CN115077211A - Exhaust duct integrated heater unit for heat treatment furnace - Google Patents

Exhaust duct integrated heater unit for heat treatment furnace Download PDF

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Publication number
CN115077211A
CN115077211A CN202110552664.9A CN202110552664A CN115077211A CN 115077211 A CN115077211 A CN 115077211A CN 202110552664 A CN202110552664 A CN 202110552664A CN 115077211 A CN115077211 A CN 115077211A
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China
Prior art keywords
heat treatment
treatment furnace
exhaust
heater
chamber
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CN202110552664.9A
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Chinese (zh)
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CN115077211B (en
Inventor
中西识
河在昱
郑珍煐
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Korea Guangyang Thermoelectric System Co ltd
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Korea Guangyang Thermoelectric System Co ltd
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Publication of CN115077211A publication Critical patent/CN115077211A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B9/00—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
    • F26B9/02—Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards in buildings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B23/00—Heating arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B23/00—Heating arrangements
    • F26B23/04—Heating arrangements using electric heating
    • F26B23/06—Heating arrangements using electric heating resistance heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/005—Treatment of dryer exhaust gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/02—Applications of driving mechanisms, not covered by another subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/14—Chambers, containers, receptacles of simple construction
    • F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/14—Chambers, containers, receptacles of simple construction
    • F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
    • F26B25/185—Spacers; Elements for supporting the goods to be dried, i.e. positioned in-between the goods to build a ventilated stack
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1313—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells specially adapted for a particular application
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/62—Heating elements specially adapted for furnaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Drying Of Solid Materials (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Resistance Heating (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Tunnel Furnaces (AREA)

Abstract

The invention discloses an exhaust duct integrated heater unit of a heat treatment furnace. In the present invention, the heat treatment furnace has a chamber for accommodating and drying a substrate, and a plurality of heater units are installed in the chamber so as to heat or dry the substrate by heat generated from the heater units, wherein the exhaust duct integrated heater unit is composed of a heater frame disposed at a front, a rear, and both sides of the heater unit to form an outer frame of the heater unit, and an exhaust duct integrated with the heater frame and discharging an air flow in the chamber of the heat treatment furnace to the outside.

Description

Exhaust duct integrated heater unit for heat treatment furnace
Technical Field
The present invention relates to an exhaust duct integrated heater unit of a heat treatment furnace, the heat treatment furnace including an exhaust duct integrated with a frame for fixing a heater, the exhaust duct discharging a furnace airflow of the heat treatment furnace to the outside.
Background
Recently, the market of displays is applied to various video devices such as TVs, mobile phones, and screens, and efforts to upgrade the product performance are continuously being made due to the rapid development of technologies. Organic light emitting display devices and LCD substrates are one of the next-generation displays and are used in various product fields. The glass substrate constituting the display device is manufactured through a heat treatment, and in order to satisfy conditions required by each process during the heat treatment, it is possible to prevent performance degradation and reduce product defective rate only by blocking the influence of external gas and minimizing heat released to the outside of the chamber. Further, in order to improve the yield of finished products, it is better to reduce the in-plane variation of the substrate during heat treatment, and therefore, a high-performance heat treatment furnace is required.
In the process of manufacturing an organic light emitting display device substrate or an LCD glass substrate (hereinafter, referred to as a "substrate" or a "glass substrate"), which is a typical flat panel display, temperature control and temperature uniformity are essential to ensure good substrate quality and yield. For example, in a substrate manufacturing process using a heat treatment furnace, since an organic layer formed on the surface of a substrate may contain a certain amount of moisture, a drying process for evaporating the moisture is required. In the LCD glass substrate manufacturing process, a cleaning process is performed before a photosensitive film is coated on a surface of a substrate, and a heat drying process for removing moisture is performed after the cleaning process. Thus, most of the substrate manufacturing process performs a heating and drying process, thereby manufacturing the substrate. Moisture generated in the substrate manufacturing process can be removed by heating and drying with ultraviolet rays or by placing the substrate in a chamber of a heat treatment furnace including a heat generating body such as a heater (heater). In this regard, "LCD glass furnace chamber" has been proposed in Korean patent laid-open publication No. 10-1238560 and Korean patent laid-open publication No. 10-2013-0028322.
