CN102414824B - Ald系统和方法 - Google Patents
Ald系统和方法 Download PDFInfo
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- CN102414824B CN102414824B CN201080018411.3A CN201080018411A CN102414824B CN 102414824 B CN102414824 B CN 102414824B CN 201080018411 A CN201080018411 A CN 201080018411A CN 102414824 B CN102414824 B CN 102414824B
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- 238000000034 method Methods 0.000 title claims description 26
- 239000007789 gas Substances 0.000 claims abstract description 243
- 239000000758 substrate Substances 0.000 claims abstract description 238
- 239000002243 precursor Substances 0.000 claims abstract description 90
- 238000000429 assembly Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims description 51
- 238000000576 coating method Methods 0.000 claims description 51
- 239000000463 material Substances 0.000 claims description 51
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 238000005086 pumping Methods 0.000 claims description 31
- 239000012530 fluid Substances 0.000 claims description 21
- 230000004087 circulation Effects 0.000 claims description 20
- 238000010926 purge Methods 0.000 claims description 20
- 239000004215 Carbon black (E152) Substances 0.000 claims description 14
- 229930195733 hydrocarbon Natural products 0.000 claims description 14
- 150000002430 hydrocarbons Chemical class 0.000 claims description 12
- 238000011068 loading method Methods 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 7
- 239000011159 matrix material Substances 0.000 claims description 4
- 239000010409 thin film Substances 0.000 claims description 4
- 238000006557 surface reaction Methods 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 238000006386 neutralization reaction Methods 0.000 claims 3
- 102100024058 Flap endonuclease GEN homolog 1 Human genes 0.000 claims 1
- 101000833646 Homo sapiens Flap endonuclease GEN homolog 1 Proteins 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 12
- 238000004140 cleaning Methods 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 19
- 238000000151 deposition Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 239000007787 solid Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- -1 steam Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 244000287680 Garcinia dulcis Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
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- 230000003321 amplification Effects 0.000 description 1
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- 230000001413 cellular effect Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000007600 charging Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
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- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- 238000010792 warming Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45504—Laminar flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
- C23C16/45546—Atomic layer deposition [ALD] characterized by the apparatus specially adapted for a substrate stack in the ALD reactor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45582—Expansion of gas before it reaches the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
1000 双室气体沉积系统 | 6000 衬里组合件 |
1100 排气口 | 6010 底部衬里壁 |
1110 照明塔 | 6020 顶部衬里壁 |
1120 上部室 | 6030 前衬里孔 |
1130 右面 | 6040 后衬里壁 |
1135 上部前体供应 | 6050 右衬里孔 |
1140 框架 | 6060 左衬里口 |
1145 上部交叉平台 | 6070 衬里处理器 |
1150 下部室 | 6080 调节球 |
1155 下部交叉平台 | 6090 矩形后孔 |
1160 下部前体供应 | 7000 衬底 |
1165 电子控制器 | 7010 衬底支撑表面 |
1170 底部装载口 | 7015 输入增压衬里 |
1180 前面 | 7020 上部增压衬里壁 |
1190 上部装载口 | 7030 下部增压衬里壁 |
1200 用户界面 | 7040 后增压衬里壁 |
7050 法兰 | |
2000 自动气体沉积生产设备 | 7060 底壁顶表面 |
2010 机器人衬底处理器 | 7080 输出增压衬里 |
2020 衬底贮存托架 | 7090 上部体积 |
2030 机器人底座 | 7100 下部体积 |
2040 操作臂 | 7110 通孔 |
2050 升举元件 | 7120 竖井 |
2060 洁净室 | 7130 可移动井板 |
2070 壁板 | D 井高度尺寸 |
2080 壁口 | 8000 竖井组合件 |
8010 金属轴 | |
3000 室组合件 | 8020 尖端附件 |
3010 顶部外壁 | 8030 球形末端 |
3020 底部外壁 | |
3030 左外壁 | 8100 反应室组合件 |
3035 前孔 | 8110 外壁组合件 |
3040 右外壁 | 8120 中空室 |
3042 前外壁 | 8130 衬底支撑架 |
3045 后孔 | 8140 左支撑区域 |
3044 后外壁 | 8150 右支撑区域 |
