CN102282210A - 环氧树脂组合物 - Google Patents

环氧树脂组合物 Download PDF

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Publication number
CN102282210A
CN102282210A CN2010800047262A CN201080004726A CN102282210A CN 102282210 A CN102282210 A CN 102282210A CN 2010800047262 A CN2010800047262 A CN 2010800047262A CN 201080004726 A CN201080004726 A CN 201080004726A CN 102282210 A CN102282210 A CN 102282210A
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China
Prior art keywords
epoxy
epoxy resin
compound
resin composition
composition
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CN2010800047262A
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English (en)
Chinese (zh)
Inventor
藤田淳
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN102282210A publication Critical patent/CN102282210A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/02—Applications for biomedical use

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polyethers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN2010800047262A 2009-01-16 2010-01-13 环氧树脂组合物 Pending CN102282210A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009008198A JP2010163566A (ja) 2009-01-16 2009-01-16 エポキシ樹脂組成物
JP2009-008198 2009-01-16
PCT/US2010/020864 WO2010083192A2 (en) 2009-01-16 2010-01-13 Epoxy resin composition

Publications (1)

Publication Number Publication Date
CN102282210A true CN102282210A (zh) 2011-12-14

Family

ID=42340275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800047262A Pending CN102282210A (zh) 2009-01-16 2010-01-13 环氧树脂组合物

Country Status (7)

Country Link
US (1) US20110282010A1 (https=)
EP (1) EP2387596A2 (https=)
JP (1) JP2010163566A (https=)
KR (1) KR20110114645A (https=)
CN (1) CN102282210A (https=)
TW (1) TW201031706A (https=)
WO (1) WO2010083192A2 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869521A (zh) * 2012-12-11 2014-06-18 三星显示有限公司 液晶显示器
CN104487474A (zh) * 2012-07-26 2015-04-01 电气化学工业株式会社 树脂组合物
CN105934690A (zh) * 2014-03-31 2016-09-07 日东电工株式会社 光学部件用树脂组合物及使用该树脂组合物制造的光学部件
CN105934691A (zh) * 2014-03-31 2016-09-07 日东电工株式会社 光学部件用树脂组合物及使用该光学部件用树脂组合物制成的光学部件
CN109153900A (zh) * 2016-05-19 2019-01-04 锡克拜控股有限公司 用于组装惰性材料的组件的粘合剂
TWI791629B (zh) * 2017-09-29 2023-02-11 日商東京應化工業股份有限公司 硬化性組成物、硬化膜，及硬化物之製造方法
CN116685615A (zh) * 2021-12-30 2023-09-01 索路思高新材料有限公司 高折射高粘接性环氧树脂组合物和包含其的密封材料

Families Citing this family (27)

* Cited by examiner, † Cited by third party
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US8530578B2 (en) 2009-11-19 2013-09-10 3M Innovative Properties Company Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acrylic polymer
WO2011062852A1 (en) 2009-11-19 2011-05-26 3M Innovative Properties Company Pressure sensitive adhesive comprising functionalized polyisobutylene hydrogen bonded to acylic polymer
JP5479248B2 (ja) * 2010-07-06 2014-04-23 積水化学工業株式会社 光学デバイス用封止剤
CN103210035B (zh) 2010-11-16 2015-08-12 3M创新有限公司 可紫外线固化的酸酐改性聚(异丁烯)
US8663407B2 (en) 2010-11-17 2014-03-04 3M Innovative Properties Company Isobutylene (Co)polymeric adhesive composition
US8629209B2 (en) 2010-12-02 2014-01-14 3M Innovative Properties Company Moisture curable isobutylene adhesive copolymers
JP5354753B2 (ja) * 2011-01-13 2013-11-27 信越化学工業株式会社 アンダーフィル材及び半導体装置
JP2013021119A (ja) * 2011-07-11 2013-01-31 Shin Etsu Chem Co Ltd ウエハーレベルアンダーフィル剤組成物、これを用いた半導体装置及びその製造方法
JP5919574B2 (ja) * 2011-10-24 2016-05-18 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材
WO2013147989A1 (en) 2012-03-29 2013-10-03 3M Innovative Properties Company Adhesives comprising poly(isobutylene) copolymers comprising pendent free-radically polymerizable quaternary ammonium substituent
EP2847267A1 (en) 2012-05-11 2015-03-18 3M Innovative Properties Company Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines
JP5939388B2 (ja) * 2012-05-18 2016-06-22 株式会社スリーボンド 硬化性樹脂組成物およびプライマー組成物
US9587150B2 (en) 2012-08-14 2017-03-07 3M Innovative Properties Company Adhesives comprising grafted isobutylene copolymer
CN105246940B (zh) 2013-05-28 2018-09-04 株式会社大赛璐 光半导体密封用固化性组合物
JP6448083B2 (ja) * 2014-11-28 2019-01-09 協立化学産業株式会社 光硬化性樹脂組成物及び高屈折性樹脂硬化体
JP6080064B2 (ja) * 2016-03-03 2017-02-15 パナソニックＩｐマネジメント株式会社 Ｕｖ硬化性樹脂組成物、光学部品用接着剤および封止材
JP2018095679A (ja) * 2016-12-08 2018-06-21 三井化学株式会社 シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
JP7146282B2 (ja) * 2016-12-09 2022-10-04 エルジー・ケム・リミテッド 密封材組成物
JP6953709B2 (ja) * 2016-12-14 2021-10-27 味の素株式会社 樹脂組成物
JP7170246B2 (ja) * 2018-12-27 2022-11-14 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置
WO2020149384A1 (ja) 2019-01-17 2020-07-23 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び装置の製造方法
JP7554992B2 (ja) * 2019-06-10 2024-09-24 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置
DE102020203286A1 (de) 2020-03-13 2021-09-16 3D Global Holding Gmbh Lentikularlinsen-Baugruppe zum Anbringen an einer Anzeigefläche
JP7547882B2 (ja) * 2020-09-11 2024-09-10 味の素株式会社 樹脂組成物
KR20240087719A (ko) * 2021-10-19 2024-06-19 세키스이가가쿠 고교가부시키가이샤 봉지용 수지 조성물
KR20230102199A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재
JP7754950B2 (ja) * 2022-01-04 2025-10-15 三井化学株式会社 レンズ用樹脂組成物、レンズ用硬化物及びレンズ

