TW201029088A - Probe device - Google Patents

Abstract

The present invention provides a probe device capable of restraining production going down when executing the maintenance operation of a detection part through using a substrate of maintenance. The probe device comprises a wafer transportation arm which has an arm body; a pre-aligning mechanism for the positioning of orientation and central part of the wafer taken out from a wafer box; and a substrate holding part which has an adsorption part for taking over the wafer from the wafer transportation arm and keeping adsorbing it. When a situation occurs that needs to interrupt the current process immediately to execute the maintenance operation of the detection part, the substrate supported by the arm body is kept at the substrate holding device and a substrate for probe polishing stored in a substrate storing part is taken out by the arm body and exchanged with the substrate held by a wafer holder. Accordingly, the standby time of the detection part is reduced during performing a probe polishing process, thereby increasing the production of the test.

Description

201029088 VI. Description of the Invention: [Technical Field] The present invention relates to a probe device capable of contacting a probe of a probe card to a detected portion of a substrate such as a semiconductor wafer (hereinafter referred to as a wafer) The electrode sheet is used to perform electrical measurement of the wafer to be inspected. [Prior Art] A conventional probe device is such that a probe such as a probe needle of a probe card contacts an electrode pad of an ic wafer to perform a probe test for investigating electrical characteristics. The probe device includes: a loading cassette; the detecting unit includes a probe card and a mounting table; and the transfer chamber is provided with a wafer transfer mechanism capable of performing wafer transfer between the loading cassette and the detecting unit . Next, the wafer transfer mechanism is used to take out the wafer from the transfer container (wafer carrier) loaded into the loading cassette, and the pre-alignment mechanism in the transfer chamber or the wafer transfer mechanism is provided. The pre-alignment mechanism performs the pre-alignment, and after the pre-alignment is completed, the wafer is transferred to the mounting table in the detecting unit. As the wafer transfer mechanism, for example, two arm bodies (substrate attachments) are used, and the wafer transfer mechanism can be used by one side of the arm body while the detection unit is performing the probe test of the wafer. The next crystal to be inspected is taken out and pre-aligned, and before the wafer inspection in the detecting unit is completed, the wafer is placed in a state where the wafer is placed, and the indoor standby is performed. Then, when the wafer inspection in the detecting unit is completed, the detected wafer is taken out by the arm body on the other side, and the undetected wafer supported by the arm body of one side is delivered in 201029088. The probe needle is placed as a probe. . = The inspection will cause the foreign matter of the electrode piece to adhere to the front end of the probe = probe, so it is necessary to go to the probe of the head = the π grinding 4 of the head, the object. Performing the probe grinding i continuation test -: erroneously - '4;: =::;: € ===== = After moving the details, Xuan Yun will also grind the crystal from the body of the arm. Round take-out and transport = probe body:: The detected part of the detection unit is completed: ?:::= hand #The probe of the body is polished and the wafer is placed on the load a. * When the side of the life needs to interrupt the current processing, sometimes the arm of the one side has an undetected wafer. At this time, there is no 41 due to the other crystal garden. Tl tl·, a round conveying mechanism to un-examine the probe grinding wafer f, and to cut the material: (4) transport the arm 3 =: return the carrier; take out the probe to polish the wafer; The probe is polished by the probe to grind the probe; and the probe is ground 201029088: rounded to the substrate storage portion, etc. - after the series of processing is completed, the undetected wafer is again re-processed from the carrier. take out. In addition, when the detecting unit is a plurality of units (for example, two units) and the wafer transporting unit 3 has three arm bodies, the two arm bodies of the three arm bodies often support undetected wafers or have been supported. The detection etch =: and only one arm body is in the empty state. Therefore, the number of the ejector arm bodies is the same as the case of the carrier mechanism having the two arm bodies described above, and the slot in the carrier must be temporarily moved back to the carrier, and the slot is narrow. #未检测The wafer returns the wafer to the inside of the hand to contact the inside of the smart device to cause movement on the lifting device of the carrier, or to place the wafer in the moving direction or the center to produce low carrier and wafer phase When touching the carrier of the wafer, the foregoing 2 therefore 'when the pre-aligned wafer has been returned to the interrupt processing, it will be invalid, and the result is when the pre-alignment of the row is completed; :^ The circle is re-aligned. Therefore, the standby time of the t detecting unit which is under the probe test output becomes long, which is caused by this point. The detection of the probe is carried out, and the detection device is mounted, and the dedicated mounting table of the probe test mounting table is placed in the inspection portion, and a load placement device is placed on the outside of the probe 5 Needle grinding wafer for wafers. The probe is mounted on the dedicated probe, and the probe is used to test the probe. When the probe is polished, the probe is retracted, and the dedicated stage is moved to the probe 5 201029088. Contact with the probe needle of the needle grinding 35® and the probe card can also be used in the crystal B] ° Therefore, even if the wafer is interrupted, the rape is read, the next reading is performed. Fresh inspection (four) 1 card probe grinding. However, the above-mentioned problem is that the probe device is becoming larger and larger, and the demand for the method is gradually increasing. Therefore, the enlargement of the device is not inferior to the == patent opening; [invention content] > An object of the invention is to provide a probe device capable of suppressing a decrease in yield when a maintenance operation of a detecting portion is performed using a substrate for a matte. In the probe device of the present invention, the electrode sheet of the substrate to be detected placed on the mounting table is brought into contact with the probe of the probe card to measure the electrical characteristics of the detected portion of the substrate, and is characterized in that: The transfer container is configured to carry a transfer container in which a plurality of substrates are housed, and the substrate transfer mechanism is configured to transfer the substrate between the transfer container and the mounting table of the detection unit mounted on the loading cassette. A plurality of substrate branch assemblies that are independent of each other and free to advance and retreat. When the branch is in standby with the undetected substrate, there is an empty substrate support 201029088 support assembly; the transfer room is connected to the load And the detecting unit is configured to move the substrate transfer mechanism therein; the pre-alignment mechanism is disposed in the transfer chamber, has a turntable capable of fixing the substrate and rotating, and detects the substrate on the turntable The peripheral edge detecting portion of the periphery positions the direction and the center portion with respect to the substrate taken out from the transfer container;

