CN101783305B - 探测器装置 - Google Patents

探测器装置 Download PDF

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Publication number
CN101783305B
CN101783305B CN2009101801843A CN200910180184A CN101783305B CN 101783305 B CN101783305 B CN 101783305B CN 2009101801843 A CN2009101801843 A CN 2009101801843A CN 200910180184 A CN200910180184 A CN 200910180184A CN 101783305 B CN101783305 B CN 101783305B
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CN
China
Prior art keywords
wafer
substrate
mentioned
aforesaid substrate
carrying
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CN2009101801843A
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English (en)
Chinese (zh)
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CN101783305A (zh
Inventor
带金正
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN101783305A publication Critical patent/CN101783305A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
CN2009101801843A 2009-01-21 2009-11-16 探测器装置 Active CN101783305B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-011229 2009-01-21
JP2009011229A JP5381118B2 (ja) 2009-01-21 2009-01-21 プローブ装置

Publications (2)

Publication Number Publication Date
CN101783305A CN101783305A (zh) 2010-07-21
CN101783305B true CN101783305B (zh) 2012-03-21

Family

ID=42523227

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101801843A Active CN101783305B (zh) 2009-01-21 2009-11-16 探测器装置

Country Status (4)

Country Link
JP (1) JP5381118B2 (enExample)
KR (1) KR101208137B1 (enExample)
CN (1) CN101783305B (enExample)
TW (1) TWI466208B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384270B2 (ja) * 2009-09-21 2014-01-08 東京エレクトロン株式会社 ローダ
US9335347B2 (en) * 2012-09-10 2016-05-10 Advantest Corporation Method and apparatus for massively parallel multi-wafer test
CN102928761B (zh) * 2012-11-20 2016-05-11 上海华虹宏力半导体制造有限公司 晶圆测试系统及晶圆测试方法
SG11201605303XA (en) * 2013-12-31 2016-08-30 Shanghai Microelectronics Equi Silicon wafer pre-alignment device and method therefor
JP6551655B2 (ja) * 2015-03-31 2019-07-31 株式会社東京精密 プローバ
CN105097592B (zh) * 2015-06-17 2018-01-26 北京七星华创电子股份有限公司 半导体设备承载区域的硅片分布状态光电扫描方法及装置
KR102503282B1 (ko) * 2015-11-06 2023-02-24 세메스 주식회사 프로브 스테이션
CN105575841B (zh) * 2015-12-15 2019-08-02 北京中电科电子装备有限公司 一种晶圆测量装置
CN107785299A (zh) * 2016-08-30 2018-03-09 上海微电子装备（集团）股份有限公司 一种硅片拾取装置
CN106807650A (zh) * 2017-01-22 2017-06-09 江苏安纳金机械有限公司 一种充放电及休眠测试的自动拣料机及其运作方法
US11125814B2 (en) * 2017-02-22 2021-09-21 Sintokogio, Ltd. Test system
CN107942222A (zh) * 2017-11-21 2018-04-20 德淮半导体有限公司 测试机台及测试方法
WO2019208338A1 (ja) * 2018-04-27 2019-10-31 東京エレクトロン株式会社 基板処理システム、および基板処理方法
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
JP7474325B2 (ja) * 2020-06-05 2024-04-24 ローツェ株式会社 ウエハ搬送装置、およびウエハ搬送方法
TWI773187B (zh) * 2021-03-12 2022-08-01 旭東機械工業股份有限公司 用於檢測一晶圓盒的方法及系統
CN117192342B (zh) * 2023-11-08 2024-02-13 深圳市森美协尔科技有限公司 探针台
CN120985619A (zh) * 2025-10-24 2025-11-21 泓浒(苏州)半导体科技有限公司 一种多轨迹晶圆搬运机械手及控制方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1407612A (zh) * 2001-09-03 2003-04-02 木本军生 探测器装置
CN1526163A (zh) * 2001-11-30 2004-09-01 ���������ƴ���ʽ���� 探测器装置和探测器测试方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133843A (en) * 1980-03-21 1981-10-20 Nec Corp Probe grinder for probe card
JP3634138B2 (ja) * 1998-02-23 2005-03-30 株式会社 日立ディスプレイズ 液晶表示装置
JP2000164649A (ja) * 1998-11-26 2000-06-16 Tokyo Seimitsu Co Ltd プローバの触針クリーニング機構
JP2006128451A (ja) * 2004-10-29 2006-05-18 Seiko Epson Corp プローバー装置及びその探針メンテナンス方法、半導体装置の製造方法
JP4166813B2 (ja) * 2006-05-11 2008-10-15 東京エレクトロン株式会社 検査装置及び検査方法
JP5120017B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1407612A (zh) * 2001-09-03 2003-04-02 木本军生 探测器装置
CN1526163A (zh) * 2001-11-30 2004-09-01 ���������ƴ���ʽ���� 探测器装置和探测器测试方法

Also Published As

Publication number Publication date
JP5381118B2 (ja) 2014-01-08
TWI466208B (zh) 2014-12-21
KR101208137B1 (ko) 2012-12-04
JP2010171139A (ja) 2010-08-05
CN101783305A (zh) 2010-07-21
KR20100085877A (ko) 2010-07-29
TW201029088A (en) 2010-08-01

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