KR20110044860A - 절연 시트 및 적층 구조체 - Google Patents

절연 시트 및 적층 구조체 Download PDF

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Publication number
KR20110044860A
KR20110044860A KR1020117002695A KR20117002695A KR20110044860A KR 20110044860 A KR20110044860 A KR 20110044860A KR 1020117002695 A KR1020117002695 A KR 1020117002695A KR 20117002695 A KR20117002695 A KR 20117002695A KR 20110044860 A KR20110044860 A KR 20110044860A
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KR
South Korea
Prior art keywords
insulating sheet
resin
polymer
skeleton
substance
Prior art date
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Withdrawn
Application number
KR1020117002695A
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English (en)
Korean (ko)
Inventor
히로시 마에나까
이사오 히구찌
야스나리 구사까
다꾸지 아오야마
다까시 와따나베
다이스께 나까지마
료우스께 다까하시
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20110044860A publication Critical patent/KR20110044860A/ko
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472Sheet interfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/42Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00Insulators or insulating bodies characterised by their form
    • H01B17/56Insulating bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/251Organics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10Inorganic particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/306Resistant to heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/714Inert, i.e. inert to chemical degradation, corrosion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254Polymeric or resinous material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/25Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258Alkali metal or alkaline earth metal or compound thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Insulating Bodies (AREA)
KR1020117002695A 2008-08-07 2009-08-04 절연 시트 및 적층 구조체 Withdrawn KR20110044860A (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2008204531 2008-08-07
JPJP-P-2008-204531 2008-08-07
JP2008313268 2008-12-09
JPJP-P-2008-313268 2008-12-09
JP2009001097 2009-01-06
JPJP-P-2009-001097 2009-01-06
JPJP-P-2009-046692 2009-02-27
JP2009046692 2009-02-27
PCT/JP2009/063794 WO2010016480A1 (ja) 2008-08-07 2009-08-04 絶縁シート及び積層構造体

Publications (1)

Publication Number Publication Date
KR20110044860A true KR20110044860A (ko) 2011-05-02

Family

ID=41663697

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117002695A Withdrawn KR20110044860A (ko) 2008-08-07 2009-08-04 절연 시트 및 적층 구조체

Country Status (7)

Country Link
US (1) US20110135911A1 (https=)
EP (1) EP2312593A1 (https=)
JP (1) JP4469416B2 (https=)
KR (1) KR20110044860A (https=)
CN (1) CN102113065A (https=)
TW (1) TW201012641A (https=)
WO (1) WO2010016480A1 (https=)

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* Cited by examiner, † Cited by third party
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KR20170120351A (ko) 2016-04-21 2017-10-31 최해용 고선명 2d/3d 겸용 프로젝터 시스템
KR20170003757U (ko) 2016-04-22 2017-11-01 최해용 고선명 2d/3d 겸용 프로젝터 시스템

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WO2005103180A1 (ja) * 2004-04-20 2005-11-03 Hitachi Chemical Co., Ltd. 接着シート、半導体装置、及び半導体装置の製造方法
JP4495768B2 (ja) * 2008-08-18 2010-07-07 積水化学工業株式会社 絶縁シート及び積層構造体
KR101265913B1 (ko) * 2010-06-08 2013-05-20 세키스이가가쿠 고교가부시키가이샤 광 반도체 장치용 다이본드재 및 이를 이용한 광 반도체 장치
JP2012086490A (ja) * 2010-10-21 2012-05-10 Nitto Denko Corp シート
WO2012073360A1 (ja) * 2010-12-02 2012-06-07 積水化学工業株式会社 絶縁シート及び積層構造体
US9480148B2 (en) 2011-02-21 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
KR20140007429A (ko) * 2011-03-31 2014-01-17 미쓰비시 가가꾸 가부시키가이샤 삼차원 집적 회로 적층체, 및 삼차원 집적 회로 적층체용 층간 충전재
JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP2013123907A (ja) * 2011-12-16 2013-06-24 Panasonic Corp 金属張積層板、及びプリント配線板
JP5967002B2 (ja) * 2013-04-08 2016-08-10 東洋インキScホールディングス株式会社 易変形性凝集体、熱伝導性樹脂組成物、熱伝導性部材、および熱伝導性接着シート
KR102047418B1 (ko) * 2012-05-21 2019-11-22 토요잉크Sc홀딩스주식회사 이 변형성 응집체와 그 제조 방법, 열 전도성 수지 조성물, 열 전도성 부재와 그 제조 방법 및 열 전도성 접착 시트
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JP5821159B2 (ja) * 2013-03-28 2015-11-24 エルジー・ケム・リミテッド 樹脂組成物及びこれを含む逆波長分散性を有する光学フィルム
JPWO2014199843A1 (ja) * 2013-06-13 2017-02-23 東レ株式会社 樹脂組成物、樹脂シートおよび半導体装置の製造方法
CN103740321A (zh) * 2014-01-02 2014-04-23 王亚洲 一种耐高温有机硅树脂应变胶
JP6413249B2 (ja) 2014-02-03 2018-10-31 住友ベークライト株式会社 熱伝導性シートおよび半導体装置
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JP7603262B2 (ja) * 2019-10-25 2024-12-20 パナソニックIpマネジメント株式会社 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、金属張積層板及びプリント配線板
KR102465161B1 (ko) * 2019-11-06 2022-11-09 주식회사 아모그린텍 방열 시트, 이의 제조방법 및 이를 포함하는 전자기기
EP3872851B1 (en) * 2020-02-27 2025-04-30 Infineon Technologies Austria AG Protection cap for package with thermal interface material
JP7433653B2 (ja) * 2020-11-06 2024-02-20 北川工業株式会社 熱伝導部材
CN113136088B (zh) * 2021-04-09 2022-06-21 中北大学 一种基于四重氢键增韧聚苯并噁嗪制备高性能基体树脂的方法
CN113141714B (zh) * 2021-04-20 2022-03-22 吉安诺惠诚莘科技有限公司 一种柔性电路板生产方法
CN113916929B (zh) * 2021-09-17 2023-04-07 东方电气集团东方电机有限公司 一种发电机定子线棒主绝缘固化程度的评价方法
CN119306916B (zh) * 2024-12-17 2025-03-14 河北铁科翼辰新材科技有限公司 可过滤低频振动的减振隔振聚氨酯弹性垫板及其制备方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170120351A (ko) 2016-04-21 2017-10-31 최해용 고선명 2d/3d 겸용 프로젝터 시스템
KR20170003757U (ko) 2016-04-22 2017-11-01 최해용 고선명 2d/3d 겸용 프로젝터 시스템

Also Published As

Publication number Publication date
US20110135911A1 (en) 2011-06-09
CN102113065A (zh) 2011-06-29
JPWO2010016480A1 (ja) 2012-01-26
TWI335267B (https=) 2011-01-01
EP2312593A1 (en) 2011-04-20
TW201012641A (en) 2010-04-01
JP4469416B2 (ja) 2010-05-26
WO2010016480A1 (ja) 2010-02-11

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