KR101982725B1 - Heating Assembly for Substrate Thermal Treatment Device - Google Patents

Abstract

The present invention relates to a heating assembly provided in a heating chamber of a substrate heating apparatus for performing a heating process on a substrate, the heating assembly comprising: a substrate heating process facilitating the replacement and maintenance of the heater, To a heating assembly for a device.
The present invention relates to a heating assembly provided in a plurality of substrate heating apparatuses for heating a substrate, the heating assembly comprising: a heater outer case provided in a horizontal direction in the heating chamber with an open end thereof exposed to the outside of the heating chamber; And a heater inserted into the inside of the heater outer case through the open end of the heater outer case.

Description

Technical Field The present invention relates to a heating assembly for a substrate heat treatment apparatus,

The present invention relates to a heat generating assembly for a substrate heat treating apparatus. More particularly, the present invention relates to a heating assembly provided in a heating chamber of a substrate heating apparatus for performing a heating process on a substrate, the heating assembly being capable of easily performing replacement and maintenance of the heater, To a heat generating assembly for a substrate heat treatment apparatus which is easy to manufacture.

The manufacturing process of a semiconductor device such as a flat panel display or a solar cell includes a heat treatment process for crystallization or phase change on a thin film deposited on a substrate. The heat treatment apparatus for such a heat treatment process is also called an annealing apparatus.

The heat treatment system is essential for flat panel display manufacturing processes such as AMOLED (Active Matrix Organic Light Emitting Diodes), LTPS LCDs, oxide TFTs, and flexible displays.

As an example of the heat treatment process for the substrate, the LTPS process will be described as follows. There are HTPS (High Temperature Poly-Silicon) and LTPS (Low Temperature Poly-Silicon) methods for crystallizing a TFT composed of amorphous a-Si into poly-Si, To convert the a-Si into poly-Si through a heat treatment process.

Conventionally, a substrate heating apparatus is configured to perform a substrate heat treatment by heating an interior of a chamber using a heater while a plurality of substrates are loaded in a chamber provided with a heater.

In recent years, substrate heat treatment apparatuses have also become larger as the size of substrates becomes larger. As the size of the substrate heat treatment apparatus is increased, uniform heat treatment for the substrate, prevention of deformation of the substrate through effective support of the substrate, and smooth maintenance of the substrate heat treatment apparatus are required.

An object of the present invention is to provide a substrate heat treatment apparatus which can efficiently perform a heat treatment process for a large area substrate and can easily maintain the same, in order to solve the problems of the conventional substrate heat treatment apparatus.

It is another object of the present invention to provide a substrate heat treatment apparatus capable of pulling out a heating module from a heating chamber constituting a substrate heat treatment apparatus.

In addition, the present invention provides a heating assembly capable of separately mounting and dismounting the heaters provided in the heating module, capable of absorbing mounting error and deformation while maintaining the airtightness, facilitating temperature control in the heating chamber, And to provide a heating module and a substrate heat treatment apparatus.

It is also an object of the present invention to provide a substrate heat treatment apparatus including a fin support that efficiently supports a substrate in a heating chamber and takes up little space in the heating chamber.

It is also an object of the present invention to provide a substrate heat treatment apparatus capable of enabling additional heating with the heating assembly in a heating chamber or supplying a process gas.

It is another object of the present invention to provide a substrate heating apparatus for heating a heating chamber by supplying a heating gas to the heating chamber.

The present invention relates to a substrate heating apparatus including a heating chamber for performing a heat treatment on a plurality of substrates, the heating chamber comprising: a chamber outer wall constituting an outer wall; And a heating module which is provided to be able to be drawn out from the outer wall of the chamber and supports and heats the substrate.

In an exemplary embodiment, a first transfer unit having a first transfer roller for supporting the heating module is provided on an inner bottom surface of the heating chamber.

In addition, the substrate heating apparatus may further include a lifter provided in the drawing direction of the heating module and supporting the heating module to be able to move up and down. And a second conveying unit having a second conveying roller for supporting the heating module may be provided on a bottom surface of the lifter.

The heating module may include a plurality of substrate supporting pins for supporting the substrate, a substrate heating unit for generating heat for heating the substrate, and a heating chamber for closing one side of the heating chamber when the heating module is coupled to the heating chamber. And a rear door for opening and closing the door.

