CN101971486A - 半导体器件和具备该半导体器件的通信设备以及电子设备 - Google Patents

半导体器件和具备该半导体器件的通信设备以及电子设备 Download PDF

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Publication number
CN101971486A
CN101971486A CN200980108588XA CN200980108588A CN101971486A CN 101971486 A CN101971486 A CN 101971486A CN 200980108588X A CN200980108588X A CN 200980108588XA CN 200980108588 A CN200980108588 A CN 200980108588A CN 101971486 A CN101971486 A CN 101971486A
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wiring pattern
encapsulation
lead frame
semiconductor device
outside terminal
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CN101971486B (zh
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帆足之彦
久保博生
津津良一仁
城石邦彦
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Yoshikawa Kogyo Co Ltd
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Yoshikawa Kogyo Co Ltd
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Abstract

本发明提供一种具备收容有第1元件(1)的第1封装(2)和重叠固定在该第1封装上并在内部收容有第2元件(3)的第2封装(4)的半导体器件，该半导体器件用于一种可以使平面尺寸进一步小型化的半导体器件的封装结构。第1封装(2)包括引线框架(5)以及布线图案(6)，对于布线图案(6)，在树脂模制时使用在基体基材上配置了布线图案(6)的转印引线框架，在树脂模制后剥下基体基材，从而使布线图案(6)以被转印在模制树脂的剥下面的方形残留，布线图案(6)的端部作为外部端子(6a)，面向模制树脂的剥下面侧而露出。第1元件(1)以在布线图案(6)的外部端子(6a)上部分性地重叠的方式，隔着绝缘层(8)被搭载，并且与引线框架(5)以及布线图案(6)电连接。

