TW201012641A - Insulating sheet and multilayer structure - Google Patents

Insulating sheet and multilayer structure Download PDF

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Publication number
TW201012641A
TW201012641A TW098126681A TW98126681A TW201012641A TW 201012641 A TW201012641 A TW 201012641A TW 098126681 A TW098126681 A TW 098126681A TW 98126681 A TW98126681 A TW 98126681A TW 201012641 A TW201012641 A TW 201012641A
Authority
TW
Taiwan
Prior art keywords
insulating sheet
resin
skeleton
polymer
substance
Prior art date
Application number
TW098126681A
Other languages
English (en)
Chinese (zh)
Other versions
TWI335267B (https=
Inventor
Hiroshi Maenaka
Isao Higuchi
Yasunari Kusaka
Takuji Aoyama
Takashi Watanabe
Daisuke Nakajima
Ryousuke Takahashi
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW201012641A publication Critical patent/TW201012641A/zh
Application granted granted Critical
Publication of TWI335267B publication Critical patent/TWI335267B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
TW098126681A 2008-08-07 2009-08-06 Insulating sheet and multilayer structure TW201012641A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008204531 2008-08-07
JP2008313268 2008-12-09
JP2009001097 2009-01-06
JP2009046692 2009-02-27

Publications (2)

Publication Number Publication Date
TW201012641A true TW201012641A (en) 2010-04-01
TWI335267B TWI335267B (https=) 2011-01-01

Family

ID=41663697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098126681A TW201012641A (en) 2008-08-07 2009-08-06 Insulating sheet and multilayer structure

Country Status (7)

Country Link
US (1) US20110135911A1 (https=)
EP (1) EP2312593A1 (https=)
JP (1) JP4469416B2 (https=)
KR (1) KR20110044860A (https=)
CN (1) CN102113065A (https=)
TW (1) TW201012641A (https=)
WO (1) WO2010016480A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398503B (zh) * 2010-06-08 2013-06-11 積水化學工業股份有限公司 A polystyrene material for optical semiconductor devices and an optical semiconductor device using the same
TWI503056B (zh) * 2011-02-21 2015-10-01 Panasonic Ip Man Co Ltd Metal sheet and printed wiring board
TWI575692B (zh) * 2011-03-31 2017-03-21 三菱化學股份有限公司 Three - dimensional volume of the product body

