KR101131369B1 - 절연 시트 및 적층 구조체 - Google Patents
절연 시트 및 적층 구조체 Download PDFInfo
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- ZHQNDEHZACHHTA-UHFFFAOYSA-N CC1(C)c(cccc2)c2-c2c1cccc2 Chemical compound CC1(C)c(cccc2)c2-c2c1cccc2 ZHQNDEHZACHHTA-UHFFFAOYSA-N 0.000 description 1
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
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- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
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- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
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Abstract
열전도율 10 W/mㆍK 이상의 열전도체를 도전층에 접착시키는 데 이용되고, 중량 평균 분자량 10,000 이상의 중합체(A)와, 방향족 골격을 가지며 중량 평균 분자량 600 이하의 에폭시 단량체(B1) 및 옥세탄 단량체(B2) 중의 적어도 하나의 단량체와, 경화제(C)와, 제1 무기 충전재(D) 20 내지 60 부피%와, 유기 충전재(E1) 및 제1 무기 충전재(D)와는 다르며 신 모스 경도가 3 이하인 제2 무기 충전재(E2) 중의 적어도 하나의 충전재(E) 1 내지 40 부피%를 포함하고, 유기 충전재(E1)을 포함하는 경우에는, 유기 충전재(E1)의 함유량이 3 내지 40 부피%인 절연 시트.
Description
<부호의 설명>
1… 적층 구조체
2… 열전도체
2a… 한쪽면
2b… 다른쪽의 면
3… 절연층
4… 도전층
Claims (18)
- 열전도율이 10 W/mㆍK 이상인 열전도체를 도전층에 접착시키는 데 이용되는 절연 시트로서,
중량 평균 분자량이 10,000 이상인 중합체(A)와,
방향족 골격을 가지며 중량 평균 분자량이 600 이하인 에폭시 단량체(B1) 및 방향족 골격을 가지며 중량 평균 분자량이 600 이하인 옥세탄 단량체(B2) 중의 적어도 하나의 단량체(B)와,
경화제(C)와,
제1 무기 충전재(D)와,
유기 충전재(E1) 및 상기 제1 무기 충전재(D)와는 다르며 신(新) 모스 경도가 3 이하인 제2 무기 충전재(E2) 중의 적어도 하나의 충전재(E)를 포함하고,
상기 제1 무기 충전재(D)의 함유량이 20 내지 60 부피%이고,
상기 충전재(E)의 함유량이 1 내지 40 부피%이며, 상기 충전재(E)가 상기 유기 충전재(E1)을 포함하는 경우에는, 상기 유기 충전재(E1)의 함유량이 3 내지 40 부피%인 절연 시트. - 제1항에 있어서, 상기 충전재(E)가 상기 유기 충전재(E1)이고, 상기 유기 충전재(E1)의 함유량이 3 내지 40 부피%인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 제1 무기 충전재(D)의 열전도율이 10 W/mㆍK이고, 신 모스 경도가 3.1 이상인 절연 시트.
- 제1항에 있어서, 상기 충전재(E)가 상기 제2 무기 충전재(E2)이고, 상기 제2 무기 충전재(E2)의 함유량이 1 내지 40 부피%인 절연 시트.
- 제4항에 있어서, 상기 제1 무기 충전재(D) 및 상기 제2 무기 충전재(E2)가 하기 수학식 X를 만족시키는 절연 시트.
<수학식 X>
[{(제1 무기 충전재(D)의 신 모스 경도)×(절연 시트 100 부피% 중의 제1 무기 충전재(D)의 함유량(부피%))}+{(제2 무기 충전재(E2)의 신 모스 경도)×(절연 시트 100 부피% 중의 제2 무기 충전재(E2)의 함유량(부피%))}] < 6 - 제1항에 있어서, 상기 제2 무기 충전재(E2)가 규조토, 질화붕소, 수산화알루미늄, 수산화마그네슘, 탄산칼슘, 탈크, 카올린, 점토 및 운모로 이루어지는 군으로부터 선택된 적어도 1종인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 유기 충전재(E1)이 코어쉘 구조를 갖는 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 유기 충전재(E1)이 규소 원자에 산소 원자가 직접 결합된 골격을 갖는 화합물과 유기물을 포함하는 복합 충전재인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 제1 무기 충전재(D)가 알루미나, 합성 마그네사이트, 결정성 실리카, 질화알루미늄, 질화규소, 탄화규소, 산화아연 및 산화마그네슘으로 이루어지는 군으로부터 선택된 적어도 1종인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 중합체(A)가 방향족 골격을 가지며 중량 평균 분자량이 30,000 이상인 중합체인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 중합체(A)가 페녹시 수지인 절연 시트.