Description

半导体器件和具备该半导体器件的通信设备以及电子设备
技术领域
本发明涉及重叠2个封装而构成的半导体器件，特别涉及该封装结构。
背景技术
在作为这样重叠2个封装而构成的半导体器件以压电振荡器为例子进行说明时，通过与便携电话等移动体通信设备的普及相伴的低价格化以及小型化的急速发展，对于这些通信设备中使用的晶体振荡器等压电振荡器，也进一步要求小型化以及薄型化。
以往，作为压电振荡器的结构，已知如专利文献1所公开的那样，由收容有用于构成振荡电路的电路元件的第1封装、重叠固定在该第1封装上并在内部收容有压电振动元件的第2封装构成的结构。另外，在所述专利文献1中，通过用不同的引线框架来构成用于电连接安装了压电振荡器的安装基板与第1封装的引线框架、用于电连接第1封装与第2封装的引线框架，并将这些不同的引线框架配置成使垂直方向的位置重叠，而谋求使压电振荡器小型化。
但是，进一步要求与便携电话的普及相伴的通信设备、电子设备部件的小型化、薄型化，通过如所述专利文献1所公开的那样简单地重叠引线框架这样的技术，无法对应于该要求。即，在所述专利文献1的技术中，由于重合而引线框架变得密集，所以无法平滑地进行布线，在用于小型化、薄型化的引线框架的窄间距化中存在界限。另外，如果为了小型化、薄型化而使引线框架的厚度变薄，则强度变低，由于组装时的加工等而引线框架发生变形，而引起有时无法进行加工这样的问题等。
相对于此，本申请申请人在专利文献2中，公开了使用转印引线框架的压电振荡器的封装结构。在对封装进行树脂模制时，使用在基体基材上配置了布线图案的转印引线框架，在树脂模制后，剥下转印引线框架的基体基材，从而仅使布线图案以转印在模制树脂的剥下面的方式残留，布线图案的端部作为外部端子，被形成为面向模制树脂的剥下面侧而露出，由此，与在封装中重叠多个引线框架来使用的情况相比，可以抑制厚度，可以实现小型化、薄型化。
但是，在使用了该转印引线框架的封装结构中，在小型化、薄型化、特别是平面尺寸的小型化中也存在界限。即，如果希望使封装的平面尺寸小型化，则需要避免布线图案的外部端子与电路元件的短路，所以不得不缩小布线图案的外部端子的平面尺寸从而不使它们重合，但如果使布线图案的外部端子的平面尺寸过度缩小，则无法得到所需的安装强度。因此，由于确保所需的安装强度这样的制约，在封装的平面尺寸的小型化中存在界限。
专利文献1：日本特开2004-166230号公报
专利文献2：日本专利第3947545号公报
发明内容
本发明所要解决的课题在于，提供一种可以使平面尺寸进一步小型化的压电振荡器等半导体器件的封装结构。
本发明的半导体器件，具备：收容有第1元件的第1封装；以及重叠固定在该第1封装上并在内部收容有第2元件的第2封装，其特征在于，第1封装包括引线框架以及布线图案，引线框架的几个端部被作为面向第1封装的外面而露出的外部端子，对于布线图案，在对第1封装进行树脂模制时使用在基体基材上配置了布线图案的转印引线框架，在树脂模制后剥下基体基材，从而使所述布线图案以在模制树脂的剥下面转印的方式残留，所述布线图案的端部作为外部端子，被形成为面向模制树脂的剥下面侧而露出，第1元件以在布线图案的外部端子上至少部分性地重叠的方式，隔着绝缘层被搭载，并且与引线框架以及布线图案电连接，将在第1封装的上面或者下面中的某一个面露出的外部端子作为安装端子，在另一个面露出的外部端子与第2封装的外部端子电连接。
这样，在本发明中，通过与所述专利文献1同样地采用转印引线框架，可以实现半导体器件的封装的小型化、薄型化。进而，通过以在布线图案的外部端子上至少部分性地重叠的方式隔着绝缘层搭载电路元件，无需缩小布线图案的外部端子的平面尺寸，就可以实现封装的平面尺寸的小型化。即，不会降低通过布线图案的外部端子得到的安装强度，而可以实现封装的平面尺寸的小型化。另外，由于在布线图案的外部端子与电路元件之间隔着绝缘层，所以两者也不会短路。
在本发明中，可以在转印引线框架的布线图案的中央部分，设置载置第1元件的岛部。在该情况下，以在布线图案的外部端子上至少部分性地重叠，并且在岛部上至少部分性地重叠的方式，隔着绝缘层搭载了电路元件。
通过这样设置岛部，可以经由岛部高效地散热第1元件的热。另外，当仅在处于布线图案的端部的外部端子处载置而搭载第1元件，并将布线图案的中央部分作为空间的情况下，由于布线图案的中央部分的空间较窄，所以在通过树脂进行模密封时树脂不易蔓延而在树脂密封中易于产生不良，但如果在布线图案的中央部分设置岛部，则无需对该部分进行树脂密封，所以在封装的树脂密封中不易产生不良。
另外，在该岛部中，优选设置与第1元件和/或引线框架电连接的端子。通过这样在岛部设置端子，并将岛部还用作布线，可以使封装的平面尺寸进一步小型化。
另外，如果将第1元件作为用于构成振荡电路的电路元件，将第2元件作为压电振动元件，则可以得到小型且薄型的压电振荡器。进而，通过将本发明的压电振荡器等半导体器件搭载于通信设备、电子设备中，可以实现设备的小型化、薄型化。
根据本发明，使用通过转印引线框架得到的布线图案，并且以在布线图案的外部端子上至少部分性地重叠的方式隔着绝缘层搭载元件，从而不会降低通过布线图案的外部端子得到的安装强度，而可以使封装的平面尺寸小型化。
附图说明
图1是本发明的实施例的压电振荡器的分解立体图。
图2是图1的A-A以及B-B断面图。
图3是图1中的第1封装的立体图，(a)示出第2封装侧，(b)示出安装面侧，(c)示出内部结构。
图4示出第1封装的制作工序的一部分。
图5示出本发明中的电路元件(第1元件)的搭载例。
(符号说明)
1：电路元件(第1元件)；2：第1封装；3：压电振动元件(第2元件)；4：第2封装；5：引线框架；5a：外部端子；5b：另一端；6：布线图案；6a：外部端子；6b：岛部；6c：端子；7：屏蔽材料；8：绝缘层；9：引线键合；10：树脂模；11：UV带；12：层叠带；13：晶片；14：树脂模；15：盖；16：外部端子；17：导电性粘接剂。
