TWI773187B - Method and system for inspecting a wafer cassette - Google Patents

Abstract

The present invention discloses a method and system for inspecting a wafer cassette. During inspection, the wafer cassette is placed on a rotating platform, and a front side of the wafer cassette is facing a camera module. A left side, a right side and back side of the wafer cassette can be rotated respectively to face the camera module through the rotation of the rotating platform. The camera module will capture shot of the left side, right side and back side of the wafer cassette respectively at different time intervals, and lastly, a computer device will determine whether the wafer cassette is normal based on the images captured by the camera module.

Description

Method and system for inspecting a wafer cassette

The present invention relates to wafer cassettes, and more particularly, to a method and system for inspecting a wafer cassette.

Wafer cassette is a special container used to hold, protect and transport multiple wafers, such as Front Opening Unified Pod (FOUP) and Front Opening Wafer Supply Box (FOSB), which are common in the semiconductor industry. , Front Opening Shipping Box), the former is mainly used for wafer transportation between workstations in the same factory, and the latter is used for wafer transportation between factories. In any case, this type of wafer cassette at least includes a cover, a box body, and a cover placement rack and an inner cassette placement rack respectively disposed on the inner surface of the box cover and the inside of the box body, and a top outside the box body. The face, bottom face, left face, right face and rear face are each equipped with one or more accessories. A base, two grips provided on the left and right sides respectively...etc.

After the wafer cassette is used, there is usually a need for cleaning. The above-mentioned accessories and box cover can be removed from the box body for cleaning, and the inside and outside of the box body itself also need to be cleaned. After the above cleaning operation is completed, the removed accessories and the box cover need to be installed back to the box body, but there is no guarantee whether the removed accessories and the box cover are correctly and completely installed back without abnormality. . Therefore, it is necessary to check the condition of the wafer cassettes, so as to pick out abnormal wafer cassettes, and ensure that the wafer cassettes used in the above-mentioned transportation situations are normal.

The present invention provides a method for detecting a wafer cassette, so as to detect the condition of the wafer cassette, so as to pick out abnormal wafer cassettes, such as abnormal wafer cassettes with missing parts. The wafer box to be tested includes a box body and a box cover that is closed on the box body. The method includes: respectively photographing a top surface and a front side surface of the wafer box that has been covered with the box cover. ; Removing the box cover; respectively photographing a left side, a box mouth, a right side and a rear side of the wafer box with the box cover removed; replacing the box cover; the wafer box and a computer device detects the condition of the wafer box according to the captured image.

In one embodiment, the method of the present invention utilizes a main photographing module to perform the above-mentioned photographing. The main photographing module includes a first photographing device and a second photographing device, the first photographing device includes a video lens, and the first photographing device includes a video lens. The second shooting device includes a telecentric lens.

In one embodiment, the method of the present invention includes that when the main photographing module is photographing the opening of the wafer cassette, a photographing module on the inside of the cassette cover is directed to an inner side of the cassette cover for photographing. .

In one embodiment, the method of the present invention includes, before the main photographing module photographing the top surface of the wafer cassette with the cover covered, using a lid-closing condition photographing module to photograph the wafer cassette The two sides of the top surface close to the front edge are photographed, and the computer device judges whether the box cover is closed according to the image captured by the photographing module in the closed state.

In one embodiment, the method of the present invention includes, after the box cover is put back into the wafer box, and before the main camera module takes pictures of the bottom surface of the wafer box, capturing the camera by a lid-closing status camera module. The top surface of the wafer box is photographed on both sides of the area near the front edge, and the computer device determines whether the box cover is properly closed according to the image captured by the camera module in the closed state.

In one embodiment, the method of the present invention includes using the above-mentioned cover-closing state photographing module and the computer device to perform the above-mentioned two detections, so as to determine whether the box cover is properly closed.

In one embodiment, the method of the present invention includes, after removing the box cover, photographing an inner side surface of the box cover by a camera module inside the box cover.

In one embodiment, the method of the present invention includes reading a parameter barcode on the rear side of the wafer cassette by a parameter reading device before the main shooting module performs shooting, and the computer device determines the desired parameter according to the barcode data. Which set of detection parameters to use for detection.

In one embodiment, the method of the present invention includes reading a box body barcode and a box cover barcode respectively located on the wafer cassette by a group of identification and reading devices before the main shooting module performs shooting, and the computer device according to The box body barcode and the box cover barcode determine whether the box cover belongs to the box body.

The present invention further provides a system for inspecting the above-mentioned wafer cassette. The system includes a rotating platform, a main photographing module and a computer device. The rotating platform is used to place the wafer cassette, and is configured to move from a preparation area into an inspection area, and to rotate so that the wafer cassette rotates accordingly. The main photographing module is located in the inspection area, and is used for photographing the wafer cassette that has entered the inspection area. The computer device can detect the condition of the wafer cassette according to the image captured by the main photographing module.

In one embodiment, the system of the present invention includes a multi-axis robot arm disposed in the detection area, the multi-axis robot arm is located in front of the rotating platform and connected to the main camera module, so as to move and transform the main camera module s position.

In one embodiment, the system of the present invention includes a box cover loading and unloading mechanism disposed on one side of the detection area, the box cover loading and unloading mechanism is configured to be able to remove or install the box cover, and to remove the box. The lid is turned from the upright position to the lying-flat position so that an inner side of the box lid faces upwards.

In one embodiment, the system of the present invention includes a box cover inner side photographing module disposed above the box cover mounting and dismounting mechanism and coupled to the computer device, and the box cover inner side shooting module is used for facing the box cover. The inner side surface is photographed, and the computer device detects the inner side surface of the box cover according to the image captured by the camera module inside the box cover.