3050 背板 | 8160 输入增压部 |
3060 圆周法兰 | 8170 输出增压部 |
3070 中空矩形室 | 8180 出口模块 |
3080 可移动入口门 | 8190 右侧孔 |
3090 支撑架 | 8210 左侧孔 |
3100 门致动器 | 8220A,B,C 支撑架 |
3110 电加热器 | 8230 衬底 |
3120 隔热 | 8240 肩部 |
3125 室眼螺栓 | 8250 插座 |
3130 右矩形孔 | 8260 可移除衬里 |
3140 左矩形孔 | 9000 双宽室组合件 |
3150 输入增压部 | 9010 衬底 |
3160 输入增压法兰 | 9020 衬底 |
3170 上部输入增压壁 | 9030 双宽入口门 |
3180 下部输入增压壁 | |
3190 输入增压侧壁 | 10000 双室系统 |
3200 输入增压侧壁 | 10010 室组合件 |
3210 输入增压室 | 10020 室组合件 |
3220 输入增压端壁 | 10030 气体供应模块 |
3230 输入口 | 10040 输入导管 |
3240 气体供应模块 | 10050 上部输入增压部 |
3250 输出增压部 | 10060 下部输入增压部 |
3260 输出增压法兰 | 10070 截止阀 |
3270 上部输出增压壁 | 10080 输出导管 |
3280 下部输出增压部 | 10090 上部输出增压部 |
3290 输出增压侧壁 | 10100 下部输出增压部 |
3300 输出增压室 | 10110 上部出口模块 |
3310 出口 | 10120 下部出口模块 |
3320 出口模块 | 10130 截止阀 |
3330 截止阀 | 10140 前体捕集器 |
3340 真空压力计 | 11000 双室系统 |
3350 衬底支撑表面 | 11010 上部室 |
3360 背板眼螺栓 | 11020 下部室 |
3370 锥形通道 | 11030 输入增压部 |
3380 衬里紧固件 | 11140 气体供应模块 |
3390 井致动组合件 | 11050 输出增压部 |
3400 井柱 | 11060 出口模块 |
3410 气缸和活塞组合件 | |
3420 真空波纹管 | 12000 矩形导管组合件 |
3430 通孔 | 12010 上部法兰/口 |
3440 导杆 | 12020 下部法兰/口 |
3450 加强鳍片 | 12030 矩形流体导管 |
13010 输出增压部 | |
13020 出口增压部 | |
13030 第一前体捕集器 | |
13040 辅助前体捕集器 | |
13050 截止阀 |
13060 第二捕集器 | |
13070 T型配件 | |
13080 截止阀 | |
13090 截止阀 | |
13120 左导管 | |
13130 右导管 | |
13140 辅助前体捕集器 | |
13150 辅助前体捕集器 | |
13160 第二捕集器 | |
Claims (29)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20887509P | 2009-02-27 | 2009-02-27 | |
US61/208,875 | 2009-02-27 | ||
PCT/US2010/000590 WO2010098875A2 (en) | 2009-02-27 | 2010-02-26 | Ald systems and methods |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102414824A CN102414824A (zh) | 2012-04-11 |
CN102414824B true CN102414824B (zh) | 2015-12-02 |
Family
ID=42666130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080018411.3A Active CN102414824B (zh) | 2009-02-27 | 2010-02-26 | Ald系统和方法 |
Country Status (7)
Country | Link |
---|---|
US (2) | US9328417B2 (zh) |
EP (1) | EP2401417A4 (zh) |
JP (1) | JP5784508B2 (zh) |
KR (1) | KR101638214B1 (zh) |
CN (1) | CN102414824B (zh) |
SG (2) | SG173891A1 (zh) |
WO (1) | WO2010098875A2 (zh) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100108636A1 (en) * | 2008-10-30 | 2010-05-06 | Seagate Technology Llc | Integrated Tool for Fabricating an Electronic Component |
US9175388B2 (en) * | 2008-11-01 | 2015-11-03 | Ultratech, Inc. | Reaction chamber with removable liner |
US8920210B2 (en) * | 2009-06-18 | 2014-12-30 | Ronald C. Benson | System and method for drying grit used for abrasive blasting |
WO2012051485A1 (en) | 2010-10-16 | 2012-04-19 | Cambridge Nanotech Inc. | Ald coating system |
EP2465972B1 (en) * | 2010-12-15 | 2017-05-03 | NCD Co., Ltd. | Method and system for thin film deposition |
US9644285B2 (en) | 2011-08-22 | 2017-05-09 | Soitec | Direct liquid injection for halide vapor phase epitaxy systems and methods |
FR2979748B1 (fr) * | 2011-09-07 | 2014-05-02 | Soitec Silicon On Insulator | Systemes de depot ayant des portes d'acces a des emplacements souhaitables, et procedes relatifs |
TWI586830B (zh) * | 2011-08-22 | 2017-06-11 | 索泰克公司 | 在所需位置具有進出閘門之沈積系統及相關製作方法 |
US9982346B2 (en) * | 2011-08-31 | 2018-05-29 | Alta Devices, Inc. | Movable liner assembly for a deposition zone in a CVD reactor |
US20130078375A1 (en) * | 2011-09-26 | 2013-03-28 | Peter Krotov | Deposition source integration into coater |
US9156041B1 (en) * | 2012-05-07 | 2015-10-13 | The United States Of America As Represented By The Secretary Of The Army | Dimethylmethylphosphonate vapor generator |
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SG10201400261RA (en) | 2014-07-30 |
KR101638214B1 (ko) | 2016-07-08 |
US9777371B2 (en) | 2017-10-03 |
WO2010098875A3 (en) | 2010-10-21 |
CN102414824A (zh) | 2012-04-11 |
US9328417B2 (en) | 2016-05-03 |
US20120064245A1 (en) | 2012-03-15 |
WO2010098875A2 (en) | 2010-09-02 |
EP2401417A2 (en) | 2012-01-04 |
SG173891A1 (en) | 2011-09-29 |
JP2012519235A (ja) | 2012-08-23 |
US20100166955A1 (en) | 2010-07-01 |
KR20120018113A (ko) | 2012-02-29 |
JP5784508B2 (ja) | 2015-09-24 |
EP2401417A4 (en) | 2012-12-12 |
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