In addition, each process has a condition required for performing a heat treatment on a glass substrate of a display device, and a structure capable of rapidly increasing or cooling a temperature is required for mass production of more excellent products in the same time. For this reason, the structure in the chamber should be simplified and exhaust gas can be appropriately controlled. Further, there is a need for a heat treatment furnace design that facilitates equipment placement in a confined factory space and facilitates operational maintenance by reducing the space required for maintenance.
Prior art documents
Patent document
Patent document 1, korean granted patent publication No. 10-1238560 (publication date 2013, 02, 28)
Patent document 2, Korean granted patent publication No. 10-0722154 (published date 2007, 05, 28)
Patent document 3 korean laid-open patent publication No. 10-2013-0028322 (publication date 2013, 03 and 19 months)
Disclosure of Invention
Problems to be solved by the invention
The invention aims to solve the technical problem that the structure of a heat treatment furnace is simplified and the exhaust performance is improved through the integration of a heater and an exhaust guide pipe of the heat treatment furnace.
The invention aims to solve the technical problem that the space required by the operation and maintenance of the heat treatment furnace is reduced by integrating the heater and the exhaust duct of the heat treatment furnace.
The invention aims to improve the operability of operation and maintenance of a heat treatment furnace by integrating a heater and an exhaust duct of the heat treatment furnace.
Means for solving the problems
According to the present invention, the above object can be accomplished by an exhaust duct integrated heater unit of a heat treatment furnace, which is composed of a heat treatment furnace having a chamber for accommodating substrates and performing heat drying on the substrates, and in which a plurality of heater units are installed so that the substrates are heated or dried by heat generated from the heater units, a heater frame disposed at the front, rear, and both side surfaces of the heater units to form an outer frame of the heater unit, and an exhaust duct integrated with the heater frame for exhausting an air flow in the chamber of the heat treatment furnace to the outside.
According to an embodiment of the present invention, the exhaust guide may be formed at a lower portion thereof with a plurality of exhaust holes for exhausting a gas flow in a chamber furnace of the heat treatment furnace through the exhaust duct.
According to an embodiment of the present invention, a reinforcing strip for connecting and reinforcing the heater frame and having a hollow exhaust duct may be installed at a lower portion of the heater frame, and a plurality of exhaust holes formed at the reinforcing strip may exhaust a gas flow in a chamber furnace of the heat treatment furnace through the exhaust duct.
According to an embodiment of the present invention, the heater frame and the exhaust duct are detachably assembled to each other by using the assembly joint brackets on both sides of the heater frame.
According to an embodiment of the present invention, rolling bearings may be mounted on both side surfaces of the heater frame, and the rolling bearings move along slide rails provided on an inner wall of the heat treatment furnace.
According to the embodiment of the invention, exhaust pipes can be installed at the two ends of the exhaust guide pipes positioned at the front side and the rear side in the chamber furnace of the heat treatment furnace, and the exhaust pipes are used for discharging the exhaust airflow in the chamber furnace of the heat treatment furnace to the outside.
Effects of the invention
The heater frame and the exhaust duct in the heat treatment furnace chamber are integrated, so that the structure can be simplified compared with the prior art, and the manufacturing cost of equipment is reduced, and the exhaust performance is improved.
In addition, the present invention has the effects of reducing the number of parts, shortening the temperature raising time and directly exhausting the part with relatively weak cooling performance by arranging the exhaust hole in the center of the chamber by integrating the heater frame in the heat treatment furnace chamber with the exhaust duct.
In addition, the present invention is configured to integrate the exhaust guide of the heat treatment furnace and configure the heater frame into a split structure that can be divided into a plurality of parts, and to dock (dock) into the heat treatment furnace or undock (undock) in sequence, so that the space required for maintenance of the furnace door side behind the heat treatment furnace can be reduced, thereby having an effect that the arrangement of the heat treatment furnace equipment in a factory can be facilitated and the workability can be improved.
In addition, the present invention has the effect of improving the operability of the heater unit installation and shortening the operation time compared to the prior art by providing the bearings at the left/right sides of the frame of the heater integrated with and separated from the exhaust guide of the heat treatment furnace and performing the docking or undocking in a sliding manner along the guide rail of the chamber.
