KR101016058B1 - Heater For Heat Treatment Apparatus - Google Patents

Abstract

A heater for supplying heat applied to a substrate is disclosed in a heat treatment apparatus for heat treating a substrate on which a predetermined film is formed. The heater 100 according to the present invention includes a first pipe 120; A coil-type hot wire 170 installed while being wound around the outer circumferential surface of the first pipe 120; And a second tube 140 surrounding the first tube 120 and a second tube 140 having a constant distance from the first tube 120 and having a constant distance from the second tube 140. And a third tube 160 and cooled through at least one of the central space 130 of the first tube 120 and the space 150 between the second tube 140 and the third tube 160. It is characterized in that the gas flows.

Heat treatment, substrate, heater, cooling

Description

Heater For Heat Treatment Apparatus

The present invention relates to a heater for a heat treatment apparatus. More particularly, the present invention relates to a heater provided with a space through which a cooling gas can flow in order to quickly cool the inside of the chamber of the heat treatment apparatus after the heat treatment process is completed.

Annealing devices used in the manufacture of semiconductors, flat panel displays, and solar cells are responsible for the heat treatment steps necessary for processes such as crystallization and phase change for a predetermined thin film deposited on a substrate such as a silicon wafer or glass. to be.

Representative annealing apparatus is a silicon crystallization apparatus for crystallizing amorphous silicon deposited on a glass substrate with polysilicon when manufacturing a liquid crystal display or thin film crystalline silicon solar cell.

In order to perform such a crystallization process (heat treatment process), a heat treatment apparatus capable of heating a substrate on which a predetermined thin film is formed should be provided. For example, at least 550 to 600 ° C. temperature is required for the crystallization of amorphous silicon.

Typically, the heat treatment apparatus includes a sheet type that can perform heat treatment on one substrate and a batch type that can perform heat treatment on a plurality of substrates. Single leaf type has the advantage of simple configuration of the device, but the disadvantage of low productivity has been in the spotlight for the recent mass production.

However, the conventional heat treatment apparatus takes a lot of time in the step of unloading the substrate in the heat treatment apparatus after finishing the heat treatment process, thereby lowering the productivity of the heat treatment process. This decrease in productivity is due to the time that the temperature inside the chamber is lowered due to the need to unload the substrate after the heat treatment process is completed and the chamber is cooled below a certain temperature in order to prevent damage to the substrate due to thermal shock. It happens because it takes a lot.

Accordingly, the present invention has been made to solve the problems of the prior art as described above, by rapidly cooling the interior of the chamber after the end of the heat treatment process to significantly improve the productivity of the heat treatment process required for manufacturing flat panel display or solar cell, etc. It is an object to provide a heater for a heat treatment apparatus that can be made.

In order to achieve the above object, the heater according to the present invention is a heater for supplying heat applied to the substrate in a heat treatment apparatus for heat treating a substrate on which a predetermined film is formed, the heater is a gas for cooling into the heater Characterized in that it comprises a space that can flow.

And, in order to achieve the above object, the heater according to the present invention comprises a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; And a second tube surrounding the first tube at regular intervals from the first tube, wherein the cooling gas flows through the central space of the first tube.

And, in order to achieve the above object, the heater according to the present invention comprises a first tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a third tube surrounding the second tube with a predetermined distance from the second tube, wherein at least one of a central space of the first tube and a space between the second tube and the third tube It characterized in that the cooling gas flows through.

The material of the heating wire may be any one of nichrome and cantal.

The pitch of the heating wire may be the same or change depending on the position on the first tube regardless of the position on the first tube.

The material of the first tube and the second tube may be quartz.

The material of the first tube, the second and the third tube may be quartz.

The first tube around which the coiled heating wire is wound may be detachable from the second tube or the third tube.

The heat treatment apparatus includes a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, the chamber providing a heat treatment space for the plurality of substrates; A boat on which the plurality of substrates are loaded and supported; And a plurality of heater units disposed at predetermined intervals along the stacking direction of the substrate, wherein the heater unit includes the plurality of heaters; The substrate may be disposed between the plurality of heater units.

