WO2019083261A1 - Dispositif de dépôt - Google Patents

Dispositif de dépôt

Info

Publication number
WO2019083261A1
WO2019083261A1 PCT/KR2018/012589 KR2018012589W WO2019083261A1 WO 2019083261 A1 WO2019083261 A1 WO 2019083261A1 KR 2018012589 W KR2018012589 W KR 2018012589W WO 2019083261 A1 WO2019083261 A1 WO 2019083261A1
Authority
WO
WIPO (PCT)
Prior art keywords
crucible
plate
heater unit
opening
deposition
Prior art date
Application number
PCT/KR2018/012589
Other languages
English (en)
Korean (ko)
Inventor
송기철
이승훈
원종하
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Publication of WO2019083261A1 publication Critical patent/WO2019083261A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material

Definitions

  • the present invention relates to a deposition apparatus, and more particularly, to a deposition apparatus for depositing an evaporation material as an evaporation material.
  • Deposition is a method of depositing gaseous particles on a thin solid film on the surface of an object such as metal, glass or the like.
  • an OLED display panel manufacturing process includes a process of depositing an organic material on a glass substrate in a vacuum state.
  • the deposition process includes heating a crucible containing an organic material to evaporate the organic material into a gaseous state, and a process in which the gaseous organic material is deposited on the substrate through a nozzle.
  • the organic material charged in the crucible is unevenly exhausted.
  • the organic material may be unevenly exhausted because the heat supplied to the crucible is collected at the center of the crucible or the injection pressure of the organic material filled in the crucible is not controlled.
  • the organic material charged in the crucible is unevenly discharged, there may arise a problem that organic substances are deposited unevenly on the substrate. Further, since the organic material charged in the crucible can not be used for a long time and is replaced sooner, a large amount of organic material may be discarded.
  • a vapor deposition apparatus for uniformly exhausting the organic material filled in the crucible may be required.
  • the present invention is directed to solving the above-mentioned problems and other problems.
  • the present invention seeks to provide a deposition apparatus for controlling the pressure inside a crucible.
  • a deposition apparatus includes a crucible in which a deposition material is filled in a lower portion, a heater unit that supplies heat to a crucible, a nozzle through which the evaporation material evaporated by heat supplied by the heater unit passes,
  • the inner plate may include a stationary plate having at least one or more openings for moving the evaporation material to the plurality of nozzles, and a movable plate for adjusting the size of the openings.
  • a plurality of inner plates may be arranged inside the crucible, and a plurality of inner plates may be arranged at different heights inside the crucible.
  • the upper plate located on the upper side of the plurality of inner plates is provided with an upper opening, and a pair of lower openings may be formed on the lower plate located below the upper plate among the plurality of inner plates.
  • the upper opening faces the upper surface of the lower plate, and the lower opening faces the lower surface of the upper plate.
  • the pair of lower openings may be discordant with the upper openings in the vertical direction.
  • An opening is formed in each of the plurality of inner plates, and an opening area of the upper side inner plate located on the upper side of the plurality of inner plates may be smaller than an opening area of the lower side inner plate located on the lower side.
  • Each of the plurality of inner plates is horizontally arranged inside the crucible, and the plurality of inner plates are spaced apart from each other in the vertical direction.
  • the evaporation source filled in the crucible can be uniformly exhausted, and the advantage of being able to use the evaporation source filled in for a long time and to minimize the amount of the evaporation source abandoned.
  • the organic material can be uniformly deposited on the substrate.
  • FIG. 1 is a view showing a deposition apparatus system according to an embodiment of the present invention viewed from above.
  • FIG. 2 is a side view of a deposition system according to an embodiment of the present invention.
  • FIG 3 is a perspective view of a deposition apparatus according to an embodiment of the present invention.
  • FIG. 4 is an exploded perspective view of a deposition apparatus according to an embodiment of the present invention.
  • FIG. 5 is a perspective view of a guide according to an embodiment of the present invention.
  • FIG. 6 is a view showing a nozzle cover according to an embodiment of the present invention.
  • FIG. 7 is a perspective view of a crucible according to an embodiment of the present invention.
  • FIG. 8 is a vertical cross-sectional view of a crucible according to an embodiment of the present invention.
  • FIG. 9 is a perspective view of a heater unit according to an embodiment of the present invention.
  • FIG. 10 is an exploded perspective view of a heater unit according to an embodiment of the present invention.
  • FIG. 11 is a perspective view illustrating a cooling unit housing a heater unit according to an embodiment of the present invention.
  • FIG. 14 is a view for explaining an inner plate according to the first embodiment of the present invention.
  • 15 is a view for explaining an inner plate according to a second embodiment of the present invention.
  • 16 is a view for explaining an inner plate according to a third embodiment of the present invention.