Drawings
Fig. 1 is a view showing an example of a heat treatment furnace.
Fig. 2 is an example showing the front surface of the heat treatment furnace.
Fig. 3 is an example of a heat treatment furnace in a plan view.
Fig. 4 is an example showing a side surface of the heat treatment furnace.
Fig. 5A and 5B are views showing an example of an exhaust duct integrated heater unit according to an embodiment of the present invention, fig. 5A being a perspective view and fig. 5B being a side view.
Fig. 6A and 6B are views showing an example of an exhaust duct integrated heater unit according to an embodiment of the present invention, fig. 6A being a plan view and fig. 6B being a front view.
Fig. 7 is a view illustrating a disassembled state of a heater frame in the exhaust duct integrated heater unit according to an embodiment of the present invention.
Fig. 8 is a view showing an example of the bottom surface structure of the exhaust gas conduit-integrated heater unit according to an embodiment of the present invention.
Fig. 9 is a detailed view of a portion a of fig. 8, and is a view showing an example of a discharge state of the discharge duct based on the discharge duct integrated-type heater unit according to an embodiment of the present invention.
Description of the reference numerals
100: the heat treatment furnace 200: chamber
300: the heater unit 310: heater frame
310 a: reinforcing tape 310 b: exhaust passage
310 c: discharge hole
311a, 311 b: exhaust pipe (at the front/back of the chamber)
312a, 312 b: exhaust pipe (side part of the chamber)
313: joint support
314: rolling bearing 315: exhaust passage
316: discharge hole 317: exhaust pipe
Detailed Description
Hereinafter, the "heater unit integrated with an exhaust gas conduit of a heat treatment furnace" according to a preferred embodiment of the present invention will be specifically described.
In order to put the substrate to be heat-treated into each preset stage within the chamber or to carry the substrate having finished the heat treatment process out of the chamber, the heat treatment furnace may have a shutter at a front side thereof and a door at a rear side thereof.
Further, the heat treatment furnace has a chamber for receiving the substrate to be heated or dried, and a heater unit composed of a heating body is installed in the chamber, so that the substrate can be heated by heat generated from the heater unit or dried by evaporating moisture. In addition, although the arrangement may be different, in general, the upper and lower portions of the heating element constituting the heater are provided with upper and lower heat transfer plates in close contact therewith, so that the substrate heating process can be efficiently performed.
In addition, the chamber side of the heat treatment furnace has a gas supply port through which a fluid containing a process gas flows in and a gas exhaust port through which the fluid in the chamber is exhausted, and includes a frame having a supporter for supporting and lifting the chamber and a conductive portion connected to a plurality of bus bars connected to heating wires of the heater to conduct current.
In addition, in order to remove moisture remaining on the substrate during the heat treatment process of the substrate in the chamber, the heat treatment furnace includes a heater, and in order to improve the quality of the product, more efficient and high-performance process capability is required.
Fig. 1 is a view showing an example of a heat treatment furnace. Fig. 2 is an example showing the front surface of the heat treatment furnace. Fig. 3 is an example of a heat treatment furnace in a plan view. Fig. 4 is an example showing a side surface of the heat treatment furnace.
The diagrams of fig. 1 to 4 show the overall structure of the heat treatment furnace 100, which is an example of the heat treatment furnace 100 including the chamber 200.
As shown in fig. 1 to 4, in order to load substrates to be heat-treated into respective stations preset in the chamber 200 or to carry substrates having finished a heat treatment process out of the chamber 200, the heat treatment furnace 100 may have a shutter portion 120 at a front side and a door portion 110 at a rear side.
Further, the heat treatment furnace 100 has a chamber 200 for receiving a substrate to be heated or dried, and a plurality of heater units 300 composed of heating bodies are installed in the chamber 200, so that the substrate can be heated by heat generated from the heater units 300 or dried by evaporating moisture.
In addition, the heat treatment furnace 100 has an air supply port through which a fluid containing a process gas flows in and an air exhaust port through which the fluid in the chamber 200 is exhausted at one side of the chamber 200, and includes a frame having a supporter for supporting and lifting the chamber 200 and a conductive portion connected to a plurality of bus bars connected to heating wires of the heater unit 300 to conduct current.