Preferably, the substrate heating unit is a heating assembly including a heater outer case opened at one side and a heater inserted into the heater outer case, and the heating assembly may include a plurality of heating assemblies. In addition, the heater inserted into the heater outer case is composed of at least two combinations, and the heat generating positions may be set to be different from each other.

In addition, the open portion of the heater outer case may be exposed to the outside of the rear door, and may be fixed to the rear door by a sealing fixing portion including a bellows pipe. The seal fixing portion may include a first flange connected to one end of the bellows pipe and fixed to the rear door, and a second flange connected to the other end of the bellows pipe and coupled to a fixing flange provided on an outer circumferential surface of the heater outer case. 2 < / RTI > flange. Furthermore, an engagement surface of the first flange and the rear door and an engagement surface of the second flange and the fixing flange may be provided with O-rings, respectively.

In one embodiment, the heating module may further include a gas supply pipe for supplying the heated gas or process gas into the heating chamber in the direction of the rear door.

The substrate support pin is included in a pin support, and the pin support includes a heater mounting part which is seated on the heater outer case, and an installation plate provided on the heater mounting part, The pins may protrude from the upper portion of the mounting plate.

In another embodiment, the substrate heating unit is a plurality of heating gas supply pipes for supplying heating gas from the outside of the rear door into the heating chamber, and the heating gas supply pipe is provided with a plurality of A heating gas supply hole may be provided.

The heating gas supply hole may be formed so as to discharge the heating gas downward from the upper side with respect to the substrate, and the heating gas supply pipe may be disposed in the longitudinal direction with respect to the substrate. The substrate heating apparatus further includes a heating gas supply unit for supplying the heating gas to the heating gas supply pipe and a heating gas heating unit for heating the heating gas supplied from the heating gas supply unit to transfer the heating gas to the heating gas supply pipe .

According to another aspect of the present invention, there is provided a heating assembly provided in a plurality of substrate heating apparatuses for heating a substrate, the heating assembly comprising: a heater outer case having an open end horizontally disposed in the heating chamber with the open end exposed to the outside of the heating chamber; And a heater inserted into the inside of the heater outer case through the open end of the heater outer case.

In one embodiment, the heater is composed of at least two combinations, and each of the combined heaters has a different heating position. Further, the heater includes a first heater, a second heater, and a third heater, wherein the first heater is set at a heat generating position on both sides with respect to the longitudinal direction of the heater outer case, The heat generating position is set inside the heat generating position of the first heater and the heat generating position is set inside the heat generating position of the second heater.

In addition, at least two thermocouples may be attached to the heater.

Further, the heat-releasing assembly for the substrate heat-treating apparatus may be fixed to the outer wall or the rear door of the chamber of the heating chamber by a seal fixing part including a bellows pipe. The seal fixing part may include a first flange connected to one end of the bellows pipe and fixed to the outer wall of the chamber or the rear door, a fixing flange connected to the other end of the bellows pipe, And a second flange coupled to the second flange. In addition, an engagement surface of the first flange and the rear door and an engagement surface of the second flange and the fixing flange may be provided with O-rings, respectively.

According to the present invention, there is provided a substrate heat treatment apparatus capable of performing an efficient heat treatment process on a large-area substrate and facilitating maintenance of the apparatus. The present invention is advantageous in that the heating module can be taken out from the heating chamber constituting the substrate heat treatment apparatus, thereby facilitating maintenance or replacement of the heating module.

In addition, the present invention provides a heating assembly capable of separately mounting and dismounting the heaters provided in the heating module, capable of absorbing installation errors and deformation while maintaining airtightness, and easily controlling the temperature inside the heating chamber. In addition, the present invention can solve the defect caused by the deviation of the process temperature in the heat treatment process for a large area substrate.

In addition, the present invention can provide a pin support that efficiently supports the substrate in the heating chamber and occupies less space in the heating chamber.

Further, the present invention is advantageous in that heating of the heating chamber can be effectively performed.