According to the present invention, a space in which a cooling gas flows is provided inside the heater to quickly cool the inside of the chamber of the heat treatment apparatus after the heat treatment process is completed, thereby reducing the time required for the unloading process of the substrate. There is an effect to dramatically improve the productivity of the heat treatment process required for the manufacture of a display or a solar cell.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing the configuration of a heater 100 for a heat treatment apparatus according to an embodiment of the present invention. As shown, the heater 100 has a long rod shape as a whole, but is not necessarily limited thereto, and may be variously changed according to specifications of the heat treatment apparatus to which the heater is applied.

2 and 3 are cross-sectional perspective and cross-sectional views showing a portion a of FIG. 1 in detail. In FIG. 1, the opposite side of the a part is the same as the a part, so only the a part will be described below.

Referring to FIG. 2, the heater 100 includes a coil-type hot wire 170 wound around a first tube 120 having a predetermined length, and an outer circumferential surface of the first tube 120 at a predetermined interval, and a predetermined length. It comprises a second tube 140 having a predetermined length surrounding the outside of the first tube 120, and a third tube 160 having a predetermined length surrounding the outside of the second tube 140.

Since the material of the first tube 120, the second tube 140, and the third tube 160 is that the first tube 120, the second tube 140, and the third tube 160 are all applied to the heat treatment apparatus. It is preferable that it is a material with high melting point, for example, quartz.

It is preferable that the lengths of the first tube 120, the second tube 140, and the third tube 160 are all substantially the same. However, as illustrated, the length of the first tube 120 is greater than the length of the second tube 140 and the third tube 160 by the length of the terminal 180 to connect the terminal 180 to be described later. It may be large. In addition, the first tube 120, the second tube 140 and the third tube 160 is preferably all coaxial, but if necessary, the first tube 120 and the second tube 140 is Although coaxial with each other, the third tube 160 may configure the heater so as not to have a coaxial with respect to the first tube 120 and the second tube 140.

The first tube 120 has an outer diameter of about 10 mm, an inner diameter of about 6 mm, and a thickness of about 2 mm. The first tube 120 itself has an empty space 130 in the center.

The heating wire 170 corresponding to the heating element is wound in the form of a coil on the outer circumferential surface of the first tube 120. The material of the hot wire 170 is preferably any one of nichrome and Kanthal. The diameter of the hot wire 180 preferably has a range of 0.6 mm to 0.8 mm.

When the heating wire 170 is wound on the first tube 120, the pitch of the heating wire 170 is related to the amount of heat generated. In other words, the heat generation amount of the heating wire 120 is small when compared to the area having a large pitch. Therefore, in order to uniformly heat the substrate, the heat generation amount must be constant over the entire area of the heater 100. For this purpose, the heating wire 170 has the same pitch regardless of the position on the first tube 120. However, if necessary, the pitch of the heating wire 170 may be changed according to the position on the first pipe 120. For example, the end side of the heater 100 is in contact with the external environment by making the pitch of the heating wire 170 smaller on the end side than the center side of the first tube 120 (that is, by increasing the amount of heat generated at the end side). It can compensate for the heat loss that occurs.

The second tube 140 is installed in a form surrounding the first tube 120 while having a predetermined distance from the first tube 120. The second tube 140 has an outer diameter of about 18 mm, an inner diameter of about 14 mm, and a thickness of about 2 mm.

The third tube 160 is installed in a form surrounding the second tube 140 at regular intervals from the second tube 140. The third pipe 160 preferably has an outer diameter of about 30 mm, an inner diameter of about 22 mm, and a thickness of about 4 mm. An empty space 150 having an interval of about 2 mm is formed between the second tube 140 and the third tube 160.

The end 180 of the first tube 120 is provided with a terminal 180 to apply power to the heating wire 170 wound around the outer circumferential surface of the first tube 120. The connection method between the heating wire 170 and the external power source (not shown) through the terminal 180 is not particularly limited and a detailed description thereof will be omitted.