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WO2005103180A1 (ja) * 2004-04-20 2005-11-03 Hitachi Chemical Co., Ltd. 接着シート、半導体装置、及び半導体装置の製造方法
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
JP2012086490A (ja) * 2010-10-21 2012-05-10 Nitto Denko Corp シート
WO2012073360A1 (ja) * 2010-12-02 2012-06-07 積水化学工業株式会社 絶縁シート及び積層構造体
JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP2013123907A (ja) * 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP5967002B2 (ja) * 2013-04-08 2016-08-10 東洋インキＳｃホールディングス株式会社 易変形性凝集体、熱伝導性樹脂組成物、熱伝導性部材、および熱伝導性接着シート
KR102047418B1 (ko) * 2012-05-21 2019-11-22 토요잉크Sc홀딩스주식회사 이 변형성 응집체와 그 제조 방법, 열 전도성 수지 조성물, 열 전도성 부재와 그 제조 방법 및 열 전도성 접착 시트
US9297916B2 (en) * 2012-07-19 2016-03-29 Geospace Technologies, Lp Micro-geophone
US9470808B2 (en) * 2012-07-19 2016-10-18 Geospace Technologies, Lp Micro-geophone
JP5821159B2 (ja) * 2013-03-28 2015-11-24 エルジー・ケム・リミテッド 樹脂組成物及びこれを含む逆波長分散性を有する光学フィルム
JPWO2014199843A1 (ja) * 2013-06-13 2017-02-23 東レ株式会社 樹脂組成物、樹脂シートおよび半導体装置の製造方法
CN103740321A (zh) * 2014-01-02 2014-04-23 王亚洲 一种耐高温有机硅树脂应变胶
JP6413249B2 (ja) 2014-02-03 2018-10-31 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
US10487013B2 (en) * 2016-03-10 2019-11-26 Denka Company Limited Ceramic resin composite body
KR102457334B1 (ko) 2016-04-21 2022-10-20 최해용 고선명 2d/3d 겸용 프로젝터 시스템
KR20170003757U (ko) 2016-04-22 2017-11-01 최해용 고선명 2d/3d 겸용 프로젝터 시스템
WO2017191801A1 (ja) * 2016-05-06 2017-11-09 Dic株式会社 樹脂組成物、成形体、積層体及び接着剤
US11014203B2 (en) * 2016-07-11 2021-05-25 Laird Technologies, Inc. System for applying interface materials
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US10344194B2 (en) * 2017-09-27 2019-07-09 Momentive Performance Materials Inc. Thermal interface composition comprising ionically modified siloxane
USD881822S1 (en) 2017-10-06 2020-04-21 Laird Technologies, Inc. Material having an edge shape
USD999405S1 (en) 2017-10-06 2023-09-19 Laird Technologies, Inc. Material having edging
AT522851B1 (de) * 2018-04-27 2022-08-15 Panasonic Ip Man Co Ltd Harzzusammensetzung, Harzfilm, Metallfolie mit Harz, Prepreg, Metallkaschiertes Laminat und gedruckte Leiterplatte
CN110845736A (zh) * 2018-08-21 2020-02-28 常州强力电子新材料股份有限公司 可能量固化的环氧接枝改性的有机硅树脂、含有其的可能量固化组合物及应用
EP3683831B1 (en) * 2019-01-15 2024-12-04 Infineon Technologies AG Interface material comprising a polymer ceramic
CN110828077B (zh) * 2019-10-25 2021-11-19 国网辽宁省电力有限公司铁岭供电公司 多用途折叠绝缘垫
JP7603262B2 (ja) * 2019-10-25 2024-12-20 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板
KR102465161B1 (ko) * 2019-11-06 2022-11-09 주식회사 아모그린텍 방열 시트, 이의 제조방법 및 이를 포함하는 전자기기
EP3872851B1 (en) * 2020-02-27 2025-04-30 Infineon Technologies Austria AG Protection cap for package with thermal interface material
JP7433653B2 (ja) * 2020-11-06 2024-02-20 北川工業株式会社 熱伝導部材
CN113136088B (zh) * 2021-04-09 2022-06-21 中北大学 一种基于四重氢键增韧聚苯并噁嗪制备高性能基体树脂的方法
CN113141714B (zh) * 2021-04-20 2022-03-22 吉安诺惠诚莘科技有限公司 一种柔性电路板生产方法
CN113916929B (zh) * 2021-09-17 2023-04-07 东方电气集团东方电机有限公司 一种发电机定子线棒主绝缘固化程度的评价方法
CN119306916B (zh) * 2024-12-17 2025-03-14 河北铁科翼辰新材科技有限公司 可过滤低频振动的减振隔振聚氨酯弹性垫板及其制备方法
CN119842038A (zh) * 2025-02-07 2025-04-18 滁州银兴新材料科技有限公司 一种纳米二氧化硅改性聚氨酯保温材料的制备方法

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JP3646890B2 (ja) 1995-06-06 2005-05-11 日立化成工業株式会社 絶縁接着材料付き金属体及びその製造方法
JP3209132B2 (ja) * 1997-02-27 2001-09-17 日立化成工業株式会社 金属ベース基板
JP4884691B2 (ja) * 2005-04-13 2012-02-29 神島化学工業株式会社 合成ゴム組成物
JP2006342238A (ja) 2005-06-08 2006-12-21 Kyocera Chemical Corp 熱硬化性接着シート、銅張積層板及びフレキシブルプリント配線板
JP2007116134A (ja) * 2005-09-22 2007-05-10 Toray Ind Inc 半導体用テープ、半導体用接着剤付きテープ、半導体集積回路接続用基板および半導体装置
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398503B (zh) * 2010-06-08 2013-06-11 積水化學工業股份有限公司 A polystyrene material for optical semiconductor devices and an optical semiconductor device using the same
TWI503056B (zh) * 2011-02-21 2015-10-01 Panasonic Ip Man Co Ltd Metal sheet and printed wiring board
US9480148B2 (en) 2011-02-21 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
TWI575692B (zh) * 2011-03-31 2017-03-21 三菱化學股份有限公司 Three - dimensional volume of the product body

Also Published As

Publication number Publication date
US20110135911A1 (en) 2011-06-09
CN102113065A (zh) 2011-06-29
JPWO2010016480A1 (ja) 2012-01-26
TWI335267B (https=) 2011-01-01
KR20110044860A (ko) 2011-05-02
EP2312593A1 (en) 2011-04-20
JP4469416B2 (ja) 2010-05-26
WO2010016480A1 (ja) 2010-02-11

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