The substrate storage unit is provided in the transfer chamber and houses a maintenance substrate for performing maintenance work on the detection unit. The substrate holding device is provided in the transfer chamber and has a substrate that can receive the substrate from the substrate transfer mechanism. a absorbing mechanism for absorbing and holding; and, for controlling the substrate transporting mechanism, when the substrate is placed on the detecting portion and a situation occurs in which the current processing needs to be interrupted to perform the business, the substrate supporting assembly can be The maintenance substrate of the branch building is taken out and the d: holding device is adjacent to the substrate accommodating portion measuring portion, and the probe device is provided with, for example, a plurality of the detection sums and the (4) portion is _ When the substrate is removed by the substrate reading unit and the detection unit has completed the detection, and the second detection unit has to interrupt the current processing to perform the maintenance operation, the board support assembly can support the board support assembly. The substrate on which the inspection is completed is held by the substrate holding device to perform the maintenance work. Further, in the probe device of the present invention, for example, in addition to the aforementioned pre-alignment mechanism, a pre-alignment mechanism is provided at the substrate holding device, and the substrate holding device has a function of a pre-alignment rotary table. The substrate is pre-aligned for the substrate.

In the probe device of the present invention, the substrate transport mechanism for transporting the substrate between the loading cassette and the detecting unit has a plurality of substrate branch assemblies, and when it is in standby while supporting the undetected substrate, When the substrate supporting assembly is in an empty state, and when the substrate to be inspected is placed in the detecting portion, the maintenance process for interrupting the current processing and performing the detecting portion with the maintenance substrate can be performed by providing the absorbing mechanism. The substrate holding device temporarily receives the un-detected substrate that has been pre-aligned by the substrate support assembly. Therefore, the undetected substrate can be held in the state of the posture (the center position and the direction of the substrate) when it is received from the substrate transfer mechanism. Therefore, it is not necessary to perform the pre-alignment again, and it can be directly carried into the detecting portion. Therefore, the standby time of the detecting portion can be shortened to suppress the decrease in the yield. [Embodiment] A probe device according to a third embodiment of the present invention will be described with reference to Figs. 1 to 12 . As shown in FIGS. 1 to 3, the probe device includes: a loading unit 201029088 for transferring a wafer W (parameter 6) in which a plurality of substrates to be detected (detected portions) are arranged; and a probe skirt The body 2 is placed on the wafer W for probe testing. First, the overall arrangement of the loading unit 1 and the probe device body 2 will be briefly described. The loading unit 1 includes a first loading cassette 11 and a second loading cassette 12, and is capable of loading the FOUP 100 of the sealed transport container (transportation benefit) in which a plurality of wafers w are stored in the γ direction (in the figure). The directions are disposed opposite to each other; and the transfer chamber 1G is disposed between the loads 1 and 12 . The loading 璋u (12) each has a casing 13 (14)' and can carry the FOUP1 至 to the loading port 15 (16) provided on the χ direction side of the loading 埠u (12) Inside the box 13 (14). After the loading, the F〇UP100 removes the cover by the carcass opening and closing mechanism (not shown) provided in the loading port (12), and fixes the cover to the carrying person (u (12) ) _ Wall, then rotate the FOUPIOO that has been taken: ρ cover so that the opening faces the side of the transfer chamber 1 . The loading unit 1 is provided with a control unit 5 for controlling the probe device as shown in Fig. 2 . The control unit 5 is composed of, for example, a computer, and includes a data processing unit including a memory and a CPU, and a processing procedure such as a probe test processing program 50 and an interrupt control processing program 51. The probe test processing program 50 is used to control: loading F〇upi〇〇 into the load port 11 (12), and then loading the wafer arm into the probe device body 2 from the inside of the probe device to perform the ride test. It consists of a group of steps in which the wafer w is moved back to the FOUPIOO and the wafers are transported to the red order and the series of parts are operated. In addition, 201029088 into these processing programs (pure processing procedures related to the processing of the group of instructions), such as floppy disk, light = know and = (photomagnetic_), fill, etc., _ body _ Wire rotation control ^ The probe device body 2 is in the figure, the axis is also adjacent to the loading unit 1, and has a detection unit 2 along the x-axis direction and = a number of ports (for example, 4 units). The detecting unit 21 in a state where the multi-plate 25 is removed is displayed. As will be described later, the detecting unit 2i is provided with a body 2 as shown in Figs. 2 and 3, and the pedestal unit 24 and the upper side photographing unit 9 are provided inside the frame 22. The C»seat 兀24 series can freely move along the χ, γ, ’ ', ie, horizontally and horizontally, and can move freely and freely, while the upper part can be rotated. The upper part of the =24 is placed on the stage for mounting the wafer w, and the wafer cooker 4 of the vacuum suction function is stacked. Next, the pedestal unit = portion is provided with a lower side photographing portion 8 provided with a micro camera or the like for photographing a probe card 6 to be described later. The wafer cooker 4 can freely transfer between the transfer position at which the wafer w is transferred, the photographing position of the wafer surface, and the contact position (detection position) at which the probe needle of the probe card 6 contacts the wafer W. mobile. Further, as shown in Fig. 3 (b), when the side surface of the casing 22, that is, the side surface where the blood transfer chamber 10 is in close contact, is connected to the inside of the transfer chamber ig, 201029088 is carried in and out of the frame U. Then, the wafer W can be transported to the wafer cookware 4 in the casing 22 by the loading and unloading port 23. Next, the upper photographing unit 9 is provided with a micro-camera or the like for photographing the crystal W placed on the crystalware cookware 4.

