CN107481997A - 一种双层堆叠气密封装结构及方法 - Google Patents
一种双层堆叠气密封装结构及方法 Download PDFInfo
- Publication number
- CN107481997A CN107481997A CN201710789553.3A CN201710789553A CN107481997A CN 107481997 A CN107481997 A CN 107481997A CN 201710789553 A CN201710789553 A CN 201710789553A CN 107481997 A CN107481997 A CN 107481997A
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- Prior art keywords
- pad
- film circuit
- cover plate
- thin film
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000005538 encapsulation Methods 0.000 claims abstract description 38
- 239000010409 thin film Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000010408 film Substances 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 29
- 239000000919 ceramic Substances 0.000 claims abstract description 10
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 238000002955 isolation Methods 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 6
- 230000004888 barrier function Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000010923 batch production Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710789553.3A CN107481997A (zh) | 2017-09-05 | 2017-09-05 | 一种双层堆叠气密封装结构及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710789553.3A CN107481997A (zh) | 2017-09-05 | 2017-09-05 | 一种双层堆叠气密封装结构及方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107481997A true CN107481997A (zh) | 2017-12-15 |
Family
ID=60604467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710789553.3A Pending CN107481997A (zh) | 2017-09-05 | 2017-09-05 | 一种双层堆叠气密封装结构及方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107481997A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109103165A (zh) * | 2018-07-03 | 2018-12-28 | 中国电子科技集团公司第二十九研究所 | Ltcc基板三维堆叠结构及其气密封装方法 |
CN109643643A (zh) * | 2018-11-30 | 2019-04-16 | 长江存储科技有限责任公司 | 键合存储器件及其制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814484A (zh) * | 2009-02-19 | 2010-08-25 | 日月光半导体制造股份有限公司 | 芯片封装体及其制作方法 |
CN102315200A (zh) * | 2011-09-02 | 2012-01-11 | 华为终端有限公司 | 一种芯片封装结构、封装方法及电子设备 |
CN102446870A (zh) * | 2010-10-13 | 2012-05-09 | 矽品精密工业股份有限公司 | 具有静电放电及防电磁波干扰的封装件 |
CN103426830A (zh) * | 2013-07-15 | 2013-12-04 | 中国电子科技集团公司第五十五研究所 | 一种基于低温共烧陶瓷的倒装焊接的表贴型外壳结构 |
CN105870106A (zh) * | 2016-06-01 | 2016-08-17 | 爱普科斯科技(无锡)有限公司 | 一种射频滤波模块的封装结构及其封装工艺 |
US9478599B1 (en) * | 2013-08-30 | 2016-10-25 | Integrated Device Technology, Inc. | Integrated circuit device substrates having packaged inductors thereon |
-
2017
- 2017-09-05 CN CN201710789553.3A patent/CN107481997A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101814484A (zh) * | 2009-02-19 | 2010-08-25 | 日月光半导体制造股份有限公司 | 芯片封装体及其制作方法 |
CN102446870A (zh) * | 2010-10-13 | 2012-05-09 | 矽品精密工业股份有限公司 | 具有静电放电及防电磁波干扰的封装件 |
CN102315200A (zh) * | 2011-09-02 | 2012-01-11 | 华为终端有限公司 | 一种芯片封装结构、封装方法及电子设备 |
CN103426830A (zh) * | 2013-07-15 | 2013-12-04 | 中国电子科技集团公司第五十五研究所 | 一种基于低温共烧陶瓷的倒装焊接的表贴型外壳结构 |
US9478599B1 (en) * | 2013-08-30 | 2016-10-25 | Integrated Device Technology, Inc. | Integrated circuit device substrates having packaged inductors thereon |
CN105870106A (zh) * | 2016-06-01 | 2016-08-17 | 爱普科斯科技(无锡)有限公司 | 一种射频滤波模块的封装结构及其封装工艺 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109103165A (zh) * | 2018-07-03 | 2018-12-28 | 中国电子科技集团公司第二十九研究所 | Ltcc基板三维堆叠结构及其气密封装方法 |
CN109103165B (zh) * | 2018-07-03 | 2019-12-10 | 中国电子科技集团公司第二十九研究所 | Ltcc基板三维堆叠结构及其气密封装方法 |
CN109643643A (zh) * | 2018-11-30 | 2019-04-16 | 长江存储科技有限责任公司 | 键合存储器件及其制造方法 |
US11114453B2 (en) | 2018-11-30 | 2021-09-07 | Yangtze Memory Technologies Co., Ltd. | Bonded memory device and fabrication methods thereof |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information |
Inventor after: Li Yanrui Inventor after: Pan Yuhua Inventor after: Qin Yueli Inventor after: Wang Chunfu Inventor after: Wang Wenbo Inventor after: Liao Ao Inventor before: Li Yanrui Inventor before: Qin Yueli Inventor before: Wang Chunfu Inventor before: Wang Wenbo Inventor before: Liao Ao |
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CB03 | Change of inventor or designer information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171215 |
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RJ01 | Rejection of invention patent application after publication |