  • 17 is a side view showing a deposition apparatus system for sensing the temperature of a material to be deposited according to another embodiment of the present invention.
  • FIG. 18 is a view showing a multi-channel cooling plate for controlling the temperature of a material to be deposited according to another embodiment of the present invention.
  • FIG. 1 is a top view of a deposition apparatus system according to an embodiment of the present invention
  • FIG. 2 is a side view of a deposition apparatus system according to an embodiment of the present invention.
  • a deposition system 1 includes a support unit 10, first and second drive units 11 and 12 disposed on the support unit 10, (11), (12), and is moved by at least one of the first driving part (11) (12) and the second driving part (13) At least one evaporation material 14 and 15 to which a thin film material to be evaporated is adhered and an aligner 16 for fixing the evaporation materials 14 and 15 are included in the evaporation apparatus 100 can do.
  • the supporting unit 10 may support the first driving units 11 and 12, the second driving unit 13, and the deposition apparatus 100. More specifically, the first driving part 11 and the second driving part 12 are located on the supporting part 10, the second driving part 13 is positioned on the first driving part 11 and the second driving part 13 is deposited on the second driving part 13, The device 100 may be located.
  • the first driving parts 11 and 12 may be disposed on both sides of the supporting part 10.
  • the first driving units 11 and 12 are provided with linear motors so that the second driving units 13 positioned on the first driving units 11 and 12 can be horizontally moved.
  • the first driving part 11 and the second driving part 12 can move the second driving part 13 in one direction of the supporting part 10.
  • the second driving unit 13 is provided with a linear motor (not shown) to move the deposition apparatus 100 located on the second driving unit 13.
  • the driving direction of the second driving unit 13 may be a direction perpendicular to the driving direction of the first driving unit 11 or 12.
  • the deposition apparatus 100 can be moved on the supporting unit 10 by driving the first and second driving units 11 and 12 and the second driving unit 13.
  • the deposition system 1 may include at least one deposited material 14 (15).
  • the deposition system 1 includes the first and second objects 14 and 15 as an example, but this is merely an example.
  • the deposited materials 14 and 15 may include a glass substrate.
  • At least one of the deposited materials (14) and (15) can be fixed by the aligner (16).
  • the evaporated materials 14 and 15 can be disposed above the evaporation apparatus 100 so that evaporated evaporation material in the evaporation apparatus 100 can be deposited on the lower surface of the evaporated matter 14 and 15.
  • the deposition apparatus 100 can move on the support unit 10 by the first driving unit 11 and the second driving unit 13 and can move at least one An evaporation material can be deposited on the evaporation materials 14 and 15.
  • the supporting part 10, the first driving part 11 and the second driving part 13, the deposition device 100, the at least one deposited material 14 and 15 and the aligner 16 are connected to the vacuum chamber 2 As shown in FIG.
  • FIG. 3 is a perspective view of a deposition apparatus according to an embodiment of the present invention
  • FIG. 4 is an exploded perspective view of a deposition apparatus according to an embodiment of the present invention.
  • a deposition apparatus 100 includes a moving unit 102, a cooling unit 120, a heater unit 130 accommodated in a cooling unit 120, A crucible 140 accommodated in the heater unit 130, a nozzle cover 150 disposed on the upper surface of the crucible 140, and a guide 110 disposed on the upper surface of the nozzle cover 150 have.
  • the deposition apparatus 100 may further include at least one of the ATM box 101 and the QCM sensor 103. In addition, however, at least one of the ATM box 101 and the QCM sensor 103 may be omitted in the deposition apparatus 100 according to the present invention.
  • the moving part 102 may be disposed in the second driving part 13. Therefore, as the second driving unit 13 moves the moving unit 102, the deposition apparatus 100 moves.
  • the ATM box 101 can be disposed in the moving part 102.
  • the ATM box 101 can accommodate electrical devices such as cables, sensors, and circuits of the deposition apparatus 100.
  • electrical devices such as cables, sensors, and circuits of the deposition apparatus 100.
  • a cable connected to the QCM sensor 103, a cable 139 connected to the heater unit 138, and a cable connected to the cooling channel (not shown) may be accommodated in the ATM box 101. Accordingly, it is possible to minimize the problem that the cable connected to the deposition apparatus 100 interferes with the movement of the deposition apparatus 100 or obstructs the path of the deposition material.
  • the cooling unit 120 may block the heat emitted by the heater unit 130 from being discharged to the outside of the deposition apparatus 100 in order to heat the deposition source material.
  • a receiving space may be formed in the cooling part 120 and a heater part 130 may be disposed in the accommodating space of the cooling part 120.
  • the cooling unit 120 can minimize the heat radiated from the heater unit 130 housed therein to the outside.