In addition, although the arrangement may be different, generally, the upper and lower portions of the pipe constituting the heating body of the heater unit 300 are provided with upper and lower heat transfer plates in close contact therewith, so that the substrate heating process can be efficiently performed in the chamber.
In addition, unexplained reference numerals 210 and 220 in fig. 1 and 4 are an inner case and an outer case of the chamber 200, respectively. And, unexplained reference numeral 230 is a cooling jacket which cools the chamber to a uniform temperature distribution by forming a cooling air flow in the chamber 200 and passing through a cooling air flow passage formed inside the chamber 200. Unexplained reference numeral 240 is a power supply portion that protrudes the lead wire and supplies power into the chamber 200 through the lead wire.
For reference, the basic components constituting the heat treatment furnace as shown in fig. 1 and 4, for example, the structure of the chamber and the gas supply and exhaust system of the process gas, the conductive part including the bus bar supplying power to the heater unit, and the member of the power supply part, are not directly related to the present invention. In addition, the basic components of the heat treatment furnace are not related to the gist of the present invention and are known components, and thus, the description thereof will be omitted.
In addition, the heater unit 300, which functions as a heating body of the heat treatment furnace, may be a plate-shaped heater in which a heating wire (heating wire) that generates heat by resistance is built in a pipe (metal protection pipe) and magnesium oxide (MgO) as an insulation powder is added and filled to insulate the heating wire from the pipe.
As shown in fig. 1 to 4, the heater unit used in the conventional heat treatment furnace is a separate type structure separated from the exhaust gas guide pipe, and the exhaust gas guide pipe is provided only on the front side and the rear side (shutter portion/door portion) of the heat treatment furnace.
However, since the heat treatment furnace equipment tends to be large in size and is required to be arranged with high temperature performance, if the exhaust duct is provided only on the front and rear sides, that is, the shutter portion 120 and the door portion 110, the furnace inner center portion of the chamber cannot be cooled by exhaust gas, and therefore, a structural change is required to solve this problem.
In addition, when the heater is operated and maintained, the heater frame is generally drawn out from the rear side of the heat treatment furnace, i.e., the furnace door side, and then the operation and maintenance are performed, and in this case, as the size of the heat treatment furnace increases, a further increased maintenance space is required, and therefore, it is difficult to sufficiently utilize the limited space provided by the factory.
Further, when the heater and the exhaust gas duct constituting the conventional heat treatment furnace are structured such that the heater frame is drawn out to the outside of the chamber, the operation is difficult and a large amount of operation time is required because the heater frame is large in size.
Thus, the present invention provides an exhaust gas duct-integrated heater unit for a heat treatment furnace, which simplifies the structure of the heat treatment furnace and improves the exhaust performance by integrating a heater frame and an exhaust gas duct of the heat treatment furnace.
Further, the present invention provides a heater frame integrating an exhaust gas duct for improving the facility performance of a heat treatment furnace, improving the operability of operation and maintenance, and shortening the operation time.
Further, the present invention provides an exhaust gas guide integrated heater frame for a heat treatment furnace, which can reduce a space required for operation and maintenance by integrating a heater frame and an exhaust gas guide of the heat treatment furnace.
Further, the present invention provides an exhaust gas duct-integrated heater frame for a heat treatment furnace, which can improve the operability of operation and maintenance by integrating a heater frame and an exhaust gas duct of the heat treatment furnace.
Next, the main components of the heater unit of the heat treatment furnace according to the present invention will be described in detail with reference to fig. 5A and 5B to 9.
Further, the heat treatment furnace 100 has a chamber 200 for receiving a substrate to be heated or dried, and an inner furnace of the chamber 200 is mounted with a plurality of heater units 300 so that the substrate can be heated or dried using heat generated from the heater units 300.
