2mm 정도인 것이 바람직하다. 제2 관(240b)은 제1 관(220b)과 일정한 간격을 가지면서 제1 관(220b)을 둘러싸는 형태로 설치된다. 제2 관(240b)은 외경이 대략 18mm, 내경은 대략 14mm, 두께는 2mm 정도인 것이 바람직하다. 제1 관(220b)과 제2 관(240b) 사이에는 대략 2mm 정도의 간격을 갖는 빈 공간(246b)이 형성된다.The lengths of the first tube 220b and the second tube 240b are substantially the same, and the first tube 220b and the second tube 240b may be coaxial. The first tube 220b preferably has an outer diameter of about 10 mm, an inner diameter of about 6 mm, and a thickness of about 2 mm. The second tube 240b is installed in a form surrounding the first tube 220b with a predetermined distance from the first tube 220b. The second tube 240b preferably has an outer diameter of about 18 mm, an inner diameter of about 14 mm, and a thickness of about 2 mm. An empty space 246b having an interval of about 2 mm is formed between the first tube 220b and the second tube 240b.
제1 관(220b)의 내부에는 발열체(270b)가 삽입되어 있다. 발열체(270b)는 봉 형상을 가지는 것이 바람직하나 반드시 이에 한정되는 것은 아니다. 발열체(270b)의 재질은 칸탈(Kanthal)인 것이 바람직하다. The heating element 270b is inserted into the first tube 220b. The heating element 270b preferably has a rod shape, but is not necessarily limited thereto. The material of the heating element 270b is preferably Kanthal.
발열체(270b)를 제1 관(220b)에 삽입시킬 때 제1 관(220b)의 내주면과 발열체(270b)의 외주면은 떨어져 있게 하는 것이 좋다. 이는 만일 제1 관(220b)의 내주면과 발열체(270b)의 외주면이 접하게 되면 열처리 공정 중에 제1 관(220b)과 발열체(270b)의 열 팽창 계수의 차이로 인하여 제1 관(220b)이 파손될 우려가 있기 때문이다. 따라서, 제1 관(220b)의 내주면과 발열체(270b)의 외주면 사이의 이격 거리는 발열체(270b)의 열 팽창 계수를 고려하여 결정하는 것이 바람직하다. When the heating element 270b is inserted into the first tube 220b, the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b may be separated from each other. This is because if the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b come into contact with each other, the first tube 220b may be damaged due to a difference in thermal expansion coefficient between the first tube 220b and the heating element 270b during the heat treatment process. This is because there is concern. Therefore, the separation distance between the inner circumferential surface of the first tube 220b and the outer circumferential surface of the heating element 270b is preferably determined in consideration of the thermal expansion coefficient of the heating element 270b.
발열체(270b)의 단부에는 발열체(270b)에 전원을 인가할 수 있도록 도전관(510b)이 설치된다. 도전관(510b)을 통한 발열체(270b)와 외부 전원(미도시)간의 연결 방식은 특별하게 제한되지 않으며 이에 대한 상세한 설명은 생략한다.At the end of the heating element 270b, a conductive tube 510b is installed to apply power to the heating element 270b. The connection method between the heating element 270b and the external power source (not shown) through the conductive tube 510b is not particularly limited, and a detailed description thereof will be omitted.
한편, 상술한 바와 같이, 발열체(270b)의 단부는 외부 전원과 연결되기 때문에 발열체(270b)로부터 발생하는 열로부터 발열체(270b)와 외부 전원간의 연결 수단, 예를 들어 도선(구리선) 등을 보호할 필요가 있다. 이를 위하여, 발열체(270b)의 직경은 발열체(270b)의 중앙부와 단부에서 서로 다른 값을 갖도록 할 수 있다. On the other hand, as described above, since the end of the heating element 270b is connected to an external power source, the connecting means between the heating element 270b and the external power source, for example, a conductor (copper wire), etc., is protected from heat generated from the heating element 270b. Needs to be. To this end, the diameter of the heating element 270b may have different values at the center and the end of the heating element 270b.