  • the heater unit 130 may be accommodated in the inner space of the cooling unit 120.
  • a receiving space may be formed in the heater unit 130 and a heater unit 138 (see FIG. 10) for emitting heat and a crucible 140 may be accommodated in the receiving space of the heater unit 130 .
  • the heater unit 138 is accommodated along the inner circumference of the heater unit 130, and the crucible 140 can be accommodated inside the heater unit 138.
  • the heater unit 138 of the heater unit 130 can emit heat, and the heat emitted from the heater unit 138 can heat the crucible 140.
  • the heater unit 130 may include a reflector 135 (see FIG. 10) that reflects heat emitted from the heater unit 138.
  • the reflector 135 may form an outer surface of the heater unit 130.
  • the heater unit 130 includes the reflector 135, the heater unit 138, and the crucible 140.
  • the heater unit 138 is located inside the reflector 135, and the inside of the heater unit 138 So that the crucible 140 is positioned.
  • the reflector 135 reflects the heat radiated from the heater unit 138 toward the inside of the heater unit 130 so that the reflected heat can further heat the crucible 140. Accordingly, the power consumption used by the heater unit 138 to discharge heat can be reduced.
  • the crucible 140 can house the deposition material 3 (see FIG. 8). When the crucible 140 is heated, the evaporation material 3 contained in the crucible 140 can be evaporated to the evaporation material 4 (see FIG. 8).
  • the deposition material 3 is a material to be charged in the crucible 140 to be deposited on at least one of the objects to be deposited 14 and 15 and is a material before being evaporated into the deposition material 4.
  • the evaporation material 4 is a gaseous material in which the evaporation material 3 in a liquid state is vaporized and represents a material that can be deposited in at least one of the at least one protector 14 and 15.
  • the liquid state substance and the gaseous state substance are distinguished from each other and named, so that the present invention is not limited thereto.
  • At least one nozzle 141, 142 having a hole through which the evaporation material 4 can pass may be disposed on the crucible 140.
  • the evaporation material 4 evaporated inside the crucible 140 may be injected into the guide 110 through the nozzles 141 and 142.
  • the guide 110 can guide the evaporation material 4 that has passed through the nozzles 141 and 142 toward the evaporation materials 14 and 15.
  • the guide 110 can guide the evaporation material 4 having passed through the nozzles 141 and 142 to be uniformly deposited on the evaporation materials 14 and 15.
  • the nozzle cover 150 may be positioned between the crucible 140 and the guide 110.
  • the nozzle cover 150 may be a cover covering the periphery of the nozzles 141 and 142 formed on the crucible 140.
  • the nozzle cover 150 minimizes the transfer of heat formed in the crucible 140 to the guide 110 and minimizes the influence of the guide 110 on the deposited materials 14 and 15 by heating.
  • FIG. 5 is a perspective view of a guide according to an embodiment of the present invention.
  • the guide 110 may have a hexahedral shape, and a hole may be formed in at least one of the surfaces.
  • At least one injection hole 112 may be formed on the lower surface of the guide 110 to inject the deposition material 4 having passed through the nozzles 141 and 142 into the guide 110.
  • the size of the injection hole 112 may be larger than the size of the nozzles 141 and 142.
  • An open space 113 through which the evaporation material 4 moves may be formed in the guide 110.
  • the deposition material 4 may be deposited on the deposited material 14 (15) through the open space 113.
  • At least one or more sensing holes 111 may be formed on the side surface of the guide 110. At least one QCM sensor 103 may be disposed in the sensing hole 111.
  • the QCM sensor 103 can sense the inside of the guide 110 through the sensing hole 111. [ Specifically, the QCM sensor 103 senses the evaporation material 4 existing in the guide 110 to acquire information such as evaporation amount and state of the evaporation material 4.
  • Fig. 6 is a view showing a nozzle cover according to an embodiment of the present invention.
  • At least one or more nozzle holes 151 may be formed in the nozzle cover 150 according to the embodiment of the present invention.
  • the nozzle hole 151 may be a hole through which the nozzles 141 and 142 penetrate when the nozzle cover 150 is disposed above the crucible 140.
  • the deposition material 4 having passed through the nozzles 141 and 142 can be injected into the guide 110 through the nozzle holes 151.
  • the nozzle cover 150 may block the heat transfer between the crucible 140 and the guide 110 while passing the evaporation material 4. Specifically, when the evaporation materials 14 and 15 are heated, the evaporation materials 14 and 15 may be positioned on the guide 110, And can be deposited non-uniformly. Therefore, the heat transfer to the objects to be deposited 14 and 15 must be blocked, and the nozzle cover 150 can block heat from being transferred to the objects to be deposited 14 and 15.
  • the nozzle cover 150 may be mounted on top of the crucible 140.
