CN102315200A - 一种芯片封装结构、封装方法及电子设备 - Google Patents

一种芯片封装结构、封装方法及电子设备 Download PDF

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CN102315200A
CN102315200A CN201110258811A CN201110258811A CN102315200A CN 102315200 A CN102315200 A CN 102315200A CN 201110258811 A CN201110258811 A CN 201110258811A CN 201110258811 A CN201110258811 A CN 201110258811A CN 102315200 A CN102315200 A CN 102315200A
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chip
radome
pad
pcb board
packaging structure
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赵龙
李春澍
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Huawei Device Co Ltd
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Huawei Device Co Ltd
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Priority to CN201110258811A priority Critical patent/CN102315200A/zh
Publication of CN102315200A publication Critical patent/CN102315200A/zh
Priority to PCT/CN2012/080683 priority patent/WO2013029533A1/zh
Priority to EP14166650.3A priority patent/EP2763169A1/en
Priority to EP12799503.3A priority patent/EP2602819A4/en
Priority to US13/722,270 priority patent/US20130113088A1/en
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Abstract

本发明公开了一种芯片封装结构、封装方法及电子设备，涉及芯片封装领域，用以解决芯片封装结构中导电漆形成的屏蔽膜容易脱落的问题。所述芯片封装结构，包括：印刷电路板PCB板；屏蔽罩；所述屏蔽罩固定扣置在所述PCB板的零件面上；待屏蔽芯片；所述待屏蔽芯片设置在所述PCB板的零件面上，位于所述屏蔽罩之内，且所述待屏蔽芯片的管脚与所述PCB板上的第一焊盘相连接；所述待屏蔽芯片与所述屏蔽罩不接触。本发明提供的方案可以应用于芯片的封装。

Description

一种芯片封装结构、封装方法及电子设备
技术领域
本发明涉及芯片封装领域，尤其涉及一种芯片封装结构、封装方法及电子设备。
背景技术
在高密度封装技术中，芯片可能受到来自外界电磁信号的干扰，从而造成芯片的性能下降甚至损坏，并连带造成该芯片所在的设备引发故障。
目前已经出现具有屏蔽功能的芯片封装结构，该芯片封装结构通常采用在塑封后的芯片表面喷涂导电漆的方式，以屏蔽外界电磁信号的干扰。但这种芯片封装结构中由导电漆形成的屏蔽膜容易脱落，从而导致这种芯片封装结构的抗干扰能力降低，也就造成了其屏蔽功能的不理想。
发明内容