즉, 도 27을 참조하면, 발열체(270b)의 단면적은 중앙부보다 양 단부에서 더 크도록 발열체(270b)를 구성하는 것이 바람직하다. 발열체(270b)에서 발생하는 열의 양은 발열체(270b)의 단면적에 반비례하기 때문에 발열체(270b)의 단부의 단면적을 크게 하면 발열체(270b)의 단부에서 발생하는 열의 양이 작아져서 발열체(270b)와 외부 전원간의 연결 수단이 열에 의해 손상을 입는 것을 예방할 수 있다.That is, referring to FIG. 27, it is preferable to configure the heating element 270b such that the cross-sectional area of the heating element 270b is larger at both ends than the center portion. Since the amount of heat generated in the heat generating element 270b is inversely proportional to the cross-sectional area of the heat generating element 270b, increasing the cross-sectional area of the end portion of the heat generating element 270b decreases the amount of heat generated at the end of the heat generating element 270b, and thus the heat generating element 270b and the outside. The connection means between the power sources can be prevented from being damaged by heat.
본 발명에 따른 히터(200b)는 히터(200b)의 내부를 냉각용 가스가 흐를 수 있도록 제1 관(220b)과 제2 관(240b) 사이에 공간(244b)을 갖는 것을 특징적 구성으로 한다. 즉, 히터(200b) 내부의 공간(244b)을 통하여 냉각용 가스가 흐르게 된다. 공간(244b)을 통하여 냉각용 가스가 흐르도록 하는 방식은 특별하게 제한되지 않으며 이에 대한 상세한 설명은 생략한다. 냉각용 가스로는 공기, 헬륨, 질소, 아르곤을 사용할 수 있다. 냉각용 가스의 온도는 대략 상온인 것이 바람직하나 필요에 따라서는 상온 미만의 온도로 냉각된 가스를 사용할 수도 있다.The heater 200b according to the present invention is characterized by having a space 244b between the first tube 220b and the second tube 240b so that the gas for cooling flows inside the heater 200b. That is, the gas for cooling flows through the space 244b inside the heater 200b. The manner in which the cooling gas flows through the space 244b is not particularly limited, and a detailed description thereof will be omitted. As the cooling gas, air, helium, nitrogen, argon may be used. The temperature of the gas for cooling is preferably about room temperature, but if necessary, a gas cooled to a temperature below room temperature may be used.
한편, 히터(200b)는 발열체(270b)가 제1 관(220b) 또는 제2 관(240b)으로부터 용이하게 탈착이 가능하도록 구현되는 것이 바람직하다. 이는 히터(200b)의 사용 도중에 발열체(270b)가 끊어지는 등의 문제점이 발생한 경우에 열처리 장치에 장착되어 있는 히터(200b)에서 발열체(270b)만을 분리시켜 이를 수리 또는 교체함으로써 불량이 난 히터(200b)를 간단하게 수리 또는 교체할 수 있는 이점이 있다.On the other hand, the heater 200b is preferably implemented so that the heating element 270b can be easily detached from the first tube 220b or the second tube 240b. When a problem such as the heating element 270b is cut off during use of the heater 200b occurs, the heater that is defective by removing only the heating element 270b from the heater 200b mounted on the heat treatment apparatus and repairing or replacing it. There is an advantage that the 200b) can be easily repaired or replaced.
도 26과 도 27에 도시된 히터(200b)는 이전에 설명한 히터(200, 200a)와 동일한 방식으로 사용할 수 있다. 또한, 히터(200b)의 양단으로 제1 및 제2 냉각부(300, 400) 그리고 단자부(500)와 절연부(600)가 설치될 수 있고, 이들의 구성 및 작용도 이전과 동일하므로 여기서는 그 자세한 설명은 생략한다. The heater 200b illustrated in FIGS. 26 and 27 may be used in the same manner as the heaters 200 and 200a described above. In addition, the first and second cooling units 300 and 400, the terminal unit 500, and the insulating unit 600 may be installed at both ends of the heater 200b. Detailed description will be omitted.