As shown in FIG. 3(a), an upper plate 25 as a top portion of the frame 22 is provided above the moving area of the wafer cooker 4 and the upper image capturing unit 9, and the probe card 6 is attached and fixed thereto. Upper plate 25. A test head, not shown, is mounted on the upper side of the probe card 6, and the probe card 6 and the test head are electrically connected by a probe pin unit not shown. Further, on the lower surface side of the probe card 6, the electrode sheets corresponding to the wafer w are arranged, and the probes (probe needles 7) each electrically connected to the upper electrode group are provided, for example, to the probe card 6. On the whole face. As shown in Figs. 2 and 3, the transfer chamber 1 is provided with a wafer transfer arm 3 as a substrate transfer mechanism. The structure of the wafer transfer arm 3 is provided with a j-hand 35 and a second arm body 36 that can freely advance and retreat at a transport base 3G that can freely move (4) along the wrong straight axis and freely move and move freely in the γ direction of the towel. Two arm bodies (substrate, and pieces). Here, the symbol 33 is a base moving portion 'symbol 32 that can move along the guide rail extending in the γ direction in the drawing, and the base 32 is movable up and down with respect to the base moving portion 33, and the symbol 31 is provided on the base. The turning portion of the table lifting portion 32.

El f/r , ", 卞, limb ^ Xingle z are formed in the U-shaped notch portions 55, 56 toward the distal end side, and are located at the end of the arm body 3S (10) left 4 201029088 on the transfer base 3 各(4) Two parallel guide rails 37 are provided, and the i-th arm body 35 and the second arm main body 36 are moved back and forth along the rails 37 and 37 by the arm guides % and buckles. The base 30 is provided with a pre-alignment mechanism 40 (refer to FIG. 4) for pre-aligning the first arm body 35 or the circle W implanted by the second arm body 36 to adjust the crystal. The direction of the circle w is simultaneously detected, and the center is only placed. As shown in FIG. 4, the pre-aligner 40 is provided with the cooker portion 41, the sensor span beam 42, and the photo sensor pass-through portion 44'. In the main body 35, 36τ, an unilluminated light-emitting portion is provided. In the figure, the cooker portion 41 is a turntable that can rotate the wafer w, and the swing portion 4 of the cookware portion is set to correspond to the transfer base 3 () The center position of the wafer w on the arm body 35 ( 36) in the rear state is provided with the portion 41 that can be raised and lowered along the z-axis direction in the figure and can be pre-prepared Lowered standby position and stops at the position of the arm can interfere with the body 35, when the forward and backward. Next, in =

When the line is pre-aligned, it is lifted up and slightly lifted from the arm bodies 35, 36 for rotation. Since the top surface of the transfer base 30 is provided with a sensor cross member a that does not interfere with the wafer trade supported by the arm bodies 35, 36, the sensor cross-beam 42 is equipped with energy. The light sensor 43 receives light from the light-emitting portion not shown in the drawing and penetrates the wafer w: Next, the arm bodies 35 and 36 are formed with light transmitting portions 44 extending in the X-axis direction in the drawing. The light emitting portion is disposed below the light transmitting portion 44. 12 201029088 Then, the light from the light-emitting portion passes through the light-transmitting portion 44, and is irradiated from below to the peripheral portion (creep portion) of the wafer w which is lifted from the arm body %% by the member portion.