本发明的实施例提供一种芯片封装结构、封装方法及电子设备，用以解决芯片封装结构中导电漆形成的屏蔽膜容易脱落的问题。
为解决上述问题，本发明的实施例采用如下技术方案：
一方面，提供一种芯片封装结构，包括：
印刷电路板PCB板；
屏蔽罩；所述屏蔽罩固定扣置在所述PCB板的零件面上；
待屏蔽芯片；所述待屏蔽芯片设置在所述PCB板的零件面上，位于所述屏蔽罩内，且所述待屏蔽芯片的管脚与所述PCB板上的第一焊盘相连接；
所述待屏蔽芯片与所述屏蔽罩不接触。
另一方面，提供一种芯片封装方法，包括：
在印刷电路板PCB板上设计第一焊盘、第二焊盘；
在所述PCB板的零件面上，采用芯片键合工艺将待屏蔽芯片的管脚与所述第一焊盘连接；
在所述PCB板的零件面上设置屏蔽罩，将所述屏蔽罩与所述第二焊盘固定连接，且所述屏蔽罩与所述待屏蔽芯片不接触。
又一方面，提供一种电子设备，包括：上述的芯片封装结构。
本发明实施例提供的一种芯片封装结构、封装方法及电子设备，其中所述芯片封装结构包括：PCB板，固定扣置在PCB板的零件面上的屏蔽罩，以及待屏蔽芯片；其中，待屏蔽芯片设置在PCB板的零件面上，位于屏蔽罩之内，且待屏蔽芯片的管脚与所述PCB板上的第一焊盘相连接，这样就可以将待屏蔽芯片的管脚通过PCB板的第一焊盘导出；同时，待屏蔽芯片与屏蔽罩不接触，这样屏蔽罩就不会干扰待屏蔽芯片工作。与现有技术相比，本发明实施例提供的芯片封装结构中屏蔽罩固定扣置在PCB板上，这种芯片封装结构中的屏蔽罩不易脱落，进而能够提高芯片封装结构的抗干扰能力。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的芯片封装结构的剖面图；
图2为本发明实施例提供的芯片封装结构的俯视图；
图3为本发明实施例提供的一种芯片封装方法流程图；
图4为本发明实施例提供的另一芯片封装方法流程图。
附图标记：
100-芯片封装结构；11-PCB板，12-屏蔽罩，121-导电体，122-金属片，13-待屏蔽芯片，14-绝缘物，15-第二焊盘，16-第一焊盘，17-导线。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供的芯片封装结构100，如图1所示，包括PCB板(Printed Circuit Board，印刷电路板)11，屏蔽罩12，待屏蔽芯片13。其中，屏蔽罩12固定扣置在PCB板11的零件面即图1中A面上，待屏蔽芯片13设置在PCB板11的零件面上，位于所述屏蔽罩12之内，且待屏蔽芯片13的管脚与PCB板11上的第一焊盘16相连接；待屏蔽芯片13与屏蔽罩12不接触。
本实施例中的待屏蔽芯片可以是需要与外界电磁波隔离的裸芯片、已封装芯片、喷涂导电漆的芯片或芯片组等。
所述屏蔽罩可以是任意能够屏蔽外界电磁波的罩体，可以使位于该屏蔽罩内的待屏蔽芯片与外界电磁波隔离；同时，该屏蔽罩固定扣置在PCB板的零件面上，且固定的方式可以是任意将屏蔽罩固定在PCB板上的方式，这样就使得芯片封装结构中的屏蔽罩不易脱落，进而可以提高芯片封装结构抗干扰能力。
特别地，所述第一焊盘一方面可以固定连接待屏蔽芯片的管脚，另一方面还可以将PCB板零件面的待屏蔽芯片的管脚引至非零件面。
进一步地，屏蔽罩12包括：金属片122，以及接触并支撑金属片122的导电体121。此时，所述屏蔽罩12固定扣置在所述PCB板11的零件面上具体可以为：屏蔽罩12的导电体121焊接在PCB板11的零件面上的第二焊盘15上。在本实施例中，屏蔽罩的金属片不仅起到防止待屏蔽芯片受外界电磁干扰的作用，还起到良好的散热作用；与现有技术相比，不需要依靠PCB板散热，从而可以避免对PCB板上的其他电路产生影响。
需要说明的是，焊盘形状可以有多种，可以是有圆形、方形、椭圆形、矩形、八边形等，其具体形状由其所承载的元件形状决定。在本实施例中，第一焊盘的形状由管脚形状决定，第二焊盘的形状由导电体形状决定。
