CN102113065A - 绝缘片以及叠层结构体 - Google Patents

绝缘片以及叠层结构体 Download PDF

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Publication number
CN102113065A
CN102113065A CN2009801300918A CN200980130091A CN102113065A CN 102113065 A CN102113065 A CN 102113065A CN 2009801300918 A CN2009801300918 A CN 2009801300918A CN 200980130091 A CN200980130091 A CN 200980130091A CN 102113065 A CN102113065 A CN 102113065A
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CN
China
Prior art keywords
mentioned
insulating sheet
resin
insulating trip
described insulating
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Pending
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CN2009801300918A
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English (en)
Chinese (zh)
Inventor
前中宽
樋口勋夫
日下康成
青山卓司
渡边贵志
中岛大辅
高桥良辅
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of CN102113065A publication Critical patent/CN102113065A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
CN2009801300918A 2008-08-07 2009-08-04 绝缘片以及叠层结构体 Pending CN102113065A (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP204531/08 2008-08-07
JP2008204531 2008-08-07
JP2008313268 2008-12-09
JP313268/08 2008-12-09
JP2009001097 2009-01-06
JP001097/09 2009-01-06
JP046692/09 2009-02-27
JP2009046692 2009-02-27
PCT/JP2009/063794 WO2010016480A1 (ja) 2008-08-07 2009-08-04 絶縁シート及び積層構造体

Publications (1)

Publication Number Publication Date
CN102113065A true CN102113065A (zh) 2011-06-29

Family

ID=41663697

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801300918A Pending CN102113065A (zh) 2008-08-07 2009-08-04 绝缘片以及叠层结构体

Country Status (7)

Country Link
US (1) US20110135911A1 (https=)
EP (1) EP2312593A1 (https=)
JP (1) JP4469416B2 (https=)
KR (1) KR20110044860A (https=)
CN (1) CN102113065A (https=)
TW (1) TW201012641A (https=)
WO (1) WO2010016480A1 (https=)

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CN102993994A (zh) * 2011-09-13 2013-03-27 日东电工株式会社 热传导性片及其制造方法
CN104364901A (zh) * 2012-05-21 2015-02-18 东洋油墨Sc控股株式会社 易变形性凝集物及其制造方法、导热性树脂组合物、导热性构件及其制造方法、及导热性接合片
CN110828077A (zh) * 2019-10-25 2020-02-21 国网辽宁省电力有限公司铁岭供电公司 多用途折叠绝缘垫
CN110845736A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的环氧接枝改性的有机硅树脂、含有其的可能量固化组合物及应用
CN111225946A (zh) * 2017-09-27 2020-06-02 莫门蒂夫性能材料股份有限公司 包含离子改性硅氧烷的热界面组合物
CN109153801B (zh) * 2016-03-10 2021-04-27 电化株式会社 陶瓷树脂复合体
CN113141714A (zh) * 2021-04-20 2021-07-20 吉安诺惠诚莘科技有限公司 一种柔性电路板生产方法
CN113916929A (zh) * 2021-09-17 2022-01-11 东方电气集团东方电机有限公司 一种发电机定子线棒主绝缘固化程度的评价方法
CN114555703A (zh) * 2019-10-25 2022-05-27 松下知识产权经营株式会社 树脂组合物、树脂膜、具有树脂的金属箔、预浸料、覆金属层压体和印刷线路板