Pre-alignment is performed by the pre-alignment mechanism 4 as will be described later. First, the wafer arm W on the i-arm main body 35 or the second arm main body 36 is slightly enclosed by the cooker portion 41, and the wafer w is rotated. Then, the light is irradiated from the light-emitting portion to the peripheral portion (end portion) region including the (four) W, and the light sensor 43 is detected to detect the light passing through the wafer W, and the detection signal is transmitted to the control portion 5. The control unit 5 adjusts the first arm body 35 based on the detection signal 'on the wafer' or the eccentricity, and adjusts the position of the second arm body 36 from the cookware unit 41 to the wafer w. The first arm body 35 or the second arm body 36 is adjusted, and after the offset of the eccentricity of the 4 is corrected, the wafer W is returned to the cooker portion Μ L to correct the eccentricity of the wafer W. Then, the cookware is rotated. The portion 41 of the whole wafer W is oriented such that the wafer notch or the like faces the first direction, the body 35, or the specific direction on the second arm body 36. The wafer W direction and the center position are adjusted. As shown in Fig. 2 and Fig. 3, the transfer chamber 10 is provided with a substrate. The 卩60' is placed in a slab-like manner, for example, a ceramic set (a probe for polishing the probe needle 7 of the 针^ card 6) Each of the needle-worn wafers Wb is shown in Fig. 6). The substrate accommodating portion 60 is provided at the loading port 11 (the lower side of the reference and allows the arm bodies 35 and 6 of the wafer transfer arm 3 to approach the access position. The accommodating portion 60 is provided with three y-support members 62, ^ 65 656; on the base 13 201029088 63, 64 ϋ ^ base 61 as shown in FIGS. 5 and 6; 4 1 is laminated. Then, Λ Z-axis direction and a certain interval are provided with a gap between the claws 65 of the members 62, 63, 64', and the load is formed into a comb shape. Further, 2 longitudinal (Z-axis) The direction of the cross-sectional shape portion 65 in the Z-axis direction = the position of the cows/2, 63, 64 is approximately uniform. ❹ b 02 63, 64 are located above the base 61, =::: =, there is - one load - -, by the carrier 62 ° A * is loaded with a load-bearing member 63. Then, the claw portion 65 of the shape 64 supports the peripheral portion 3 points, and the probe is ground. The wafer is stored in the substrate by the claw portions 65 of the respective load-carrying members 62, 63, 64 to form a scaffold for accommodating the probe polishing wafer Wb, etc. Further, as shown in FIG. Therefore, only the i-probe polished wafer Wb is accommodated in the substrate storage unit 6 shed. However, in the present embodiment, a plurality of probe polishing wafers Wb are accommodated in other scaffolds. Above the 60, a substrate holding device 70 is provided which temporarily fixes the wafer W being conveyed supported by the arm bodies 35, 36. The substrate holding device 7 is located behind the base 61 At one side, and a support portion 71 extending in a vertical direction to a position higher than the load carrying members 62, 63, 64 is mounted. Then, from the branch portion 71 toward the approximate center above the substrate receiving portion 6〇 The horizontal end is 201029088 ^ίτ a} The front end of the body is formed with the wrist suction portion (the vacuum cooker vacuum suctions the approximately disk-shaped wafer W into a plurality of vacuums) The suction portion 4 and the upper portion of the sucking portion 73 are formed with a recessed portion two holes 74: 'in the wrist portion 72 and the suction portion 73, the plate holding device 70 is for whom", so the arm body 35 36 is close to the base 36 and the wrist 72 is not ready to open. When the circle W is transmitted, the arm body 35 and the retracted wafer are transported; In addition, the access position is set to the arm body 35 (J, angle, so that the crystal 31 carries the arm 3 to be held toward the substrate 裴¥: often from the same position at the same angle as many times), and does not retreat, so The ground advancement and retreat 70 are in contact with each other, and the main body 35 (36) is held in contact with the substrate. The substrate transfer device 7G holds the wafer W by holding the arm p 73 and the wafer transfer arm p 73. When the fixed 曰 仃曰曰 传递 传递 传递 , , , , , , 中心 中心 中心 中心 中心 中心 中心 中心 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能 能ΐ=77=:: body delivery, first, moving the wafer transfer arm 3 to operate (36). Arm too rider # The hand (36) of the solid transport arm 3 can be moved to the substrate storage unit 60 Save the body t = two Figure 7 (a) shows the 'body 35 (36) supporting the wafer ~ toward the upper position of the suction portion 73 a, 'the arm body 35 (36) is as described above In general, the substrate holder 15 201029088 holds the device 70 in and out in the same direction. Then, if the Γ5Γ=73 relatively enters the arm body 35 (36) 2 4 55 ( 56) within the protruding portion 75 of the 'arm body 35 (36)' and the arm body 35 is placed at a position such that approximately the central portion of the wafer w forms a central portion of the portion 73 ( At the same time, the wafer W and the absorbing portion 73 are only apart from each other - the minute 陈 _ _ _ y y as shown in Figure 7 (b), at the vacuum suction hole 7 moxibustion 5) by the wrist 72 The inner suction path (not shown) is lowered to attract the arm body 35 (36) so that the wafer 2 is attracted to the absorbing portion 73 (vacuum suction). The state in which the substrate holding device 7G does not move (holding posture = state). New Zealand' is shown in Fig. 7 (〇, the arm body % = is lowered and stops at the absorbing portion 73 and the remaining components 62, 63, 6 The area is 'retracted toward the transfer base 3', whereby the substrate 70 can hold the wafer w supported by the arm body 35 (36) in a state of a dimension of $. In addition, by the arm body 35 (3), when the wafer w held on the substrate holding device 7G is received, the foregoing description is reversed, and the hand f body %(3) is coordinated with the base device 70 to be connected. This wafer w. "secondary" simply describes a series of processes for performing probe testing using the probe device. Here, for convenience of explanation, the detecting portion 21 « shown in Fig. 2 is loaded on the side of the 埠u side. The detecting unit 21 is sequentially named as the fourth to fourth detecting units 2, and in the probe test, for convenience of explanation, the first arm body 35 performs the pre-alignment of the wafer w. As shown in FIG. 2, the wafer transfer arm 3 is used to carry out the wafers from the placed touch bay, and the pre-alignment mechanism 40 disposed at the wafer transfer arm 3 is aligned as shown above. The wafer is transported to the first detecting unit 21 again. Then, in the same manner as the first detecting unit 21, the crystals are sequentially transferred to the second to fourth detecting units 2 for all the detections (four).

