JP2007100216A - 蒸発源及びこれを用いた真空蒸着装置 - Google Patents
蒸発源及びこれを用いた真空蒸着装置 Download PDFInfo
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- JP2007100216A JP2007100216A JP2006262953A JP2006262953A JP2007100216A JP 2007100216 A JP2007100216 A JP 2007100216A JP 2006262953 A JP2006262953 A JP 2006262953A JP 2006262953 A JP2006262953 A JP 2006262953A JP 2007100216 A JP2007100216 A JP 2007100216A
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- evaporation source
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- 238000001704 evaporation Methods 0.000 title claims abstract description 33
- 230000008020 evaporation Effects 0.000 title claims abstract description 33
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 16
- 239000010409 thin film Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 40
- 238000007599 discharging Methods 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000007738 vacuum evaporation Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 23
- 229910044991 metal oxide Inorganic materials 0.000 description 14
- 150000004706 metal oxides Chemical class 0.000 description 14
- 239000010408 film Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1068—Seed pulling including heating or cooling details [e.g., shield configuration]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
【解決手段】本発明は、蒸発源及びこれを用いた真空蒸着装置に関し、本発明は、薄膜材料が収容された空間部及び薄膜材料を外部に吐出する開口部を含むるつぼと;前記るつぼの空間部に位置し、1つ以上の孔を有するインナープレートと;前記るつぼの外周面に位置する加熱装置と;を備え、前記インナープレートは、多段に積層されることを特徴とする蒸発源及び真空蒸着装置を開示する。
【選択図】図3a
Description
以下、添付の図面を参照して本発明に係る蒸発源及びこれを用いた蒸着装置を説明する。
120 被処理基板
121 マスク
122 基板固定装置
130 蒸発源
140 るつぼ
141 開口部
145 空間部
150 加熱装置
160 インナープレート
170 蓋対
175 孔
180 薄膜材料
Claims (17)
- 薄膜材料が収容された空間部及び薄膜材料を外部に吐出する開口部を含むるつぼと、
前記るつぼの空間部に位置し、1つ以上の孔を有するインナープレートと、
前記るつぼの外周面に位置する加熱装置と、
を備え、
前記インナープレートは、多段に積層されることを特徴とする蒸発源。 - 前記インナープレートは、2乃至5段に積層されることを特徴とする請求項1に記載の蒸発源。
- 前記多段のインナープレートは、2mm乃至10mmの間隔で積層されることを特徴とする請求項1に記載の蒸発源。
- 前記多段のインナープレートの外径は、前記空間部の内径と同一であることを特徴とする請求項1に記載の蒸発源。
- 前記多段のインナープレートは、各インナープレートの孔が互いに対応しないように配置されることを特徴とする請求項1に記載の蒸発源。
- 前記多段のインナープレートは、各インナープレートの孔の大きさが互いに異なることを特徴とする請求項1に記載の蒸発源。
- 前記開口部に組み付けられ、蒸発した薄膜材料を吐出するための孔を含む蓋体をさらに備えることを特徴とする請求項1に記載の蒸発源。
- 前記るつぼは、黒鉛、PBN、及び金属よりなる群から選択されたいずれか1つで形成されることを特徴とする請求項1に記載の蒸発源。
- 前記多段のインナープレートは、銅、金及び銀よりなる群から選択されたいずれか1つで形成されることを特徴とする請求項1に記載の蒸発源。
- 真空チャンバーと;
前記真空チャンバーの下部に位置し、薄膜材料が収容された空間部と蒸発した薄膜材料を外部に吐出する開口部とを含むるつぼと、前記るつぼの空間部に位置し、蒸発した薄膜材料を通過させるための1つ以上の孔を有する多段のインナープレートと、前記るつぼの外周面に位置する加熱装置と、を備える蒸発源と;
を備えることを特徴とする真空蒸着装置。 - 前記多段のインナープレートは、2mm乃至10mmの間隔で積層されることを特徴とする請求項10に記載の真空蒸着装置。
- 前記多段のインナープレートの外径は、前記空間部の内径と同一であることを特徴とする請求項10に記載の真空蒸着装置。
- 前記多段のインナープレートは、各インナープレートの孔が互いに対応しないように配置されることを特徴とする請求項10に記載の真空蒸着装置。
- 前記多段のインナープレートは、各インナープレートの孔の大きさが互いに異なることを特徴とする請求項10に記載の真空蒸着装置。
- 前記蒸発源は、前記開口部に組み付けられ、蒸発した薄膜材料を吐出するための孔を含む蓋体をさらに備えることを特徴とする請求項10に記載の真空蒸着装置。
- 前記るつぼは、黒鉛、PBN、及び金属よりなる群から選択されたいずれか1つで形成されることを特徴とする請求項10に記載の真空蒸着装置。
- 前記多段のインナープレートは、銅、金及び銀よりなる群から選択されたいずれか1つで形成されることを特徴とする請求項10に記載の真空蒸着装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050092264A KR100712217B1 (ko) | 2005-09-30 | 2005-09-30 | 증발원 및 이를 이용한 진공증착기 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007100216A true JP2007100216A (ja) | 2007-04-19 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006262953A Pending JP2007100216A (ja) | 2005-09-30 | 2006-09-27 | 蒸発源及びこれを用いた真空蒸着装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070074654A1 (ja) |
EP (1) | EP1770186B1 (ja) |
JP (1) | JP2007100216A (ja) |
KR (1) | KR100712217B1 (ja) |
CN (1) | CN1940123A (ja) |
DE (1) | DE602006013917D1 (ja) |
TW (1) | TWI328617B (ja) |
