JP2004363363A - Carrying apparatus, processing apparatus and carrying method - Google Patents

Carrying apparatus, processing apparatus and carrying method Download PDF

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Publication number
JP2004363363A
JP2004363363A JP2003160630A JP2003160630A JP2004363363A JP 2004363363 A JP2004363363 A JP 2004363363A JP 2003160630 A JP2003160630 A JP 2003160630A JP 2003160630 A JP2003160630 A JP 2003160630A JP 2004363363 A JP2004363363 A JP 2004363363A
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Prior art keywords
arm
flange
sensors
arm portion
holding
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JP2003160630A
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JP3962705B2 (en
Inventor
Shinya Mochizuki
伸也 望月
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To highly accurately carry a cassette by performing spacing at the time of carrying the cassette, facilitating adjusting with less driving constituents thereof, and further enabling easily recognizing a grasping state or a positional relation of the flange of a cassette at the time of carrying the cassette. <P>SOLUTION: In the carrying apparatus 7 in which an arm 23 grasps a flange 19 provided on the top surface of an object 3 to be carried and carry the object 3, a plurality of sensors 0 are provided on the arm section 23, and the sensors recognize the presence or absence of the flange portion 19 in the arm 23 and a holding state. This arm section 23 is formed to be a cross section of U shape, optical sensors are provided on both ends of a side surface of the arm 23, and an optical sensor is provided on the center portion of the side surface thereof so that these optical sensors recognize the presence or absence of the flange 19 and the holding state. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、半導体ウエハ等の複数枚の基板を収納した密閉型の収納容器等の被搬送体を搬送するための搬送装置及び処理装置並びに搬送方法に関する。
【0002】
【従来の技術】
半導体製造プロセスの一例には、半導体ウエハ(以下、単にウエハという)等の被処理体を熱処理装置に搬入させて多数枚のウエハを一度に成膜処理、酸化拡散処理或はCVD処理等の熱処理が行われる。この場合、複数枚のウエハを収納したカセットを載置する装置内に設けた搬出入ステージ、及びこのカセットを一時的にストックするためのストッカ或は、このカセット内に収納されたウエハをウエハ移載機を介してウエハボートに移載する際にこのカセットを保持する保持ステージの間でこのカセットが所定の位置に搬送される。この複数枚のウエハを収容するカセットには、開放型のオープンカセットと密閉型の収納容器であるFOUP(Front Opening Unified pod)カセットとがある。
