CN102738044B - 半导体制造装置用部件 - Google Patents

半导体制造装置用部件 Download PDF

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Publication number
CN102738044B
CN102738044B CN201210071328.3A CN201210071328A CN102738044B CN 102738044 B CN102738044 B CN 102738044B CN 201210071328 A CN201210071328 A CN 201210071328A CN 102738044 B CN102738044 B CN 102738044B
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China
Prior art keywords
power supply
bonding
component
thermal expansion
ceramic
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CN201210071328.3A
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English (en)
Chinese (zh)
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CN102738044A (zh
Inventor
来田雅裕
早濑徹
胜田祐司
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NGK Insulators Ltd
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NGK Insulators Ltd
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Publication of CN102738044A publication Critical patent/CN102738044A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
CN201210071328.3A 2011-03-31 2012-03-16 半导体制造装置用部件 Active CN102738044B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-079462 2011-03-31
JP2011079462 2011-03-31

Publications (2)

Publication Number Publication Date
CN102738044A CN102738044A (zh) 2012-10-17
CN102738044B true CN102738044B (zh) 2016-04-06

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ID=46926976

Family Applications (1)

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CN201210071328.3A Active CN102738044B (zh) 2011-03-31 2012-03-16 半导体制造装置用部件

Country Status (5)

Country Link
US (1) US8908349B2 (https=)
JP (1) JP5968651B2 (https=)
KR (1) KR101867625B1 (https=)
CN (1) CN102738044B (https=)
TW (1) TWI539551B (https=)

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* Cited by examiner, † Cited by third party
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JP5968651B2 (ja) * 2011-03-31 2016-08-10 日本碍子株式会社 半導体製造装置用部材
JP6084915B2 (ja) * 2012-11-06 2017-02-22 日本碍子株式会社 セラミックス部材と金属部材との接合体及びその製法
JP6234076B2 (ja) * 2013-06-17 2017-11-22 株式会社Maruwa 接合構造体及びこれを用いた半導体製造装置
JP6085073B2 (ja) * 2015-01-20 2017-02-22 日本碍子株式会社 シャフト端部取付構造
JP6666717B2 (ja) * 2015-12-28 2020-03-18 日本特殊陶業株式会社 セラミックス部材
JP6560150B2 (ja) * 2016-03-28 2019-08-14 日本碍子株式会社 ウエハ載置装置
JP6693832B2 (ja) * 2016-07-29 2020-05-13 日本特殊陶業株式会社 セラミックス部材
JP6698476B2 (ja) * 2016-08-30 2020-05-27 京セラ株式会社 静電吸着用部材
JP2018139255A (ja) * 2017-02-24 2018-09-06 京セラ株式会社 試料保持具およびこれを用いたプラズマエッチング装置用部品
JP2018203581A (ja) * 2017-06-07 2018-12-27 日本特殊陶業株式会社 セラミックス構造体
JP6871184B2 (ja) * 2018-01-31 2021-05-12 日機装株式会社 半導体発光装置の製造方法
JPWO2020004564A1 (ja) 2018-06-28 2021-07-15 京セラ株式会社 半導体製造装置用部材の製造方法および半導体製造装置用部材
US10957520B2 (en) * 2018-09-20 2021-03-23 Lam Research Corporation Long-life high-power terminals for substrate support with embedded heating elements
JP6966651B2 (ja) * 2019-03-26 2021-11-17 日本特殊陶業株式会社 電極埋設部材及びその製造方法、静電チャック、セラミックス製ヒーター
JP7173335B2 (ja) * 2019-06-26 2022-11-16 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、銅／セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法
JP7368488B2 (ja) * 2019-10-18 2023-10-24 京セラ株式会社 構造体および加熱装置
CN114158147A (zh) * 2020-09-08 2022-03-08 苏州珂玛材料科技股份有限公司 陶瓷加热盘引出电极连接结构及其连接方法
US12300474B2 (en) * 2020-10-15 2025-05-13 Applied Materials, Inc. Semiconductor substrate support power transmission components
KR102642090B1 (ko) * 2021-08-24 2024-02-29 주식회사 케이엔제이 지지 소켓 및 증착층을 포함하는 부품 제조 방법
WO2023106445A1 (ko) 2021-12-08 2023-06-15 주식회사 미코세라믹스 극저온 서셉터 및 그에 사용되는 전기적 커넥터 어셈블리
JP7623309B2 (ja) 2022-01-12 2025-01-28 日本碍子株式会社 ウエハ載置台
JP7749475B2 (ja) * 2022-01-28 2025-10-06 京セラ株式会社 接合体、締結用部品、碍子および電流導入端子
CN114513869B (zh) * 2022-02-23 2024-03-29 常州联德陶业有限公司 一种氮化铝陶瓷器件用接线端子及其固定工艺
JP7634493B2 (ja) * 2022-03-03 2025-02-21 日本碍子株式会社 給電部材及びウエハ載置台
KR102488086B1 (ko) * 2022-06-17 2023-01-13 주식회사 제스코 정전척
KR102619089B1 (ko) * 2022-10-31 2023-12-29 주식회사 미코세라믹스 세라믹 서셉터
JP7675282B1 (ja) 2023-09-04 2025-05-12 日本碍子株式会社 ウエハ載置台
KR102742914B1 (ko) * 2023-12-21 2024-12-16 주식회사 미코세라믹스 세라믹 서셉터