- 제11항에 있어서, 상기 페녹시 수지의 유리 전이 온도 Tg가 95 ℃ 이상인 절연 시트.
- 제1항 또는 제2항에 있어서, 상기 경화제(C)가 페놀 수지, 또는 방향족 골격 또는 지환식 골격을 갖는 산무수물, 상기 산무수물의 수소 첨가물 또는 상기 산무수물의 변성물인 절연 시트.
- 제13항에 있어서, 상기 경화제(C)가 다지환식 골격을 갖는 산무수물, 상기 산무수물의 수소 첨가물 또는 상기 산무수물의 변성물, 또는 테르펜계 화합물과 무수 말레산과의 부가 반응에 의해 얻어진 지환식 골격을 갖는 산무수물, 상기 산무수물의 수소 첨가물 또는 상기 산무수물의 변성물인 절연 시트.
- 제13항에 있어서, 상기 경화제(C)가 멜라민 골격 또는 트리아진 골격을 갖는 페놀 수지, 또는 알릴기를 갖는 페놀 수지인 절연 시트.
- 열전도율이 10 W/mㆍK 이상인 열전도체와,
상기 열전도체의 적어도 한쪽면에 적층된 절연층과,
상기 절연층의 상기 열전도체가 적층된 면과는 반대측의 면에 적층된 도전층을 구비하고,
상기 절연층이 제1항 또는 제2항에 기재된 절연 시트를 경화시킴으로써 형성되는 적층 구조체. - 제17항에 있어서, 상기 열전도체가 금속인 적층 구조체.
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Application Number | Priority Date | Filing Date | Title |
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JP2008209914A JP4495768B2 (ja) | 2008-08-18 | 2008-08-18 | 絶縁シート及び積層構造体 |
JPJP-P-2008-209914 | 2008-08-18 | ||
PCT/JP2009/054069 WO2010021167A1 (ja) | 2008-08-18 | 2009-03-04 | 絶縁シート及び積層構造体 |
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KR20100043260A KR20100043260A (ko) | 2010-04-28 |
KR101131369B1 true KR101131369B1 (ko) | 2012-06-13 |
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US (1) | US20110159296A1 (ko) |
EP (1) | EP2316897A4 (ko) |
JP (1) | JP4495768B2 (ko) |
KR (1) | KR101131369B1 (ko) |
CN (1) | CN102124066A (ko) |
TW (1) | TWI415142B (ko) |
WO (1) | WO2010021167A1 (ko) |
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JP4495771B1 (ja) * | 2009-02-27 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
JP4495772B1 (ja) * | 2009-03-02 | 2010-07-07 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
JP5375638B2 (ja) * | 2010-02-05 | 2013-12-25 | 三菱化学株式会社 | 三次元集積回路用の層間充填材組成物、塗布液、三次元集積回路の製造方法 |
JP2011184668A (ja) * | 2010-03-11 | 2011-09-22 | Sekisui Chem Co Ltd | 熱伝導性熱可塑性接着剤組成物 |
JP5411774B2 (ja) * | 2010-03-30 | 2014-02-12 | ナミックス株式会社 | 先供給型液状半導体封止樹脂組成物 |
GB201007793D0 (en) * | 2010-05-10 | 2010-06-23 | Zephyros Inc | Improvements in or relating to structural adhesives |
JP2011241245A (ja) * | 2010-05-14 | 2011-12-01 | Mitsubishi Chemicals Corp | エポキシ樹脂組成物および硬化物 |
JP5670136B2 (ja) * | 2010-09-24 | 2015-02-18 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
CN102464954B (zh) * | 2010-11-19 | 2013-12-25 | 富葵精密组件(深圳)有限公司 | 复合胶粘片、包括该复合胶粘片的胶片及胶片的制作方法 |
JP2012119918A (ja) * | 2010-11-30 | 2012-06-21 | Murata Mfg Co Ltd | 電子部品 |
JP5871428B2 (ja) * | 2011-03-16 | 2016-03-01 | 古河電気工業株式会社 | 高熱伝導性フィルム状接着剤用組成物、高熱伝導性フィルム状接着剤、並びに、それを用いた半導体パッケージとその製造方法 |
KR101374372B1 (ko) * | 2011-05-12 | 2014-03-17 | 한국생산기술연구원 | 복합시트 및 이를 이용한 디스플레이 기판 |
JP2012253167A (ja) * | 2011-06-02 | 2012-12-20 | Denki Kagaku Kogyo Kk | 熱伝導性絶縁シート、金属ベース基板及び回路基板 |
CN102337097B (zh) * | 2011-07-01 | 2015-05-27 | 哈尔滨理工大学 | 粉体填充型高导热云母带用粘合剂的制备方法 |
WO2013100174A1 (ja) * | 2011-12-27 | 2013-07-04 | パナソニック株式会社 | 熱伝導性樹脂組成物 |