【0003】
このFOUPカセットは、箱体の開口部を蓋体で密閉状態に着脱可能に設けられ、内部に25枚程度のウエハが収容されている。このFOUPカセットは密閉式であるため、ウエハを搬送する際には、ウエハ表面にカセット周囲のパーティクル等が付着するおそれがなく、ウエハ表面のクリーン度が維持されため、ウエハの収納容器としてこのFOUPカセットが使用される傾向にある。このFOUPカセットは、処理装置の搬出入ステージからストッカ或は保持ステージに搬送されて、順次熱処理された後、FOUPカセットに収納されて次工程へ搬送される。
【0004】
従来、このカセットを搬送する方法として次に示す搬送方法が知られている。従来法の一つとして、筐体内に昇降動、回転動及び水平動の協動により駆動するFOUP搬送機を設け、ステージに載置されているカセットの底面を、このFOUP搬送機の支持アームで支受けした状態で他のステージにカセットを搬送するようにした方法がある(例えば、特許文献1参照。)。他の従来法として、旋回台と昇降機構を設けたロボットアームを鉛直方向と水平方向に移動自在に設け、このロボットアームに対して回転自在に支持された支持プレートにカセットのフランジよりも大きな開口部を形成した構造の搬送用ロボットで搬送する。この搬送時には、支持プレートを下降させてカセットのフランジを開口部に挿通させ、次いで、支持プレートを回動させて支持プレートにフランジを係止させると共に、支持プレートを上昇させることよりカセットを他のステージに搬送する方法である(例えば、特許文献2参照。)。
【0005】
【特許文献1】
特開2000−311935号公報
【特許文献2】
特開平11−297786号公報
【0006】
【発明が解決しようとする課題】
しかしながら、特許文献1の搬送方法は、昇降動、回転動及び水平動による支持アームによりカセットの底面を支受けした状態でカセットを搬送する方法であるから、カセットの受け渡し時において支持アームをカセットの底面より逃がすスペースが必要になるばかりでなく、複雑な多関節アーム機構等を有するFOUP搬送機を必要としている。一方、特許文献2の搬送方法は、支持プレートを下降させてカセットのフランジを開口部に挿通させた状態で支持プレートを回動させて支持プレートにフランジを係止させることにより搬送する方法であるから、プレート回転機構と多関節アーム機構との組み合わせ機構となるため、自ずから複雑な機構となる。また、特許文献1及び特許文献2の何れにもカセットの受け渡し時の位置関係を確認するセンサ等の安全機構は有していない。
【0007】
本発明は、上記の課題点を解決するために開発したものであり、その目的とするところは、カセット搬送時におけるスペースが効率的に行え、かつその駆動要素も少なく、調整も容易に行えるようにし、しかも、カセット搬送時におけるカセットのフランジの把持状態や位置関係を容易に確認できるようにしてカセットの搬送を高精度に行えるようにしたことにある。
【0008】
【課題を解決するための手段】
上記の目的を達成するため、請求項1に係る発明は、被搬送体の上面に設けたフランジ部をアーム部で把持して搬送する搬送装置において、前記アーム部に複数のセンサを設け、このセンサでアーム部内の前記フランジ部の有無及び保持状態を認識するようにした搬送装置である。
【0009】
請求項2に係る発明は、前記アーム部を断面略コ字形状に形成し、このアーム部の側面両端部位に第一・第三の光センサと側面中央部位に第二の光センサを設け、これらの光センサで前記フランジ部の有無及び保持状態を確認する請求項1記載の搬送装置である。
【0010】
請求項3に係る発明は、上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサである請求項2記載の搬送装置である。
【0011】
請求項4に係る発明は、前記フランジ部の両側縁部に切欠部を形成し、一方、前記アーム部の下端の両側に内向き状に形成した保持片に突部を形成し、前記切欠部と前記突部でアーム部内の前記フランジ部の位置決めを行う請求項1ないし3のいずれかに記載の搬送装置である。
【0012】
請求項5に係る発明は、被搬送体は、半導体ウエハを収納した密閉型カセットである請求項1ないし4のいずれかに記載の搬送装置である。
【0013】
請求項6に係る発明は、上面にフランジ部が設けられた被搬送体を搬出入する載置台と、同被搬送体を収納する収納棚と、同被搬送体に収納された被処理体を受け渡すための保持台とを備えた処理装置において、前記載置台、収納棚あるいは保持台上に位置する同被搬送体を、前記被搬送体の上面に設けられたフランジ部をアーム部で把持すると共に、前記アーム部に複数のセンサを設け、このセンサでアーム部内の前記フランジ部の有無及び保持状態を認識するようにした搬送装置を備えた処理装置である。