Fig. 5A and 5B are views showing an example of an exhaust duct integrated heater unit according to an embodiment of the present invention, fig. 5A being a perspective view and fig. 5B being a side view. Fig. 6A and 6B are views showing an example of an exhaust duct integrated heater unit according to an embodiment of the present invention, fig. 6A being a plan view and fig. 6B being a front view. Fig. 7 is a view illustrating a disassembled state of a heater frame in the exhaust duct integrated heater unit according to an embodiment of the present invention. Fig. 8 is a view showing an example of the bottom surface structure of the exhaust gas conduit-integrated heater unit according to an embodiment of the present invention. Fig. 9 is a detailed view of a portion a of fig. 8, showing an example of a discharge state of the discharge duct based on the exhaust duct integrated with the heater unit according to an embodiment of the present invention.
As shown in fig. 5A, 5B to 9, the heater unit 300 of the present invention may have heater frames 310 disposed at the front, rear, and both side surfaces thereof, so that an outer frame of the heater unit 300 may be formed.
In addition, in order to exhaust the gas flow within the chamber 200 of the heat treatment furnace 100 to the outside, integrated exhaust ducts 311a, 311b, 312a, 312b may be disposed on the heater frame 310.
For this, as shown in fig. 9, a plurality of exhaust holes 316 may be formed at the lower portion of the exhaust guide 311a, 311b, 312a, 312b, and the exhaust holes 316 may exhaust the gas flow in the cavity 200 of the heat treatment furnace 100 through the exhaust duct 315.
As shown in fig. 5A and 5B to 9, unexplained reference numeral 320 denotes a heat transfer plate which is heated by heat generated by an internal heat generating body (pipe).
Further, as shown in fig. 9, a lower portion of the heater frame 310 may be mounted with a reinforcing band 310a, the reinforcing band 310a being connected to and reinforcing the heater frame 310 and having a hollow air discharge duct 310 b. Wherein the reinforcing band 310a may be formed with a plurality of exhaust holes 310c, which exhaust the gas flow in the chamber 200 of the heat treatment furnace 100 through the exhaust duct 310 b.
In this way, when the integrated heater unit 300 is composed of the heater frame 310 integrated with the exhaust ducts 311a, 311b, 312a, 312b, since there is no need to separately provide an exhaust duct in the heat treatment furnace 100, the number of parts is reduced, and the time required for temperature rise and cooling is reduced, which is advantageous for manufacturing a high-performance heat treatment furnace.
Further, the hollow exhaust duct 310b provided on the heater frame 310 reinforcing band 310a is used as an exhaust duct, so that an exhaust gas flow (exhaust gas flow) to the central portion in the cavity furnace of the heat treatment furnace, which is relatively weak to cool, can be directly and rapidly exhausted.
In the heater unit 300 including the exhaust duct integrated heater frame according to the present invention, as shown in fig. 7 and 8, the heater frame 310 and the exhaust ducts 312a and 312b are detachably assembled to each other by at least one joint holder 313 for assembly on both side surfaces of the heater frame 310. Referring to fig. 7, heater frame 310 and exhaust ducts 312a and 312b are assembled by 4 joint brackets 313 and are separated into 3 pieces.
As shown in fig. 7, the joint holder 313 tightly attaches the corresponding surfaces of the two facing heater frames 310 together, and then fastens them by a separate fastening means (not shown) to complete the assembly, and the disassembly can be easily completed by releasing the fastening means of the joint holder 313.
Accordingly, when the heater frame 310 and the exhaust gas guide integrated structure (for example, 3 sections) are separated and the chamber 200 of the heat treatment furnace is coupled/decoupled, the heater units 300 can be sequentially assembled and installed, and thus, an operation and maintenance space determined based on the size of the heater frame can be reduced.
In the heater unit 300 including the exhaust guide integrated heater frame according to the present invention, as shown in fig. 5A and 5B and fig. 6A and 6B, rolling bearings 314 may be mounted on both side surfaces of the heater frame 310, and the rolling bearings 314 may move along slide rails provided on the inner wall of the heat treatment furnace.
In this manner, the heater unit 300 can be easily mounted in the chamber 200 or removed from the chamber 200 by the rolling bearings 314 mounted on both side surfaces of the heater frame 310 and sliding along a guide rail (not shown) provided in the heat treatment furnace chamber 200, and the operability of operation and maintenance such as installation and maintenance of the heater unit 300 can be improved.