具体实施方式
以下，根据将本发明应用到压电振荡器中的实施例，对本发明的实施方式进行说明。
图1是本发明的实施例的压电振荡器的分解立体图，图2是图1的A-A以及B-B断面图，图3是图1中的第1封装的立体图，(a)示出第2封装侧，(b)示出安装面侧，(c)示出内部结构。
图1所示的压电振荡器具备：收容有用于构成振荡电路的电路元件(第1元件)1的第1封装2；以及收容有压电振动元件(第2元件)3的第2封装4，是通过将第2封装4重叠固定在第1封装2上而构成的。
第1封装2具备如图2以及图3所示，具有引线框架5和布线图案6的引线结构。
其中，引线框架5在第1封装2内弯曲，其一端在第1封装2的上面露出而成为外部端子5a。另外，也可以代替使引线框架5弯曲，而通过进行蚀刻来形成外部端子5a。
另一方面，布线图案6在其端部的6个部位具有外部端子6a，并且在中央部分具有岛部6b。在岛部6b的两侧，向侧方突出设置了端子6c。在实施例中，布线图案6的外部端子6a成为用于将第1封装2安装到安装基板(未图示)的安装端子，在第1封装2的安装面侧，以仅使6个部位的外部端子6a露出的方式，其他部分被由绝缘物质构成的屏蔽材料7屏蔽。
以在布线图案6的外部端子6a上部分性地成叠，并且与岛部6b上的全面重叠的方式，隔着绝缘层8搭载了电路元件1。另外，以可以从安装基板经由外部端子6a接收电力以及控制信号的方式，通过引线键合9将电路元件1与外部端子6a电连接。另外，以可以经由引线框架5向第2封装4内的压电振动元件3发送接收控制信号的方式，通过引线键合9，直接或者经由布线图案6的端子6c将电路元件1与引线框架5电连接。
具有这样的结构的第1封装2通过树脂模10进行一体化并进行了封装化。
可以通过以下的方法来制作该第1封装2。
首先，准备在铜、不锈钢等基体基材(未图示)的表面上涂覆粘接剂，并在该涂覆面配置了导电性的布线图案6的转印引线框架(即，转印引线框架是在基体基材上配置布线图案而得到的)，并在其上搭载电路元件1。具体而言，如上所述，以在布线图案6的外部端子6a上部分性地重叠，并且与岛部6b上的全面重叠的方式，隔着绝缘层8搭载电路元件1。
为了隔着绝缘层8将电路元件1搭载到布线图案6上，例如如图4(a)所示，使用在由UV硬化树脂构成的UV带11上层叠了由绝缘性的热硬化树脂构成的绝缘层8(绝缘膜)的层叠带12，并在该层叠带12上，载置电路元件1的集合体即晶片13。之后，对晶片13进行切割而对电路元件1进行个片化。在该切割中，使UV带11半切断。在切割结束后，照射UV而使UV带11硬化来使其粘性消失。之后，如果如图4(c)所示那样拾取电路元件1，则仅绝缘层8残留在电路元件1的背面。然后，将具备该绝缘层8的电路元件1搭载于布线图案6上，一边加压一边加热。由此，由热硬化性树脂构成的绝缘层8溶融/硬化，隔着绝缘层8，接合了电路元件1和布线图案6。
另外，优选使溶融/硬化前的电路元件1背面的绝缘层8的厚度比布线图案6的厚度厚，使得在该绝缘层8的溶融/硬化的过程中，使绝缘层8蔓延到电路元件1与封装底面之间的间隙(例如图2所示的间隙S)，而这些间隙S被绝缘层8充填。即，由于树脂模10不易蔓到这样的间隙S中，所以优选通过绝缘层8预先进行密封。
在这样在布线图案6上搭载(绝缘接合)了电路元件1之后，在布线图案6的上方配置一个或者多个引线框架5。然后，通过引线键合9将这些引线框架5以及布线图案6与电路元件1进行电连接，通过树脂对电路元件1周边进行模密封。另外，在电连接中，例如也可以使用倒装连接等其他电连接方法。
在进行模密封之后，从树脂模10(模制树脂)剥下转印引线框架的基体基材，从而仅使转印引线框架的布线图案6以在树脂模10的剥下面侧转印的方式残留，其端部的外部端子6a和中央部分的岛部6b以及端子6c在树脂模10的剥下面露出。之后，通过绝缘性的屏蔽材料7来屏蔽外部端子6a以外的部分，从而仅使外部端子6a露出。另外，在本实施例中，在从基体基材剥下了树脂模10的时刻，引线框架5的另一端5b也在剥下面露出，但其也被屏蔽材料7屏蔽。
这样，对外部端子6a以外的部分进行屏蔽的目的在于，防止外部端子6a以外的布线部分与安装基板短路而造成恶劣影响，但在无需担心与安装基板的短路的情况下，也可以不屏蔽。
另一方面，在树脂模14内收容有压电振动元件3，并通过盖15密封了第2封装4。另外，通过导电性粘接剂17对在第2封装4的下面露出的外部端子16接合了压电振动元件3。
将该第2封装4重叠固定在第1封装2上，通过外部端子5a、16进行电连接，从而成为压电振荡器。之后，针对各封装的每一个(针对每个压电振荡器)进行裁断。另外，也可以在对第1封装进行了裁断之后，重叠固定第2封装。
在以上的实施例中，将布线图案6的外部端子6a作为用于安装到安装基板上的安装端子，使引线框架5的外部端子5a与第2封装4的外部端子16连接，但也可以与其相反地，以将引线框架5的外部端子5a作为用于安装到安装基板上的安装端子，使布线图案6的外部端子6a与第2封装4的外部端子16连接的方式变更引线结构。另外，也可以将布线图案6的端子6c用作安装端子。
另外，在实施例中，以在布线图案6的外部端子6a上部分性地重叠的方式，搭载了电路元件1，但在电路元件1较大的情况下，也可以如图5(a)所示以在外部端子6a上的全面重叠的方式搭载。在该情况下，通过通孔等来进行电路元件1与外部端子6a的电连接。另外，在电路元件1较大的情况下，也可以如图5(b)以及图5(c)所示，以在一部分的外部端子6a上部分性地重叠的方式配置。进而，也可以以在岛部6b上并非全面而部分性地重叠的方式配置。总之，在本发明中，以在外部端子6a上至少部分性地重叠、并且在岛部6b上也至少部分性地重叠的方式，搭载了电路元件1。
另外，在以上的实施例中，说明了压电振荡器，但本发明的封装结构不限于压电振荡器。