【0014】
請求項7に係る発明は、前記アーム部を断面略コ字形状に形成し、このアーム部の側面両端部位に第一・第三の光センサと、側面中央部位に第二の光センサを設け、これらの光センサで前記フランジ部の有無及び保持状態を確認するようにした請求項6記載の処理装置である。
【0015】
請求項8に係る発明は、上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサである請求項7記載の処理装置である。
【0016】
請求項9に係る発明は、前記フランジ部の両側縁部に切欠部を形成し、一方、前記アーム部の下端の両側に内向き状に形成した保持片に突部を形成し、前記切欠部と前記突部でアーム部内の前記フランジ部の位置決めを行うようにした請求項6ないし8のいずれかに記載の処理装置である。
【0017】
請求項10に係る発明は、前記載置台と収納棚と保持台には、被搬送体の位置決めピンを立設し、一方、被搬送体の下面には、前記ピンに嵌合して被搬送体を位置決めする位置決め溝を形成した請求項6ないし9のいずれかに記載の処理装置である。
【0018】
請求項11に係る発明は、被搬送体は、半導体ウエハを収納した密閉型カセットである請求項6ないし10のいずれかに記載の処理装置である。
【0019】
請求項12に係る発明は、搬送機構に設けられた略コ字形状のアーム部で被搬送体の上面に設けたフランジ部を把持して搬送する搬送方法であって、前記アーム部をフランジ部に挿入した挿入状態と挿入完了状態と、前記フランジ部を前記アーム部で保持した保持状態とを、前記アーム部に配設された複数のセンサにより確認するようにした搬送方法である。
【0020】
請求項13に係る発明は、前記アーム部をフランジ部に挿入した挿入状態と挿入完了状態と、前記フランジ部を前記アーム部で保持した保持状態とを確認するセンサは、前記アーム部の側面両端部位に設けた第一・第三の光センサと、側面中央部位に設けた第二の光センサの何れかにより確認するようにした請求項12記載の搬送方法である。
【0021】
請求項14に係る発明は、上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサである請求項13記載の搬送方法である。
【0022】
請求項15に係る発明は、被搬送体は、半導体ウエハを収納した密閉型カセットである請求項12ないし14のいずれかに記載の処理方法である。
【0023】
【発明の実施の形態】
本発明における搬送装置及び処理装置並びに搬送方法の実施形態を図面に基づいて説明する。
図1は本発明における搬送装置を用いた処理装置の斜視説明図であり、図2は図1における搬送装置部分を示した拡大説明図である。
【0024】
図1及び図2に示した熱処理装置は、半導体ウエハWを熱処理装置に搬入させて多数枚のウエハWを、例えば成膜処理、酸化拡散処理或はCVD処理等の熱処理を行う装置である。同図において、筐体で構成された装置本体1の前面に設けた搬出入ステージ2には、被搬送体である密閉型収納容器(FOUPカセット)3を載置する載置台4を配置し、この密閉型収納容器3を一時的にストッカとして収納する収納棚5と収納容器3からウエハWを熱処理エリア内に受け渡すための保持台6を配置し、載置台4と収納棚5と保持台6との間における収納容器3の搬送を、後述する搬送装置であるカセット搬送機構7により行う。なお、密閉型収納容器3の搬送は、上記の例に限ることなく、例えば、載置台4と保持台6との間での搬送の場合も包含され、これらの搬送工程は実施に応じて任意である。
【0025】
同図において、ウエハWを熱処理エリア内に受け渡すために保持台6に保持されている密閉型収納容器3は、容器3の前面を開口した開口部8を蓋体9で気密状に被蓋したフランジ10を装置本体1の壁体11に当接させた状態で、ロック状態の蓋体9を図示しない解錠機構で外して壁体11に設けたゲート12を作動させて壁体11に形成した開口窓13を開口させ、この開口窓13よりウエハ移載機構14によりウエハWをウエハボート15に移載し、次いで、このウエハボート15を図示しないエレベータにより熱処理炉16内にロードさせた後、所定の熱処理工程を行う。処理終了後は、熱処理炉16よりウエハボート15をアンロードして、上記とは逆にウエハ移載機構14により保持台6に位置して開口している密閉型収納容器3に移載し、この容器3をカセット搬送機構7により搬出入ステージ2より次工程へ搬送する。
【0026】
前記の被搬送体である密閉型収納容器3は、容器3の内部にウエハWを25枚程度収納でき、プラスチック製で箱型状を構成し、ウエハ収納状態で約12Kgの重量を有している。この容器3の上面には、矩形状の首部18を形成し、この首部18の上端に矩形状に張り出したフランジ部19を設け、このフランジ部19の両側縁部に切欠部20,20を形成している。また、この容器3の下面には、複数の位置決め溝21を形成し、載置台4、収納棚5並びに保持台6には、それぞれ位置決め溝21に対応した位置決め用ピン22を立設し、載置台4、収納棚5並びに保持台6に収納容器3を載置したとき、収納容器3が所定の位置に位置決めされるように設けられている。
