WO2010008211A3 - Batch-type heat treatment device and heater used therein - Google Patents

Batch-type heat treatment device and heater used therein Download PDF

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Publication number
WO2010008211A3
WO2010008211A3 PCT/KR2009/003909 KR2009003909W WO2010008211A3 WO 2010008211 A3 WO2010008211 A3 WO 2010008211A3 KR 2009003909 W KR2009003909 W KR 2009003909W WO 2010008211 A3 WO2010008211 A3 WO 2010008211A3
Authority
WO
WIPO (PCT)
Prior art keywords
batch
substrates
treatment device
heat treatment
type heat
Prior art date
Application number
PCT/KR2009/003909
Other languages
French (fr)
Korean (ko)
Other versions
WO2010008211A2 (en
Inventor
허관선
강호영
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020080069331A external-priority patent/KR101016061B1/en
Priority claimed from KR1020080069329A external-priority patent/KR101016048B1/en
Priority claimed from KR1020080069330A external-priority patent/KR101016058B1/en
Priority claimed from KR1020080110814A external-priority patent/KR101009990B1/en
Priority claimed from KR1020080110813A external-priority patent/KR101016064B1/en
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to JP2011518650A priority Critical patent/JP5973728B2/en
Priority to CN200980122777.2A priority patent/CN102067294B/en
Publication of WO2010008211A2 publication Critical patent/WO2010008211A2/en
Publication of WO2010008211A3 publication Critical patent/WO2010008211A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

Abstract

Disclosed are: a batch-type heat treatment device which can heat treat a plurality of substrates simultaneously, each of the substrate being heated by a plurality of heaters corresponding to the each substrate; and a heater used in the batch-type heat treatment device. The batch-type heat treatment device of the present invention comprises: a chamber (100) which provides a heat-treatment space for a plurality of substrates (10); a boat (108) for loading the plurality of substrates (10) therein and supporting the substrates (10); and a plurality of main heater units (120) disposed at predetermined intervals in the direction in which the substrates are stacked, each of the main heater units (120) comprising a plurality of individual main heaters (200), wherein the substrates (10) are disposed between the plurality of main heater units (120).
PCT/KR2009/003909 2008-07-16 2009-07-16 Batch-type heat treatment device and heater used therein WO2010008211A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011518650A JP5973728B2 (en) 2008-07-16 2009-07-16 Batch heat treatment apparatus and heater applied to the apparatus
CN200980122777.2A CN102067294B (en) 2008-07-16 2009-07-16 Batch-type heat treatment device and be applicable to the heater of this annealing device

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
KR1020080069331A KR101016061B1 (en) 2008-07-16 2008-07-16 Heater For Heat Treatment Apparatus
KR10-2008-0069330 2008-07-16
KR1020080069329A KR101016048B1 (en) 2008-07-16 2008-07-16 Batch Type Heat Treatment Apparatus
KR10-2008-0069329 2008-07-16
KR10-2008-0069331 2008-07-16
KR1020080069330A KR101016058B1 (en) 2008-07-16 2008-07-16 Heater For Heat Treatment Apparatus
KR10-2008-0110814 2008-11-10
KR1020080110814A KR101009990B1 (en) 2008-11-10 2008-11-10 Heater
KR10-2008-0110813 2008-11-10
KR1020080110813A KR101016064B1 (en) 2008-11-10 2008-11-10 Heater

Publications (2)

Publication Number Publication Date
WO2010008211A2 WO2010008211A2 (en) 2010-01-21
WO2010008211A3 true WO2010008211A3 (en) 2010-03-25

Family

ID=41550851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003909 WO2010008211A2 (en) 2008-07-16 2009-07-16 Batch-type heat treatment device and heater used therein

Country Status (4)

Country Link
JP (2) JP5973728B2 (en)
CN (3) CN102067294B (en)
TW (1) TWI508178B (en)
WO (1) WO2010008211A2 (en)