Is there a wafer W, and when all the detection sections 21 are exploring? The wafer transfer arm 3 is moved by the first arm = position, and the wafer W to be detected is carried out and pre-aligned, and is placed in the transfer chamber 10 for standby. 8 ==r circle w, _probe; == the position of the electrode piece (not shown) on the surface" Pull and then calculate the contact coordinates of the probe needle 7 and the piece according to the photographic data. And the wafer touches:: Then, after the probe needle 7 and the phase-cut reception probe 4 are completed, the wafer cooker 4 will move to the vicinity of the carry-in and exit 23. At this time, 'because of the wafer transfer arm 3 Since the crystal (4) is not placed on the second 36, the wafer W that has been inspected is taken out by the second arm body %, and the undetected wafer W supported by the i-th arm body % is transferred to the wafer cookware. 4. Then, the wafer transfer hand '17 201029088 3 will have been transferred to the F〇upi〇〇, and the winter FOUP100 will contain the undetected wafer w, then the next = = The wafer W of the image is carried out. The series of steps is performed in the same manner as the first 2 to the fourth detection unit 21. The probe device of the above step 3 can transfer the arm by a wafer. Needle test/transfer wafer W to 4 prosecutors 21 for investigation ”==inspection=part: root=processing program to interrupt current; == Fig. 12 is mixed with nn 'α ", -People's test Figure 8 to (probe grinding 5 grinding treatment) This side: the probe needle 7 of the broken treatment; the research 2 The detection is performed when the wafer transfer arm 3 is in the unchecked probe polishing position G, and the second condition is performed at the first detecting unit 21. The second detection is completed. After the exchange of the wafers, the probe is polished as shown in FIG. First, refer to the figure /, send arm I: status. In addition, when the first situation is described, the undetected wafers placed on the wafer transfer y are loaded with the completed wafers 2'. Wafer system Wb/W2, substrate storage unit 18 201029088 a pair as shown when 'the wafer transfer arm 3 is supported = two in the transfer room: rr_: r two Dan - person, as shown in Figure 8 Μ - - and前, i) 晶圆 = wafer m is kept on the substrate 2:::: body? vvD is taken out (| The Si::::' is intended to perform the probe polishing process, and the position of the center of the probe polishing wafer Wb is positioned. Then, the wafer transfer arm 3 is moved: the detecting portion 21 of the probe polishing process Move to the front of the implementation (arrow 3). The loading and exiting port is referred to in Figure 3) in the section of '如® 8 (〇所*' from the probe grinding process to the wafer transfer arm 3; The wafer W2 carries out the probe H = supported by the first arm body 35, and the wafer 挟 and 4 (arrow 4) t-needle polishing wafer Wb are carried into the circle... () at the detecting portion 21 , moving two == planting; Yu Jing Probe polishing on the cooker 4 = treatment: = = = probe processing of the probe needle 7 _ let the move _ head 7 probe grinding Ί U transport arm 3 moved to the KKJP1 Position and move the completed wafer W2 into the 201029088 FOUP100 (arrow 5). As shown in Figure 9 (a), after the wafer W2 is moved into the FOUP100, the undetected wafer w is no longer taken out of the FOUP100. The wafer transfer arm 3 is directly moved to a position (arrow 6) where the substrate storage unit 6 can be accessed. Next, the wafer W1 (arrow 7) held by the holding device 7 is held by the first arm body 35, and the wafer transfer arm 3 is moved to the probe grinding process as shown in Fig. 9 (匕). The inspection unit 21 in the middle is moved in front of the exit 23 (refer to FIG. 3) (arrow 8). After the iron detecting unit 21 completes the probe polishing process, the wafer is carried out on the wafer carrying out the probe polishing wafer Wb and is delivered to the second arm body % = = round? The first arm body 35 is selected to be loaded into the main day. Japanese cookware 4 (arrow 9). In the case of Yu Jing = 2 9 = kg, the detecting unit 21 performs the probe test for the placement of the probe test: :J. Next, in the substrate housing portion: =: = arm 3 is moved until the wafer Wb is loaded into the substrate housing portion; and the probe (4) is completed as the interrupt processing. Worse, a series of steps, and then the probe test according to the probe test = test = rational. The mileage type 50 is used to continue the grinding process (the interruption is performed at: ^: the test processing is performed in the case where the probe building has completed the pre-alignment of the 曰m-word wafer transfer arm 3; Grinding place 2 == 20 201029088 After the grinding process, it is carried out from the substrate to the detecting portion 21, and since the position of receiving the wafer % circle wi is maintained as the self-collecting device 70, the crystal state can be obtained. When the two arms are received, the wafer 1 is taken out and the two are taken from the second place. The singularity of the wafer is valid. Therefore, it can be directly loaded into the detecting unit 21 without ordering the pre-alignment. Next, the description will be described with reference to FIGS. 10 to 12 .

Huan, 丨 lc's wafer cooker system 4c; 3rd inspection unit 2id day round:: completed wafer transfer arm 3 completed test: 曰曰, system W3, wafer cookware 4 b The undetected wafer dog placed on the buck; the wafer w5 that has been completed in the round cooker 4c; the wafer W6 in the wafer 挟...4d; The wafer system W7 that is transported to the round cooker 4d in the up1〇〇, the wafer system W8 that is transported from the F〇upi〇〇 to the wafer cooker 4c, and the second detection unit 2沁After the probe W3 of the probe test is exchanged with the wafer W4, the probe polishing process is performed in the second detecting unit 21c. When the wafer W3 that has been detected by the first detecting unit 2ib is received by the wafer transfer arm 3 and the undetected wafer W4 is delivered to the wafer, the control unit 5 determines the second detecting unit 21c. When the probe polishing process is performed, first, as shown in FIG. 1(a), the wafer transfer arm 3 is moved to a position (arrow plus) where the substrate storage portion 6A can be accessed, instead of the FOUP 100. Next, as shown in Fig. 1(b), the wafer W3 which has been completed and supported by the second arm body 36 is held 21 201029088 on the substrate holding device 70, and by the first! The arm body % carries out the probe polishing wafer Wb placed on the substrate housing portion 60 (arrow 21). Then, in the same manner as in the first case, the probe polishing wafer is pre-aligned, and the direction of the probe polishing wafer Wb and the center position positioning are performed in association with the detecting portion 21c to be subjected to the probe polishing process. Then, as shown in Fig. 10 (c), the wafer transfer arm 3 is moved to the front of the carry-in port 23 (see Fig. 3) of the detecting portion 21c to be subjected to the probe polishing process (arrow 22). Then, the wafer w5 that has been detected is transferred from the wafer cooker 4c of the detecting unit 21C that requires the probe polishing process to the second arm body 36 of the wafer transfer arm 3, and the first arm body is carried out. The 35 supported probes grind the wafer and move it into the wafer cooker 4c (arrow 23). Then, in the detecting portion 2k, the 挟^ cookware is moved so that the probe grinding crystals placed on the crystal matching tool 4e are in contact with the probe needle 7 and the probe of the probe needle 7 is rubbed. In the aspect of 'detection unit 2^ for the probe: during the processing period', as shown in the figure, move 3 to the position where the access to FOUP1〇〇 = the wafer w5 of the arm body 36 is carried into Foupioo, the same The first arm body 35 is delivered to the first arm body 35 (Arrows 25). Next, the wafer evaluation and the measurement unit 21d are used to adjust the direction of the wafer W7 and the center position to move the wafer transfer arm 3 to the front of the inspection carry-in port 23 (refer to FIG. 3) (arrow 22 201029088 == At the wafer cooker 4d, the completed W0 is sent to the second arm body %, and the wafer read by the body is loaded into the wafer cooker arrow. Then the detecting portion 21d is directed to the crystal. The circle W7 starts the probe «^>4 ^SC ° and the other aspect. When the detecting portion 21d performs the probe inspection on the wafer W7, as shown in Fig. U(1), the wafer is transferred.