In one embodiment, the system of the present invention includes a pick-up gripper disposed above the inspection zone, the pick-up gripper configured to move laterally, vertically, and grasp the head of the wafer cassette.

In one embodiment, the system of the present invention includes a removal platform disposed within the action range of the lifting jaw, the removal platform is located on one side of the inspection area to receive the wafer cassette sent by the lifting jaw and move the cassette to a waiting area.

In one embodiment, the system of the present invention includes a box cover loading and unloading mechanism and a removal platform respectively disposed on both sides of the detection area, and a lifting gripper disposed above the detection region. The box cover loading and unloading mechanism is configured to The cassette cover can be removed or installed, the lifting jaws are configured to be able to move laterally, vertically lift and grasp the head of the wafer cassette, and the removal platform is used for receiving the lifting jaws. The wafer cassette and moving the wafer cassette to a waiting area.

In one embodiment, the system of the present invention includes a parameter reading device disposed in the preparation area and coupled to the computer device, the parameter reading device being used to read a parameter located on a rear side of the wafer cassette bar code, the computer device selects the corresponding detection parameter according to the parameter bar code.

In one embodiment, the system of the present invention includes a group determination reading device disposed in the inspection area and coupled to the computer device, and the group determination reading device is used for reading a right side of the wafer cassette. A box body barcode on the surface and a box cover barcode on a front side of the wafer cassette, the computer device judges whether the box cover belongs to the box body according to the box body barcode and the box cover barcode read.

The present invention also provides a method for detecting a wafer cassette, so as to detect the condition of the wafer cassette, so as to pick out abnormal wafer cassettes, such as abnormal wafer cassettes with missing parts. The method includes: placing the wafer cassette on a rotating platform in a preparation area, so that the rotating platform supports a bottom surface of the wafer cassette, and a front side of the wafer cassette faces a front; The rotating platform is moved from the preparation area into a detection area; the rotating platform already located in the detection area is rotated, so that a left side, a right side and a rear side of the wafer cassette which are rotated along with it, turn towards the front side in turn ; use a main photographing module to photograph the front side, left side, right side and back side of the wafer cassette from the front, and transmit the photographed images to a computer device; and by the computer The device detects the condition of the wafer cassette according to the image captured by the main photographing module.

In one embodiment, when the main camera module of the present invention shoots the front side of the wafer cassette, a cover of the wafer box has not been removed, so that the main camera module is aimed at the front side. The captured image includes an outer side surface of the box cover.

In one embodiment, the method of the present invention includes dismounting the box cover with a box cover mounting and dismounting mechanism immediately after the main camera module completes the shooting of the front side of the wafer box, and then starts to separate the The left side, the right side and the rear side of the wafer cassette are photographed, and then the cassette cover is replaced by the cassette cover mounting and dismounting mechanism.

Compared with the prior art, the above-mentioned method and system of the present invention can photograph the above-mentioned wafer cassette, and use the above-mentioned computer to perform image detection on the photographed image, so as to pick out abnormal wafer cassettes, such as an abnormality with missing parts Wafer box.

1 shows a preferred embodiment of the system of the present invention, which mainly includes a rotating platform 3 located in a detection area 10 , a main camera module 5 located in the detection area 10 and a computer coupled to the main camera module 5 device (not shown). In this embodiment, the main photographing module 5 is arranged on a multi-axis robot arm 4, and the multi-axis robot arm 4 is arranged in front of the rotating platform 3, but it is not limited to this.

The rotating platform 3 usually stays in a preparation area (not shown in the figure) outside the inspection area 10. After a wafer cassette 100 to be inspected is placed on it, it moves from the preparation area along a Y-axis rail device 31 from the preparation area. Move into the detection area 10 . Usually, the detection area 10 and the preparation area are usually separated by a casing 10a, the detection area 10 is located inside the casing 10a, and the preparation area is located outside the casing 10a. In addition, the casing 10a retains a passage opening 10b, so that the rotating platform 3 originally located in the preparation area can move along the Y-axis slide rail device 31 through the passage opening 10b into the inspection area 10, or withdraw from the inspection area 10 to the preparation area Area.

The wafer cassette 100 placed on the rotating platform 3 and reaching the inspection area 10 along with the rotating platform 3 is photographed by the main photographing module 5 . For example, when it is desired to photograph a certain side of the wafer cassette 100 (such as a left side 13 or a right side 14 shown in FIGS. 2 to 3 ), the computer device can rotate the rotating platform 3 to make the certain side One side faces the position of the main photographing module 5 , so that the main photographing module 5 can photograph the one side of the wafer cassette 100 . In this way, the main photographing module 5 can respectively photograph different sides of the wafer cassette 100 at different time points, and transmit the photographed images to the computer device for automatic optical inspection (AOI) to judge the wafer cassette Whether 100 is normal will be described in detail later. In this embodiment, the main photographing module 5 is moved to its desired position by the multi-axis robotic arm 4, so the main photographing module 5 can also photograph a top surface 11 and a bottom surface 16 of the wafer cassette 100 (see FIG. 2 to 3), which will be described later. In addition, the multi-axis robotic arm 4 can also be replaced by other transfer devices, that is, any transfer device that can move the main photographing module 5 to any spatial position it wants to reach can be selected to replace the multi-axis Robotic arm 4.

FIG. 2 shows that the wafer cassette 100 to be inspected in this embodiment is a front-opening wafer transfer pod (FOUP), but this is only an example for the convenience of explaining the present invention, and is not limited in practice. The round box 100 may also be a Front Opening Shipping Box (FOSB).