In the heater unit 300 including the exhaust duct integrated heater frame according to the present invention, the exhaust pipes 317 are installed at both ends of the exhaust ducts 311a and 311b positioned at the front and rear sides of the chamber 200 of the heat treatment furnace 100 to discharge the air flow in the chamber 200 of the heat treatment furnace 100 to the outside, so that the air flow in the chamber can be discharged to the outside through the exhaust ducts integrated in the heater unit frame.
As described above, in the exhaust guide integrated heater unit 300 of the heat treatment furnace of the present invention, the heater frame in the chamber 200 of the heat treatment furnace 100 is integrated with the exhaust guide, so that the structure can be simplified as compared with the prior art, thereby having advantages of reducing the manufacturing cost of the equipment and improving the exhaust performance.
In addition, in the exhaust duct integrated heater unit 300 of the heat treatment furnace of the present invention, the furnace heater frame of the chamber 200 of the heat treatment furnace 100 is integrated with the exhaust duct, thereby having advantages of reducing the number of parts, shortening the temperature rise time, and directly exhausting the portion having relatively weak cooling performance by providing the exhaust passage in the center portion of the chamber.
In addition, in the exhaust guide integrated heater unit 300 of the heat treatment furnace of the present invention, the heater frame in the chamber 200 of the heat treatment furnace 100 is integrated with the exhaust guide, and the heater frame is configured in a split structure that can be divided into a plurality of parts and can be sequentially docked (Docking) into the heat treatment furnace or undocked (Undocking), so that a space required for maintenance on the door side of the furnace behind the heat treatment furnace can be reduced, and there is a merit that the facility arrangement of the heat treatment furnace in a factory can be facilitated and the workability can be improved.
Further, in the exhaust gas conduit-integrated heater unit 300 of the heat treatment furnace according to the present invention, the heater frame in the chamber 200 of the heat treatment furnace 100 is integrated with the exhaust gas conduit into one body, and bearings are provided on both side surfaces of the heater frame, which is integrated with and separated from the exhaust gas conduit, to perform docking or undocking in a manner of sliding along the guide rails of the chamber, thereby having advantages of improving the operation of installing the heater unit and shortening the operation time compared to the related art.
Although the present invention has been described with reference to one embodiment shown in the drawings, the present invention is not limited to the embodiment, and modifications and variations can be made within a scope not departing from the gist of the present invention, which belong to the technical idea of the present invention.

Claims (6)

1. An exhaust duct-integrated heater unit of a heat treatment furnace having a chamber for accommodating and drying a substrate, and a plurality of heater units installed in the chamber so as to heat or dry the substrate by heat generated from the heater units, wherein the exhaust duct-integrated heater unit is composed of a heater frame disposed at a front, a rear, and both side surfaces of the heater unit to form an outer frame of the heater unit, and an exhaust duct integrated to the heater frame for discharging an air flow in the chamber of the heat treatment furnace to the outside.
2. The integrated heater unit of exhaust duct of heat treatment furnace according to claim 1, wherein a plurality of exhaust holes are formed at a lower portion of the exhaust duct, and the plurality of exhaust holes exhaust the gas flow in the chamber furnace of the heat treatment furnace through the exhaust duct.
3. The exhaust duct integrated heater unit of a heat treatment furnace according to claim 1, wherein a reinforcing band for connecting and reinforcing the heater frame and having a hollow exhaust duct is installed at a lower portion of the heater frame, and a plurality of exhaust holes are formed at the reinforcing band and exhaust a gas flow in a chamber furnace of the heat treatment furnace through the exhaust duct.
4. The heater unit integrated with an exhaust gas duct of a heat treatment furnace according to claim 1, wherein the heater frame and the exhaust gas duct are detachably assembled to each other by an assembling joint holder so as to be separable into at least one piece.
5. The heater unit integrated with an exhaust gas duct of a heat treatment furnace according to claim 1, wherein rolling bearings are mounted on both side surfaces of the heater frame, and the rolling bearings move along slide rails provided on an inner wall of the heat treatment furnace.