  • FIG. 7 is a perspective view of a crucible according to an embodiment of the present invention
  • FIG. 8 is a vertical cross-sectional view of a crucible according to an embodiment of the present invention.
  • the crucible 140 may be provided with a space 143 in which the deposition material 3 and the deposition material 4 are accommodated.
  • the evaporation material 3 can be accommodated in the space 143 and the evaporation material 3 can be evaporated as the crucible 140 is heated.
  • the deposition material 4 moves upward in the space 143 and can be discharged to the outside of the crucible 140 through at least one of the nozzles 141 and 142. [ The evaporation material 4 discharged from the crucible 140 can be injected into the guide 110.
  • At least one or more nozzles 141 and 142 may be formed on the crucible 140. At least one or more nozzles 141 and 142 can supply the evaporated material 4 evaporated from the evaporation material 3 to the evaporation materials 14 and 15.
  • the deposition apparatus 100 may include at least one vertical nozzle 141 and at least one oblique nozzle 142.
  • the vertical nozzle 141 has a nozzle hole through which the evaporation material 4 passes and a slope nozzle 142 which surrounds the nozzle through which the evaporation material 4 passes, It is reasonable that it is not limited to these names.
  • the vertical nozzles 141 and the oblique nozzles 142 may be different in shape, position, and size.
  • the vertical nozzle 141 may have a circular shape in the horizontal section, and may include a nozzle hole for moving the deposition material 4 in the vertical direction.
  • the inclined nozzle 142 may have a rectangular shape in cross section in the horizontal direction and may include a nozzle hole for moving the deposition material 4 in a predetermined angle slanting direction. The deposition material 4 passing through the vertical nozzle 141 and the slanted nozzle 142 may be injected into the nozzle hole 151.
  • the vertical nozzle 141 and the inclined nozzle 142 may be formed on the upper surface of the crucible 140, respectively.
  • the vertical nozzle 141 may be formed on the upper surface of the crucible 140 on the inner side of the deposition apparatus 100 rather than the inclined nozzle 142.
  • the vertical nozzle 141 may be formed in a region closer to the center of the guide 110 than the inclined nozzle 142.
  • the vertical nozzle 141 can be positioned between the pair of inclined nozzles 142. Accordingly, the evaporation material 4 evaporated inside the crucible 140 is discharged vertically in a region close to the center of the guide 110, and discharged in an oblique direction in a region close to the side of the guide 110 .
  • a heater 130 for evaporating the evaporation material 3 to the evaporation material 4 may be disposed outside the crucible 140.
  • FIG. 9 is a perspective view of a heater unit according to an embodiment of the present invention
  • FIG. 10 is an exploded perspective view of a heater unit according to an embodiment of the present invention.
  • the heater unit 130 includes a frame 134, at least one reflector 135 mounted on the frame 134, a heater unit 138 accommodated in the frame 134, And a heater cover 133 covering the heater unit 138 and the upper portion of the frame 134.
  • the frame 134 supports the heater unit 130 and can accommodate at least one heater unit 138 and the crucible 140.
  • the receiving space S1 in which the heater unit 138 and the crucible 140 are accommodated may be formed in the frame 134.
  • the heater unit 138 is accommodated along the inner periphery of the frame 134, and the crucible 140 can be accommodated inside the heater unit 138.
  • the heater unit 138 can heat the crucible 140 by releasing heat.
  • the heater unit 138 may be divided into an upper heater unit 136 and a lower heater unit 137.
  • the upper heater unit 136 may be arranged horizontally to the nozzles 141 and 142 and the lower heater unit 137 may be arranged to be parallel to the space 143 of the crucible 140.
  • the upper heater unit 136 heats the nozzles 141 and 142 to suppress the occurrence of a clogging phenomenon in which the evaporation material 4 is deposited around the nozzles 141 and 142, 137 may heat the space 143 of the crucible 140 to evaporate the evaporation source material 3.
  • the heater unit 130 may include a cable 139 for supplying power to the heater unit 138 and the cable 139 may be accommodated in the ATM box 101.
  • the heater unit 130 may further include a heater cover 133 that minimizes the transfer of the heat radiated from the heater unit 138 to the deposits 14 and 15, And may be disposed on top of the upper heater unit 136.
  • the heater cover 133 has a hole through which at least one of the nozzles 141 and 142 is passed to cover the upper heater unit 136 while passing through the nozzles 141 and 142.
  • the nozzle cover 150 may be disposed on the upper portion of the heater cover 133 and the guide 110 may be disposed on the upper portion of the nozzle cover 150.
  • the heater unit 130 may include at least one reflector 135 for concentrating the heat emitted from the heater unit 138 into the crucible 140.
  • the reflector 135 may be mounted on the outer surface of the frame 134. Specifically, the reflector 135 can be mounted on the side surface and the bottom surface of the frame 134.