1 is a perspective view of a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
2 is a perspective view showing a state in which a heating module is moved to a lifter in a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
3 is a perspective view of a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
4 is a side view of a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
FIG. 5 is a left side view of the heating module of the substrate heat treatment apparatus according to the preferred embodiment of the present invention.
6 is a view illustrating a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention in a rear door direction.
FIG. 7 is a cross-sectional view illustrating a heating assembly of a heating module of a substrate heating apparatus according to a preferred embodiment of the present invention.
FIG. 8 is a cross-sectional view (a sectional view taken along line AA 'in FIG. 7) of a heating assembly provided in a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
9 is a cross-sectional view illustrating a state in which a heater provided in a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention is mounted on a heater outer case.
FIG. 10 is a view illustrating a heat generation combination of a heater included in a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
11 to 13 are views showing various examples of installation of a heater in a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
14 is a plan view showing a state in which a structure for supplying a process gas is added in the substrate heat treatment apparatus according to the preferred embodiment of the present invention.
15 is a cross-sectional view (cross-sectional view taken along the line BB 'in Fig. 14) showing a state in which a structure for supplying a process gas is added in the substrate heat treatment apparatus according to the preferred embodiment of the present invention.
16 is a perspective view showing a pin support according to another embodiment of the substrate heat treatment apparatus according to a preferred embodiment of the present invention.
17 is a view showing an example of supporting a substrate using a pin support according to another embodiment in a substrate heat treatment apparatus according to a preferred embodiment of the present invention.
18 is a plan view showing a chamber heating structure by heating gas supply in a substrate heat treatment apparatus according to another preferred embodiment of the present invention.
FIG. 19 is a cross-sectional view (cross-sectional view taken along the line C-C 'of FIG. 18) showing a chamber heating structure by supplying a heating gas in the substrate heat treatment apparatus according to another preferred embodiment of the present invention.
FIG. 20 is a side sectional view (sectional view in DD 'direction in FIG. 18) showing a chamber heating structure by supplying a heating gas in the substrate heat treatment apparatus according to another preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same or similar components throughout the drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. In addition, the preferred embodiments of the present invention will be described below, but it is needless to say that the technical idea of the present invention is not limited thereto and can be variously modified by those skilled in the art.

FIG. 1 is a perspective view of a substrate heat treatment apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which a heating module is moved to a lifter in a substrate heat treatment apparatus according to a preferred embodiment of the present invention.

A substrate heating apparatus 1 according to a preferred embodiment of the present invention includes a heating chamber 10 provided on a base 3 and a lifter 5. 1, the plurality of heating chambers 10 may be arranged in layers or arranged in a lateral direction.

The heating chamber 10 includes a chamber outer wall 12 constituting an outer wall of the heating chamber 10, a front door 14 opened and closed to store and draw out a substrate (not shown) And a heating module 20 including a substrate heating unit provided inside the substrate heating unit and heating the loaded substrate. In addition, an exhaust duct 16 may be included at one side of the heating chamber 10 to allow the gas inside the chamber to be discharged to the outside.

2, the heating module 20 may be configured to be withdrawn from the interior of the heating chamber 10. As shown in FIG. The first transfer part 18 may be provided on the lower floor of the heating chamber 10 for smoothly drawing out the heating module 20. The first conveying unit 18 is provided with a plurality of first conveying rollers 18a to support the lower portion of the heating module 20 when the heating module 20 is drawn out.

The lifter 5 is provided in a direction in which the heating module 20 is drawn out. A lifting portion 7 is provided below the lifter 5 to enable the lifter 5 to be driven up and down. As an example, the elevating portion 7 may be provided using a hydraulic or pneumatic cylinder, but not limited thereto, and various types of mechanical driving portions capable of lifting and lowering the lifter 5 may be provided as the elevating portion 7 . 2, the heating module 20 can be drawn from the inside of the heating chamber 10 to the lifter 5 with the lifter 5 positioned at the same height as the bottom surface of the heating chamber 10 . To this end, a second conveying portion 9 is provided on the bottom surface of the lifter 5, and a plurality of second conveying rollers 9a are provided on the second conveying portion 9 to support the lower portion of the heating module 20.

The heating module 20 is lifted from the lifter 10 in a state in which the lifter 5 is lifted up to the bottom surface of the heating chamber 10 in the case of maintenance for the heating module 20 or replacement of the heating module 20. [ 5) direction. In order to take out the heating module 5, a lifting device (not shown) may be provided on the lifter 5. As an example of the pulling device, a cable driven by a motor may be connected to the heating module 20, or a piston operated by hydraulic pressure or pneumatic pressure, but the present invention is not limited thereto. The heating module 20 is pulled out to the lifter 5 in a state where the lower portion is supported by the first conveying portion 18 and the second conveying portion 9. [ After lifting the heating module 20 to the upper portion of the lifter 5, the lifter 5 may be lowered to perform maintenance or the like with respect to the heating module 20.