【0027】
前述のカセット搬送機構7は、Z軸昇降部7aとX軸水平部7bと多関節アーム部7cから成り、この多関節アーム部7cの先端部に、断面略コ字形状のアーム部23を設け、アーム部23の下端の両側に内向き状の保持片24を形成し、この保持片24でフランジ部19を保持するようにしている。この保持片24は、爪状態に突出形成した構造であっても良い。また、フランジ部19にアーム部23により把持された状態で、フランジ部19に形成した切欠部20と保持片24に形成した突部25が一致している位置を、アーム部23に穿孔した確認穴26,26から見てアーム部23の中心とフランジ部19の中心が一致していることを確認し、更には、切欠部20に突部25が係止されるようにすると、この切欠部20と突部25でアーム部23内のフランジ部19の位置決めが行われ、安定した状態でカセット搬送を行うことが可能となる。
【0028】
図3及び図4において、断面略コ字形状のアーム部23の側面両端部位である枠部27内に透過型の第一の光センサ28と、透過型の第三の光センサ29並びに側面中央部位に反射型の第二の光センサ30を設け、この透過型の光センサ28,29でフランジ部19の有無を確認し、反射型の光センサ30で密閉型収納容器(カセット)3のフランジ部19をアーム部23の保持片24で保持する状態を確認するようにしている。本例における光センサ28、29、30は、アンプ内蔵型の光電スイッチを用いており、この光電スイッチ28、29の透過型光センサは、投光側センサ28a、29aと受光側センサ28b、29bのそれぞれ一対から構成されている。また、この枠部27内には、リミットスイッチからなる安全機構31を各隅部内に4個設け、障害物等が不用意に接触したときに作動状態がロックされて停止するように設けられている。
【0029】
図5及び図6は、アーム部23に設けた光センサとフランジ部との関係を説明した説明図である。図5において、フランジ部19がアーム部23内に挿入した状態のとき、投光側の第一・第三センサ28a、29aの光は、フランジ部19の側面に遮光されONになる。第二の反射型の光センサ(光電スイッチ)30は、図5における検出距離L´(本例では44mm)では反射光を受光不可であり、図6における検出距離L(本例では26mm)では反射光を受光可能な検出距離に設定されているので、図5の状態において、光センサ30は、フランジ部19の首部18の面まで投光するので、検出距離L´では受光不可となり、OFFとなる。この状態において、図6に示すように、アーム部23がZ軸方向にハンドアップされて保持片24にフランジ部19の下面が把持されると、投光側の第一・第三センサ28a、29aの光は、受光側センサ28b、29bに受光されてOFF(又はON)となると共に、第二の反射型の光センサ30は、フランジ部19の側部に反射して検出可能な検出距離Lであるから、受光されてONとなる。なお、この反射型の光センサ30の検出距離は、実施に応じて適宜に設定可能とする。
【0030】
次に、上記実施形態の作用を説明する。
図1の状態の載置台4に位置している密閉型収納容器(カセット)3をカセット搬送機構7で搬送する場合、カセット搬送機構7を、Z軸昇降部7aとX軸水平部7bと多関節アーム部7cを作動させてX軸、Y軸、Z軸を移動させて、図7に示すように、アーム部23をフランジ部19の側部に位置させる。この場合、光センサ28、29、30はOFF状態である。次いで、図8に示すように、X軸水平部7bを動作させてアーム部23をフランジ部19内に挿入すると、光センサ28がONとなり、光センサ29、30はOFFである。更に、図9に示すように、X軸水平部7bを動作させてアーム部23をフランジ部19内に完了状態まで挿入すると、光センサ28,29がONとなり、光センサ30はOFF状態である。
【0031】
次いで、図10に示すように、アーム部23をZ軸方向に上昇させて保持片24にフランジ部19の下面を把持すると、反射型の光センサ30は、フランジ部19の側部に反射した反射光を受光してONになり、センサ28、29は、受光側センサ28b、29bに受光されてOFF(又はON)となる。その後、図2に示すように、カセット3がカセット搬送機構7のアーム部23に把持されて、所定の搬送位置に搬送される。
【0032】