  • the reflector 135 may be formed of a material having high heat reflectivity. Alternatively, the reflector 135 may be formed of a material having a low thermal conductivity.
  • the reflector 135 can reflect the heat emitted from the heater unit 138 toward the outside of the heater unit 130 in the direction of the crucible 140. Accordingly, there is an advantage that the crucible 140 can be heated with a small amount of heat. It also has the advantage of increasing the reusability of the heat energy released to the outside, increasing the energy efficiency of the system, and reducing the influence on the deposited material. In addition, there is an advantage that the heat emitted from the heater unit 138 can be minimized to the outside of the deposition apparatus 100.
  • the cooling unit 120 may be formed outside the heater unit 130 so that the heat emitted from the heater unit 138 is not discharged to the outside of the deposition apparatus 100.
  • FIG. 11 is a perspective view illustrating a cooling unit housing a heater unit according to an embodiment of the present invention.
  • the deposition apparatus 100 includes at least one crucible 140 (addition of crucible 140 in FIG. 11), at least one heater unit 130, at least one cooling unit 120, . ≪ / RTI >
  • the crucible 140 may be accommodated in the heater unit 130 and the heater unit 130 may be accommodated in the cooling unit 120. Therefore, the size of the crucible 140 may be smaller than that of the heater 130, and the size of the heater 130 may be smaller than that of the cooling unit 120.
  • the number of crucibles 140 and the number of heater units 130 may be the same.
  • the deposition apparatus 100 may include a plurality of cooling units 120, and each of the cooling units 120 includes a plurality of heater units 130.
  • the number of the crucibles 140, The number of the cooling units 120, and the number of the cooling units 120 may be the same.
  • the deposition apparatus 100 may include one cooling unit 120, and a plurality of separation spaces may be formed in the cooling unit 120, (130) can be accommodated.
  • the cooling unit 120 may block the heat emitted from the heater unit 138 from being discharged to the outside of the deposition apparatus 100.
  • the cooling unit 120 is configured such that the heat discharged from the heater unit 138 is discharged to the outside of the deposition apparatus 100 and the deposition material 4 is deposited on the materials 14 and 15 positioned higher than the deposition apparatus 100 It is possible to minimize the non-uniform deposition.
  • the heater unit 138 heats the crucible 140 and the crucible 140 is heated, the evaporation material 3 contained in the evaporation apparatus 100 is evaporated into the evaporation material 4, 141 and 142 and the deposition material 4 may be moved in a direction guiding the guide 110 to be deposited on the deposited material 14 and 15.
  • the evaporation source material 3 accommodated in the crucible 140 may be unevenly consumed. If the deposition material 3 is unevenly discharged, the amount of the deposition material 3 that is not deposited on the deposition material 14 (15) and is discarded may increase.
  • the deposition apparatus 100 may include an inner plate 300 (see FIG. 12) for adjusting the internal pressure of the crucible 140.
  • FIG. 12 to 13 are views showing a comparative example compared with the inner plate according to the embodiment of the present invention.
  • a space 143 in which the evaporation material 3 and the evaporation material 4 evaporated in the evaporation material 3 are accommodated may be formed in the crucible 140.
  • the deposition apparatus 100 may include an inner plate 300 and the inner plate 300 may be located in a space 143 formed inside the crucible 143.
  • the deposition apparatus 100 may include a plurality of inner plates 300. 12, the deposition apparatus 100 may include first to third inner plates 310, 320, and 330, or may include a deposition apparatus 100, as shown in FIG. 13, And may include first and second inner plates 310 and 320. That is, since the number of the inner plates 300 included in the deposition apparatus 100 may vary, it is appropriate that the present invention is not limited to the example shown in FIGS.
  • the inner plate 300 may have an opening 301 for moving the deposition material 4 to the plurality of nozzles 141 and 142.
  • At least one opening 301 may be formed in at least one of the inner plates 310, 320, and 330, and the size and shape of the opening 301 may vary.
  • FIG. 13 (a) is an internal cross-sectional view of the crucible 140 when the deposition apparatus 100 includes a plurality of inner plates 310 and 320
  • FIG. 13 (c) is a plan view of the lower plate 320 among a plurality of inner plates.
  • an opening 301 may be formed in each of the plurality of inner plates 310 and 320 and a plurality of inner plates 310 and 320 may be formed in the upper plate 310 of the upper one of the plurality of inner plates 310 and 320,
  • the horizontal length D1 of the opening portion and the horizontal length D2 of the opening portion of the lower plate 320 located at the lower side may be the same or different.
  • the size of the opening 301 may be different from the horizontal length D1 (D2) of the opening formed in the plurality of inner plates 310 and 320.
