JP5381118B2 - プローブ装置 - Google Patents

プローブ装置 Download PDF

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Publication number
JP5381118B2
JP5381118B2 JP2009011229A JP2009011229A JP5381118B2 JP 5381118 B2 JP5381118 B2 JP 5381118B2 JP 2009011229 A JP2009011229 A JP 2009011229A JP 2009011229 A JP2009011229 A JP 2009011229A JP 5381118 B2 JP5381118 B2 JP 5381118B2
Authority
JP
Japan
Prior art keywords
wafer
substrate
probe
needle
inspection unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009011229A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010171139A (ja
JP2010171139A5 (enExample
Inventor
正 帯金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009011229A priority Critical patent/JP5381118B2/ja
Priority to CN2009101801843A priority patent/CN101783305B/zh
Priority to KR1020100005275A priority patent/KR101208137B1/ko
Priority to TW099101536A priority patent/TWI466208B/zh
Publication of JP2010171139A publication Critical patent/JP2010171139A/ja
Publication of JP2010171139A5 publication Critical patent/JP2010171139A5/ja
Application granted granted Critical
Publication of JP5381118B2 publication Critical patent/JP5381118B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/16—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding sharp-pointed workpieces, e.g. needles, pens, fish hooks, tweezers or record player styli

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2009011229A 2009-01-21 2009-01-21 プローブ装置 Active JP5381118B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009011229A JP5381118B2 (ja) 2009-01-21 2009-01-21 プローブ装置
CN2009101801843A CN101783305B (zh) 2009-01-21 2009-11-16 探测器装置
KR1020100005275A KR101208137B1 (ko) 2009-01-21 2010-01-20 프로브 장치
TW099101536A TWI466208B (zh) 2009-01-21 2010-01-20 Probe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009011229A JP5381118B2 (ja) 2009-01-21 2009-01-21 プローブ装置

Publications (3)

Publication Number Publication Date
JP2010171139A JP2010171139A (ja) 2010-08-05
JP2010171139A5 JP2010171139A5 (enExample) 2011-10-20
JP5381118B2 true JP5381118B2 (ja) 2014-01-08

Family

ID=42523227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009011229A Active JP5381118B2 (ja) 2009-01-21 2009-01-21 プローブ装置

Country Status (4)

Country Link
JP (1) JP5381118B2 (enExample)
KR (1) KR101208137B1 (enExample)
CN (1) CN101783305B (enExample)
TW (1) TWI466208B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5384270B2 (ja) * 2009-09-21 2014-01-08 東京エレクトロン株式会社 ローダ
US9335347B2 (en) 2012-09-10 2016-05-10 Advantest Corporation Method and apparatus for massively parallel multi-wafer test
CN102928761B (zh) * 2012-11-20 2016-05-11 上海华虹宏力半导体制造有限公司 晶圆测试系统及晶圆测试方法
WO2015101220A1 (zh) * 2013-12-31 2015-07-09 上海微电子装备有限公司 一种硅片预对准装置及其方法
JP6551655B2 (ja) * 2015-03-31 2019-07-31 株式会社東京精密 プローバ
CN105097592B (zh) * 2015-06-17 2018-01-26 北京七星华创电子股份有限公司 半导体设备承载区域的硅片分布状态光电扫描方法及装置
KR102503282B1 (ko) * 2015-11-06 2023-02-24 세메스 주식회사 프로브 스테이션
CN105575841B (zh) * 2015-12-15 2019-08-02 北京中电科电子装备有限公司 一种晶圆测量装置
CN107785299A (zh) * 2016-08-30 2018-03-09 上海微电子装备（集团）股份有限公司 一种硅片拾取装置
CN106807650A (zh) * 2017-01-22 2017-06-09 江苏安纳金机械有限公司 一种充放电及休眠测试的自动拣料机及其运作方法
AT527530B1 (de) * 2017-02-22 2025-04-15 Sintokogio Ltd Prüfsystem
CN107942222A (zh) * 2017-11-21 2018-04-20 德淮半导体有限公司 测试机台及测试方法
WO2019208338A1 (ja) * 2018-04-27 2019-10-31 東京エレクトロン株式会社 基板処理システム、および基板処理方法
JP7349240B2 (ja) * 2018-10-05 2023-09-22 東京エレクトロン株式会社 基板倉庫及び基板検査方法
JP2020096028A (ja) * 2018-12-11 2020-06-18 東京エレクトロン株式会社 検査装置、及び、検査方法
JP7274350B2 (ja) * 2019-05-28 2023-05-16 東京エレクトロン株式会社 搬送システム、検査システム及び検査方法
KR102788325B1 (ko) 2020-06-05 2025-03-31 로제 가부시키가이샤 웨이퍼 반송 장치 및 웨이퍼 반송 방법
TWI773187B (zh) * 2021-03-12 2022-08-01 旭東機械工業股份有限公司 用於檢測一晶圓盒的方法及系統
CN117192342B (zh) * 2023-11-08 2024-02-13 深圳市森美协尔科技有限公司 探针台
CN120985619A (zh) * 2025-10-24 2025-11-21 泓浒(苏州)半导体科技有限公司 一种多轨迹晶圆搬运机械手及控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56133843A (en) * 1980-03-21 1981-10-20 Nec Corp Probe grinder for probe card
JP3634138B2 (ja) * 1998-02-23 2005-03-30 株式会社 日立ディスプレイズ 液晶表示装置
JP2000164649A (ja) * 1998-11-26 2000-06-16 Tokyo Seimitsu Co Ltd プローバの触針クリーニング機構
JP4496456B2 (ja) * 2001-09-03 2010-07-07 軍生 木本 プローバ装置
JP2003168707A (ja) * 2001-11-30 2003-06-13 Tokyo Electron Ltd プローブ装置
JP2006128451A (ja) * 2004-10-29 2006-05-18 Seiko Epson Corp プローバー装置及びその探針メンテナンス方法、半導体装置の製造方法
JP4166813B2 (ja) * 2006-05-11 2008-10-15 東京エレクトロン株式会社 検査装置及び検査方法
JP5120017B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置

Also Published As

Publication number Publication date
KR101208137B1 (ko) 2012-12-04
TW201029088A (en) 2010-08-01
JP2010171139A (ja) 2010-08-05
TWI466208B (zh) 2014-12-21
KR20100085877A (ko) 2010-07-29
CN101783305B (zh) 2012-03-21
CN101783305A (zh) 2010-07-21

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