본 발명은 상술한 바와 같이 바람직한 실시예를 들어 도시하고 설명하였으나, 상기 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형과 변경이 가능하다. 그러한 변형예 및 변경예는 본 발명과 첨부된 특허청구범위의 범위 내에 속하는 것으로 보아야 한다.Although the present invention has been illustrated and described with reference to the preferred embodiments as described above, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art without departing from the spirit of the present invention. Modifications and variations are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

Claims (30)

  1. 복수개의 기판을 동시에 열처리할 수 있으며 각 기판은 상기 각 기판에 대응하는 복수개의 히터에 의해 가열되는 것을 특징으로 하는 배치식 열처리 장치.A plurality of substrates can be heat-treated at the same time, each substrate is heated by a plurality of heaters corresponding to each substrate characterized in that the batch heat treatment apparatus.
  2. 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치로서,A batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates,
    상기 복수개의 기판에 대하여 열처리 공간을 제공하는 챔버; A chamber providing a heat treatment space for the plurality of substrates;
    상기 복수개의 기판이 로딩되어 지지되는 보트; 및A boat on which the plurality of substrates are loaded and supported; And
    상기 기판의 적층 방향을 따라 일정 간격을 가지면서 배치되는 복수개의 메인 히터 유닛 - 상기 메인 히터 유닛은 복수개의 단위 메인 히터를 포함함 -;A plurality of main heater units disposed at regular intervals along the stacking direction of the substrate, wherein the main heater units include a plurality of unit main heaters;
    을 포함하고,Including,
    상기 기판은 상기 복수개의 메인 히터 유닛 사이에 배치되는 것을 특징으로 하는 배치식 열처리 장치.And the substrate is disposed between the plurality of main heater units.
  3. 제2항에 있어서,The method of claim 2,
    상기 기판은 기판 홀더에 안착된 상태로 상기 보트에 로딩되는 것을 특징으로 하는 배치식 열처리 장치.And the substrate is loaded into the boat while seated on a substrate holder.
  4. 제2항에 있어서,The method of claim 2,
    상기 복수개의 단위 메인 히터는 상기 기판의 단변 방향과 평행하게 일정 간격을 가지면서 배치되는 것을 특징으로 하는 배치식 열처리 장치. And the plurality of unit main heaters are disposed at regular intervals in parallel with the short side direction of the substrate.
  5. 제2항에 있어서,The method of claim 2,
    임의의 메인 히터 유닛의 단위 메인 히터는 상기 임의의 메인 히터 유닛의 최인접 메인 히터 유닛의 단위 메인 히터와 정렬되게 배치되는 것을 특징으로 하는 배치식 열처리 장치.The unit main heater of any of the main heater unit is disposed in alignment with the unit main heater of the nearest main heater unit of the arbitrary main heater unit.
  6. 제2항에 있어서,The method of claim 2,
    임의의 메인 히터 유닛의 단위 메인 히터는 상기 임의의 메인 히터 유닛의 최인접 메인 히터 유닛의 단위 메인 히터와 어긋나게 배치되는 것을 특징으로 하는 배치식 열처리 장치.The unit main heater of any of the main heater units is disposed in the unit of the main heater of the nearest main heater unit of the arbitrary main heater unit, the batch type heat treatment apparatus.
  7. 제2항에 있어서,The method of claim 2,
    상기 챔버 내부의 열 손실을 방지하기 위한 복수개의 보조 히터 유닛을 더 포함하는 것을 특징으로 하는 배치식 열처리 장치.And a plurality of auxiliary heater units for preventing heat loss inside the chamber.