  • the uniformity of the deposition and the internal pressure of the crucible 140 can be changed according to the size of the opening 301 formed in the plurality of inner plates 310 and 320. For example, if the size of the opening 301 is small, the deposition material 4 may be uniformly deposited on the deposition materials 14 and 15, but the pressure of the deposition material may increase, . Alternatively, if the size of the opening 301 is large, the inner pressure of the crucible 140 is not controlled, and the deposition material 4 may be deposited non-uniformly on the deposited materials 14 and 15.
  • the deposition apparatus 100 may include a movable plate for adjusting the size of the opening 301.
  • Fig. 14 is a view for explaining the inner plate according to the first embodiment of the present invention.
  • 14 (a) is an internal sectional view of the crucible 140 when the deposition apparatus 100 includes a plurality of inner plates 410 and 420
  • Fig. 14 (b) is a cross- 14C is a plan view of the lower plate 420 of the plurality of inner plates.
  • the evaporation source material 3 may be filled in the lower part of the crucible 140.
  • the heater unit 138 supplies heat to the crucible 140, the evaporation material 3 may be evaporated into the evaporation material 4 to pass through the plurality of nozzles 141 and 142.
  • a plurality of inner plates 410 and 420 may be disposed inside the crucible 140 and a plurality of inner plates 410 and 420 may be disposed within the crucible 140 at different heights.
  • Each of the plurality of inner plates 410 and 420 may be horizontally disposed inside the crucible 140 and the plurality of inner plates may be spaced apart from each other in the vertical direction.
  • the inner plates 410 and 420 may include a fixing plate 411 and a movable plate 412.
  • the inner plates 410 and 420 may include a fixing plate 411 and a movable plate 412.
  • the inner plates 410 and 420 may include a fixing plate 411 and a movable plate 412,
  • At least one or more openings 401, 402 and 403 for moving the deposition material 4 to the plurality of nozzles 141 and 142 may be formed in the fixing plates 411 and 421 and the movable plate 412 ) 413, 422, and 423 can adjust the sizes of the openings 401, 402, and 403.
  • An upper opening 401 is formed in the upper plate 410 located on the upper side of the plurality of inner plates 410 and 420 and a plurality of inner plates 410 and 420 are formed in the upper plate 410.
  • a pair of lower openings 402 and 403 may be formed in the lower plate 420 located below the upper plate 410.
  • the upper opening 401 may face the upper surface 420a of the lower plate 420 and the lower opening 402 and 403 may face the lower surface 410b of the upper plate 410.
  • the pair of lower openings 402 and 403 may be vertically inconsistent with the upper opening 401.
  • Openings 401, 402 and 403 are formed in each of the plurality of inner plates 410 and 420 and an opening area S1 of the upper plate 410 located on the upper side among the plurality of inner plates is May be smaller than the area S2 of the opening of the lower plate 420 positioned. That is, the opening area S1 of the upper plate 410 may be smaller than the sum of the first opening area S2 of the lower plate 420 and the second opening area S2.
  • a pair of lower openings 402 and 403 may be formed on both sides of the lower plate 420 and an upper opening 401 may be formed in the center of the upper plate 410.
  • the upper plate 410 may be disposed on both sides of the upper opening 401 and may include a pair of upper movable plates 412 and 413 for adjusting the size of the upper opening 401.
  • the lower plate 420 may include a pair of lower movable plates 422 and 423 that adjust the size of each of the pair of lower openings 402 and 403.
  • the pair of upper movable plates 412 and 413 move in the horizontal direction to adjust the size of the upper opening 401 and each of the pair of lower movable plates 422 and 423 moves in the horizontal direction It is possible to adjust the size of the lower openings 402,
  • the deposition apparatus 100 includes at least one movable plate 422 or 423 as described above, depending on the type of the deposition source material 3, the exhausted state of the deposition source material 3, the internal pressure of the crucible 140, 401) 402 and 403 can be appropriately adjusted. It is possible to induce the evaporation source material 3 to be exhausted uniformly through the adjustment of the size of the openings 401, 402 and 403, and thus the deposition material 4 is uniformly deposited on the evaporation materials 14 and 15 There is an advantage that can be.
  • FIG. 15 is a view for explaining the inner plate according to the second embodiment of the present invention.
  • 15 (a) is an internal sectional view of the crucible 140 when the deposition apparatus 100 includes a plurality of inner plates 410 and 420
  • FIG. 15 (b) is a cross- 15C is a plan view of the lower plate 420 of the plurality of inner plates.
  • a plurality of inner plates 410 and 420 may be disposed inside the crucible 140 and a plurality of inner plates 410 and 420 may be disposed within the crucible 140 at different heights.
  • Porous openings may be formed in any one of the plurality of inner plates 410 and 420.