Cited By (4)
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KR101457081B1 (ko) | 2014-07-04 | 2014-10-31 | (주) 디오브이 | 가스킷 역할을 포함한 이너플레이트를 사용한 대용량 선형 증발원 |
KR101471901B1 (ko) * | 2012-10-29 | 2014-12-11 | 주식회사 선익시스템 | 다중 분사판이 구비된 도가니 |
KR101495062B1 (ko) | 2014-08-22 | 2015-02-25 | (주) 디오브이 | 교체가 용이한 카트리지형 증발원 |
WO2019083261A1 (ko) * | 2017-10-24 | 2019-05-02 | 엘지전자 주식회사 | 증착 장치 |
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WO2009134041A2 (en) * | 2008-04-29 | 2009-11-05 | Sunic System. Ltd. | Evaporator and vacuum deposition apparatus having the same |
KR101015336B1 (ko) * | 2008-08-22 | 2011-02-16 | 삼성모바일디스플레이주식회사 | 내부 플레이트 및 이를 구비한 증착용 도가니 장치 |
CN102268642A (zh) * | 2011-07-22 | 2011-12-07 | 上海奕瑞光电子科技有限公司 | 电阻加热式蒸发源 |
JP6049355B2 (ja) * | 2012-08-29 | 2016-12-21 | キヤノントッキ株式会社 | 蒸発源 |
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CN104593729B (zh) * | 2014-12-24 | 2017-04-05 | 深圳市华星光电技术有限公司 | 防止蒸镀材料喷溅及塞孔的坩埚 |
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TWI624554B (zh) * | 2015-08-21 | 2018-05-21 | 弗里松股份有限公司 | 蒸發源 |
MY190445A (en) | 2015-08-21 | 2022-04-21 | Flisom Ag | Homogeneous linear evaporation source |
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FR3088078B1 (fr) | 2018-11-06 | 2021-02-26 | Riber | Dispositif d'evaporation pour systeme d'evaporation sous vide, appareil et procede de depot d'un film de matiere |
KR101997750B1 (ko) | 2018-11-07 | 2019-07-08 | 진승욱 | 인너 플레이트 및 이를 구비하는 증발원 |
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FR3102189B1 (fr) * | 2019-10-17 | 2022-08-05 | Riber | Cellule d’évaporation pour chambre d’évaporation sous vide et procédé d’évaporation associé |
CN111549318A (zh) * | 2020-04-30 | 2020-08-18 | 云谷(固安)科技有限公司 | 蒸镀坩埚及蒸镀装置 |
KR102598142B1 (ko) * | 2020-07-10 | 2023-11-06 | 엘지전자 주식회사 | 증착 장치 |
US20220033958A1 (en) * | 2020-07-31 | 2022-02-03 | Applied Materials, Inc. | Evaporation source, vapor deposition apparatus, and method for coating a substrate in a vacuum chamber |
CN113088891B (zh) * | 2021-03-09 | 2023-03-03 | 中国电子科技集团公司第十一研究所 | 铟蒸发舟 |
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2005
- 2005-09-30 KR KR1020050092264A patent/KR100712217B1/ko active IP Right Grant
-
2006
- 2006-09-27 JP JP2006262953A patent/JP2007100216A/ja active Pending
- 2006-09-28 TW TW095136110A patent/TWI328617B/zh active
- 2006-09-29 DE DE602006013917T patent/DE602006013917D1/de active Active
- 2006-09-29 EP EP06255048A patent/EP1770186B1/en active Active
- 2006-09-30 CN CNA2006101418265A patent/CN1940123A/zh active Pending
- 2006-10-02 US US11/540,544 patent/US20070074654A1/en not_active Abandoned
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KR101471901B1 (ko) * | 2012-10-29 | 2014-12-11 | 주식회사 선익시스템 | 다중 분사판이 구비된 도가니 |
KR101457081B1 (ko) | 2014-07-04 | 2014-10-31 | (주) 디오브이 | 가스킷 역할을 포함한 이너플레이트를 사용한 대용량 선형 증발원 |
KR101495062B1 (ko) | 2014-08-22 | 2015-02-25 | (주) 디오브이 | 교체가 용이한 카트리지형 증발원 |
WO2019083261A1 (ko) * | 2017-10-24 | 2019-05-02 | 엘지전자 주식회사 | 증착 장치 |
KR20190045606A (ko) * | 2017-10-24 | 2019-05-03 | 엘지전자 주식회사 | 증착 장치 |
KR102446900B1 (ko) * | 2017-10-24 | 2022-09-26 | 엘지전자 주식회사 | 증착 장치 시스템 |
Also Published As
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CN1940123A (zh) | 2007-04-04 |
TW200712230A (en) | 2007-04-01 |
DE602006013917D1 (de) | 2010-06-10 |
EP1770186B1 (en) | 2010-04-28 |
KR100712217B1 (ko) | 2007-04-27 |
KR20070037056A (ko) | 2007-04-04 |
TWI328617B (en) | 2010-08-11 |
EP1770186A1 (en) | 2007-04-04 |
US20070074654A1 (en) | 2007-04-05 |
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