As shown in FIG. 2 and FIG. 3 , the wafer cassette 100 includes a box body 1 and a box cover 2 , and the box cover 2 is closed on a box opening 101 of the box body 1 . The wafer cassette 100 further includes a plurality of accessories, for example, a head 111 (commonly known as a mushroom head) located on the top surface 11 of the wafer cassette 100 and gripped by a mechanical gripper (not shown in the figure), a head 111 (commonly called a mushroom head) located on the wafer cassette Two locking holes 121 on a front side 12 of the 100 , a left handle 131 and a left wing (not shown in the figure, not necessary) located on the left side 13 of the wafer cassette 100 , located on the right side of the wafer cassette 100 A right handle 141 and a right wing (not shown in the figure, not necessary) of the 14 , and a wafer placement rack (not shown in the figure) located in the wafer cassette 100 . The left and right wings are mainly used for another transfer machine, and the wafer placement rack is mainly used for placing wafers. Wherein, the wafer placement rack has multiple layers of placement slots for placing a wafer respectively, and the wafer placement rack is composed of a main rack body located in the box body 1 and an inner side surface of the box cover 2 of an auxiliary frame. An outer side of the box cover 2 is the front side 12 of the wafer cassette 100 , and the outer side of the box cover 2 is transparent. In addition, two lock bolt mechanisms (not shown in the figure) are also provided in the box cover 2 corresponding to the two lock holes 121. After two keys (not shown in the figure) are inserted into the two lock holes 121 respectively, the two keys can be rotated to The two locking bolt mechanisms are driven into an unlocked state or a locked state. Wherein, when the two locking bolt mechanisms are in the locked state, the two locking holes 121 are both upright, and the box cover 2 is locked and cannot be removed from the box body 1 at this time. As shown in FIG. 4 , when the two locking mechanisms are in the unlocked state, the two locking holes 121 are both horizontal, and the box cover 2 has been unlocked and can be detached from the box body 1 .

The main photographing module 5 can be a single photographing device or includes a plurality of photographing devices. In this embodiment, as shown in FIG. 1 , the main photographing module 5 includes a first photographing device 51 and a second photographing device 52 . A photographing device 51 can be a side scanning camera, which has a CCTV lens, and the second photographing device 52 can be a machine vision camera, which has a telecentric lens, depending on the items to be detected. Decide which camera to use for shooting.

In this embodiment, the main shooting module 5 is transferred by the multi-axis robot arm 4 to change its position. However, in another embodiment, multiple transfer mechanisms can be used to replace the multi-axis robot arm 4. The plurality of photographing devices of the module 5 can be respectively arranged in the aforementioned transfer mechanism, so that each of the photographing devices can be transferred by the aforementioned transfer mechanism to the position where they want to shoot.

Preferably, as shown in FIG. 1 , if it is necessary to further detect the function of the inside of the box body 1 , the system of the present invention can further include a box cover loading and unloading mechanism 6 for loading and unloading the box cover 2 . In this embodiment, the box cover attachment and detachment mechanism 6 is arranged on the right side of the rotating platform 3, but it can also be arranged on the left side of the rotating platform 3 or other positions. In any case, the box cover mounting and dismounting mechanism 6 includes a support plate 61 , a plurality of vacuum suction devices 62 and two rotary key devices 63 arranged on the support plate 61 . The cover loading and unloading mechanism 6 is usually located at an original position at a distance from the rotating platform 3. When it is necessary to detect the internal conditions of the wafer cassette 100 on the rotating platform 3, the box cover loading and unloading mechanism 6 can be along an X-axis slide rail device 60. It moves from the original position shown in FIGS. 1 and 5 to a loading and unloading position shown in FIG. 6 . Before that, as shown in FIG. 5 , the rotating platform 3 has been rotated 90 degrees clockwise, so that the front side 12 of the wafer cassette 100 (ie, the outer side of the cassette cover 2 ) is turned to face the cassette cover loading and unloading mechanism 6 . At this time, the left side 13 of the wafer cassette 100 just faces the multi-axis robot arm 4 and the main camera module 5 .

As shown in FIG. 6 , in the loading and unloading position, the support plate 61 has been pressed against the box cover 2 , and the suction cups 621 of each vacuum suction device 62 shown in FIGS. 1 and 5 have sucked the outer side of the box cover 2 , the keys 631 of the two auto-rotating key devices 63 have respectively protruded into the two locking holes 121 on the box cover 2 . Then, the two auto-rotating key devices 63 drive their keys 631 to rotate to an unlocking position, and can drive the two locking bolt mechanisms in the box cover 2 to enter the unlocking state. Then, as shown in FIG. 7 , the box cover mounting and dismounting mechanism 6 returns to the original position, and at the same time, the box cover 2 sucked by the vacuum suction device 62 returns to the original position along with the box cover mounting and dismounting mechanism 6 , so that The cassette opening 101 of the wafer cassette 100 is exposed. At this point, the cover attaching and detaching mechanism 6 has completed the operation of removing the box cover 2 . If you want to put the box cover 2 back in its original position and lock it, you only need to perform the above-mentioned actions in reverse, which will not be repeated. In short, the cover removal mechanism 6 can remove or replace the cover 2 from the wafer cassette 100 .