优选的，所述导电体121为表面裸露的导电体，具体可以为金属线或焊球。进一步优选的，所述导电体接地；导电体接地的方式可以是将导电体连接至待屏蔽芯片的接地管脚，也可以由第二焊盘将导电体引出接地，当然不排除其他方式将导电体接地，以使得屏蔽罩可以更好的屏蔽外界电磁信号的干扰。
进一步的，屏蔽罩12和设置有待屏蔽芯片13的PCB板11之间填充有绝缘物14。优选的，绝缘物可以为塑胶。该绝缘物不仅可以使得屏蔽罩和待屏蔽芯片之间不接触，从而使得屏蔽罩不会干扰待屏蔽芯片工作；另外，该绝缘物还可以起到屏蔽罩与PCB板之间的支撑作用，以使得芯片封装结构更加牢固。
进一步的，所述待屏蔽芯片13的管脚与所述PCB板11上的第一焊盘16相连接包括：所述待屏蔽芯片13的管脚与导线17的一端相焊接，且导线17的另一端与所述PCB板11上的第一焊盘16相焊接。这种连接方式是采用传统的芯片键合工艺，其中，所述导线可以使用传统工艺中使用的金线或铝线。当然，待屏蔽芯片的管脚与第一焊盘连接方式不限于通过导线连接，示例的，也可以根据待屏蔽芯片的管脚位置设置好相应的第一焊盘位置，将待屏蔽芯片的管脚直接焊接在第一焊盘上。
更进一步的，若所述芯片封装结构还需要封装，则上述芯片封装结构还包括：封装外壳；所述封装外壳上设置有与所述待屏蔽芯片的管脚对应的第三焊盘；所述第三焊盘与第一焊盘连接，以便将与该第三焊盘对应的待屏蔽芯片的管脚引出。需要说明的是该设置有第三焊盘的封装外壳在图示中并未标示，但本领域技术人员可以根据现有的封装工艺理解本发明所描述的芯片封装结构。
图2为本发明实施例提供的芯片封装结构的俯视图，通过图2可以进一步看清本发明实施例提供的芯片封装结构100的各个部分的位置关系，需要说明的是图2中未标识金属片、金属片与PCB板之间的绝缘物等。参考图2所示，并结合上述对芯片封装结构的描述，可以清楚了解待屏蔽芯片13位于PCB板11上，在PCB板的四周设置有导电体121，待屏蔽芯片13的管脚与导线17的一端相焊接，导线17的另一端与PCB板11上的第一焊盘16相焊接。
本发明实施例还提供了芯片封装方法，如图3所示，并结合图1，该封装方法具体包括以下步骤：
S301、在印刷电路板PCB板11上设计第一焊盘16、第二焊盘15；
S302、在PCB板11的零件面上，采用芯片键合工艺将待屏蔽芯片13的管脚与第一焊盘16连接；
S303、在PCB板11的零件面上设置屏蔽罩12，将屏蔽罩12与第二焊盘15固定连接，且屏蔽罩12与待屏蔽芯片13不接触。
本发明实施例提供的芯片封装方法，通过在PCB板上固定扣置在PCB板的零件面上的屏蔽罩，使得位于屏蔽罩之内的待屏蔽芯片可以免受外界电磁波的干扰；并且由于屏蔽罩固定扣置在PCB板上，使得这种芯片封装结构中的屏蔽罩不易脱落；同时，待屏蔽芯片与屏蔽罩不接触，这样屏蔽罩就不会干扰待屏蔽芯片工作。
进一步的，S303具体可以包括：
首先，在所述PCB板11的零件面上的第二焊盘15焊接导电体121；
然后，在所述PCB板11的零件面上注塑，并且塑胶平面高于待屏蔽芯片13、低于导电体121；
最后，在塑胶未完全固化之前，将金属板置于所述PCB板11的导电体121之上，并压合使得金属板122紧贴塑胶，且与导电体良好接触；塑胶固化后，金属板与塑胶粘合。
由于上述的注塑过程中，塑胶呈液态，其自身处于一定温度，在该温度下导电体会在一定程度软化；在塑胶未完全固化之前，将金属板压合在导电体之上就可以使得两者良好接触，另外，由于塑胶未完全固化，将金属板压合至紧贴塑胶，就可以使得塑胶固化后，金属板与塑胶粘合；这就能够保证金属板不会轻易剥落，也保证了制作完成的芯片封装结构的牢固性。
更进一步的，如果芯片封装结构还需要封装，则本发明提供的芯片封装结构的制作方法，如图4所示，还可以包括：
S304、通过封装工艺将设置有屏蔽罩的芯片封装结构封装在封装外壳中，由封装外壳上的第三焊盘将待屏蔽芯片的管脚引出。
具体的，可以利用导线将第一焊盘与第三焊盘连接，从而将所述待屏蔽芯片的管脚引出，完成封装。