  8. 제7항에 있어서,The method of claim 7, wherein
    상기 복수개의 보조 히터 유닛은 상기 기판의 단변 방향과 평행하게 배치되는 제1 보조 히터 유닛과, 상기 기판의 장변 방향과 평행하게 배치되는 제2 보조 히터 유닛을 포함하는 것을 특징으로 하는 배치식 열처리 장치.The plurality of auxiliary heater units may include a first auxiliary heater unit disposed in parallel with a short side direction of the substrate and a second auxiliary heater unit disposed in parallel with a long side direction of the substrate. .
  9. 제8항에 있어서,The method of claim 8,
    상기 제1 보조 히터 유닛은 상기 메인 히터 유닛의 양측에 상기 단위 메인 히터와 평행하게 배치되는 복수개의 제1 단위 보조 히터를 포함하고, The first auxiliary heater unit includes a plurality of first unit auxiliary heaters disposed in parallel with the unit main heater on both sides of the main heater unit,
    상기 제2 보조 히터 유닛은 상기 메인 히터 유닛의 양측에 상기 단위 메인 히터와 수직으로 배치되는 복수개의 제2 단위 보조 히터를 포함하는 것을 특징으로 하는 배치식 열처리 장치.The second auxiliary heater unit includes a plurality of second unit auxiliary heaters disposed on both sides of the main heater unit perpendicular to the unit main heater.
  10. 제2항에 있어서,The method of claim 2,
    상기 챔버 내부를 냉각시키기 위한 복수개의 냉각관을 더 포함하는 것을 특징으로 하는 배치식 열처리 장치.And a plurality of cooling tubes for cooling the inside of the chamber.
  11. 제10항에 있어서, The method of claim 10,
    상기 냉각관은 상기 기판의 단변 방향을 따라 상기 복수개의 단위 메인 히터 사이에 배치되는 것을 특징으로 하는 배치식 열처리 장치.The cooling tube is a batch heat treatment apparatus, characterized in that disposed between the plurality of unit main heaters along the short side direction of the substrate.
  12. 제10항에 있어서, The method of claim 10,
    상기 냉각관의 내부로는 냉각 가스가 흐르며 상기 냉각관은 열전도율이 높은 재질로 이루어지는 것을 특징으로 하는 배치식 열처리 장치.Cooling gas flows into the cooling tube, and the cooling tube is a batch heat treatment apparatus, characterized in that made of a material having high thermal conductivity.
  13. 제2항에 있어서, The method of claim 2,
    상기 챔버 내부에 공정 가스를 공급하는 가스 공급부와 상기 챔버 내부로부터 폐 가스를 배출하는 가스 배출부를 더 포함하는 것을 특징으로 하는 배치식 열처리 장치.And a gas supply unit for supplying a process gas into the chamber and a gas discharge unit for discharging waste gas from the inside of the chamber.
  14. 제13항에 있어서,The method of claim 13,
    상기 가스 공급부는 공정 가스가 유출되는 복수개의 제1 가스 구멍이 형성되어 있는 가스 공급관을 포함하고, 상기 가스 배출부는 폐 가스가 유입되는 복수개의 제2 가스 구멍이 형성되어 있는 가스 배출관을 포함하는 것을 특징으로 하는 배치식 열처리 장치. The gas supply part includes a gas supply pipe in which a plurality of first gas holes through which process gas flows is formed, and the gas discharge part includes a gas discharge pipe in which a plurality of second gas holes into which waste gas is introduced is formed. Batch heat treatment apparatus characterized in that.
  15. 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서, 상기 히터는 상기 히터 내부로 냉각용 가스가 흐를 수 있는 공간을 포함하는 것을 특징으로 하는 히터.A heater applicable to a batch type heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, wherein the heater comprises a space through which a gas for cooling flows into the heater.
  16. 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서,A heater applicable to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates,
    상기 히터는,The heater,
    제1 관;First tube;
    상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관; 및A second tube surrounding the first tube at regular intervals from the first tube; And
    상기 제1 관 내부에 삽입되는 발열체Heating element inserted into the first tube
    를 포함하며,Including;
    상기 제1 관과 상기 제2 관 사이의 공간을 통하여 냉각용 가스가 흐르도록 하는 것을 특징으로 하는 히터.And a gas for cooling flows through the space between the first tube and the second tube.