Preferably, if the inner side surface of the box cover 2 needs to be further inspected, the box cover mounting and dismounting mechanism 6 can further include a telescopic cylinder 64, and the support plate 61 can be configured to be able to be turned forward and backward. In this way, after the box cover 2 is returned to the original position with the box cover mounting and dismounting mechanism 6, the support plate 61 is continuously pulled back by the telescopic cylinder 64, so that the support plate 61 together with the box cover 2 on it can be removed from the original position. As shown in FIG. 8, the inner side surface 20 of the box cover 2 presents a state of facing upward, so as to be arranged above the box cover loading and unloading mechanism 6 and coupled to the box cover 2. The photographing module 7 inside a box cover of the computer device photographs it. 7 and 8 have omitted a sealing rubber ring around the inner side surface 20 of the box cover 2, and the auxiliary frame body located on the inner side surface 20 of the box cover 2 has been omitted.

Preferably, in order to further detect the bottom surface 16 of the wafer cassette 100, as shown in FIG. 9, the system of the present invention may further include a lifting gripper 8 disposed above the rotating platform 3, and the lifting gripper 8 is also configured to The head 111 of the wafer cassette 100 can be moved laterally, vertically lifted, and grasped. As shown in FIG. 10 , after the lifting jaw 8 grasps the head 111 and rises, the wafer cassette 100 rises accordingly. At this time, the rotating platform 3 returns from the inspection area 10 to the preparation area, so that the wafer cassette 100 An empty space is formed under the bottom surface 16 of the pod, so that the multi-axis robotic arm 4 can move the main shooting module 5 to a shooting position in the containing space to shoot the bottom surface 16 of the wafer cassette 100 .

It can be seen from the above description that the system of the present invention can make the main camera module 5 face the front side 12, left side 13, right side 14 and The rear side 15 is photographed to obtain one or more front side images, left side images, right side images and rear side images. In further cooperation with the multi-axis robotic arm 4, the main photographing module 5 can photograph the top surface 11 of the wafer cassette 100 to obtain one or more top surface images. Preferably, the box cover 2 can also be removed by the selectively configurable box cover loading and unloading mechanism 6, so that the main shooting module 5 can shoot the inside of the box mouth 101 and/or the box body 1 to obtain an or Multiple images in the box. More preferably, the box cover mounting and dismounting mechanism 6 is also configured to be able to flip the removed box cover 2, so that the inner side surface 20 of the box cover 2 faces upwards, so that the camera module 7 on the inside of the box cover, which can be selectively configured, is opposite. The inner side surface 20 of the box cover 2 is photographed to obtain one or more images of the inner side of the box cover. In addition, the system of the present invention can also lift the wafer cassette 100 from the rotating platform 3 to a height by means of the pick-up gripper 8 that can be selectively configured, so that the main camera module 5 on the multi-axis robot arm 4 faces the The bottom surface 16 of the wafer cassette 100 is photographed to obtain one or more bottom surface images.

After receiving the above-mentioned images, the computer device can process the images through an automatic optical inspection algorithm to detect whether the condition of the wafer cassette 100 is normal.

At least one inspection method that can be performed by the pod inspection system exemplified above is described below, but the inspection method is not limited to being performed by the system. In addition, not all of the detection items mentioned below need to be carried out, and one or more items can be selected and carried out as needed, of course, all of them can be carried out.

First, as shown in FIG. 1, the rotating platform 3 has come to the detection area 10. At this time, the wafer cassette 100 on the rotating platform 3 has been covered with the cassette cover 2 and locked, and the front side 12 of the wafer cassette 100 is Facing forward and facing the multi-axis robotic arm 4 and the main camera module 5 .

Initially, as shown in FIG. 11 , the main photographing module 5 has been moved by the multi-axis robotic arm 4 to a photographing position above the rotating platform 3 , and its first photographing device 51 faces the top surface 11 of the wafer cassette 100 Shooting is performed, and then the one or more top images captured are transmitted to the computer device. Since the top surface image includes the top surface 11 of the wafer cassette 100 and related accessories (such as the head 111 ), the computer device can use the top surface image to detect whether the condition of the top surface 11 of the wafer cassette 100 is normal. . For example, it is detected whether the distance D (see FIG. 2 ) between a center point of the head 111 and a front edge of the top surface 11 of the wafer cassette 100 conforms to a standard distance (this is equivalent to detecting whether the position of the head 111 is Correct), and/or detect whether the head 111 is missing (or broken), and/or detect whether there is a missing component that is not installed on the head 111 . If any of the aforementioned detection results of the computer device are out of specification or missing parts, it means that the wafer cassette 100 is abnormal.

Next, as shown in FIG. 12 , the multi-axis robotic arm 4 continues to move the main photographing module 5 to a photographing position in front of the rotating platform 3 , so that the first photographing device 51 of the main photographing module 5 faces the wafer cassette 100 The front side 12 of the camera is photographed, and one or more front side images obtained by shooting are transmitted to the computer device. It should be noted that the main photographing module 5 is not limited to the above-mentioned photographing sequence, for example, it can also be changed to photograph the front side image first, and then photograph the top side image.

Since the front profile image includes the front side 12 of the pod 100 and related accessories (such as the left and right side flaps, if any), the computer device can use the front profile image to detect the pod 100 Whether the condition of the front side 12 is normal is equivalent to detecting whether the condition of the outer side of the box cover 2 is normal. For example, detecting whether there are missing parts on the outer side of the box cover 2 with screws not installed, and/or detecting whether there are missing parts in which the left and right side flaps are not installed, and/or whether the two locking holes 121 are missing parts Both are upright (this is equivalent to detecting whether the box cover 2 is locked by the two locking mechanisms), and/or detecting whether the head 111 is warped or deformed. If there are any missing parts or deformations in the aforementioned detection results of the computer device, or if any of the locking holes 121 are not upright, it means that the wafer cassette 100 is abnormal.