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1307386A (zh) * 2000-01-28 2001-08-08 富士康(昆山)电脑接插件有限公司 电连接器端子制造方法及其制造模具

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US5707715A (en) * 1996-08-29 1998-01-13 L. Pierre deRochemont Metal ceramic composites with improved interfacial properties and methods to make such composites
US6143432A (en) * 1998-01-09 2000-11-07 L. Pierre deRochemont Ceramic composites with improved interfacial properties and methods to make such composites
JP3746594B2 (ja) * 1997-06-20 2006-02-15 日本碍子株式会社 セラミックスの接合構造およびその製造方法
JP3718380B2 (ja) * 1999-08-18 2005-11-24 株式会社日立製作所 はんだ接続構造を有する回路装置およびその製造方法
WO2001060125A1 (en) * 2000-02-07 2001-08-16 Tdk Corporation Composite substrate, thin-film light-emitting device comprising the same, and method for producing the same
JP2001237304A (ja) * 2000-02-21 2001-08-31 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板
JP2002293655A (ja) 2001-03-29 2002-10-09 Ngk Insulators Ltd 金属端子とセラミック部材との接合構造、金属部材とセラミック部材との接合構造および金属端子とセラミック部材との接合材
JP3949459B2 (ja) * 2002-01-25 2007-07-25 日本碍子株式会社 異種材料の接合体及びその製造方法
US7252872B2 (en) * 2003-01-29 2007-08-07 Ngk Insulators, Ltd. Joined structures of ceramics
JP4184829B2 (ja) * 2003-02-25 2008-11-19 京セラ株式会社 静電チャックの製造方法
JP4967447B2 (ja) * 2006-05-17 2012-07-04 株式会社日立製作所 パワー半導体モジュール
US7816155B2 (en) * 2007-07-06 2010-10-19 Jds Uniphase Corporation Mounted semiconductor device and a method for making the same
JP5174582B2 (ja) * 2007-08-30 2013-04-03 日本碍子株式会社 接合構造体
TWI450353B (zh) * 2008-01-08 2014-08-21 日本碍子股份有限公司 A bonding structure and a semiconductor manufacturing apparatus
JP2010263050A (ja) * 2009-05-01 2010-11-18 Showa Denko Kk 発光ダイオード及びその製造方法、並びに発光ダイオードランプ
JP5968651B2 (ja) * 2011-03-31 2016-08-10 日本碍子株式会社 半導体製造装置用部材

Patent Citations (1)

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CN1307386A (zh) * 2000-01-28 2001-08-08 富士康(昆山)电脑接插件有限公司 电连接器端子制造方法及其制造模具

Also Published As

Publication number Publication date
JP5968651B2 (ja) 2016-08-10
US20120250211A1 (en) 2012-10-04
KR101867625B1 (ko) 2018-06-15
JP2012216786A (ja) 2012-11-08
US8908349B2 (en) 2014-12-09
TWI539551B (zh) 2016-06-21
KR20120112036A (ko) 2012-10-11
CN102738044A (zh) 2012-10-17
TW201240014A (en) 2012-10-01

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