  17. 제16항에 있어서,The method of claim 16,
    상기 발열체의 양 단부의 단면적은 중앙부의 단면적보다 큰 것을 특징으로 하는 히터.The cross-sectional area of both ends of the heating element is larger than the cross-sectional area of the central portion.
  18. 제16항에 있어서, The method of claim 16,
    상기 발열체는 상기 제1 관 또는 상기 제2 관으로부터 분리 가능한 것을 특징으로 하는 히터.The heater may be separated from the first tube or the second tube.
  19. 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서,A heater applicable to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates,
    상기 히터는,The heater,
    제1 관;First tube;
    상기 제1 관의 외주면에 감기면서 설치되는 코일형 열선; 및A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; And
    상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관A second tube surrounding the first tube with a predetermined distance from the first tube;
    을 포함하며,Including;
    상기 제1 관의 중앙 공간을 통하여 냉각용 가스가 흐르도록 하는 것을 특징으로 하는 히터.And a gas for cooling flows through the central space of the first pipe.
  20. 복수개의 기판을 동시에 열처리할 수 있는 배치형 열처리 장치에 적용 가능한 히터로서,A heater applicable to a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates,
    상기 히터는,The heater,
    제1 관;First tube;
    상기 제1 관의 외주면에 감기면서 설치되는 코일형 열선;A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube;
    상기 제1 관과 일정한 간격을 가지면서 상기 제1 관을 둘러싸는 제2 관; 및A second tube surrounding the first tube at regular intervals from the first tube; And
    상기 제2 관과 일정한 간격을 가지면서 상기 제2 관을 둘러싸는 제3 관A third tube surrounding the second tube with a predetermined distance from the second tube
    을 포함하며,Including;
    상기 제1 관의 중앙 공간 및 상기 제2 관과 상기 제3 관 사이의 공간 중 적어도 하나의 공간을 통하여 냉각용 가스가 흐르도록 하는 것을 특징으로 하는 히터.And a gas for cooling flows through at least one of a central space of the first pipe and a space between the second pipe and the third pipe.
  21. 제19항 또는 제20항에 있어서,The method of claim 19 or 20,
    상기 열선의 피치는 상기 제1 관 상의 위치에 관계없이 동일하거나 상기 제1 관 상의 위치에 따라 변경되는 것을 특징으로 하는 히터.And the pitch of the heating wire is the same or varies depending on the position on the first tube regardless of the position on the first tube.
  22. 제20항에 있어서,The method of claim 20,
    상기 코일형 열선이 감겨져 있는 제1 관은 상기 제2 관 또는 상기 제3 관으로부터 분리 가능한 것을 특징으로 하는 히터.And the first tube wound around the coiled heating wire is detachable from the second tube or the third tube.
  23. 제20항에 있어서, The method of claim 20,
    상기 제3 관의 양단에는 상기 제3 관을 냉각시키는 냉각수가 흐르도록 하는 제1 냉각부가 설치되는 것을 특징으로 하는 히터.Heaters, characterized in that the first cooling unit for providing a cooling water for cooling the third pipe flows in both ends of the third pipe.
  24. 제23항에 있어서, The method of claim 23, wherein
    상기 제3 관의 양단에는 상기 제2 관과 상기 제3 관 사이의 공간을 통하여 냉각용 가스가 흐르도록 하는 제2 냉각부가 더 설치되는 것을 특징으로 하는 히터.Heaters, characterized in that the second cooling unit is further provided at both ends of the third tube to allow the cooling gas to flow through the space between the second tube and the third tube.