When the heating module 20 is mounted inside the heating chamber 10, the heating module 20 is lifted to the mounting position by using the lifter 5 and then the heating module 20 is heated to the inside of the heating chamber 10 . Maintenance or replacement of the heating module 20 can be facilitated even when the heating chamber 10 is enlarged through the structure of the lifter 5 and the drawing-out structure of the heating module 20. [

Next, the heating module 20 will be described in detail.

FIG. 3 is a perspective view of a heating module of a substrate heating apparatus according to a preferred embodiment of the present invention, FIG. 4 is a side view of a heating module of a substrate heating apparatus according to a preferred embodiment of the present invention, and FIG. FIG. 3 is a view of the heating module of the substrate heat treatment apparatus according to the example, as viewed from the left side of FIG. 3. 6 is a view illustrating a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention in a rear door direction.

In the substrate heating apparatus 1 according to the preferred embodiment of the present invention, the heating module 20 is configured to be capable of being drawn out from the heating chamber 10. [ The heating module 20 includes a rear door 22, a lower support panel 24 horizontally coupled to the rear door 22, a support frame 26 provided on the lower support panel 24, And a heating assembly 30 as a substrate heating part supported by the support frame 26 and a substrate support pin 28. [

The rear door 22 is a component that is coupled to the heating chamber 10 in a manner facing the front door 14 of the heating chamber 10 in one embodiment. As shown in Fig. 6, the rear door 22 is structured such that a heater constituting the heating assembly 30 is inserted.

The lower support panel 24 forms the bottom surface of the heating module 20 and is supported by the first support portion 18 inside the heating chamber 10.

The support frame 26 is provided on the lower support panel 24 and functions to support the substrate support plate 28 and the heat generating assembly 30. Since a plurality of substrates are loaded and heat-treated in the heating module 20, the support frame 26 forms a plurality of substrate loading spaces so that a plurality of substrates can be loaded.

4 and 5, the substrate is supported by a substrate support pin 28, which may be made of a quartz material that is heat resistant and can minimize damage to the substrate. In one embodiment, the heating assembly 30 is provided to heat the substrate at the top and bottom of the substrate, wherein each heating assembly 30 includes a plurality of heating assemblies 30 extending longitudinally along the direction of the front door 14 from the rear door 22 .

The heat treatment process for the substrate will be briefly described as follows.

With the heating module 20 mounted inside the heating chamber 10, the front door 14 is opened and a plurality of substrates are loaded into the heating module 20. [ Each substrate is supported by a plurality of substrate support pins 28 in a space defined by a layer of the heating module 20. After the loading of the substrate is completed, the front door 14 is closed and the heat generating assembly 30 emits heat to perform heat treatment on the substrate. In this case, the process gas may be supplied to the heating chamber 10 and exhausted through the exhaust duct 16 described above. When the heat treatment process for the substrate is completed, the front door 14 is opened again and the substrate loaded therein is unloaded.

The substrate heat treatment apparatus 1 according to the present invention is characterized in that the heating module 20 is taken out from the heating chamber 10 as described above. Another feature of the substrate heat treatment apparatus 1 lies in the separated configuration of the heat generating assembly 30 provided in the heating module 20.

FIG. 7 is a cross-sectional view illustrating an installation state of a heating assembly provided in a heating module of a substrate heating apparatus according to a preferred embodiment of the present invention, and FIG. 8 is a sectional view of the heating module of the substrate heating apparatus according to the preferred embodiment of the present invention. (A cross-sectional view in the AA 'direction in FIG. 7) of the heat generating assembly. 9 is a cross-sectional view illustrating a state in which a heater provided in a heating module of a substrate heat treatment apparatus according to a preferred embodiment of the present invention is mounted on a heater outer case. FIG. 10 is a cross- Fig. 2 is a view for explaining a heat generation combination of a heater provided in a heating module of the apparatus. Fig.

The heating assembly 30 provided in the heating module 20 of the substrate heating apparatus 1 according to the preferred embodiment of the present invention includes a heater outer case 32 and a heater inserted into the heater outer case 32 34).