As shown in FIG. 13 , after the main photographing module 5 completes the shooting of the above-mentioned top surface image and front side image, the box cover 2 is removed by the box cover assembling and dismounting mechanism 6 . The operation process has been described above and will not be repeated. Since the left side 13 of the wafer cassette 100 with the cassette cover 2 removed just faces the main photographing module 5, the first photographing device 51 of the main photographing module 5 faces the pod 100 with the cassette cover 2 removed. The left side 13 shoots, and transmits one or more left side images obtained by shooting to the computer device. It should be noted that, the main photographing module 5 can be changed to photograph the left side image before or at the same time when the lid assembling and dismounting mechanism 6 unloads the lid 2 from the box body 1 .

Since the left side image includes the left side 13 of the wafer cassette 100 and related accessories (eg, the left handle 131 and the head 111 ), the computer device can use the left side image to detect the left side 13 of the wafer cassette 100 condition is normal. For example, it is detected whether the left grip 131 has any missing parts, and/or whether the head 111 is warped and deformed. If there is any missing part or deformation in the aforementioned detection result of the computer device, it means that the wafer cassette 100 is abnormal.

Next, as shown in FIG. 14, the rotating platform 3 is rotated to the position where the cassette opening 101 of the wafer cassette 100 from which the cassette cover 2 has been removed faces the main photographing module 5. In this embodiment, the rotating platform 3 is It is rotated 90 degrees counterclockwise. Then, the second photographing device 52 of the main photographing module 5 photographs the cassette opening 101 of the wafer cassette 100 , and transmits the photographed one or more images inside the cassette to the computer device.

Since the above-mentioned in-box image contains the scene of the wafer cassette 100 viewed from the cassette opening 101 and related accessories (such as the main frame of the above-mentioned wafer placement rack), the computer device can utilize the above-mentioned in-box image to view It is checked whether the condition of the inside of the wafer cassette 100 is normal. For example, detecting whether the main frame of the wafer placement rack has any missing parts that are not installed, and/or detecting whether the height of each placement slot of the main rack of the wafer placement rack conforms to a Standardize the height, and/or detect whether there are leftover wafers on the main frame of the wafer carrier. If any of the aforementioned inspection results of the computer device are out of specification, missing parts or left wafers, it means that the wafer cassette 100 is abnormal.

As shown in FIG. 8 , while the main photographing module 5 is performing the above-mentioned photographing of the images in the box, the photographing module 7 on the inside of the box cover is also photographing the inner side surface 20 of the box cover 2, and an image obtained by the photographing is captured. or multiple images of the inside of the box cover are transmitted to the computer device. It should be pointed out that the above-mentioned shooting of the inside image of the box cover can be changed before the shooting of the left side image or the inside of the box. At any point in time, the aforementioned images of the inside of the box cover can be photographed.

Since the image of the inside of the box cover includes the inner side surface 20 of the box cover 2 of the wafer cassette 100 and related accessories (eg, the auxiliary frame of the wafer placement rack, the sealing rubber ring), the computer device can utilize The above-mentioned image of the inner side of the box cover is used to detect whether the inner side surface 20 of the box cover 2 of the wafer cassette 100 is normal. For example, detecting whether the auxiliary frame of the wafer placement rack has any missing parts, and/or detecting whether the height of each placement groove of the auxiliary frame of the wafer placement rack conforms to a Standardize the height, and/or detect whether the sealing rubber ring protrudes from the periphery of the box cover 2, and/or detect whether the box cover 2 is deformed, and/or detect the center point of the box cover 2 to the edge of the box cover 2. Whether the horizontal distance and vertical distance meet the corresponding standard distance. If the aforementioned detection result of the computer device has any irregularities, missing parts, deformation, or protruding of the sealing rubber ring, it means that the wafer cassette 100 is abnormal.

Preferably, the camera module 7 on the inside of the box cover can be configured to move vertically and horizontally above the inner side surface 20 of the box cover 2. For example, the inner side surface 20 can be divided into four areas. Module 7 moves to the top of each area in sequence to shoot. This is to measure the 3D height difference of the four regions, so as to detect whether the box cover 2 is deformed. In addition, a 3D height measuring device (not shown in the figure), such as a white light interferometer, which can move together with the camera module 7 on the inside of the box cover can also be configured, so that the 3D height measuring device can be used to measure the height. Perform the aforementioned height difference measurement.

After the camera module 7 on the inside of the box cover completes the shooting of the image inside the box cover, the support plate 61 of the box cover mounting and dismounting mechanism 6 is turned back to its original position under the push of the telescopic cylinder 64 and is in an upright position, located on the support plate 61 The box cover 2 is also in an upright position, which is in preparation for putting the box cover 2 back into the box body 1 .

As shown in FIG. 15 , after the main shooting module 5 completes the shooting of the above-mentioned images in the box, the rotating platform 3 is rotated in the reverse direction. The wafer cassette 100 of the cassette cover 2 is then rotated to a position where the right side 14 faces the main photographing module 5 . Then, the first photographing device 51 of the main photographing module 5 photographs the right side surface 14 of the wafer cassette 100 , and transmits one or more images of the right side surface obtained by photographing to the computer device.

Since the right side image includes the right side 14 of the wafer cassette 100 and related accessories (eg, the right handle 141 and the head 111 ), the computer device can use the right side image to detect the right side of the wafer cassette 100 Is the condition normal. For example, it is detected whether the right grip 141 has any missing parts, and/or whether the head 111 is warped or deformed. If there is any missing part or deformation in the aforementioned detection result of the computer device, it means that the wafer cassette 100 is abnormal.

