WO2010008211A3 - Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement - Google Patents

Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement Download PDF

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Publication number
WO2010008211A3
WO2010008211A3 PCT/KR2009/003909 KR2009003909W WO2010008211A3 WO 2010008211 A3 WO2010008211 A3 WO 2010008211A3 KR 2009003909 W KR2009003909 W KR 2009003909W WO 2010008211 A3 WO2010008211 A3 WO 2010008211A3
Authority
WO
WIPO (PCT)
Prior art keywords
batch
substrates
treatment device
heat treatment
type heat
Prior art date
Application number
PCT/KR2009/003909
Other languages
English (en)
Korean (ko)
Other versions
WO2010008211A2 (fr
Inventor
허관선
강호영
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080069330A external-priority patent/KR101016058B1/ko
Priority claimed from KR1020080069329A external-priority patent/KR101016048B1/ko
Priority claimed from KR1020080069331A external-priority patent/KR101016061B1/ko
Priority claimed from KR1020080110813A external-priority patent/KR101016064B1/ko
Priority claimed from KR1020080110814A external-priority patent/KR101009990B1/ko
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN200980122777.2A priority Critical patent/CN102067294B/zh
Priority to JP2011518650A priority patent/JP5973728B2/ja
Publication of WO2010008211A2 publication Critical patent/WO2010008211A2/fr
Publication of WO2010008211A3 publication Critical patent/WO2010008211A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Resistance Heating (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un dispositif de traitement thermique multi-étage permettant de traiter thermiquement plusieurs substrats simultanément, chaque substrat étant chauffé par plusieurs dispositifs de chauffage qui correspondent à chaque substrat. L'invention concerne également un dispositif de chauffage utilisé dans un tel positif de traitement thermique. Le dispositif de traitement thermique multi-étage selon l'invention comprend : une chambre (100) présentant un espace de traitement thermique destiné à plusieurs substrats (10); un support (108) servant de support aux substrats (10) chargés sur celui-ci; et plusieurs unités principales de chauffage (120) disposées à intervalles prédéterminés dans la direction dans laquelle sont empilés les substrats, chaque unité principale de chauffage (120) comprenant plusieurs dispositifs de chauffage principaux individuels (200), les substrats (10) étant disposés entre les unités principales de chauffage (120).
PCT/KR2009/003909 2008-07-16 2009-07-16 Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement WO2010008211A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980122777.2A CN102067294B (zh) 2008-07-16 2009-07-16 批处理式热处理装置以及适用于该热处理装置的加热器
JP2011518650A JP5973728B2 (ja) 2008-07-16 2009-07-16 バッチ式熱処理装置及び該装置に適用されるヒータ

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR10-2008-0069329 2008-07-16
KR1020080069330A KR101016058B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR1020080069329A KR101016048B1 (ko) 2008-07-16 2008-07-16 배치식 열처리 장치
KR10-2008-0069330 2008-07-16
KR1020080069331A KR101016061B1 (ko) 2008-07-16 2008-07-16 열처리 장치용 히터
KR10-2008-0069331 2008-07-16
KR1020080110813A KR101016064B1 (ko) 2008-11-10 2008-11-10 히터
KR10-2008-0110813 2008-11-10
KR10-2008-0110814 2008-11-10
KR1020080110814A KR101009990B1 (ko) 2008-11-10 2008-11-10 히터

Publications (2)

Publication Number Publication Date
WO2010008211A2 WO2010008211A2 (fr) 2010-01-21
WO2010008211A3 true WO2010008211A3 (fr) 2010-03-25

Family

ID=41550851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003909 WO2010008211A2 (fr) 2008-07-16 2009-07-16 Dispositif de traitement thermique multi-étage et dispositif de chauffage utilisé dans un tel dispositif de traitement

Country Status (4)

Country Link
JP (2) JP5973728B2 (fr)
CN (3) CN102067294B (fr)
TW (1) TWI508178B (fr)
WO (1) WO2010008211A2 (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011136604A2 (fr) * 2010-04-30 2011-11-03 주식회사 테라세미콘 Appareil de traitement de substrat
KR101157192B1 (ko) * 2010-08-31 2012-06-20 주식회사 테라세미콘 배치식 기판 처리 장치
KR101306751B1 (ko) * 2011-04-29 2013-09-10 주식회사 테라세미콘 기판 지지용 홀더 및 이를 사용한 기판 처리 장치
KR101155813B1 (ko) * 2011-08-24 2012-06-12 (주)써모니크 그라파이트 히터로
KR101435454B1 (ko) * 2012-04-27 2014-08-28 주식회사 테라세미콘 기판 처리 장치
KR101982725B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치용 발열 조립체
KR101982724B1 (ko) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 기판 열처리 장치
KR101557037B1 (ko) * 2013-08-14 2015-10-02 (주) 예스티 대면적 유리기판 열처리장치
KR101527158B1 (ko) * 2013-10-24 2015-06-09 주식회사 테라세미콘 배치식 기판처리 장치
KR101479224B1 (ko) 2013-12-09 2015-01-05 포스코에너지 주식회사 박판형 운모 히터
TWI698944B (zh) * 2013-12-23 2020-07-11 南韓商圓益Ｉｐｓ股份有限公司 批量式基板處理裝置
KR102117421B1 (ko) * 2014-05-12 2020-06-02 주식회사 제우스 히터 체결장치 및 이를 이용한 기판 열처리장치
KR101753376B1 (ko) 2015-08-24 2017-07-04 주식회사 하이원시스 4방향 상부 슬라이딩 도어가 설치된 프리히터
JP2019029102A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置
JP2019027623A (ja) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス 加熱装置および加熱方法
TWI709203B (zh) * 2018-09-11 2020-11-01 大陸商北京北方華創微電子裝備有限公司 腔室冷卻裝置及半導體加工設備
CN110890262A (zh) * 2018-09-11 2020-03-17 北京北方华创微电子装备有限公司 腔室冷却装置及半导体加工设备
WO2020112608A1 (fr) * 2018-11-30 2020-06-04 Lam Research Corporation Socle en céramique avec dispositif de chauffage multicouche pour une uniformité thermique améliorée
JP7079042B2 (ja) * 2019-05-31 2022-06-01 株式会社九州日昌 加熱装置および加熱方法
JP7079044B2 (ja) * 2019-05-31 2022-06-01 株式会社九州日昌 加熱装置および加熱方法
JP2021197448A (ja) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 熱処理装置
KR102559562B1 (ko) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 열처리 오븐의 배기 덕트 일체형 히터 유닛
EP4352780A1 (fr) * 2021-06-09 2024-04-17 Watlow Electric Manufacturing Company Dispositif d'isolation de conduit de froid
CN114485170B (zh) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 快速退火炉加热系统以及温度控制方法
KR102508123B1 (ko) * 2022-10-28 2023-03-10 (주)삼양세라텍 열처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059837A (ja) * 2001-08-10 2003-02-28 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP2004179672A (ja) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc 基板加熱装置及び半導体回路の形成方法
KR100817400B1 (ko) * 2006-11-09 2008-03-27 권상환 열처리 장치