In one embodiment, the heater outer case 32 is provided within the heating module 20 while being supported by the support frame 26. The heater outer case 32 may be made of a quartz material which is easy to transfer the heat generated in the heater 34 inside the heater 34 to the substrate in the form of radiant heat and has excellent heat resistance. In one embodiment, one end of the heater outer case 32 is exposed to the outside of the rear door 22 of the heating module 20 to have a shape as shown in Fig. The heater outer case 32 is provided in an end portion inside the heating chamber 10 in a clogged state and the end portion exposed in the rear door 22 is provided in an open state.

A heater (34) is inserted into the heater outer case (32). The heater 34 is detachable from the heater outer case 32 as shown in FIG. Accordingly, when an abnormality occurs in the heater 34, only the heater 34 in which an abnormality has occurred can be separated from the heating module 20 and can be repaired or replaced.

The heater 34 is preferably provided by a combination of a plurality of heaters. Referring to FIG. 7, it is exemplified that the heater 34 is inserted into the heater outer case 32 by combining three of the first heater 34a, the second heater 34b, and the third heater 34c do. However, the heater 34 may be provided as a single heater or two or more heaters. The heater 34 may be provided in the form of a built-in electric resistor or in the form of a lamp heater. The heater 34 may be provided with a thermocouple 36 for temperature measurement. Referring to Fig. 8, three heaters 34a, 34b, and 34c are arranged in a triangular shape, and a thermocouple 36 is disposed at the center thereof. Also, in the case of the thermocouple 36, the plurality of thermocouples 36a, 36b, 36c, 36d, and 36e may be included as shown in FIG. 7 to measure the temperature at a plurality of points.

In the present invention, when a plurality of the heaters 34 are provided, the heat generating positions of the heaters 34a, 34b, and 34c may be set to be different from each other. 7, the heat generating positions 34a-1 and 34a-2 of the first heater 34a are biased toward both ends and the heat generating positions 34b-1 and 34b-2 of the second heater 34b are Is set toward the center of the heat generating positions 34a-1 and 34a-2 of the first heater 34a. In addition, the heat generation position 34c-1 of the third heater 34c is set around the center portion. By setting the heat generating positions of the plurality of heaters 34a, 34b, and 34c differently, the temperature distribution in the heating chamber 10 can be adjusted as needed. For example, referring to FIG. 10, the heat generation of the heat generating assembly 30 can be divided into five zones (zones A to E) according to the heat generating positions of the plurality of heaters 34a, 34b, and 34c and the heat source. The heating module 20 is provided with the plurality of heating assemblies 30 so that the heating and heating positions of the heating assemblies 30 can be adjusted or the plurality of heaters built in the heating assembly 30 can be controlled on / The heat treatment temperature of the substrate and the temperature distribution inside the heating chamber 10 can be efficiently controlled.

As described above, one end of the heater outer case 32 is exposed to the outside of the rear door 22 of the heating module 20. In order to maintain the airtightness during the substrate heat treatment process in the heating chamber 10, A sealing process between the case 32 and the rear door 22 is required. In this case, if the heater outer case 32 is made of quartz or the like, it may be weak against an external impact, so that a structure capable of absorbing external impact to some extent may be preferable. To this end, the present invention proposes a structure for effectively supporting the heater outer case 32 and maintaining airtightness.

Referring to Fig. 7, the heater outer case 32 is fixed by the sealing fixing portion 40 on the outside of the rear door 22.

The sealing fixing portion 40 includes a bellows pipe 42 and a first flange 44 and a second flange 50 provided on both sides of the bellows pipe 42. The first flange 44 is fixed to the rear door 22 and a first O-ring 46 is provided between the first flange 44 and the fixing surface of the rear door 22. Although not shown in FIG. 7, the first flange 44 can be fixed to the rear door 22 by a separate bolt threaded through the first flange and screwed into the rear door 22. The second flange 50 is provided with a second O-ring 52 on the fixing flange 48. The second flange 50 is provided on the outer circumference of the heater outer case 32. The second flange 50 is provided with a fixing flange 48 tightly coupled to the outer circumference of the heater outer case 32, As shown in Fig. In one embodiment, the second flange 50 and the fixing flange 48 may be joined using bolts (not shown).