US9313897B2 (en) | 2012-09-14 | 2016-04-12 | Infineon Technologies Ag | Method for electrophoretically depositing a film on an electronic assembly |
WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
US10178767B2 (en) | 2012-11-28 | 2019-01-08 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board |
US9303327B2 (en) * | 2013-01-10 | 2016-04-05 | Infineon Technologies Ag | Electric component with an electrophoretically deposited film |
JP6136330B2 (ja) * | 2013-02-13 | 2017-05-31 | 味の素株式会社 | 薄型フィルム用樹脂組成物、薄型フィルム、積層シート及び多層プリント配線板 |
WO2014157132A1 (ja) * | 2013-03-28 | 2014-10-02 | 新日鉄住金化学株式会社 | フェノキシ樹脂組成物及びその硬化物 |
CN103275629A (zh) * | 2013-06-18 | 2013-09-04 | 上海第二工业大学 | 一种高导热胶膜及其制备方法 |
KR20150024154A (ko) * | 2013-08-26 | 2015-03-06 | 삼성전기주식회사 | 인쇄회로기판용 절연필름 및 이를 이용한 제품 |
CN103626960B (zh) * | 2013-11-21 | 2016-04-20 | 中国林业科学研究院林产化学工业研究所 | 萜烯基胺类环氧树脂固化剂及其制备方法和应用 |
CN103740312B (zh) * | 2013-12-03 | 2015-02-04 | 赛伦(厦门)新材料科技有限公司 | 一种可热返修的导热薄膜粘结剂 |
US20150155070A1 (en) * | 2013-12-04 | 2015-06-04 | General Electric Company | Insulation for electrical components |
JP6264022B2 (ja) * | 2013-12-20 | 2018-01-24 | Dic株式会社 | 熱伝導性粘着シート、物品及び画像表示装置 |
JP6653795B2 (ja) * | 2014-08-27 | 2020-02-26 | Jnc株式会社 | 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法 |
DE102014221715A1 (de) * | 2014-10-24 | 2016-04-28 | Siemens Aktiengesellschaft | Tränkharz, Leiteranordnung, elektrische Spule und elektrische Maschine |
EP3273496A4 (en) * | 2015-03-16 | 2018-10-31 | Sekisui Chemical Co., Ltd. | Solar cell |
CN109874344B (zh) * | 2015-04-15 | 2023-03-28 | 株式会社钟化 | 离子束用的电荷转换膜 |
GB2548266B (en) | 2015-11-04 | 2018-06-27 | Payton Planar Magnetics Ltd | Planar transformer components comprising electrophoretically deposited coating |
WO2017145624A1 (ja) * | 2016-02-26 | 2017-08-31 | 日立化成株式会社 | 接着フィルム及びダイシング・ダイボンディングフィルム |
JP6693199B2 (ja) * | 2016-03-18 | 2020-05-13 | 東洋インキScホールディングス株式会社 | 熱伝導性部材及びデバイス |
CN109155244A (zh) * | 2016-06-10 | 2019-01-04 | 日立化成株式会社 | 粘接膜及切割芯片接合一体型膜 |
DE102016220092A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Halbzeug zur Kontaktierung von Bauteilen |
JP7248217B2 (ja) * | 2017-12-04 | 2023-03-29 | 積水ポリマテック株式会社 | 熱伝導性組成物 |
JP7119528B2 (ja) * | 2018-04-18 | 2022-08-17 | 富士電機株式会社 | 半導体装置 |
FR3084202B1 (fr) * | 2018-07-20 | 2020-10-23 | Inst Supergrid | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
JP7182396B2 (ja) * | 2018-08-10 | 2022-12-02 | ポリプラスチックス株式会社 | 難燃性ポリブチレンテレフタレート樹脂組成物 |
EP3873986A4 (en) * | 2018-10-29 | 2022-06-22 | Henkel AG & Co. KGaA | THERMOCONDUCTIVE COATING COMPOSITION |
CN113272355A (zh) * | 2018-12-26 | 2021-08-17 | 住友电木株式会社 | 树脂组合物和金属基覆铜层叠板 |
CN109735241B (zh) * | 2019-01-08 | 2021-11-02 | 京东方科技集团股份有限公司 | 一种异方性导电结构及其制作方法、显示装置 |
CN111675880A (zh) * | 2019-11-28 | 2020-09-18 | 哈尔滨理工大学 | 一种新型软性绝缘导热垫 |