  • An upper opening 401 and a pair of porous openings 404 may be formed in the upper plate 410 positioned on the upper side of the plurality of inner plates 410 and 420.
  • the pair of porous openings 404 may include a plurality of small holes.
  • the upper opening 401 may be located between the pair of porous openings 404.
  • the upper plate 410 may include an upper fixing plate 411 and a pair of movable plates 412 and 413 and the pair of movable plates 412 and 413 may include upper and lower movable plates 412 and 413, And can move in the horizontal direction.
  • the movable plates 412 and 413 can be attached to any one of the upper surface and the lower surface of the fixed plates 411 and 421 and horizontally moved.
  • the upper opening 401 faces the upper surface 420a of the lower plate 420 and each of the pair of porous openings 404 can face each of the lower openings 402 and 403 formed in the lower plate 420.
  • a pair of lower openings 402 and 403 may be formed in the lower plate 420 located below the upper plate 410 of the plurality of inner plates 410 and 420 and a pair of lower openings And a pair of lower movable plates 422 and 423 for adjusting the size of each of the lower movable plates 402 and 403.
  • Each of the pair of lower openings 402 and 403 may face each of the pair of porous openings 404 formed in the upper plate 410.
  • some of the deposition material that has passed through the pair of lower openings 402, 403 may pass through the upper opening portion 401, and some portion may pass through the porous opening portion 404.
  • 16 is a view for explaining the inner plate according to the third embodiment of the present invention.
  • 16 (a) is an internal sectional view of the crucible 140 when the deposition apparatus 100 includes a plurality of inner plates 410 and 420
  • FIG. 16 (b) is a cross- 16C is a plan view of the lower plate 420 of the plurality of inner plates.
  • a plurality of inner plates 410 and 420 may be disposed inside the crucible 140 and a plurality of inner plates 410 and 420 may be disposed within the crucible 140 at different heights.
  • An upper opening 401 is formed in the upper plate 410 located on the upper side of the plurality of inner plates 410 and 420 and a lower plate 420 is disposed on the lower plate 420 located below the upper plate 410.
  • [ (402) and (403) may be formed.
  • the upper plate 410 may include an upper fixing plate 411 formed with an upper opening 401 and an upper movable plate 414 adjusting the size of the upper opening 410.
  • the upper plate 410 includes one upper movable plate 414, and the upper movable plate 414 can adjust the size of the upper opening 401.
  • the horizontal length D3 of the upper movable plate 414 may be longer than the horizontal length D4 of the upper opening 401.
  • the movable plate 414 can be positioned on either side of the upper opening 401, and the size of the upper opening 401 can be regulated.
  • the lower plate 420 includes a lower fixing plate 421 formed with a pair of lower openings 402 and 403 and a pair of lower movable plates 421 and 422 adjusting the size of each of the pair of lower openings 402 and 403. [ 422) < / RTI >
  • the movable plate is described as being located on the upper portion of the fixed plate, but this is merely an example.
  • the movable plate may be mounted on the lower portion of the fixed plate or accommodated in the fixed plate to adjust the size of the opening.
  • the movable plate may be connected to the motor to automatically adjust the size of the opening. That is, the control unit (not shown) can measure the exhaustion state of the deposition source 3, the internal pressure of the crucible 140, and the like, and adjust the size of the opening by moving the movable plate. That is, the position and the moving method of the movable plate are not limited.
  • the deposition apparatus 100 can control the temperature of the materials 14 and 15 to induce the deposition material 4 to be deposited uniformly.
  • FIG. 17 is a side view showing a deposition apparatus system for sensing the temperature of a material to be deposited according to another embodiment of the present invention
  • FIG. 18 is a side view showing a multi-channel cooling plate for controlling the temperature of the material to be deposited according to another embodiment of the present invention.
  • a deposition system includes a support 10, first and second drivers 11 and 12 positioned on the support 10, The deposition apparatus 100 and the deposition apparatus 100 which are positioned on the second and third driving units 13 and 13 and are moved by at least one of the first and second driving units 11 and 12 and the second driving unit 13, At least one evaporation material 14 (15) to which the thin film material evaporated in the evaporation material 14 (100) is adhered, a multi-channel cooling plate 720 730 for controlling the temperature of the evaporation material 14 (15) An infrared camera 710 for measuring the temperature of the substances to be deposited 14 and 15, an infrared camera support unit 710 for fixing the infrared camera 710, 20).
  • the infrared camera 710 may be disposed on the infrared camera support portion 20.
  • the infrared camera support portion 20 can move in the horizontal direction.
  • the infrared camera 710 may be arranged to be vertically aligned with at least one evaporated material 14 (15).
  • the infrared camera 710 may be positioned below the at least one deposited material 14 (15).