Since the first O-ring 46 and the second O-ring 52 are respectively provided on the engagement surface of the first flange 44 and the engagement surface of the second flange 50, the heater outer case 32 and the rear door 22, Confidentiality is maintained in the space. Since the sealing fixing part 40 includes the bellows tube 42, there is an advantage that the bellows tube 42 absorbs the movement of the heater outer case 32 to some extent. Here, the bellows pipe 42 may be made of a metal material.

 In the above description with reference to Figs. 7 to 10, one end of the heat generating assembly 30 is exposed to the outside of the rear door 22. This is because it is assumed that the heating module 20 is separated from the heating chamber 10 in the present invention. However, the structure of the heating assembly 30 may be applied to a case where the heating module 20 is fixed to the heating chamber 10. That is, when the heating module 20 is manufactured in a state where the heating module 20 is fixed to the heating chamber 10, the heating assembly 30 is installed through the outer wall 12 of the chamber of the heating chamber 10. In this case, the seal fixing part 40 is provided in a form in which the first flange 44 is coupled to the chamber outer wall 12.

Since the heating assembly 30 includes the heater outer case 32 and the heater 34 inserted into the heater outer case 32, the heater 34 in the embodiment of the present invention may be mounted in various combinations, As shown in FIG.

11 to 13 are views showing various examples of installation of a heater in a substrate heat treatment apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 11, the heater 34 is disposed on the entire heat generating assembly 30 provided in the heating module 20. In the case of FIG. 12, the arrangement of the heaters 34 is omitted in the case of some heat generating assemblies 30, and in the case of FIG. 13, the heaters 34 are disposed only in the surrounding heat generating assemblies 30 except for the center.

Next, an example of the substrate heat treatment apparatus 1 according to the present invention having additional constitution will be described.

FIG. 14 is a plan view showing a state in which a structure for supplying a process gas is added to the substrate heat treatment apparatus according to the preferred embodiment of the present invention, and FIG. 15 is a cross- (A cross-sectional view taken along the line BB 'in Fig. 14).

Referring to the heating chamber 10 shown in FIGS. 14 and 15, the heating chamber 10 is further provided with a gas supply pipe 60. The gas supply pipe 60 supplies gas from the outside of the heating chamber 10 to the inside of the heating chamber 10. The gas supply pipe 60 may be provided in plurality such as the first gas supply pipe 60a and the second gas supply pipe 60b. One end of the gas supply pipe 60 is exposed to the outside of the rear door 22, and a plurality of gas supply holes 62 are formed in the gas supply pipe. The gas supplied to the gas supply hole 62 may be a process gas necessary for the substrate heat treatment process in the heating chamber 10. [ Alternatively, the gas may be in the form of hot air for further heating of the substrate in the substrate heat treatment process in the heating chamber 10, in which case the gas may be an inert gas. In addition, gas outlets 64a and 64b may be formed on the sides of the heating chamber 10.

Referring to FIG. 15, the gas supply pipe 60 is provided on the upper portion of each substrate S for heat treatment, and the gas supply hole 62 may be disposed so as to face downward. The gas supplied toward the lower part of the oblique line can be discharged to the outside of the heating chamber 10 through gas outlets 64a and 64b provided in both sides of the heating chamber 10.

FIG. 16 is a perspective view showing a pin support according to another embodiment of the substrate heat treatment apparatus according to the preferred embodiment of the present invention, and FIG. 17 is a perspective view of a substrate heat treatment apparatus according to another embodiment And the substrate is supported using a pin support.

In the foregoing description, it has been described that the substrate is supported by the plurality of substrate support pins 28 inside the heating chamber 10. 16 and 17 show a pin support 70 for effectively disposing a substrate support pin 28 in the practice of the present invention.

The pin support 70 includes a mounting plate 72 provided in a plate shape, a substrate support pin 28 formed on the mounting plate 72, and a heater seating portion 74.

The heater seat portion (74) is seated on the upper portion of the heater outer case (32). So that the pin support 70 can be supported by the heater outer case 32. The thickness of the mounting plate 72 can be made thin so that the thickness of the structure for mounting the substrate support pin 28 can be reduced. Accordingly, the overall height of the heating chamber 10 can also be reduced.

16 and 17, an example in which the plurality of pin supports 70 are arranged in the transverse direction is shown, but the number of the pin supports 70 arranged in the transverse direction by adjusting the length of the installation plate 72 is One or three or more.