6. The heater unit integrated with an exhaust duct of a heat treatment furnace according to claim 1, wherein exhaust pipes for discharging an exhaust gas flow in a chamber furnace of the heat treatment furnace to the outside are installed at both ends of the exhaust duct located at the front side and the rear side in the chamber furnace of the heat treatment furnace.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116294540A (en) * 2023-03-03 2023-06-23 上海至纯洁净系统科技股份有限公司 Multi-gas discharge integrated module capable of being used in wafer drying system and wafer drying system

Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2683302A1 (en) * 1991-10-30 1993-05-07 Mg Entreprise Device for drying, particularly agricultural products, with heated air
JP2003343982A (en) * 2002-05-29 2003-12-03 Espec Corp Heating device
US20040048220A1 (en) * 2002-09-10 2004-03-11 Nguyen Vuong P. Thermal process station with heated lid
CN1913101A (en) * 2005-08-11 2007-02-14 东京毅力科创株式会社 Decompression drying device
US20070245555A1 (en) * 2004-09-24 2007-10-25 Nihon University Method for Manufacturing a Ceramic Electronic Component
CN101478882A (en) * 2006-06-26 2009-07-08 热力处理方案有限公司 Rapid thermal firing IR conveyor furnace having high intensity heating section
US20110200742A1 (en) * 2008-10-16 2011-08-18 Sharp Kabushiki Kaisha Drying method and drying device
CN102983091A (en) * 2008-07-16 2013-03-20 泰拉半导体株式会社 Heater of batch-type heat treatment device
KR20130032171A (en) * 2011-09-22 2013-04-01 주식회사 테라세미콘 Vacuum dry apparatus
CN103210272A (en) * 2011-01-21 2013-07-17 Tp太阳能公司 Dual independent transport systems for ir conveyor furnaces and methods of firing thin work pieces
US20130240512A1 (en) * 2012-03-14 2013-09-19 Microwave Materials Technologies, Inc. Enhanced microwave system employing inductive iris
CN103546996A (en) * 2012-07-12 2014-01-29 光洋热系统株式会社 Heater unit and heat treatment apparatus
CN205332695U (en) * 2016-01-28 2016-06-22 昆山国显光电有限公司 Heating furnace
US20170042439A1 (en) * 2014-02-14 2017-02-16 National University Of Singapore System, device and methods for brainwave-based technologies
CN107210245A (en) * 2014-11-18 2017-09-26 泰拉半导体株式会社 Substrate board treatment
CN206597766U (en) * 2017-01-13 2017-10-31 安徽未名鼎和环保有限公司 A kind of rubbish heat-treatment furnace with excellent treatment effect
US20180174868A1 (en) * 2015-06-12 2018-06-21 J.E.T. Co., Ltd. Substrate treatment device and substrate treatment method
KR20180077384A (en) * 2016-12-28 2018-07-09 주식회사 비아트론 Heat-Treatment Apparatus and Method of Substrate using VCSEL
CN108444269A (en) * 2018-04-08 2018-08-24 安吉晶圣光伏发电有限公司 A kind of baking oven machine for diode
KR101957762B1 (en) * 2018-08-07 2019-03-14 한국지질자원연구원 Preprocessing apparatus for rock sample
TWM593652U (en) * 2019-12-31 2020-04-11 銓揚精密有限公司 Improved gas-exhausting equipment of semiconductor drying box
CN210320888U (en) * 2019-07-02 2020-04-14 安徽三优光电科技有限公司 Quick heating type baking oven for semiconductor forming
CN111052336A (en) * 2017-09-01 2020-04-21 株式会社国际电气 Substrate processing apparatus, method of manufacturing semiconductor device, and program
US20200197851A1 (en) * 2018-12-21 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Exhaust module for wafer baking apparatus and wafer processing system having the same
KR20220154302A (en) * 2021-05-12 2022-11-22 한국고요써모시스템(주) Heater unit of heat treatment oven

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722154B1 (en) 2005-08-16 2007-05-28 주식회사 제우스 Oven chamber for LCD glass substrate which sealing is enhanced
KR101380138B1 (en) 2011-09-09 2014-04-01 주식회사 아이비원 Chamber type drying apparatus for glass using ir steel heater