该封装工艺可以参考现有技术中的封装工艺，例如BGA(英文全称为Ball Grid Array，球栅阵列结构)封装、QFN(Quad Flat No-leadPackage，方形扁平无引脚封装)等封装工艺。由于封装工艺是本领域技术人员所了解的，故在此就不再赘述。
需要说明的是，图3或图4所示的芯片封装方法可以作为参考应用于实际芯片封装结构的制造过程中，但封装方法的顺序不限于图3或图4所示的顺序。
另外，本发明实施例还提供了一种电子设备，包括：上述任一芯片封装结构。该电子设备可以是移动终端，当然也可以使用芯片的任何一种电子设备。
下面，以手机为例进行详述。
手机硬件主要包括：显示屏、上盖(前盖)、下盖(后盖)、电池盖、扬声器麦克风和主板等，其中主板又包括射频芯片、基带芯片、电源管理芯片、Flash存储芯片(闪速存储芯片)，这些主板上的芯片的引脚与手机的天线、显示屏、扬声器麦克风等外围设备连接，就实现了手机的基本功能。
所述射频芯片、基带芯片、电源管理芯片、Flash存储芯片中的任一个或多个(两个以上)都可以采用本发明实施例提供的芯片封装构造，以使得该手机中需要封装的芯片不易受外界电磁波影响，抗干扰能力强。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (12)

1.一种芯片封装结构，其特征在于，包括：
印刷电路板PCB板；
屏蔽罩；所述屏蔽罩固定扣置在所述PCB板的零件面上；
待屏蔽芯片；所述待屏蔽芯片设置在所述PCB板的零件面上，位于所述屏蔽罩内，且所述待屏蔽芯片的管脚与所述PCB板上的第一焊盘相连接；
所述待屏蔽芯片与所述屏蔽罩不接触。
2.根据权利要求1所述的芯片封装结构，其特征在于，所述屏蔽罩包括：金属片，以及接触并支撑该金属片的导电体；
所述屏蔽罩固定扣置在所述PCB板的零件面上包括：
所述屏蔽罩的导电体焊接在所述PCB板的零件面上的第二焊盘上。
3.根据权利要求2所述的芯片封装结构，其特征在于，所述导电体为金属线或焊球。
4.根据权利要求2所述的芯片封装结构，其特征在于，所述导电体接地。
5.根据权利要求1-4任一项权利要求所述的芯片封装结构，其特征在于，所述待屏蔽芯片的管脚与所述PCB板上的第一焊盘相连接包括：
所述待屏蔽芯片的管脚与导线的一端相焊接，且导线的另一端与所述PCB板上的第一焊盘相焊接。
6.根据权利要求1～5任一项权利要求所述的芯片封装结构，其特征在于，所述待屏蔽芯片与所述屏蔽罩不接触包括：
所述屏蔽罩和设置有待屏蔽芯片的PCB板之间填充有绝缘物。
7.根据权利要求6所述的芯片封装结构，其特征在于，所述绝缘物为塑胶。
8.根据权利要求1～7任一项权利要求所述的芯片封装结构，其特征在于，还包括：封装外壳；所述封装外壳上设置有与所述待屏蔽芯片的管脚对应的第三焊盘；
所述第三焊盘与第一焊盘连接，以便将与该第三焊盘对应的待屏蔽芯片的管脚引出。
9.一种芯片封装方法，其特征在于，包括：
在印刷电路板PCB板上设计第一焊盘、第二焊盘；
在所述PCB板的零件面上，采用芯片键合工艺将待屏蔽芯片的管脚与所述第一焊盘连接；
在所述PCB板的零件面上设置屏蔽罩，将所述屏蔽罩与所述第二焊盘固定连接，且所述屏蔽罩与所述待屏蔽芯片不接触。
10.根据权利要求9所述的芯片封装方法，其特征在于，所述在所述PCB板的零件面上设置屏蔽罩，将屏蔽罩与所述第二焊盘固定连接，且所述屏蔽罩与所述待屏蔽芯片不接触包括：
在所述PCB板的零件面上的第二焊盘焊接导电体；
在所述PCB板的零件面上注塑，并且塑胶平面高于待屏蔽芯片、低于导电体；
在塑胶未完全固化之前，将金属板置于所述PCB板的导电体之上，并压合使得金属板紧贴塑胶，且与导电体良好接触；塑胶固化后，金属板与塑胶粘合。
11.根据权利要求9或10所述的芯片封装方法，其特征在于，还包括：
通过封装工艺将设置有屏蔽罩的芯片封装在封装外壳中，由封装外壳上的第三焊盘将待屏蔽芯片的管脚引出。
12.一种电子设备，其特征在于，包括：权利要求1～8任一项所述的芯片封装结构。
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