  25. 제23항에 있어서, The method of claim 23, wherein
    상기 제1 냉각부는 The first cooling unit
    내부에 공간이 형성되는 제1 본체; A first body having a space formed therein;
    상기 제1 본체의 내부 공간으로 냉각수가 유입되도록 하는 냉각수 유입관; 및 A coolant inflow pipe configured to allow coolant to flow into an internal space of the first body; And
    상기 제1 본체의 내부 공간에 유입된 냉각수가 유출되도록 하는 냉각수 유출관Cooling water outlet pipe to allow the cooling water introduced into the internal space of the first body to flow out
    을 포함하는 것을 특징으로 하는 히터. Heater comprising a.
  26. 제24항에 있어서, The method of claim 24,
    상기 제2 냉각부는 The second cooling unit
    내부에 공간이 형성되는 제2 본체; 및 A second body having a space formed therein; And
    상기 제2 본체의 내부 공간으로 연결되는 가스관Gas pipe connected to the inner space of the second body
    을 포함하고, Including,
    상기 제2 본체의 내부 공간은 상기 제2 관과 상기 제3 관 사이의 공간과 연결되는 것을 특징으로 하는 히터.The inner space of the second body is characterized in that connected to the space between the second tube and the third tube.
  27. 제20항에 있어서, The method of claim 20,
    상기 열선으로 전원을 공급하는 단자부; 및A terminal unit for supplying power to the heating wire; And
    상기 단자부를 절연하는 절연부Insulation part for insulating the terminal part
    를 더 포함하는 것을 특징으로 하는 히터.Heater characterized in that it further comprises.
  28. 제27항에 있어서, The method of claim 27,
    상기 제2 관의 단부에 설치되고 상기 열선과 연결되는 고정캡을 더 포함하는 것을 특징으로 하는 히터.And a fixing cap installed at an end of the second tube and connected to the heating wire.
  29. 제27항에 있어서, The method of claim 27,
    상기 단자부는 The terminal part
    상기 제1 관 상에 설치되고 외부의 전원이 연결되는 도전관; 및A conductive pipe installed on the first pipe and connected to an external power source; And
    상기 도전관이 상기 히터의 고정캡에 밀착되도록 하는 고정 너트를 포함하는 것을 특징으로 하는 히터.And a fixing nut to allow the conductive tube to closely contact the fixing cap of the heater.
  30. 제27항에 있어서,The method of claim 27,
    상기 절연부는 내부에 공간이 형성되고 상기 단자부를 둘러싸는 절연캡을 포함하고, The insulating part has a space formed therein and includes an insulating cap surrounding the terminal portion,
    상기 절연캡의 일측에는 홀이 형성되어 있는 것을 특징으로 하는 히터.Heater, characterized in that the hole is formed on one side of the insulating cap.
PCT/KR2009/003909 2008-07-16 2009-07-16 Batch-type heat treatment device and heater used therein WO2010008211A2 (en)

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CN200980122777.2A CN102067294B (en) 2008-07-16 2009-07-16 Batch-type heat treatment device and be applicable to the heater of this annealing device
JP2011518650A JP5973728B2 (en) 2008-07-16 2009-07-16 Batch heat treatment apparatus and heater applied to the apparatus

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KR1020080069331A KR101016061B1 (en) 2008-07-16 2008-07-16 Heater For Heat Treatment Apparatus
KR10-2008-0069331 2008-07-16
KR1020080069330A KR101016058B1 (en) 2008-07-16 2008-07-16 Heater For Heat Treatment Apparatus
KR10-2008-0069329 2008-07-16
KR1020080069329A KR101016048B1 (en) 2008-07-16 2008-07-16 Batch Type Heat Treatment Apparatus
KR10-2008-0069330 2008-07-16
KR10-2008-0110814 2008-11-10
KR1020080110813A KR101016064B1 (en) 2008-11-10 2008-11-10 Heater
KR10-2008-0110813 2008-11-10
KR1020080110814A KR101009990B1 (en) 2008-11-10 2008-11-10 Heater

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CN (3) CN102067294B (en)
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013531363A (en) * 2010-04-30 2013-08-01 株式会社テラセミコン Substrate processing equipment
JP2013539600A (en) * 2010-08-31 2013-10-24 株式会社テラセミコン Batch type substrate processing equipment