上記の実施形態は、アーム部23に透過型の第一の光センサ28と透過型の第三の光センサ29並びに反射型の第二の光センサ30を設け、この透過型の光センサ28,29でフランジ部19の有無を確認し、反射型の光センサ30で密閉型収納容器3のフランジ部19をアーム部23の保持片24で保持する状態を確認するようにしているが、光センサ30も透過型の光センサ(光電スイッチ)30´を用いるようにしても良い。この場合を図7乃至図10に従って説明すると、図7では、光センサ28、29、30´はOFF状態であり、次いで、図8に示すように、X軸水平部7bを動作させてアーム部23をフランジ部19内に挿入すると、光センサ28がONとなり、光センサ29、30´はOFFである。更に、図9に示すように、X軸水平部7bを動作させてアーム部23をフランジ部19内に完了状態まで挿入すると、光センサ28,29がONとなり、光センサ30´はON(又はOFF)状態となる。この場合、フランジ部19の首部18の投光部が空洞な構造であると、光センサ30の光は受光側のセンサで受光されてOFF状態となる。次いで、図10に示すように、アーム部23をZ軸方向にハンドアップして保持片24にフランジ部19の下面を把持すると、透過型の光センサ30´は、フランジ部19の側部に遮光してONになり、センサ28、29は、受光側センサ28b、29bに受光されてOFFとなる。
【0033】
図12は、カセット搬送機構に設けたアーム部32の他の実施形態を示したものであり、断面略コ字形状を成すアーム部32は、水平方向に拡縮する構造を呈し、先ず、図12(a)に示すように、カセット3のフランジ部19の上部に位置させ、次いで、同図(b)に示すように、アーム部32を水平方向に広げるように駆動させ、次に、同図(c)に示すように、アーム部32を縮小するように水平移動させ、更に、アーム部32を上昇させてアーム部32の保持片33に保持される。この場合、アーム部32の側部に上記した各実施形態と同様の光センサ28、29、30を配置しており、この場合も上記と同様の作用効果を有するので、その説明を省略する。
【0034】
【発明の効果】
以上のことから明らかなように、本発明によると、被搬送体(密閉型収納容器)の上面に設けたフランジ部を把持して搬送する方式であるため、搬送時におけるスペースの効率化を図ることができ、しかも、アーム部内に位置する被搬送体上面のフランジ部の位置関係が容易に検出することができる。
【0035】
本発明によると、被搬送体のフランジ部に断面略コ字形状のアーム部を差し込み、かつ、アーム部に光センサを設けた構造であるため、駆動要素が少なく、調整が確実かつ容易におこなうことができる。また、アーム部内にフランジ部が確実に把持されて被搬送体を高精度に搬送することができる。
【0036】
また、処理装置に被搬送体搬送機構を配置する際に、効率的にスペースを活用することができ駆動要素を少なくした処理装置を提供することができると共に、処理装置の搬出入ステージに被搬送体を載置すると、位置決めが確実に行われ、高精度の搬送が可能となる。
【0037】
更には、搬送時のスペース効率が図られ、駆動要素も少なく、調整も容易で、しかも、被搬送体搬送時の搬送を確実にかつ容易に検出できる搬送方法を提供することが可能となる。
【図面の簡単な説明】
【図1】本発明における搬送装置を用いた処理装置の斜視説明図である。
【図2】図1における搬送装置部分を示した拡大説明図である。
【図3】本発明における搬送装置のアーム部でフランジ部を把持した状態を示す平面説明図である。
【図4】図3における正面説明図である。
【図5】本発明におけるアーム部に設けた光センサとフランジ部との関係を説明した正面説明図である。
【図6】図5におけるアーム部でフランジ部を保持した状態を示す正面説明図である。
【図7】本発明におけるアーム部をフランジ部に挿入する前の状態を示す説明図である。
【図8】図7に示したアーム部をフランジ部に挿入中の状態を示す説明図である。
【図9】図8のアーム部がフランジ部に挿入完了した状態を示す説明図である。
【図10】図9のアーム部がフランジ部を保持してカセットを保持した状態を示す説明図である
【図11】本発明における被搬送体を示した底面図である。
【図12】(a)(b)(c)は、本発明における搬送装置のアーム部でフランジ部を把持する状態の他例を示した説明図である。
【符号の説明】
1 装置本体
2 搬出入ステージ
3 密閉型収納容器(被搬送体)
4 載置台
5 収納棚
6 保持台
7 カセット搬送機構(搬送装置)
18 首部
19 フランジ部
20 切欠部
23、32 アーム部
24、33 保持片
25 突部
28 第一光センサ
29 第三光センサ
30 第二光センサ
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a transfer apparatus, a processing apparatus, and a transfer method for transferring an object to be transferred, such as a closed storage container that stores a plurality of substrates such as semiconductor wafers.