KR101238560B1 (en) 2012-11-29 2013-02-28 주식회사 디엠텍 Panel display glass oven chamber
KR101662301B1 (en) * 2014-12-29 2016-10-06 주식회사 비아트론 Gas Intake and Exhaust System for Heat Treatment of Substrate
KR101662302B1 (en) * 2014-12-31 2016-10-06 주식회사 비아트론 Heating module and thermal processing device having the same
KR101920331B1 (en) * 2017-03-09 2018-11-22 주식회사 비아트론 Substrate thermal processing Apparatus
KR102398880B1 (en) * 2017-06-02 2022-05-17 삼성디스플레이 주식회사 Heat treatment apparatus and method of manufacturing film using the same

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2683302A1 (en) * 1991-10-30 1993-05-07 Mg Entreprise Device for drying, particularly agricultural products, with heated air
JP2003343982A (en) * 2002-05-29 2003-12-03 Espec Corp Heating device
US20040048220A1 (en) * 2002-09-10 2004-03-11 Nguyen Vuong P. Thermal process station with heated lid
US20070245555A1 (en) * 2004-09-24 2007-10-25 Nihon University Method for Manufacturing a Ceramic Electronic Component
CN1913101A (en) * 2005-08-11 2007-02-14 东京毅力科创株式会社 Decompression drying device
CN101478882A (en) * 2006-06-26 2009-07-08 热力处理方案有限公司 Rapid thermal firing IR conveyor furnace having high intensity heating section
CN102983091A (en) * 2008-07-16 2013-03-20 泰拉半导体株式会社 Heater of batch-type heat treatment device
US20110200742A1 (en) * 2008-10-16 2011-08-18 Sharp Kabushiki Kaisha Drying method and drying device
CN103210272A (en) * 2011-01-21 2013-07-17 Tp太阳能公司 Dual independent transport systems for ir conveyor furnaces and methods of firing thin work pieces
KR20130032171A (en) * 2011-09-22 2013-04-01 주식회사 테라세미콘 Vacuum dry apparatus
US20130240512A1 (en) * 2012-03-14 2013-09-19 Microwave Materials Technologies, Inc. Enhanced microwave system employing inductive iris
CN103546996A (en) * 2012-07-12 2014-01-29 光洋热系统株式会社 Heater unit and heat treatment apparatus
US20170042439A1 (en) * 2014-02-14 2017-02-16 National University Of Singapore System, device and methods for brainwave-based technologies
CN107210245A (en) * 2014-11-18 2017-09-26 泰拉半导体株式会社 Substrate board treatment
US20180174868A1 (en) * 2015-06-12 2018-06-21 J.E.T. Co., Ltd. Substrate treatment device and substrate treatment method
CN205332695U (en) * 2016-01-28 2016-06-22 昆山国显光电有限公司 Heating furnace
KR20180077384A (en) * 2016-12-28 2018-07-09 주식회사 비아트론 Heat-Treatment Apparatus and Method of Substrate using VCSEL
CN206597766U (en) * 2017-01-13 2017-10-31 安徽未名鼎和环保有限公司 A kind of rubbish heat-treatment furnace with excellent treatment effect
CN111052336A (en) * 2017-09-01 2020-04-21 株式会社国际电气 Substrate processing apparatus, method of manufacturing semiconductor device, and program
CN108444269A (en) * 2018-04-08 2018-08-24 安吉晶圣光伏发电有限公司 A kind of baking oven machine for diode
KR101957762B1 (en) * 2018-08-07 2019-03-14 한국지질자원연구원 Preprocessing apparatus for rock sample
US20200197851A1 (en) * 2018-12-21 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Exhaust module for wafer baking apparatus and wafer processing system having the same
CN210320888U (en) * 2019-07-02 2020-04-14 安徽三优光电科技有限公司 Quick heating type baking oven for semiconductor forming
TWM593652U (en) * 2019-12-31 2020-04-11 銓揚精密有限公司 Improved gas-exhausting equipment of semiconductor drying box
KR20220154302A (en) * 2021-05-12 2022-11-22 한국고요써모시스템(주) Heater unit of heat treatment oven

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116294540A (en) * 2023-03-03 2023-06-23 上海至纯洁净系统科技股份有限公司 Multi-gas discharge integrated module capable of being used in wafer drying system and wafer drying system

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