= to the position where the access to Qing Qing can be accessed (arrow 28), and the wafer supported by the second arm body 36 is moved into f(10), and the wafer is transferred from the first arm body 35 from the F〇up W8 moves out (front 29). Then, the wafer alignment is pre-aligned, and after the wafer direction adjustment and the center position positioning are performed by the matching detecting unit 21C, as shown in FIG. 12(a), the wafer transfer arm 3 is moved to the probe. The detection portion 21c of the needle polishing process is carried in front of the outlet 23 (see FIG. 3) (arrow 30). Then, the probe to be detected is transferred from the wafer cooker 4e to the second arm body 36, and the crystal of the i-arm body is branched.搬 Move into the wafer cooker 4c (arrow 31). After the absence, the detecting unit 21 starts the probe test for the wafer. Then, 'when the detecting unit 21c performs the probe test on the wafer cassette 7', the wafer transfer arm 3 is moved to a position (arrow 32) where the substrate storage unit 6G can be accessed, as shown in Fig. 12 (1), and The probe grinding the wafer muscle of the second hand '36 building is carried into the substrate accommodating portion 6 〇 ' while the wafer is held by the first arm body 35 to hold the wafer of the device 70 W3 is taken out (arrow 33). The wafer W3 is then transferred to the foupioo (arrow 34). As a result, a series of steps of the probe polishing process for interrupting the second state of the current process is completed, and then the probe test is continued based on the probe test processing program 5〇. In the second state, when the probe test process is interrupted to perform the probe polishing process (interrupt process), the wafer W3 that has been detected is not returned to the FOUP 100, and is temporarily held in the substrate storage portion. The substrate holding device 7 at the top of 60 is used to start the probe grinding process. Therefore, the wafer W3 is loaded in comparison with the wafer that has been tested.

When the FOUP 100 moves the probe polishing wafer Wb again, it is possible to shorten the interval between the holding of the wafer W3 and the removal of the probe polishing wafer muscle. Furthermore, 'the case where the wafer W3 is moved back to the FOUP1 and then the probe is processed by the shoulder' is ineffective as it is required to move the arm 3 in the unsupported state without any wafer W. Step this ^

In the form of the wafer transfer arm 3, the shape of the wafer W is often cut, so it is expected that the step of reducing the ineffectiveness is oblique to the first and second conditions, and the interrupt command is used. In the probe device of the internal state, when the makeup of the wafer w that has been detected in the detection unit 2 is processed to polish the wafer Wb using the probe, it is necessary to perform maintenance work (probe polishing processing). The substrate holding device 7 of the unsuperposed two-body absorbing portion 73 of the completed pre-alignment of the building is completed. Therefore, =2, 2, 24, 2010, 290, 00, B, 曰, W, (4), the center position and direction of the circle when receiving from the wafer transfer arm 3, so that it is not necessary to perform the pre-alignment again, and can directly enter α, thereby shortening the detection unit. The standby time 'sub-suppression yield 1 drop. Further, the substrate holding device % can be used to hold and maintain the posture of the circle W. Therefore, the substrate holding device 7 can be reduced. The substrate holding device 70 can be installed in the transfer chamber 1 or the like.

Extra space. Therefore, it is possible to suppress an increase in the size of the apparatus as compared with the case of providing a wafer cooker dedicated to the probe polishing process. (Second Embodiment) A probe device according to a second embodiment of the present invention will be described with reference to Figs. 13 to 16 . The probe device of the second embodiment is the same as the i-th embodiment except for the configuration of the substrate holding device 17A. The same components are denoted by the same or the same reference numerals are used for the description. In the first embodiment, the substrate holding device 70 can only suck and hold the wafer w. However, the substrate holding device f 17G of the present embodiment can be pre-aligned with respect to the wafer W held therein as needed. As shown in Figs. 13 and 14, in the present embodiment, an installation portion 168 is provided on the upper surface of the base 61 of the substrate housing portion 60. The setting portion 168 has a flat plate 169' which is formed in a horizontal plane above the substrate housing portion 6A, and the substrate holding device 17 is disposed on the flat plate 169j. Further, the distance between the substrate housing portion 60 and the flat plate 169 is set to a distance at which the probe polishing wafer Wb placed on the uppermost scaffolding of the substrate housing portion 6G can be taken out. 25 201029088 171, set. . The crucible 168 is provided with a cooker center portion of the substrate holding device 17G, a beam 172, a light-emitting portion 175, and the like, and the light is : = straddle-up. The cookware part 2 = can' and has the vacuum work - the work of the wafer W placed thereon. The sputum is the month of the turret that sucks and holds the wafer W, and the faucet portion 171 is disposed at approximately the center a# of the flat plate 169, and the sun Γ#/body%, 36 faces the substrate holding device 170. The advancement 56 meshes into the notch portion 55 of the arm body 35 (36) at a position where it interferes with the arm bodies 35, 36. The 襟 襟 襟 襟 172 is disposed on the rear side of the installation portion 168, and the light sensor 173 is attached to the sash 173. The illuminating portion 175 is disposed on the yoke portion 171. The region of the peripheral edge portion (end portion) of the wafer W on which the green light is irradiated is immersed in the lower portion of the rim portion, and the light passing through the wafer w is detected by the 173. The sensor span 172 of the sensor 173 forms a structure that can be first 173 (four) above the hair correction 175 and at a higher horizontal position than the wafer W held by the cookware portion. Then, the substrate holding device 17G can transfer the wafer W to the cooker portion 171 by performing the advance and retreat movement and the lifting operation of the absorbing portion of the embodiment of Fig. 7 in which the wafer is conveyed. And the crystal that is sucked is 81 w° and then has a light sensor, two 卩 175, and has the function of rotating the cookware part 171, so it is the same as the erg mechanism, and can be aimed at the crystal 26 201029088 Round w for pre-alignment. The probe device of the present embodiment having the substrate holding device 170 can pre-position the wafer w held by the substrate holding device 170. Therefore, when the probe polishing process is performed, for example, the probe is polished to the wafer Wb. Move in to the first! When the wafer cooker 4 of the detecting unit 21 is completed, and the probe test at the second detecting unit 21 is completed, the crystal ff1 W held by the holding device 17G can be observed, and the detecting portion of the second detecting unit 21 can be used. 21, wafer W direction adjustment and center position positioning are performed, and the wafer w is carried into the second detection unit. Search t #图图15, Fig. 16 to illustrate the _probe polishing station and =: In addition, in this description, the first detecting unit 2ib wafer crucible device 170 2 2 detecting portion 21C wafer cooker system 4c; The substrate is held by the undetected wafer system W1G; the wafer transfer arm 3 is wafer 1; the wafer cooker 4C is placed on the wafer system W12; from Φ, when the second detection is performed, M f (4) The probe is ground (the probe test performed at the reference point 8 is completed. First, as shown in Fig. 15 (a), the wafer is swam to the substrate storage unit 6: transfer = hand D When moving, the substrate holding device 17 is placed in the pre-alignment position, and the surface substrate is set to 170. ^=== 27 201029088 The positioning of the arm 2 and the center position. Next, the wafer wi is taken out from the μ 7 board holding device 170 by the first time, and held on the base ibW and the 170 (arrow 42). Then, as shown in Fig. 15, the wafer transfer arm 3 is moved to the detection portion 21c.