Claims (6)

1.一种半导体器件，具备：收容有第1元件的第1封装；以及重叠固定在该第1封装上并在内部收容有第2元件的第2封装，其特征在于，
第1封装包括引线框架以及布线图案，
引线框架的几个端部被作为面向第1封装的外面而露出的外部端子，
对于布线图案，在对第1封装进行树脂模制时使用在基体基材上配置了布线图案的转印引线框架，在树脂模制后剥下基体基材，从而使所述布线图案以被转印在模制树脂的剥下面的方式残留，所述布线图案的端部作为外部端子，面向模制树脂的剥下面侧而露出，
第1元件以在布线图案的外部端子上至少部分性地重叠的方式，隔着绝缘层被搭载，并且与引线框架以及布线图案电连接，
将在第1封装的上面或者下面中的某一个面露出的外部端子作为安装端子，在另一个面露出的外部端子与第2封装的外部端子电连接。
2.根据权利要求1所述的半导体器件，其特征在于，
转印引线框架的布线图案在其中央部分具有岛部，以在布线图案的外部端子上至少部分性地重叠、并且在所述岛部上至少部分性地重叠的方式，隔着绝缘层搭载了第1元件。
3.根据权利要求2所述的半导体器件，其特征在于，
在所述岛部中，设置了与第1元件和/或引线框架电连接的端子。
4.根据权利要求1～3中的任意一项所述的半导体器件，其特征在于，
第1元件是用于构成振荡电路的电路元件，第2元件是压电振动元件，被用作压电振荡器。
5.一种具备权利要求1～4中的任意一项所述的半导体器件的通信设备。
6.一种具备权利要求1～4中的任意一项所述的半导体器件的电子设备。
CN200980108588XA 2008-03-10 2009-03-10 半导体器件和具备该半导体器件的通信设备以及电子设备 Active CN101971486B (zh)

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CN109309455A (zh) * 2017-07-27 2019-02-05 通用汽车环球科技运作有限责任公司 功率模块
CN113328720A (zh) * 2020-02-28 2021-08-31 精工爱普生株式会社 振动器件

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US10787303B2 (en) 2016-05-29 2020-09-29 Cellulose Material Solutions, LLC Packaging insulation products and methods of making and using same
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CN109309455A (zh) * 2017-07-27 2019-02-05 通用汽车环球科技运作有限责任公司 功率模块
CN113328720A (zh) * 2020-02-28 2021-08-31 精工爱普生株式会社 振动器件

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WO2009113507A1 (ja) 2009-09-17
JP4551461B2 (ja) 2010-09-29
CN101971486B (zh) 2013-06-19
US20110133296A1 (en) 2011-06-09
US8384202B2 (en) 2013-02-26
NZ587889A (en) 2013-09-27

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