The heater 100 according to the present invention is characterized in that it has a space to allow the gas for cooling flows inside the heater 100. The space includes a central space 130 of the first pipe 120 and a space 150 between the second pipe 140 and the third pipe 160, and at least any of the two spaces 130 and 150. Cooling gas flows through one space. At this time, in order to maximize the cooling effect of the heater 100, it is preferable to allow the gas for cooling to flow through both spaces 130 and 150. The manner in which the cooling gas flows through the spaces 130 and 150 is not particularly limited, and a detailed description thereof will be omitted.

As the cooling gas, air, helium, nitrogen, argon may be used. The temperature of the gas for cooling is preferably about room temperature, but if necessary, a gas cooled to a temperature below room temperature may be used.

On the other hand, the heater 100 is preferably implemented so that the first tube 120 is wound around the heating wire 170 can be easily removable from the second tube 140 or the third tube (160). This is to separate only the first pipe (120) in which the heating wire 170 is wound from the heater 100 mounted on the heat treatment apparatus when the problem occurs such that the heating wire 170 is broken during the use of the heater (100). By repairing or replacing, there is an advantage of simply repairing or replacing the defective heater 100.

In addition, the heater 100 has a basic configuration of the first tube 120, the second tube 140 and the third tube 160, but is not necessarily limited to this, and the third tube 160 to simplify the overall configuration. May be omitted. In this case, the cooling gas flows only through the central space 130 of the first pipe 120.

4 is a perspective view showing the configuration of a heat treatment apparatus 300 to which the heater 100 is applied according to an embodiment of the present invention. FIG. 5 is a perspective view illustrating an arrangement state of the substrate 10 and the heater 100 in the heat treatment apparatus 300 of FIG. 4.

The heat treatment apparatus 300 may simultaneously heat-treat the plurality of substrates 10, and the substrate 10 is heated by the plurality of heaters 100 corresponding to the substrate 10, thereby uniforming the entire surface of the substrate 10. It is a batch heat treatment apparatus capable of performing heat treatment.

First, referring to FIG. 4, the heat treatment apparatus 300 includes a cuboid-shaped chamber 310 that provides a heat treatment space, and a frame 320 that supports the chamber 320.

One side of the chamber 310 is provided with a door 330 that opens and closes while sliding in a predetermined direction in order to load the substrate into the chamber 320. In the state in which the door 330 is opened, the substrate 10 may be loaded into the chamber 320 using a substrate loading device (not shown) such as a transfer arm. Meanwhile, after the heat treatment is completed, the substrate 10 may be unloaded from the chamber 320 through the door 340.

The upper side of the chamber 310 is installed to open and close the cover 340 for repair and replacement of various components installed in the interior of the chamber 310.

A plurality of heaters 100 for applying heat to the substrate 10 are installed in the chamber 310. Referring to FIG. 5, four heater units including 14 heaters are installed in the chamber 310. At this time, the 14 heaters 100 constituting one heater unit are arranged at regular intervals in the long side direction of the substrate 10, and the four heater units have a constant interval in the stacking direction of the substrate 10 Is placed. The number of heaters 100 constituting one heater unit and the number of heater units disposed in the chamber 310 may be variously changed according to the size and number of substrates 10 loaded in the chamber 100. .

At this time, the substrate 10 is disposed between the four heater units. Therefore, in this embodiment, three substrates 10 are disposed between four heater units, and heat treatment proceeds at the same time. It is preferable to arrange | position the board | substrate 10 in the center between heater units.

In this way, the heater unit composed of fourteen heaters 100 capable of covering the entire area of the substrate 10 is provided on the upper side and the lower side of the substrate 10, so that the heat treatment apparatus 300 includes the substrate 10. ) Is uniformly applied heat across the entire area from the 28 heaters 100 has the advantage that the heat treatment can be made uniform.