CN103493195A (en) * 2011-04-29 2014-01-01 泰拉半导体株式会社 Holder for supporting a substrate, and substrate-processing apparatus using same
WO2020112608A1 (en) * 2018-11-30 2020-06-04 Lam Research Corporation Ceramic pedestal with multi-layer heater for enhanced thermal uniformity
CN114485170A (en) * 2021-12-27 2022-05-13 江苏邑文微电子科技有限公司 Heating system of rapid annealing furnace and temperature control method
WO2022261289A1 (en) * 2021-06-09 2022-12-15 Watlow Electric Manufacturing Company Cold conduit insulation device
CN114485170B (en) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 Heating system of rapid annealing furnace and temperature control method

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101155813B1 (en) * 2011-08-24 2012-06-12 (주)써모니크 Graphite furnace
KR101435454B1 (en) * 2012-04-27 2014-08-28 주식회사 테라세미콘 Apparatus for processing substrate
KR101982725B1 (en) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 Heating Assembly for Substrate Thermal Treatment Device
KR101982724B1 (en) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 Thermal Treatment Device for Substrate
KR101557037B1 (en) * 2013-08-14 2015-10-02 (주) 예스티 Heat processing apparatus for large glass substrate
KR101527158B1 (en) * 2013-10-24 2015-06-09 주식회사 테라세미콘 Batch type apparatus for processing substrate
KR101479224B1 (en) 2013-12-09 2015-01-05 포스코에너지 주식회사 Thin plate mica heater
TWI698944B (en) * 2013-12-23 2020-07-11 南韓商圓益Ｉｐｓ股份有限公司 Batch type apparatus for processing substrate
KR102117421B1 (en) * 2014-05-12 2020-06-02 주식회사 제우스 Heater fixing device and substrate heat tretment apparatus using it
KR101753376B1 (en) 2015-08-24 2017-07-04 주식회사 하이원시스 Pre-heater including 4-direction sliding doors on ceiling
JP2019027623A (en) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス Heating device and heating method
JP2019029102A (en) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス Heating apparatus
TWI709203B (en) * 2018-09-11 2020-11-01 大陸商北京北方華創微電子裝備有限公司 Chamber cooling device and semiconductor processing equipment
JP7079042B2 (en) * 2019-05-31 2022-06-01 株式会社九州日昌 Heating device and heating method
JP7079044B2 (en) * 2019-05-31 2022-06-01 株式会社九州日昌 Heating device and heating method
JP2021197448A (en) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 Thermal treatment device
KR102559562B1 (en) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 Heat treatment oven exhaust duct integrated heater unit
KR102508123B1 (en) * 2022-10-28 2023-03-10 (주)삼양세라텍 Heat treatment apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059837A (en) * 2001-08-10 2003-02-28 Tokyo Electron Ltd Apparatus and method for heat treatment
JP2004179672A (en) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc Substrate heater and method for forming semiconductor circuit
KR100817400B1 (en) * 2006-11-09 2008-03-27 권상환 Heat treatment equipment

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548400Y2 (en) * 1974-08-15 1980-11-12
JPS5996691A (en) * 1982-11-24 1984-06-04 東レ株式会社 Resistance heating furnace
JPS6162395U (en) * 1984-09-28 1986-04-26
JPS63137416A (en) * 1986-11-29 1988-06-09 Furendotetsuku Kenkyusho:Kk Vacuum heat insulating furnace
JPH0641355Y2 (en) * 1988-02-16 1994-10-26 富士電波工業株式会社 Water-cooled electrode for electric furnace
JPH0379985A (en) * 1989-08-22 1991-04-04 Deisuko Haitetsuku:Kk Controlling method for temperature of electric furnace
JPH05290953A (en) * 1992-04-10 1993-11-05 Matsushita Electric Ind Co Ltd Electric heating device