JP7473761B2 (ja) * | 2020-06-08 | 2024-04-24 | artience株式会社 | 成形フィルムおよびその製造方法、成形体およびその製造方法 |
JP2022037550A (ja) * | 2020-08-25 | 2022-03-09 | 日東シンコー株式会社 | 接着シート、半導体モジュール及び接着シートの製造方法 |
JP7433653B2 (ja) * | 2020-11-06 | 2024-02-20 | 北川工業株式会社 | 熱伝導部材 |
CN116406090B (zh) * | 2023-05-15 | 2024-02-02 | 台山市科伟电子科技有限公司 | 一种铝基覆铜铝箔板的生产工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006103237A (ja) * | 2004-10-07 | 2006-04-20 | Mitsubishi Plastics Ind Ltd | 金属積層体 |
JP4661594B2 (ja) * | 2003-08-13 | 2011-03-30 | 日本ゼオン株式会社 | 重合性組成物、及びそれを用いてなる成形体 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59108072A (ja) * | 1982-12-11 | 1984-06-22 | Nitto Electric Ind Co Ltd | 常温粘着性を有する熱硬化性接着シ−ト |
DE69120006T2 (de) * | 1990-09-11 | 1997-01-30 | Hitachi Chemical Co Ltd | Epoxyharz-Film und Verfahren zu seiner Herstellung |
DE69606396T2 (de) * | 1995-04-04 | 2000-07-27 | Hitachi Chemical Co., Ltd. | Klebstoff, klebstofffilm und metallfolie, die auf ihrer rückseite mit klebstoff vorsehen ist |
JP3646890B2 (ja) | 1995-06-06 | 2005-05-11 | 日立化成工業株式会社 | 絶縁接着材料付き金属体及びその製造方法 |
JP3559137B2 (ja) * | 1997-02-27 | 2004-08-25 | 日立化成工業株式会社 | 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム |
EP1369452B1 (en) * | 1998-12-09 | 2010-05-26 | Kureha Corporation | Synthetic resin composition |
JP4642173B2 (ja) * | 1999-08-05 | 2011-03-02 | 新日鐵化学株式会社 | フィルム状接着剤用組成物 |
JP2004231808A (ja) * | 2003-01-30 | 2004-08-19 | Nagase Chemtex Corp | エポキシ樹脂組成物 |
JP2004292645A (ja) * | 2003-03-27 | 2004-10-21 | Sumitomo Bakelite Co Ltd | エポキシ樹脂粉体塗料 |
JP2006104300A (ja) * | 2004-10-04 | 2006-04-20 | Kyocera Chemical Corp | 樹脂組成物及びそれを用いたアルミニウムコア接着シート |
JP2006342238A (ja) | 2005-06-08 | 2006-12-21 | Kyocera Chemical Corp | 熱硬化性接着シート、銅張積層板及びフレキシブルプリント配線板 |
JP4379387B2 (ja) * | 2005-06-27 | 2009-12-09 | パナソニック電工株式会社 | エポキシ樹脂無機複合シート及び成形品 |
JPWO2007129662A1 (ja) * | 2006-05-08 | 2009-09-17 | 積水化学工業株式会社 | 絶縁材料、電子部品装置の製造方法及び電子部品装置 |
US20080063871A1 (en) * | 2006-09-11 | 2008-03-13 | Jung Ki S | Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package |
US20100148136A1 (en) * | 2007-06-28 | 2010-06-17 | Akihito Kawagoshi | Light Diffusing Thermoplastic Resin Composition and Light Diffusion Sheet Thereof |
WO2009031536A1 (ja) * | 2007-09-05 | 2009-03-12 | Sekisui Chemical Co., Ltd. | 絶縁シート及び積層構造体 |
WO2010016480A1 (ja) * | 2008-08-07 | 2010-02-11 | 積水化学工業株式会社 | 絶縁シート及び積層構造体 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4661594B2 (ja) * | 2003-08-13 | 2011-03-30 | 日本ゼオン株式会社 | 重合性組成物、及びそれを用いてなる成形体 |
JP2006103237A (ja) * | 2004-10-07 | 2006-04-20 | Mitsubishi Plastics Ind Ltd | 金属積層体 |
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CN102124066A (zh) | 2011-07-13 |
US20110159296A1 (en) | 2011-06-30 |
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