As shown in FIG. 16 , after the main shooting module 5 completes the shooting of the above-mentioned right side image, the rotating platform 3 is rotated in the reverse direction again. The wafer cassette 100 of the lower cassette cover 2 is then rotated to a position where the rear side 15 faces the main photographing module 5 . Then, the first photographing device 51 of the main photographing module 5 photographs the rear side 15 of the wafer cassette 100, and transmits one or more rear side images obtained by photographing to the computer device.

Since the above-mentioned rear side image contains the rear side 15 of the wafer cassette 100 and related accessories, such as screws, message sheets or multi-color paper cards for identifying the information of the wafer cassette (ie, the so-called AG card), the computer device The above-mentioned rear side image can be used to detect whether the condition of the rear side 15 of the wafer cassette 100 is normal. For example, detecting whether the screws on the transparent window on the rear side 15 are missing or not, and/or detecting the existence of non-transparent foreign objects (such as AG cards or message sheets). If there are any missing parts or foreign objects in the aforementioned detection results of the computer device, it means that the wafer cassette 100 is abnormal.

After the main shooting module 5 completes the shooting of the above-mentioned rear side image, the rotating platform 3 is rotated forward. In this embodiment, the rotating platform 3 is rotated 270 degrees clockwise, so that the wafer cassette with the cassette cover 2 has been removed. 100 is then rotated to a position where the opening 101 of the box faces the cover mounting and dismounting mechanism 6 , as shown in FIG. 7 . Then, the box cover assembling and dismounting mechanism 6 is made to cover the box cover 2 back to the box opening 101 and lock it.

After the cover assembling and dismounting mechanism 6 covers the box cover 2 back to the box opening 101, the rotating platform 3 is rotated in the reverse direction. The box 100 is then rotated to a position where the front side 12 faces the main photographing module 5 . At this time, as shown in FIG. 9 and FIG. 10 , the wafer cassette 100 is lifted by the lifting gripper 8 and the bottom surface 16 of the wafer cassette 100 is photographed by the first photographing device 51 of the main photographing module 5 . One or more images of the bottom surface obtained by shooting are transmitted to the computer device.

Since the bottom surface image includes the bottom surface 16 of the wafer cassette 100 and related accessories (such as screws, input ports and output ports for gas filling, and information pads for foolproofing), the computer device can use the bottom surface image to detect Whether the condition of the bottom surface 16 of the wafer cassette 100 is normal. For example, to detect whether there are missing parts that are not installed on the screws, and/or to detect whether there are missing parts that are not installed in the input port and output port for gas filling, and/or to detect whether the information pads for foolproofing are plugged into the correct hole. If there are any missing parts or the information pads are not inserted into the correct holes in the aforementioned detection results of the computer device, it means that the wafer cassette 100 is abnormal.

Preferably, as shown in FIG. 9 and FIG. 10 , the system of the present invention may further include a cover-closing state photographing module 71 disposed above the rotating platform 3 and coupled to the computer device. In order to save space, the camera module 71 for the closing state and the gripping jaw 8 use the same moving configuration, so the camera module 71 for capturing the closing state and the gripping jaw 8 can move laterally and vertically together. Before the above-mentioned condition detection of the wafer cassette 100 is performed, if necessary, the cover condition photographing module 71 and the computer device can be used to detect whether the cassette cover 2 is closed properly. In addition, if the cassette cover 2 is detached from the pod 100 by the cassette cover attaching and detaching mechanism 6 during the condition detection of the pod 100 described above, after the cassette cover 2 is put back into the pod 100, the cassette cover 2 may be The cover state photographing module 71 and the computer device are used to check again whether the box cover 2 is properly closed. As shown in FIG. 17 , the lid-closing state photographing module 71 mainly photographs the two side areas 11 a of the top surface 11 of the wafer cassette 100 close to the front edge. Therefore, it can be judged whether the box cover 2 has been closed according to the size of the seam. If the aforementioned detection result of the computer device indicates that the cassette cover 2 is not properly closed, it means that the wafer cassette 100 is abnormal.

As can be seen from the above description, the photographing method in the above method of the present invention is: before removing the cassette cover 2 from the wafer cassette 100 , the main photographing module 5 respectively takes pictures of the top surface 11 and the front side surface 12 of the wafer cassette 100 . After the cassette cover 2 is removed from the wafer cassette 100 , the main photographing module 5 respectively photographs the left side surface 13 , the cassette opening 101 , the right side surface 14 and the rear side surface 15 of the wafer cassette 100 .

Preferably, after the cassette cover 2 is put back into the wafer cassette 100 , the main photographing module 5 is directed to the bottom surface 16 of the wafer cassette 100 to photograph.

Preferably, while the main photographing module 5 is photographing the cassette opening 101 of the wafer cassette 100 , the photographing module 7 inside the cassette cover is photographing the inner side of the cassette cover 2 .

Preferably, before the main photographing module 5 shoots the top surface 11 of the wafer cassette 100 , the lid-closing state photographing module 71 faces the top surface 11 of the wafer cassette 100 and is close to the two sides of the front edge respectively. to shoot.

Preferably, before the main photographing module 5 photographs the bottom surface 16 of the wafer cassette 100 , the lid-closing state photographing module 71 respectively photographs the two side regions 11 a of the top surface 11 of the wafer cassette 100 close to the front edge. .

The image obtained by the above shooting is processed by the computer device to detect whether any of the above abnormal conditions occurs in the wafer cassette 100. If there is, it means that the wafer cassette 100 is abnormal, and if not, it means that the wafer cassette 100 is normal. And enough for normal use.