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WO2005103180A1 (ja) * 2004-04-20 2005-11-03 Hitachi Chemical Co., Ltd. 接着シート、半導体装置、及び半導体装置の製造方法
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
KR101265913B1 (ko) * 2010-06-08 2013-05-20 세키스이가가쿠 고교가부시키가이샤 광 반도체 장치용 다이본드재 및 이를 이용한 광 반도체 장치
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JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
JP2013123907A (ja) * 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP5967002B2 (ja) * 2013-04-08 2016-08-10 東洋インキＳｃホールディングス株式会社 易変形性凝集体、熱伝導性樹脂組成物、熱伝導性部材、および熱伝導性接着シート
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JPWO2014199843A1 (ja) * 2013-06-13 2017-02-23 東レ株式会社 樹脂組成物、樹脂シートおよび半導体装置の製造方法
CN103740321A (zh) * 2014-01-02 2014-04-23 王亚洲 一种耐高温有机硅树脂应变胶
JP6413249B2 (ja) 2014-02-03 2018-10-31 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
KR102457334B1 (ko) 2016-04-21 2022-10-20 최해용 고선명 2d/3d 겸용 프로젝터 시스템
KR20170003757U (ko) 2016-04-22 2017-11-01 최해용 고선명 2d/3d 겸용 프로젝터 시스템
WO2017191801A1 (ja) * 2016-05-06 2017-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤
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USD881822S1 (en) 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
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AT522851B1 (de) * 2018-04-27 2022-08-15 Panasonic Ip Man Co Ltd Harzzusammensetzung, Harzfilm, Metallfolie mit Harz, Prepreg, Metallkaschiertes Laminat und gedruckte Leiterplatte
EP3683831B1 (en) * 2019-01-15 2024-12-04 Infineon Technologies AG Interface material comprising a polymer ceramic
KR102465161B1 (ko) * 2019-11-06 2022-11-09 주식회사 아모그린텍 방열 시트, 이의 제조방법 및 이를 포함하는 전자기기
EP3872851B1 (en) * 2020-02-27 2025-04-30 Infineon Technologies Austria AG Protection cap for package with thermal interface material
JP7433653B2 (ja) * 2020-11-06 2024-02-20 北川工業株式会社 熱伝導部材
CN113136088B (zh) * 2021-04-09 2022-06-21 中北大学 一种基于四重氢键增韧聚苯并噁嗪制备高性能基体树脂的方法
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CN119842038A (zh) * 2025-02-07 2025-04-18 滁州银兴新材料科技有限公司 一种纳米二氧化硅改性聚氨酯保温材料的制备方法

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JP3646890B2 (ja) 1995-06-06 2005-05-11 日立化成工業株式会社 絶縁接着材料付き金属体及びその製造方法
JP3209132B2 (ja) * 1997-02-27 2001-09-17 日立化成工業株式会社 金属ベース基板
JP4884691B2 (ja) * 2005-04-13 2012-02-29 神島化学工業株式会社 合成ゴム組成物
JP2006342238A (ja) 2005-06-08 2006-12-21 Kyocera Chemical Corp 熱硬化性接着シート、銅張積層板及びフレキシブルプリント配線板
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JP5122116B2 (ja) * 2006-11-29 2013-01-16 ポリプラスチックス株式会社 熱伝導性樹脂組成物
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102993994A (zh) * 2011-09-13 2013-03-27 日东电工株式会社 热传导性片及其制造方法
CN104364901A (zh) * 2012-05-21 2015-02-18 东洋油墨Sc控股株式会社 易变形性凝集物及其制造方法、导热性树脂组合物、导热性构件及其制造方法、及导热性接合片
CN104364901B (zh) * 2012-05-21 2017-05-17 东洋油墨Sc控股株式会社 易变形性凝集物及其制造方法、导热性树脂组合物、导热性构件及其制造方法、及导热性接合片
CN109153801B (zh) * 2016-03-10 2021-04-27 电化株式会社 陶瓷树脂复合体
CN111225946A (zh) * 2017-09-27 2020-06-02 莫门蒂夫性能材料股份有限公司 包含离子改性硅氧烷的热界面组合物
CN110845736A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的环氧接枝改性的有机硅树脂、含有其的可能量固化组合物及应用
CN110828077A (zh) * 2019-10-25 2020-02-21 国网辽宁省电力有限公司铁岭供电公司 多用途折叠绝缘垫
CN114555703A (zh) * 2019-10-25 2022-05-27 松下知识产权经营株式会社 树脂组合物、树脂膜、具有树脂的金属箔、预浸料、覆金属层压体和印刷线路板
CN114555703B (zh) * 2019-10-25 2024-12-10 松下知识产权经营株式会社 树脂组合物、树脂膜、具有树脂的金属箔、预浸料、覆金属层压体和印刷线路板
CN113141714A (zh) * 2021-04-20 2021-07-20 吉安诺惠诚莘科技有限公司 一种柔性电路板生产方法
CN113916929A (zh) * 2021-09-17 2022-01-11 东方电气集团东方电机有限公司 一种发电机定子线棒主绝缘固化程度的评价方法
CN113916929B (zh) * 2021-09-17 2023-04-07 东方电气集团东方电机有限公司 一种发电机定子线棒主绝缘固化程度的评价方法

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