In addition, referring to FIG. 5, a plurality of boats 350 are installed in the chamber 310 to support the substrate 10 loaded into the chamber 310. The boat 350 is preferably installed to support the long side of the substrate 10.

In addition, referring to FIG. 5, the substrate 10 may be loaded in the boat 350 in a state in which the substrate 10 is mounted on the holder 12. When the heat treatment temperature reaches the softening temperature of the substrate 10 during the heat treatment process, warpage occurs in the downward direction of the substrate 10 due to the weight of the substrate 10 itself. ) Becomes a bigger problem as it becomes larger. In order to solve this problem, heat treatment is performed while the substrate 10 is mounted on the holder 12.

Meanwhile, as described above, the heater 100 includes spaces 130 and 150 through which the gas for cooling flows into the heater 100. Therefore, if the cooling gas flows through the spaces 130 and 150 of the heater 100 after the heat treatment process is completed in the heat treatment apparatus 300, the temperature of the heater 100 itself is rapidly lowered and the chamber 310 is further expanded. ) The temperature inside can be dropped quickly. As a result, the time required for the temperature inside the chamber 310 to be lowered below a predetermined temperature for unloading the substrate 10 after completion of the heat treatment process can be shortened. The productivity of the process can be greatly improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken in conjunction with the present invention. Variations and changes are possible. Such modifications and variations are intended to fall within the scope of the invention and the appended claims.

1 is a perspective view showing the configuration of a heater for a heat treatment apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional perspective view showing portion a of FIG. 1 in detail. FIG.

3 is a cross-sectional view showing a portion a of FIG. 1 in detail.

Figure 4 is a perspective view showing the configuration of a heat treatment apparatus to which a heater is applied according to an embodiment of the present invention.

5 is a perspective view illustrating an arrangement state of a substrate and a heater in the heat treatment apparatus of FIG. 4.

<Explanation of symbols for the main parts of the drawings>

10: Substrate

12: holder

100: heater

120: the first tube

140: second tube

160: third tube

170: heating wire

180: terminal

300: heat treatment device

310: chamber

320: frame

330: door

340: cover

350: boat

Claims (9)

delete A heater for supplying heat applied to the substrate in a heat treatment apparatus for heat-treating a substrate on which a predetermined film is formed, The heater, First tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; And A second tube surrounding the first tube with a predetermined distance from the first tube; Including; And a cooling gas for cooling the inside of the chamber that provides the heat treatment space with respect to the substrate through the central space of the first pipe. A heater for supplying heat applied to the substrate in a heat treatment apparatus for heat-treating a substrate on which a predetermined film is formed, The heater, First tube; A coil-type hot wire installed while being wound around the outer circumferential surface of the first tube; A second tube surrounding the first tube at regular intervals from the first tube; And a third tube surrounding the second tube at regular intervals from the second tube. Including; Through the at least one of the central space of the first tube and the space between the second tube and the third tube to allow the cooling gas for cooling the inside of the chamber that provides the heat treatment space for the substrate flows. Heater characterized by the above-mentioned. The method according to claim 2 or 3, The material of the heating wire is a heater, characterized in that any one of nichrome or cantal. The method according to claim 2 or 3, And the pitch of the heating wire is the same or is changed according to the position on the first tube regardless of the position on the first tube. The method of claim 2, Heater, characterized in that the material of the first tube and the second tube is quartz. The method of claim 3, Heater, characterized in that the material of the first tube, the second and the third tube is quartz. The method of claim 3, And the first pipe wound around the coiled heating wire is detachable from the second pipe or the third pipe. The method according to claim 2 or 3, The heat treatment apparatus is a batch heat treatment apparatus capable of simultaneously heat treating a plurality of substrates, A chamber providing a heat treatment space for the plurality of substrates; A boat on which the plurality of substrates are loaded and supported; And A plurality of heater units disposed at regular intervals along the stacking direction of the substrate, wherein the heater unit includes the plurality of heaters; Including, And the substrate is disposed between the plurality of heater units.

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