Preferably, as shown in FIG. 1 , the system of the present invention may further include a moving platform 9 arranged within the action range of the lifting jaw 8 . The moving platform 9 is similar to the rotating platform 3 , and the difference is mainly that the moving platform 9 There is no turning function. After the main photographing module 5 completes the above-mentioned photographing of the bottom image, the moving platform 9 has moved from a waiting area (not shown in the figure) outside the casing 10a through another passage opening 10c of the casing 10a to reach the surface of the rotating platform 3 On the side, the lifting gripper 8 grabs the wafer cassette 100 to the removal platform 9, and then the wafer cassette 100 is moved to the waiting area by the removal platform 9, waiting for an operator or a transport device to deliver it to the next A work station area.

Preferably, as shown in FIG. 18, the system of the present invention may further include a parameter reading device 72 disposed in the preparation area and coupled to the computer device, when the wafer cassette 100 is placed in the preparation area. When on the rotating platform 3, the parameter reading device 72 can read a parameter bar code 151 located under the rear side 15 of the wafer cassette 100, and transmit the bar code data read from the parameter bar code 151 to the computer device. The computer device can decide which set of detection parameters to use for detection according to the barcode data. If the barcode 151 cannot be read or the corresponding detection parameter cannot be found according to the barcode data, a corresponding warning notice is issued, and an operator (or a transport device) takes out the wafer cassette 100 . After that, the operator (or the transport device) can place another wafer cassette to be inspected on the rotating platform 3 .

Preferably, as shown in FIG. 19 , the system of the present invention may further include a group of judgment reading devices 73 disposed in the detection area 10 and coupled to the computer device. When the rotating platform 3 reaches the detection area 10 , the group judgment reading device 73 first reads a box barcode (not shown) located under the right side 14 of the wafer cassette 100 , and then rotates on the rotating platform 3 . When the front side 12 of the wafer cassette 100 faces the cover attaching and detaching mechanism 6, as shown in FIG. (not shown in the picture). Then, the computer device determines whether the box cover 2 belongs to the box body 1 according to the barcode of the box body and the barcode of the box cover read by the reading device 73 according to the group. If the judgment result is "Yes", it means that the box cover 2 and the box cover The boxes 1 are in the same group, and there is no wrong cover of the box. At this time, the above-mentioned detection will be continued. However, if the judgment result is "No", it means that the box cover is wrongly covered. At this time, a corresponding warning notice will be issued and the rotating platform 3 will be returned to the preparation area, and the operator (or the conveying device) will The wafer cassette 100 is removed.

From the above, it can be seen that the above-mentioned method and system of the present invention can photograph the above-mentioned wafer cassette, and use the above-mentioned computer to perform a series of image inspections on the captured images (which may be one of the above-mentioned inspection items or multiple or all) in order to pick out abnormal cassettes, such as those with missing parts.

1: Box body 100: Wafer cassette 10: Detection area 10a: Chassis 10b: channel port 10c: channel port 11a: Area 101: Box mouth 11: Top surface 111: Head 12: Front side 121: keyhole 13: Left side 131: Left Grip 14: Right side 141: Right grip 15: rear side 151: Parameter barcode 16: Bottom 2: box cover 20: inner side 3: Rotating platform 31: Y-axis slide rail device 4: Multi-axis robotic arm 5: Main shooting module 51: The first shooting device 52:Second Shooting Device 6: Box cover loading and unloading mechanism 60: X-axis slide rail device 61: Support plate 62: Vacuum adsorption device 621: Sucker 63: Auto-rotating key device 631: Key 64: Telescopic cylinder 7: Shooting module inside the box cover 71: Covering condition shooting module 72: Parameter reading device 73: Group judgment reading device 8: Lift the gripper 9: Move off the platform

FIG. 1 shows a schematic top plan view of a preferred embodiment of the system for inspecting a wafer cassette of the present invention. FIG. 2 shows a schematic perspective view of the wafer cassette 100 to be inspected. FIG. 3 shows a schematic front side view of the wafer cassette 100 in a locked state. FIG. 4 shows a schematic front side view of the wafer cassette 100 in an unlocked state. 5 to 8 show schematic diagrams of the action of the box cover attaching and detaching mechanism 6 . FIG. 9 to FIG. 10 are schematic diagrams showing the operation of the main photographing module 5 to photograph the bottom surface 16 of the wafer cassette 100 . FIG. 11 to FIG. 16 are schematic diagrams showing the action of the main photographing module 5 photographing other sides of the wafer cassette 100 . FIG. 17 shows a schematic diagram of the area 11a that the photographing module 71 intends to photograph in the closed state. FIG. 18 is a schematic diagram showing the operation of the parameter reading device 72 . 19 and 20 are schematic diagrams showing the operation of the group judgment reading device 73 .

100: Wafer cassette

10: Detection area

10a: Chassis

10b: channel port

10c: channel port

111: Head

12: Front side

131: Left Grip

141: Right grip

2: box cover

3: Rotating platform

31: Y-axis slide rail device

4: Multi-axis robotic arm

5: Main shooting module

51: The first shooting device

52:Second Shooting Device

6: Box cover loading and unloading mechanism

60: X-axis slide rail device

61: Support plate

62: Vacuum adsorption device

621: Sucker

63: Auto-rotating key device

631: Key

64: Telescopic cylinder

8: Lift the gripper

9: Move off the platform

Claims (20)