[0002]
[Prior art]
As an example of a semiconductor manufacturing process, an object to be processed such as a semiconductor wafer (hereinafter, simply referred to as a wafer) is carried into a heat treatment apparatus, and a large number of wafers are formed at a time by a film formation process, an oxidation diffusion process, or a heat treatment such as a CVD process. Is performed. In this case, a loading / unloading stage provided in an apparatus for loading a cassette containing a plurality of wafers, a stocker for temporarily stocking the cassette, or a wafer stored in the cassette is transferred to a wafer. When the cassette is transferred to the wafer boat via the mounting machine, the cassette is transported to a predetermined position between holding stages for holding the cassette. The cassettes for accommodating the plurality of wafers include an open type open cassette and a FOUP (Front Opening Unified pod) cassette which is a closed type storage container.
[0003]
This FOUP cassette is provided so that the opening of the box body can be attached and detached by a lid so as to be sealed, and contains about 25 wafers inside. Since the FOUP cassette is a closed type, there is no risk that particles or the like around the cassette adhere to the wafer surface when transferring the wafer, and the cleanliness of the wafer surface is maintained. Therefore, the FOUP cassette is used as a wafer storage container. Cassettes tend to be used. The FOUP cassette is conveyed from the loading / unloading stage of the processing apparatus to the stocker or the holding stage, and is sequentially heat-treated, then stored in the FOUP cassette and conveyed to the next step.
[0004]
Conventionally, the following transport method has been known as a method for transporting this cassette. As one of the conventional methods, a FOUP transfer device driven by the cooperative movement of elevation, rotation, and horizontal movement is provided in the housing, and the bottom surface of the cassette placed on the stage is supported by the support arm of the FOUP transfer device. There is a method in which a cassette is transported to another stage while being supported (for example, see Patent Document 1). As another conventional method, a robot arm provided with a swivel table and an elevating mechanism is movably provided in a vertical direction and a horizontal direction, and a support plate rotatably supported by the robot arm has an opening larger than a flange of a cassette. It is transported by a transport robot having a structure in which a part is formed. At the time of this transfer, the cassette is lowered by lowering the support plate to insert the flange of the cassette through the opening, and then rotating the support plate to lock the flange to the support plate and raising the support plate to move the cassette to another position. This is a method of transporting to a stage (for example, see Patent Document 2).
[0005]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 2000-311935 [Patent Document 2]
JP-A-11-297786
[Problems to be solved by the invention]
However, the transfer method disclosed in Patent Document 1 is a method in which the cassette is transferred while the bottom surface of the cassette is supported by the support arm that is moved up and down, rotated, and horizontally moved. Not only is a space required to escape from the bottom surface, but also a FOUP transporter having a complicated articulated arm mechanism and the like is required. On the other hand, the transfer method of Patent Document 2 is a method in which the support plate is lowered by rotating the support plate in a state where the flange of the cassette is inserted through the opening and the flange is locked to the support plate. Therefore, since it becomes a combination mechanism of the plate rotation mechanism and the articulated arm mechanism, it becomes naturally a complicated mechanism. Neither Patent Document 1 nor Patent Document 2 has a safety mechanism such as a sensor for confirming a positional relationship when a cassette is delivered.
[0007]
The present invention has been developed in order to solve the above-mentioned problems, and an object of the present invention is to make it possible to efficiently use a space at the time of transporting a cassette, to reduce the number of driving elements, and to easily perform adjustment. In addition, the cassette can be transported with high precision by making it possible to easily confirm the gripping state and the positional relationship of the cassette flange when transporting the cassette.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a transporting device that grips and transports a flange portion provided on the upper surface of a transported object with an arm portion, and provides a plurality of sensors on the arm portion. This is a transport device that uses a sensor to recognize the presence or absence and the holding state of the flange portion in the arm portion.
[0009]
In the invention according to claim 2, the arm portion is formed to have a substantially U-shaped cross section, and first and third optical sensors are provided at both end portions of the side surface of the arm portion and a second optical sensor is provided at a central portion of the side surface, The transport device according to claim 1, wherein the presence / absence and the holding state of the flange portion are checked by these optical sensors.
[0010]
The invention according to claim 3 is the transport device according to claim 2, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor.
[0011]
The invention according to claim 4, wherein notches are formed at both side edges of the flange portion, and a protrusion is formed on an inward holding piece formed on both sides of a lower end of the arm portion. 4. The transfer device according to claim 1, wherein the positioning of the flange portion in the arm portion is performed by the protrusion and the protrusion.
[0012]
The invention according to claim 5 is the transfer device according to any one of claims 1 to 4, wherein the object to be transferred is a sealed cassette containing semiconductor wafers.