Si Chu_front (arrow 43), and by wafer transfer 4, the two arm body % is carried out from the wafer holder of the detecting unit, and the wafer W1 is removed, and the first arm 5 is removed. The supported probe polishing wafer is moved into the wafer cooker & Next, in the detecting portion 21c, the wafer is moved, and the wafer (4) placed on the crystal S1 cooker 4eJ1 is subjected to a probe test. The two-way two-detection unit 21° performs a probe test on the wafer W10, and as shown in FIG. 15(e), the wafer transfer arm 3 is moved to a position where the FOUPIOO can be accessed (arrow 45). The wafer W12 supported by the second arm body 36 is moved to the coffee, and the wafer wu is carried out from the first arm body 35 (FOUPHH) (arrow 46). Next, the wafer W13 is pre-aligned, and after the wafer W13 direction adjustment and the center position are positioned by the matching detecting portion 21b, as shown in FIG. 16(a), the wafer transfer arm is moved to: The loading/unloading port 23 of the detecting portion 21b for performing the probe polishing process is shown in front of FIG. 3) (arrows). Then, after the polishing process is completed, the probe is transferred from the wafer cooker 4b to the second arm body 36, and the second circle Wb% is supported by the f body 35. The wafer is loaded into the wafer cooker 4b (arrow 48). After 28 201029088, the detection unit 21b is the same as 呤 s. Then, as shown in the figure: (b=wl starts the probe test.), when the detection unit 2lb performs the probe test on the wafer W13, Bit == Na. Access bit 2, = arm body 35 to take out the completed wafer wu held by the substrate holding device 170 (arrow (6).