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WO2011136604A2 (en) * 2010-04-30 2011-11-03 주식회사 테라세미콘 Substrate treating apparatus
KR101157192B1 (en) * 2010-08-31 2012-06-20 주식회사 테라세미콘 Batch type appartus for processing a substrate
KR101306751B1 (en) * 2011-04-29 2013-09-10 주식회사 테라세미콘 Holder for supporting substrate and apparatus for processing substrate using the same
KR101155813B1 (en) * 2011-08-24 2012-06-12 (주)써모니크 Graphite furnace
KR101435454B1 (en) * 2012-04-27 2014-08-28 주식회사 테라세미콘 Apparatus for processing substrate
KR101982725B1 (en) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 Heating Assembly for Substrate Thermal Treatment Device
KR101982724B1 (en) * 2012-12-26 2019-05-27 주식회사 탑 엔지니어링 Thermal Treatment Device for Substrate
KR101557037B1 (en) * 2013-08-14 2015-10-02 (주) 예스티 Heat processing apparatus for large glass substrate
KR101527158B1 (en) * 2013-10-24 2015-06-09 주식회사 테라세미콘 Batch type apparatus for processing substrate
KR101479224B1 (en) 2013-12-09 2015-01-05 포스코에너지 주식회사 Thin plate mica heater
TWI698944B (en) * 2013-12-23 2020-07-11 南韓商圓益Ｉｐｓ股份有限公司 Batch type apparatus for processing substrate
KR102117421B1 (en) * 2014-05-12 2020-06-02 주식회사 제우스 Heater fixing device and substrate heat tretment apparatus using it
KR101753376B1 (en) 2015-08-24 2017-07-04 주식회사 하이원시스 Pre-heater including 4-direction sliding doors on ceiling
JP2019027623A (en) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス Heating device and heating method
JP2019029102A (en) * 2017-07-26 2019-02-21 株式会社Ｓｃｒｅｅｎホールディングス Heating apparatus
TWI709203B (en) * 2018-09-11 2020-11-01 大陸商北京北方華創微電子裝備有限公司 Chamber cooling device and semiconductor processing equipment
WO2020112608A1 (en) * 2018-11-30 2020-06-04 Lam Research Corporation Ceramic pedestal with multi-layer heater for enhanced thermal uniformity
WO2020241488A1 (en) * 2019-05-31 2020-12-03 株式会社九州日昌 Heating device and heating method
JP7079044B2 (en) * 2019-05-31 2022-06-01 株式会社九州日昌 Heating device and heating method
JP2021197448A (en) * 2020-06-15 2021-12-27 光洋サーモシステム株式会社 Thermal treatment device
KR102559562B1 (en) * 2021-03-11 2023-07-27 주식회사 한국제이텍트써모시스템 Heat treatment oven exhaust duct integrated heater unit
US20220397354A1 (en) * 2021-06-09 2022-12-15 Watlow Electric Manufacturing Company Cold conduit insulation device
CN114485170B (en) * 2021-12-27 2024-04-30 江苏邑文微电子科技有限公司 Heating system of rapid annealing furnace and temperature control method
KR102508123B1 (en) * 2022-10-28 2023-03-10 (주)삼양세라텍 Heat treatment apparatus

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KR100817400B1 (en) * 2006-11-09 2008-03-27 권상환 Heat treatment equipment

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JP2003059837A (en) * 2001-08-10 2003-02-28 Tokyo Electron Ltd Apparatus and method for heat treatment
JP2004179672A (en) * 2003-12-12 2004-06-24 Hitachi Kokusai Electric Inc Substrate heater and method for forming semiconductor circuit
KR100817400B1 (en) * 2006-11-09 2008-03-27 권상환 Heat treatment equipment

Also Published As

Publication number Publication date
TWI508178B (en) 2015-11-11
WO2010008211A2 (en) 2010-01-21
CN105140157B (en) 2018-05-29
CN105140157A (en) 2015-12-09
JP2014146815A (en) 2014-08-14
JP2011528501A (en) 2011-11-17
CN102067294B (en) 2016-10-19
TW201007847A (en) 2010-02-16
CN102983091A (en) 2013-03-20
JP5973728B2 (en) 2016-08-23
CN102067294A (en) 2011-05-18

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