[0013]
According to a sixth aspect of the present invention, there is provided a mounting table for loading and unloading a transferred object provided with a flange portion on an upper surface, a storage shelf for storing the transferred object, and a processing object stored in the transferred object. In the processing apparatus provided with a holding table for transferring, the object to be transferred, which is located on the mounting table, the storage shelf or the holding table, is gripped by an arm portion with a flange portion provided on an upper surface of the transferred object. In addition, the present invention provides a processing apparatus provided with a transfer device in which a plurality of sensors are provided in the arm portion, and the presence / absence and holding state of the flange portion in the arm portion are recognized by the sensors.
[0014]
In the invention according to claim 7, the arm portion is formed to have a substantially U-shaped cross section, and first and third optical sensors are provided at both end portions of the side surface of the arm portion and a second optical sensor is provided at a central portion of the side surface. 7. The processing apparatus according to claim 6, wherein the presence / absence and the holding state of the flange portion are confirmed by these optical sensors.
[0015]
The invention according to claim 8 is the processing device according to claim 7, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor.
[0016]
The invention according to claim 9 is characterized in that notches are formed on both side edges of the flange portion, and a protrusion is formed on an inwardly-shaped holding piece formed on both sides of a lower end of the arm portion, and the notch portion is formed. 9. The processing apparatus according to claim 6, wherein the positioning of the flange portion in the arm portion is performed by the projection and the projection.
[0017]
According to a tenth aspect of the present invention, the positioning table, the storage shelf, and the holding table are provided with positioning pins for the transported body, and the lower surface of the transported body is fitted to the pins to be transported. 10. The processing apparatus according to claim 6, wherein a positioning groove for positioning the body is formed.
[0018]
The invention according to claim 11 is the processing apparatus according to any one of claims 6 to 10, wherein the object to be transferred is a sealed cassette containing semiconductor wafers.
[0019]
According to a twelfth aspect of the present invention, there is provided a transfer method in which a substantially U-shaped arm provided on a transfer mechanism grips and transfers a flange provided on an upper surface of a body to be transferred. And a holding state in which the flange portion is held by the arm portion by a plurality of sensors disposed on the arm portion.
[0020]
The invention according to claim 13 is a sensor for confirming an insertion state in which the arm section is inserted into the flange section, an insertion completed state, and a holding state in which the flange section is held by the arm section. 13. The transporting method according to claim 12, wherein the first and third optical sensors provided at the site and the second optical sensor provided at the center portion on the side face are used for checking.
[0021]
The invention according to claim 14 is the transport method according to claim 13, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor.
[0022]
The invention according to claim 15 is the processing method according to any one of claims 12 to 14, wherein the object to be transferred is a sealed cassette containing semiconductor wafers.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of a transport device, a processing device, and a transport method according to the present invention will be described with reference to the drawings.
FIG. 1 is a perspective explanatory view of a processing apparatus using a transport device according to the present invention, and FIG. 2 is an enlarged explanatory view showing a transport device portion in FIG.
[0024]
The heat treatment apparatus shown in FIGS. 1 and 2 is an apparatus for carrying a semiconductor wafer W into a heat treatment apparatus and subjecting a large number of wafers W to a heat treatment such as a film formation process, an oxidation diffusion process, or a CVD process. In FIG. 1, a loading table 4 on which a sealed storage container (FOUP cassette) 3 as a transported object is placed is arranged on a loading / unloading stage 2 provided on a front surface of an apparatus main body 1 composed of a housing. A storage shelf 5 for temporarily storing the closed storage container 3 as a stocker and a holding table 6 for transferring the wafer W from the storage container 3 into the heat treatment area are arranged, and the mounting table 4, the storage shelf 5, and the holding table are arranged. The transfer of the storage container 3 to and from the storage container 6 is performed by a cassette transfer mechanism 7 which is a transfer device described later. The transfer of the closed storage container 3 is not limited to the above example, and includes, for example, the transfer between the mounting table 4 and the holding table 6, and these transfer steps are optional depending on the implementation. It is.