A method for detecting a wafer box, the wafer box includes a box body and a box cover covering the box body, the method includes: Take pictures on the top surface and a front side; remove the box cover; take pictures of a left side, a box mouth, a right side and a rear side of the wafer cassette with the box cover removed; A box cover; a bottom surface of the wafer box is photographed; and a computer device detects the condition of the wafer box according to the captured image. The method according to claim 1, wherein the shooting is performed by a main shooting module. The method according to claim 2, comprising: while the main photographing module is photographing the opening of the wafer cassette, a photographing module inside the lid is directed to an inner side of the lid. . The method as claimed in claim 2, comprising: before the main photographing module photographs the top surface of the wafer cassette with the cover covered, the wafer cassette is photographed by a cover condition photographing module The two sides of the top surface close to the front edge are photographed, and the computer device judges whether the box cover is closed according to the image captured by the photographing module in the closed state. The method according to claim 2, comprising: after the box cover is put back into the wafer box and before the main camera module takes pictures of the bottom surface of the wafer box The top surface of the wafer box is photographed on both sides of the area near the front edge, and the computer device determines whether the box cover is properly closed according to the image captured by the camera module in the closed state. The method of claim 4, comprising: after the wafer cassette is put back into the box cover and before the main photographing module photographs the bottom surface of the wafer cassette; The top surface of the wafer box is photographed on both sides of the area near the front edge, and the computer device determines whether the box cover is properly closed according to the image captured by the camera module in the closed state. The method according to claim 1 or 2, comprising, after removing the box cover, photographing an inner side surface of the box cover by a camera module inside the box cover. The method according to claim 2, comprising: reading a parameter reading device on the rear side of the wafer cassette before the main photographing module photographs the wafer cassette with the cassette cover on. Parameter barcode, the computer device decides which set of detection parameters to use for detection according to the barcode data. The method as claimed in claim 2, comprising reading a cassette located in the wafer cassette by a group of identification reading devices before the main photographing module photographs the wafer cassette with the cassette cover on it A body barcode and a box cover barcode, and the computer device determines whether the box cover belongs to the box body according to the box body barcode and the box cover barcode. A system for inspecting a wafer cassette, comprising: a rotating platform for placing the wafer cassette, and configured to move from a preparation area into an inspection area, and to rotate so that the wafer cassette rotates; a main camera module, located in the inspection area , used to photograph the wafer cassette that has entered the inspection area; a multi-axis robotic arm is disposed in the inspection area, wherein the multi-axis robotic arm is located in front of the rotating platform and connected to the main photographing module , so as to move and change the position of the main photographing module; and a computer device can detect the condition of the wafer cassette according to the image photographed by the main photographing module. The system as claimed in claim 10, comprising a box cover loading and unloading mechanism disposed on one side of the detection area, the box cover loading and unloading mechanism being configured to remove or install the box cover and to remove the removed box The lid is turned from the upright position to the lying-flat position so that an inner side of the box lid faces upwards. The system of claim 11, comprising a box-lid inner photographing module disposed above the box-lid assembling and dismounting mechanism and coupled to the computer device, the box-lid inner photographing module being used for facing the box cover's inner side shooting module The inner side surface is photographed, and the computer device detects the inner side surface of the box cover according to the image captured by the camera module inside the box cover. The system of claim 10, comprising a pick-up gripper disposed above the inspection zone, the pick-up gripper configured to move laterally, vertically, and grasp the head of the wafer cassette. The system of claim 13, comprising a moving-out platform disposed within the action range of the pick-up gripper, the moving-out platform being located at a portion of the detection area side to receive the wafer cassette sent by the lifting jaw and move the wafer cassette to a waiting area. The system according to claim 10, comprising a box cover loading and unloading mechanism and a removal platform respectively arranged on both sides of the detection area, and a lifting gripper arranged above the detection region, the box cover loading and unloading mechanism is configured to The cassette cover can be removed or installed, the lifting jaws are configured to be able to move laterally, vertically lift and grasp the head of the wafer cassette, and the removal platform is used for receiving the lifting jaws. The wafer cassette and moving the wafer cassette to a waiting area. The system of claim 10, comprising a parameter reading device disposed in the preparation area and coupled to the computer device, the parameter reading device for reading a parameter located on a rear side of the wafer cassette bar code, the computer device selects the corresponding detection parameter according to the parameter bar code. The system of claim 10, comprising a group judgment reading device disposed in the inspection area and coupled to the computer device, the group judgment reading device for reading a right side of the wafer cassette A box body barcode on the surface and a box cover barcode on a front side of the wafer cassette, the computer device judges whether the box cover belongs to the box body according to the box body barcode and the box cover barcode read. A method for inspecting a wafer cassette, comprising: placing the wafer cassette on a rotating platform in a preparation area, so that the rotating platform supports a bottom surface of the wafer cassette, and the wafer cassette is A front side faces a front; the rotating platform is moved from the preparation area into an inspection area; the rotating platform already located in the inspection area is rotated, so that a left side and a right side of the wafer cassette are rotated along with it. and a rear side, facing the front in turn; a main camera module is used to shoot the front side, left side, right side and rear side of the wafer cassette respectively from the front, and transmit the captured images to a computer device; and The state of the wafer cassette is detected by the computer device according to the image captured by the main camera module. The method of claim 19, wherein when the main photographing module photographs the front side of the wafer cassette, a cover of the wafer cassette has not been removed, so that the main photographing module targets the The image captured on the front side includes an outer side of the box cover. The method of claim 20, comprising immediately dismounting the cassette cover with a cassette cover assembling and dismounting mechanism after the main photographing module completes photographing the front side of the wafer cassette, and then starting to separate the cassettes. The left side, the right side and the rear side of the wafer cassette are photographed, and then the cassette cover is replaced by the cassette cover mounting and dismounting mechanism.

Images