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548400Y2 (fr) * 1974-08-15 1980-11-12
JPS5996691A (ja) * 1982-11-24 1984-06-04 東レ株式会社 抵抗発熱炉
JPS6162395U (fr) * 1984-09-28 1986-04-26
JPS63137416A (ja) * 1986-11-29 1988-06-09 Furendotetsuku Kenkyusho:Kk 真空断熱加熱炉
JPH0641355Y2 (ja) * 1988-02-16 1994-10-26 富士電波工業株式会社 電気炉用水冷電極
JPH0379985A (ja) * 1989-08-22 1991-04-04 Deisuko Haitetsuku:Kk 電気炉の温度制御方法
JPH05290953A (ja) * 1992-04-10 1993-11-05 Matsushita Electric Ind Co Ltd 電気加熱装置
KR100203782B1 (ko) * 1996-09-05 1999-06-15 윤종용 반도체 웨이퍼 열처리장치
JP3844274B2 (ja) * 1998-06-25 2006-11-08 独立行政法人産業技術総合研究所 プラズマｃｖｄ装置及びプラズマｃｖｄ方法
JP3058282U (ja) * 1998-10-07 1999-06-18 株式会社八光電機製作所 冷却機能を有するカートリッジヒーター
JP3929239B2 (ja) * 2000-12-06 2007-06-13 株式会社ノリタケカンパニーリミテド 遠赤外線薄型ヒータおよび基板加熱炉
JP2002221394A (ja) * 2001-01-24 2002-08-09 Showa Mfg Co Ltd 電子部品の加熱装置
JP2002289549A (ja) * 2001-03-28 2002-10-04 Hitachi Kokusai Electric Inc 基板処理装置
TWI232509B (en) * 2001-07-25 2005-05-11 Tokyo Electron Ltd Processing apparatus and processing method
JP3667270B2 (ja) * 2001-10-12 2005-07-06 松下電器産業株式会社 基板の熱処理方法およびそのための炉設備
JP3575009B2 (ja) * 2001-12-03 2004-10-06 坂口電熱株式会社 加熱炉用ヒータ端子装置
JP2003194478A (ja) * 2001-12-26 2003-07-09 Koyo Thermo System Kk 熱処理装置
KR100498609B1 (ko) * 2002-05-18 2005-07-01 주식회사 하이닉스반도체 배치형 원자층 증착 장치
JP2005056725A (ja) * 2003-08-06 2005-03-03 Nikko Materials Co Ltd ＭｏＳｉ２製発熱体及び同発熱体の製造方法
JP3917994B2 (ja) * 2004-08-24 2007-05-23 株式会社石井表記 塗布膜用乾燥炉
JP4734885B2 (ja) * 2004-10-08 2011-07-27 ウシオ電機株式会社 加熱ユニット
JP2006112762A (ja) * 2004-10-18 2006-04-27 Tdk Corp 焼成炉
JP4530896B2 (ja) * 2005-03-31 2010-08-25 株式会社ノリタケカンパニーリミテド 真空加熱炉用プレート型遠赤外線ヒータ
JP2007200798A (ja) * 2006-01-30 2007-08-09 Matsushita Electric Ind Co Ltd 発熱構成体、発熱ユニット及び加熱装置
JP2008028305A (ja) * 2006-07-25 2008-02-07 Hitachi Kokusai Electric Inc 基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059837A (ja) * 2001-08-10 2003-02-28 Tokyo Electron Ltd 熱処理装置及び熱処理方法
JP2004179672A (ja) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc 基板加熱装置及び半導体回路の形成方法
KR100817400B1 (ko) * 2006-11-09 2008-03-27 권상환 열처리 장치

Also Published As

Publication number Publication date
CN102067294A (zh) 2011-05-18
CN102067294B (zh) 2016-10-19
CN102983091A (zh) 2013-03-20
JP2014146815A (ja) 2014-08-14
TW201007847A (en) 2010-02-16
CN105140157B (zh) 2018-05-29
JP2011528501A (ja) 2011-11-17
TWI508178B (zh) 2015-11-11
JP5973728B2 (ja) 2016-08-23
CN105140157A (zh) 2015-12-09
WO2010008211A2 (fr) 2010-01-21

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