  • the infrared camera 710 can measure the temperature of the at least one deposited material 14 and 15 located on the upper side.
  • the infrared camera 710 can obtain the temperature distribution data of the objects to be deposited 14 and 15 by measuring the temperature of at least one of the objects to be deposited 14 and 15.
  • the multi-channel cooling plates 720 and 730 may be disposed on the upper side of the material deposit 14 (15).
  • the multi-channel cooling plates 720 and 730 may include a plurality of cooling channels and may control at least one cooling channel according to the temperature distribution data of the objects to be deposited 14 and 15.
  • the multi-channel cooling plate 730 may include first to third cooling channels 731 to 733.
  • the multi-channel cooling plate 730 can control the temperature of the cooling water passing through each of the first to third cooling channels 731 to 733 differently. Accordingly, the multi-channel cooling plate 730 controls the first to third cooling channels 731 to 733, respectively, to locally control the temperature of the material to be deposited 15 located under the multi-channel cooling plate 730 . That is, the multi-channel cooling plate 730 is disposed between the lower region temperature of the first cooling channel 731, the lower region temperature of the second cooling channel 732, and the lower region temperature of the third cooling channel 733 The lower zone temperature can be controlled.
  • the multi-channel cooling plate 730 can finely adjust the temperature of the material to be deposited 15 as the cooling channel contains a lot of cooling channels.
  • the multi-channel cooling plate 730 obtains the temperature distribution data of the objects to be deposited 14 and 15 from the infrared camera 710 and passes the low temperature cooling water through the cooling channel corresponding to the high temperature region to the object 15 can be lowered.
  • the deposition apparatus system 1 includes the multi-channel cooling plate 730, the temperature of the substances to be deposited 14 and 15 is locally adjusted, and the deposition material 4 is deposited on the substances to be deposited 14 and 15, It is possible to uniformly deposit the film on the substrate.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polarising Elements (AREA)
  • Glass Compositions (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

La présente invention concerne un dispositif de dépôt pour l'ajustement de la pression interne d'un creuset de façon telle que des matières premières de dépôt remplissant le creuset sont consommées de manière uniforme, le dispositif de dépôt comprenant : un creuset rempli de matières premières de dépôt au niveau de sa partie inférieure ; une unité de chauffage pour la fourniture de chaleur au creuset ; des buses dans lesquelles passe un matériau de dépôt, évaporé par la chaleur fournie par l'unité de chauffage ; et une plaque interne située à l'intérieur du creuset, la plaque interne comprenant : une plaque fixe ayant au moins une ouverture pour le déplacement du matériau de dépôt vers la pluralité de buses ; et une plaque mobile pour l'ajustement de la taille de l'ouverture.
PCT/KR2018/012589 2017-10-24 2018-10-23 Dispositif de dépôt WO2019083261A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2017-0138391 2017-10-24
KR1020170138391A KR102446900B1 (ko) 2017-10-24 2017-10-24 증착 장치 시스템

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CN113853446A (zh) * 2019-06-05 2021-12-28 Lg电子株式会社 沉积装置
CN114585770A (zh) * 2019-11-29 2022-06-03 Lg电子株式会社 沉积装置

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KR102229164B1 (ko) * 2019-10-18 2021-03-17 주식회사 에스에프에이 고온 증착 소스

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KR20110139575A (ko) * 2010-06-23 2011-12-29 (주)알파플러스 소스 튐 방지용 구조물을 구비한 증발원 장치
KR20140086334A (ko) * 2012-12-28 2014-07-08 엘아이지에이디피 주식회사 증발원 조립체
KR20150017866A (ko) * 2013-08-08 2015-02-23 주식회사 원익아이피에스 박막증착장치
KR20150068153A (ko) * 2013-12-11 2015-06-19 주식회사 선익시스템 도가니 개별 증발형 선형증발원

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JP2007100216A (ja) * 2005-09-30 2007-04-19 Samsung Sdi Co Ltd 蒸発源及びこれを用いた真空蒸着装置
KR20110139575A (ko) * 2010-06-23 2011-12-29 (주)알파플러스 소스 튐 방지용 구조물을 구비한 증발원 장치
KR20140086334A (ko) * 2012-12-28 2014-07-08 엘아이지에이디피 주식회사 증발원 조립체
KR20150017866A (ko) * 2013-08-08 2015-02-23 주식회사 원익아이피에스 박막증착장치
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CN113853446A (zh) * 2019-06-05 2021-12-28 Lg电子株式会社 沉积装置
CN113853446B (zh) * 2019-06-05 2023-08-25 Lg电子株式会社 沉积装置
CN114585770A (zh) * 2019-11-29 2022-06-03 Lg电子株式会社 沉积装置

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KR102446900B1 (ko) 2022-09-26

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