Then, as shown in Fig. 16 (1), the wafer transfer arm 3 is moved to a position where the foupioo can be accessed (arrow 51), and the wafer (four) is carried into FOUPHK) (arrow 52). Thereby, a series of steps of the probe grinding process is completed, and then the probe test is continued in accordance with the probe test processing program 50. In the probe device of the present embodiment, by providing the substrate holding device 170', the undetected wafer W can be transferred to the wafer transfer arm 3 and maintained in the posture (wafer) Since the center position and direction are not required, the pre-alignment is not required again, and it can be directly carried into the detecting unit 21. Therefore, the standby time of the detecting portion 21 can be shortened, and the decrease in the yield can be suppressed. Furthermore, the substrate holding device 170 can pre-align the wafer w held by the substrate holding device 170, so that the wafer w can be oriented and the center position can be positioned to match the original wafer transfer arm 3 . The other detecting unit 21' that is different from the detecting unit 21 that is carried in during standby allows the wafer W to be moved to the other detecting unit 21 while maintaining its posture. As a result, the standby time of other detecting sections caused by the probe grinding process can be shortened, and the decrease in yield can be suppressed more. 29 201029088 In the present embodiment, the substrate storage unit 60 accommodates the probe polishing wafer Wb serving as a maintenance substrate. However, in the embodiment of the present invention, a probe for measuring the plurality of detection portions may be accommodated. Test substrate for the wafer of the test error. Further, the pre-alignment mechanism 40 according to the embodiment of the present invention is not limited to being mounted on the wafer transfer arm 3, and may be provided in a moving area of the wafer transfer arm 3 in the transfer chamber (in an area where access is possible). However, each time the pre-alignment is performed, the wafer transfer arm 3 needs to be moved to the β-pre-alignment mechanism and the transfer of the wafer W must be performed between the pre-alignment table and the arm 3 ,. The structure of this example is preferred. Further, examples of the position in which the pre-alignment mechanism 4 is disposed in the transfer chamber 1A may be, for example, the center of the transfer chamber 1 in the γ direction in FIG. 2, and the wafer transfer arm 3 is not hindered. Transfer the position of the wafer W that has been tested or load it to the position below 埠η (12). Further, the wafer transfer arm 3 of the present embodiment includes two arm bodies 35 36. However, in the embodiment of the present invention, for example, the substrate transfer mechanism may include three substrate support members. In the case of having three substrate support level components, the two substrate supports (four) of the three towels have wafers. Therefore, when performing probe polishing, one of the substrates needs to be supported, The wafers of the building are removed, but by the substrate holding device having the state of the present embodiment, the wafer can be removed without returning to the carrier. Therefore, the standby time of the detecting portion 21 can be shortened. Suppress the decline in production. Further, although the substrate holding devices 70 and 170 of the present embodiment are provided in the upper region of the substrate housing portion 60, the embodiment 30 201029088 of the present invention is not limited thereto, and for example, the area of the substrate housing portion is It can also be placed in the area below or on the side of the left or right side. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of a probe device of the embodiment. Fig. 2 is a schematic plan view of the probe device of the embodiment. Fig. 3 (4) and (b) are schematic side views of the probe device of the embodiment. Fig. 4 is a schematic perspective view of the wafer transfer arm of the embodiment. Fig. 5 is a schematic perspective view of the substrate holding device of the embodiment. Fig. 6 is a schematic side view of the substrate holding device of the embodiment. Fig. 7 (a), (b) and (c) are explanatory views for explaining the function of the substrate holding device of the embodiment. Fig. 8 (a), (b) and (c) are explanatory views for explaining the first state of the probe polishing process of the embodiment. Fig. 9 (a), (b) and (c) are second explanatory views for explaining the first state of the probe polishing process of the embodiment. Fig. 10 (a), (b) and (c) are first explanatory views for explaining the second state of the probe polishing process of the embodiment. Figs. 11(a), (b) and (c) are a second explanatory view for explaining a second state of the probe polishing process of the embodiment. Fig. 12 (a) and (b) are third explanatory views for explaining the second state of the probe polishing process of the embodiment. Figure 13 is a schematic perspective view of a substrate holding device according to another embodiment of the present invention. 31 201029088 Fig. 14 is a schematic side view showing a substrate holding device according to another embodiment of the present invention. Fig. 15 (a), (b) and (c) are first explanatory views for explaining the probe polishing process of another embodiment. Fig. 16 (a), (b) and (c) are second explanatory views for explaining the probe polishing process of another embodiment. [Description of main component symbols] 1 Mounting unit 2 Probe device body 3 Wafer transfer arm 4, 4b, 4c, 4d Wafer cooker 5 Control unit 6 Probe card 7 Probe needle 8 Lower side imaging unit 9 Upper side imaging unit 10 Transfer room 11 First load 埠12 Second load 埠13, 14 Case 15 and 16 Carry-in port 21 Detecting unit 22 Frame 23 Carry-in port 24 pedestal unit 25 Upper plate 30 Transfer base 31 Turning unit 32 Abutment Lifting portion 33 Base moving portion 35 First arm body 36 Second arm body 37 Guide 38, 39 Arm guide 40 Pre-alignment mechanism 41 Cooker portion 42 Sensor cross beam 43 Light sensor 44 Light passage portion

32 201029088 50 Probe test processing program 51 Interrupt control processing program 55, 56 Notch portion 61 Base 65 Claw portion 71 Support portion 73 Suction portion 75 Concavity portion 168 Installation portion 170 Substrate holding device 172 Sensor cross member 175 Light-emitting portion Wb Probe polishing wafer 60 substrate storage portion 62, 63, 64 carrier assembly 70 substrate holding device 72 wrist portion 74 vacuum suction hole 100 FOUP 169 flat plate 171 cookware portion 173 light sensor W wafer reference 33

Claims (1)

201029088 VII. Patent application scope: 1. A probe device which contacts an electrode sheet of a substrate to be detected on a mounting table with a probe of a probe card to measure electrical characteristics of a detected portion of the substrate, The present invention is characterized in that: the loading cassette is configured to mount a transfer container in which a plurality of substrates are housed; and the substrate transfer mechanism is disposed between the transfer container and the mounting table of the detecting unit mounted on the loading cassette; Substrate delivery, and having a plurality of substrate support assemblies that are independent of each other and free to advance and retreat, when the substrate is supported by the undetected substrate, there is an empty substrate support assembly; The substrate is transported to the detection unit, and the substrate transfer mechanism is moved inside. The μ structure is disposed in the transfer chamber, and has a turntable capable of fixing the substrate and rotating, and detecting a peripheral edge of the turntable The knowledge unit is taken from the transfer container; the substrate is oriented in the direction and the center portion; the substrate storage portion is disposed in the shaft feed chamber and the detection portion is housed. Maintenance maintenance work substrate; substrate holding means arranged in the conveying system of the substrate transfer mechanism to receive the substrate and the means for sorption; sigh Society and the suction holding 201,029,088 2.3. 4. 5. In the case of the maintenance operation of the detecting unit, the substrate supported by the substrate supporting unit can be held by the substrate holding device, and the maintenance substrate in the substrate receiving portion can be taken out by the substrate branch assembly. Exchange with the substrate on the mounting table. ^ Apply for patent scope! The probe device of the item, wherein the maintenance substrate is exclusively used (10) to grind the bristle needle probe needle substrate. The probe device of claim 1, wherein the substrate holding device is disposed adjacent to the upper, lower, left and right sides of the substrate housing portion. For example, in the probe device of the second application of the patent scope, the holding device of the Tongzhongye is adjacent to the probe device of the upper and lower sides of the substrate storage portion, as in the scope of the patent application scope, and the δ is further provided. a plurality of the detecting portions, wherein the control unit removes the substrate after the detection by the flaw detecting unit by the substrate branch unit, and the second detecting unit needs to interrupt the current processing to perform the In the case of maintenance work, the substrate supported by the substrate support assembly can be held in the substrate holding device to perform the maintenance work. 6. The probe device of claim 5, wherein in addition to the aforementioned pre-alignment mechanism, a pre-alignment mechanism is provided at the substrate holding device, and the substrate holding device has a pre-alignment rotary table The function is to pre-align the substrate held on it. 35