WO2010008211A2 - Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement - Google Patents

Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement Download PDF

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Publication number
WO2010008211A2
WO2010008211A2 PCT/KR2009/003909 KR2009003909W WO2010008211A2 WO 2010008211 A2 WO2010008211 A2 WO 2010008211A2 KR 2009003909 W KR2009003909 W KR 2009003909W WO 2010008211 A2 WO2010008211 A2 WO 2010008211A2
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WO
WIPO (PCT)
Prior art keywords
tube
heater
unit
cooling
heat treatment
Prior art date
Application number
PCT/KR2009/003909
Other languages
English (en)
Korean (ko)
Other versions
WO2010008211A3 (fr
Inventor
허관선
강호영
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080069329A external-priority patent/KR101016048B1/ko
Priority claimed from KR1020080069331A external-priority patent/KR101016061B1/ko
Priority claimed from KR1020080069330A external-priority patent/KR101016058B1/ko
Priority claimed from KR1020080110813A external-priority patent/KR101016064B1/ko
Priority claimed from KR1020080110814A external-priority patent/KR101009990B1/ko
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to JP2011518650A priority Critical patent/JP5973728B2/ja
Priority to CN200980122777.2A priority patent/CN102067294B/zh
Publication of WO2010008211A2 publication Critical patent/WO2010008211A2/fr
Publication of WO2010008211A3 publication Critical patent/WO2010008211A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Resistance Heating (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un dispositif de traitement thermique multi-étage permettant de traiter thermiquement plusieurs substrats simultanément, chaque substrat étant chauffé par plusieurs dispositifs de chauffage qui correspondent à chaque substrat. L'invention concerne également un dispositif de chauffage utilisé dans un tel positif de traitement thermique. Le dispositif de traitement thermique multi-étage selon l'invention comprend : une chambre (100) présentant un espace de traitement thermique destiné à plusieurs substrats (10); un support (108) servant de support aux substrats (10) chargés sur celui-ci; et plusieurs unités principales de chauffage (120) disposées à intervalles prédéterminés dans la direction dans laquelle sont empilés les substrats, chaque unité principale de chauffage (120) comprenant plusieurs dispositifs de chauffage principaux individuels (200), les substrats (10) étant disposés entre les unités principales de chauffage (120).
PCT/KR2009/003909 2008-07-16 2009-07-16 Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement WO2010008211A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011518650A JP5973728B2 (ja) 2008-07-16 2009-07-16 バッチ式熱処理装置及び該装置に適用されるヒータ
CN200980122777.2A CN102067294B (zh) 2008-07-16 2009-07-16 批处理式热处理装置以及适用于该热处理装置的加热器

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR10-2008-0069330 2008-07-16
KR1020080069329A KR101016048B1 (ko) 2008-07-16 2008-07-16 배치식 열처리 장치
KR1020080069331A KR101016061B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR10-2008-0069329 2008-07-16
KR1020080069330A KR101016058B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR10-2008-0069331 2008-07-16
KR1020080110813A KR101016064B1 (ko) 2008-11-10 2008-11-10 히터
KR1020080110814A KR101009990B1 (ko) 2008-11-10 2008-11-10 히터
KR10-2008-0110813 2008-11-10
KR10-2008-0110814 2008-11-10

Publications (2)

Publication Number Publication Date
WO2010008211A2 true WO2010008211A2 (fr) 2010-01-21
WO2010008211A3 WO2010008211A3 (fr) 2010-03-25

Family

ID=41550851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003909 WO2010008211A2 (fr) 2008-07-16 2009-07-16 Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement

Country Status (4)

Country Link
JP (2) JP5973728B2 (fr)
CN (3) CN105140157B (fr)
TW (1) TWI508178B (fr)
WO (1) WO2010008211A2 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013531363A (ja) * 2010-04-30 2013-08-01 株式会社テラセミコン 基板処理装置
JP2013539600A (ja) * 2010-08-31 2013-10-24 株式会社テラセミコン バッチ式基板処理装置
CN103493195A (zh) * 2011-04-29 2014-01-01 泰拉半导体株式会社 基板支撑用的支撑板以及使用该支撑板的基板处理装置
WO2020112608A1 (fr) * 2018-11-30 2020-06-04 Lam Research Corporation Socle en céramique avec dispositif de chauffage multicouche pour une uniformité thermique améliorée
CN114485170A (zh) * 2021-12-27 2022-05-13 江苏邑文微电子科技有限公司 快速退火炉加热系统以及温度控制方法
WO2022261289A1 (fr) * 2021-06-09 2022-12-15 Watlow Electric Manufacturing Company Dispositif d'isolation de conduit de froid