KR100203782B1 (en) * 1996-09-05 1999-06-15 윤종용 Heat treatment apparatus for semiconductor wafer
JP3844274B2 (en) * 1998-06-25 2006-11-08 独立行政法人産業技術総合研究所 Plasma CVD apparatus and plasma CVD method
JP3058282U (en) * 1998-10-07 1999-06-18 株式会社八光電機製作所 Cartridge heater with cooling function
JP3929239B2 (en) * 2000-12-06 2007-06-13 株式会社ノリタケカンパニーリミテド Far-infrared thin heater and substrate heating furnace
JP2002221394A (en) * 2001-01-24 2002-08-09 Showa Mfg Co Ltd Heating device for electronic component
JP2002289549A (en) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc Wafer treatment device
TWI232509B (en) * 2001-07-25 2005-05-11 Tokyo Electron Ltd Processing apparatus and processing method
JP3667270B2 (en) * 2001-10-12 2005-07-06 松下電器産業株式会社 Substrate heat treatment method and furnace equipment therefor
JP3575009B2 (en) * 2001-12-03 2004-10-06 坂口電熱株式会社 Heater terminal equipment for heating furnace
JP2003194478A (en) * 2001-12-26 2003-07-09 Koyo Thermo System Kk Heat treatment device
KR100498609B1 (en) * 2002-05-18 2005-07-01 주식회사 하이닉스반도체 Batch type atomic layer deposition equipment
JP2005056725A (en) * 2003-08-06 2005-03-03 Nikko Materials Co Ltd Heating element made of mosi2 and its manufacturing method
JP3917994B2 (en) * 2004-08-24 2007-05-23 株式会社石井表記 Coating film drying oven
JP4734885B2 (en) * 2004-10-08 2011-07-27 ウシオ電機株式会社 Heating unit
JP2006112762A (en) * 2004-10-18 2006-04-27 Tdk Corp Baking furnace
JP4530896B2 (en) * 2005-03-31 2010-08-25 株式会社ノリタケカンパニーリミテド Plate type far infrared heater for vacuum heating furnace
JP2007200798A (en) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd Exothermic formation, exothermic unit, and heating device
JP2008028305A (en) * 2006-07-25 2008-02-07 Hitachi Kokusai Electric Inc Substrate processing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059837A (en) * 2001-08-10 2003-02-28 Tokyo Electron Ltd Apparatus and method for heat treatment
JP2004179672A (en) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc Substrate heater and method for forming semiconductor circuit
KR100817400B1 (en) * 2006-11-09 2008-03-27 권상환 Heat treatment equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013531363A (en) * 2010-04-30 2013-08-01 株式会社テラセミコン Substrate processing equipment
JP2013539600A (en) * 2010-08-31 2013-10-24 株式会社テラセミコン Batch type substrate processing equipment
CN103493195A (en) * 2011-04-29 2014-01-01 泰拉半导体株式会社 Holder for supporting a substrate, and substrate-processing apparatus using same
JP2014512700A (en) * 2011-04-29 2014-05-22 株式会社テラセミコン Substrate supporting holder and substrate processing apparatus using the holder
WO2020112608A1 (en) * 2018-11-30 2020-06-04 Lam Research Corporation Ceramic pedestal with multi-layer heater for enhanced thermal uniformity
WO2022261289A1 (en) * 2021-06-09 2022-12-15 Watlow Electric Manufacturing Company Cold conduit insulation device
CN114485170A (en) * 2021-12-27 2022-05-13 江苏邑文微电子科技有限公司 Heating system of rapid annealing furnace and temperature control method
CN114485170B (en) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 Heating system of rapid annealing furnace and temperature control method

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WO2010008211A3 (en) 2010-03-25
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CN105140157A (en) 2015-12-09
TWI508178B (en) 2015-11-11
CN102067294A (en) 2011-05-18
CN102067294B (en) 2016-10-19
CN105140157B (en) 2018-05-29
JP5973728B2 (en) 2016-08-23
CN102983091A (en) 2013-03-20

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