Next, a chamber heating structure in a manner different from that described above will be described. In the above description, the heating chamber 10 is heated by the heating assembly 30 having the heater 34 incorporated in the heater outer case 32. In the following description, a configuration in which a high-temperature gas is supplied into the heating chamber 10 to heat the heating chamber 10 will be described.

FIG. 18 is a plan view showing a chamber heating structure by supplying a heating gas in a substrate heating apparatus according to another preferred embodiment of the present invention. FIG. 19 is a schematic view of a heating apparatus for a substrate according to another preferred embodiment of the present invention, FIG. 20 is a cross-sectional view (a cross-sectional view taken along the line C-C '' of FIG. 18) showing the chamber heating structure by the supply, and FIG. 20 is a schematic view showing a chamber heating structure by heating gas supply in the substrate heat processing apparatus according to another preferred embodiment of the present invention (A sectional view in the DD 'direction in Fig. 18).

In the heating chamber 10 shown in FIG. 18, a heating gas supply pipe 80 is provided instead of the heating assembly 30 as a substrate heating unit, as compared with FIG. The heating gas supply pipe (80) includes a plurality of heating gas supply holes (82) formed at positions inside the heating chamber (10). A high temperature heating gas is supplied to each of the heating gas supply pipes 80 and the heating gas is transferred into the heating chamber 10 through the heating gas supply hole 82 to heat the heating chamber 10.

Referring to FIG. 20, it is shown that, as an example for supplying the heating gas, a heating gas heating unit 84 and a heating gas supply unit 88 are provided outside the heating chamber 10. One end of the heating gas supply pipe 80 is exposed to the outside of the rear door 22 and a heating gas heating unit 84 is provided at the end thereof. A heating gas supply unit 88 is provided at the other end of the heating gas heating unit 84 to transmit the heating gas to the heating gas heating unit 84. The heating gas heating unit 84 is provided with a gas heating body 86. In one embodiment, the heating gas heating unit 84 is formed into a hollow cylindrical shape, Is disposed in the hollow of the heating section (84). The gas heating body 86 may be composed of a resistor which generates electric heat. The heating gas supplied from the heating gas supply unit 88 passes through the heating gas heating unit 84 and is heated and then transferred to the heating gas supply pipe 80. The heating gas is supplied into the heating chamber 10 through a series of heat gas supply holes 82 provided in the heating gas supply pipe 80 to heat the substrate S. As the heating gas, an inert gas may be used.

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

1: substrate heat treatment apparatus 3: base
5: Lifter 7:
9: second transfer part 10: heating chamber
12: chamber outer wall 14: front door
16: exhaust duct 18: first conveying section
20: Heating module 22: Rear door
24: lower support panel 26: support frame
28: substrate support pin 30: heating assembly
32: heater outer case 34: heater
36: thermocouple 40: sealing fixing part
42: bellows tube 44: first flange
46: First O-ring 48: Fixing flange
50: second flange 52: second o-ring
60: gas supply pipe 62: gas supply pipe
64a, 64b: gas outlet 70: pin support
72: mounting plate 74: heater mounting portion
80: Heating gas supply pipe 82: Heating gas supply pipe
84: Heating gas heating part 86: Gas heating element
88: Heating gas supply part

Claims (7)

A heating assembly for heating a substrate, the heating assembly being provided in a plurality of the substrate heat treatment apparatuses,
A heater outer case provided horizontally in the heating chamber with the opened end exposed to the outside of the heating chamber; And
And a heater inserted into the heater outer case through the open end of the heater outer case,
Wherein the heater includes a first heater, a second heater, and a third heater, wherein the first heater is set at a heat generating position on both sides with respect to a longitudinal direction of the heater outer case, Wherein a heat generating position is set inside the heat generating position of the first heater and a heat generating position is set inside the heat generating position of the second heater. delete delete The method according to claim 1,
Characterized in that at least two thermocouples are attached to the heater The method according to claim 1,
Wherein the open end of the heater outer case is secured to a chamber outer wall or rear door of the heating chamber by a sealing securing portion including a bellows tube. 6. The method of claim 5,
The seal fixing part may include a first flange connected to one end of the bellows pipe and fixed to the outer wall of the chamber or the rear door, a fixing flange connected to the other end of the bellows pipe, And a second flange coupled to the first flange. The method according to claim 6,
Wherein a coupling surface between the first flange and the rear door and an engagement surface between the second flange and the fixing flange are provided with O-rings, respectively.

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