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KR101155813B1 (ko) * 2011-08-24 2012-06-12 (주)써모니크 그라파이트 히터로
KR101435454B1 (ko) * 2012-04-27 2014-08-28 주식회사 테라세미콘 기판 처리 장치
KR101982725B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치용 발열 조립체
KR101982724B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치
KR101557037B1 (ko) * 2013-08-14 2015-10-02 (주) 예스티 대면적 유리기판 열처리장치
KR101527158B1 (ko) * 2013-10-24 2015-06-09 주식회사 테라세미콘 배치식 기판처리 장치
KR101479224B1 (ko) 2013-12-09 2015-01-05 포스코에너지 주식회사 박판형 운모 히터
TWI698944B (zh) * 2013-12-23 2020-07-11 南韓商圓益Ｉｐｓ股份有限公司 批量式基板處理裝置
KR102117421B1 (ko) * 2014-05-12 2020-06-02 주식회사 제우스 히터 체결장치 및 이를 이용한 기판 열처리장치
KR101753376B1 (ko) 2015-08-24 2017-07-04 주식회사 하이원시스 4방향 상부 슬라이딩 도어가 설치된 프리히터
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
JP2019029102A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置
TWI709203B (zh) * 2018-09-11 2020-11-01 大陸商北京北方華創微電子裝備有限公司 腔室冷卻裝置及半導體加工設備
WO2020241490A1 (fr) * 2019-05-31 2020-12-03 株式会社九州日昌 Dispositif de chauffage et procédé de chauffage
WO2020241488A1 (fr) * 2019-05-31 2020-12-03 株式会社九州日昌 Dispositif de chauffage et procédé de chauffage
JP2021197448A (ja) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 熱処理装置
KR102559562B1 (ko) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 열처리 오븐의 배기 덕트 일체형 히터 유닛
KR102508123B1 (ko) * 2022-10-28 2023-03-10 (주)삼양세라텍 열처리 장치

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JP2004179672A (ja) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc 基板加熱装置及び半導体回路の形成方法
KR100817400B1 (ko) * 2006-11-09 2008-03-27 권상환 열처리 장치

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JP2004179672A (ja) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc 基板加熱装置及び半導体回路の形成方法
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013531363A (ja) * 2010-04-30 2013-08-01 株式会社テラセミコン 基板処理装置
JP2013539600A (ja) * 2010-08-31 2013-10-24 株式会社テラセミコン バッチ式基板処理装置
CN103493195A (zh) * 2011-04-29 2014-01-01 泰拉半导体株式会社 基板支撑用的支撑板以及使用该支撑板的基板处理装置
JP2014512700A (ja) * 2011-04-29 2014-05-22 株式会社テラセミコン 基板支持用ホルダ及び該ホルダを用いた基板処理装置
WO2020112608A1 (fr) * 2018-11-30 2020-06-04 Lam Research Corporation Socle en céramique avec dispositif de chauffage multicouche pour une uniformité thermique améliorée
WO2022261289A1 (fr) * 2021-06-09 2022-12-15 Watlow Electric Manufacturing Company Dispositif d'isolation de conduit de froid
CN114485170A (zh) * 2021-12-27 2022-05-13 江苏邑文微电子科技有限公司 快速退火炉加热系统以及温度控制方法
CN114485170B (zh) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 快速退火炉加热系统以及温度控制方法

Also Published As

Publication number Publication date
CN105140157A (zh) 2015-12-09
CN102067294A (zh) 2011-05-18
CN105140157B (zh) 2018-05-29
JP2011528501A (ja) 2011-11-17
TWI508178B (zh) 2015-11-11
JP2014146815A (ja) 2014-08-14
TW201007847A (en) 2010-02-16
JP5973728B2 (ja) 2016-08-23
CN102067294B (zh) 2016-10-19
CN102983091A (zh) 2013-03-20
WO2010008211A3 (fr) 2010-03-25

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