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CN1239116A (zh) * 1998-04-28 1999-12-22 三井化学株式会社 环氧树脂组合物及其用途
JP2002363254A (ja) * 2001-06-06 2002-12-18 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP2003055437A (ja) * 2001-08-10 2003-02-26 Nippon Kayaku Co Ltd 光学材料用エポキシ樹脂組成物及びその硬化物
JP2006083314A (ja) * 2004-09-17 2006-03-30 Toyo Ink Mfg Co Ltd 硬化性高屈折率材料及び該硬化性高屈折率材料を用いてなる積層体
CN1926167A (zh) * 2004-03-04 2007-03-07 东亚合成株式会社 紫外线固化型组合物
CN101186802A (zh) * 2006-11-24 2008-05-28 第一毛织株式会社 多芯片封装用环氧树脂组合物以及利用该组合物的多芯片封装
CN101977984A (zh) * 2008-03-25 2011-02-16 住友电木株式会社 环氧树脂组合物、树脂片、半固化片、多层印刷布线板及半导体装置

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JPH06100643A (ja) * 1992-09-22 1994-04-12 Daiso Co Ltd 重合性組成物およびそれより得られる高屈折率プラスチックレンズ
US6800373B2 (en) * 2002-10-07 2004-10-05 General Electric Company Epoxy resin compositions, solid state devices encapsulated therewith and method
JPWO2006077862A1 (ja) * 2005-01-24 2008-06-19 出光興産株式会社 エポキシ樹脂組成物及びそれを用いた光学材料
US8889803B2 (en) * 2008-01-25 2014-11-18 Mitsui Chemicals, Inc. Polymerizable epoxy composition, and sealing material composition comprising the same
JP5102671B2 (ja) * 2008-03-25 2012-12-19 株式会社日本触媒 硬化性樹脂組成物、その硬化物、光学部材及び光学ユニット

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
CN1239116A (zh) * 1998-04-28 1999-12-22 三井化学株式会社 环氧树脂组合物及其用途
JP2002363254A (ja) * 2001-06-06 2002-12-18 Nippon Kayaku Co Ltd エポキシ化合物、エポキシ樹脂組成物及びその硬化物
JP2003055437A (ja) * 2001-08-10 2003-02-26 Nippon Kayaku Co Ltd 光学材料用エポキシ樹脂組成物及びその硬化物
CN1926167A (zh) * 2004-03-04 2007-03-07 东亚合成株式会社 紫外线固化型组合物
JP2006083314A (ja) * 2004-09-17 2006-03-30 Toyo Ink Mfg Co Ltd 硬化性高屈折率材料及び該硬化性高屈折率材料を用いてなる積層体
CN101186802A (zh) * 2006-11-24 2008-05-28 第一毛织株式会社 多芯片封装用环氧树脂组合物以及利用该组合物的多芯片封装
CN101977984A (zh) * 2008-03-25 2011-02-16 住友电木株式会社 环氧树脂组合物、树脂片、半固化片、多层印刷布线板及半导体装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104487474A (zh) * 2012-07-26 2015-04-01 电气化学工业株式会社 树脂组合物
US10273389B2 (en) 2012-07-26 2019-04-30 Denka Company Limited Resin composition
CN103869521A (zh) * 2012-12-11 2014-06-18 三星显示有限公司 液晶显示器
CN105934690A (zh) * 2014-03-31 2016-09-07 日东电工株式会社 光学部件用树脂组合物及使用该树脂组合物制造的光学部件
CN105934691A (zh) * 2014-03-31 2016-09-07 日东电工株式会社 光学部件用树脂组合物及使用该光学部件用树脂组合物制成的光学部件
CN109153900A (zh) * 2016-05-19 2019-01-04 锡克拜控股有限公司 用于组装惰性材料的组件的粘合剂
TWI791629B (zh) * 2017-09-29 2023-02-11 日商東京應化工業股份有限公司 硬化性組成物、硬化膜，及硬化物之製造方法
CN116685615A (zh) * 2021-12-30 2023-09-01 索路思高新材料有限公司 高折射高粘接性环氧树脂组合物和包含其的密封材料
CN116685615B (zh) * 2021-12-30 2026-03-27 索路思高新材料有限公司 高折射高粘接性环氧树脂组合物和包含其的密封材料

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Publication number Publication date
EP2387596A2 (en) 2011-11-23
TW201031706A (en) 2010-09-01
US20110282010A1 (en) 2011-11-17
JP2010163566A (ja) 2010-07-29
WO2010083192A2 (en) 2010-07-22
WO2010083192A3 (en) 2010-10-21
KR20110114645A (ko) 2011-10-19

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Application publication date: 20111214