[0025]
Referring to FIG. 1, a closed storage container 3 held by a holding table 6 for transferring a wafer W into a heat treatment area has an opening 8 opened on the front surface of the container 3 hermetically covered with a lid 9. In a state in which the flange 10 is brought into contact with the wall 11 of the apparatus main body 1, the lid 9 in the locked state is removed by an unlocking mechanism (not shown), and the gate 12 provided on the wall 11 is actuated. The formed opening window 13 is opened, the wafer W is transferred from the opening window 13 to the wafer boat 15 by the wafer transfer mechanism 14, and then the wafer boat 15 is loaded into the heat treatment furnace 16 by an elevator (not shown). Thereafter, a predetermined heat treatment step is performed. After the processing is completed, the wafer boat 15 is unloaded from the heat treatment furnace 16 and, conversely, the wafer boat 15 is transferred by the wafer transfer mechanism 14 to the closed storage container 3 which is located on the holding table 6 and is open. The container 3 is transported by the cassette transport mechanism 7 from the loading / unloading stage 2 to the next step.
[0026]
The hermetically sealed storage container 3, which is the object to be transferred, can store about 25 wafers W in the container 3, is made of plastic, has a box shape, and has a weight of about 12 kg in a wafer storage state. I have. A rectangular neck 18 is formed on the upper surface of the container 3, and a rectangular flange 19 is provided at the upper end of the neck 18. are doing. Further, a plurality of positioning grooves 21 are formed on the lower surface of the container 3, and positioning pins 22 corresponding to the positioning grooves 21 are erected on the mounting table 4, the storage shelf 5 and the holding table 6, respectively. When the storage container 3 is placed on the table 4, the storage shelf 5, and the holding table 6, the storage container 3 is provided so as to be positioned at a predetermined position.
[0027]
The above-described cassette transport mechanism 7 includes a Z-axis elevating / lowering portion 7a, an X-axis horizontal portion 7b, and an articulated arm 7c, and an arm 23 having a substantially U-shaped cross section is provided at the tip of the articulated arm 7c. An inward holding piece 24 is formed on both sides of the lower end of the arm 23, and the flange 19 is held by the holding piece 24. The holding piece 24 may have a structure formed to protrude in a claw state. Further, in a state where the notch 20 formed in the flange portion 19 and the protrusion 25 formed in the holding piece 24 coincide with each other in a state where the arm portion 23 is gripped by the flange portion 19, it is confirmed that the position where the notch 20 formed in the holding portion 24 coincides is pierced. It is confirmed that the center of the arm portion 23 and the center of the flange portion 19 coincide with each other when viewed from the holes 26, 26. Further, when the projection 25 is locked in the notch portion 20, the notch portion The positioning of the flange portion 19 in the arm portion 23 is performed by the projection 20 and the projection portion 25, and the cassette can be transported in a stable state.
[0028]
3 and 4, a first transmissive optical sensor 28, a third transmissive optical sensor 29, and a center of the side surface are provided in a frame portion 27, which is both side portions of the arm portion 23 having a substantially U-shaped cross section. A reflection type second optical sensor 30 is provided at the position, the presence or absence of the flange portion 19 is confirmed by the transmission type optical sensors 28 and 29, and the reflection type optical sensor 30 is used to detect the flange of the closed storage container (cassette) 3. The state where the part 19 is held by the holding piece 24 of the arm part 23 is checked. The optical sensors 28, 29, and 30 in this example use photoelectric switches with built-in amplifiers. The transmission optical sensors of the photoelectric switches 28 and 29 include light-emitting sensors 28a and 29a and light-receiving sensors 28b and 29b. Are each constituted by a pair. In the frame 27, four safety mechanisms 31 each composed of a limit switch are provided in each corner so that the operation state is locked and stopped when an obstacle or the like is carelessly contacted. I have.
[0029]
5 and 6 are explanatory diagrams illustrating the relationship between the optical sensor provided on the arm 23 and the flange. In FIG. 5, when the flange portion 19 is inserted into the arm portion 23, light from the first and third sensors 28a and 29a on the light emitting side is blocked by the side surface of the flange portion 19 and turned ON. The second reflection type optical sensor (photoelectric switch) 30 cannot receive the reflected light at the detection distance L ′ (44 mm in this example) in FIG. 5 and at the detection distance L (26 mm in this example) in FIG. Since the detection distance is set to be such that the reflected light can be received, in the state shown in FIG. 5, the optical sensor 30 projects light to the surface of the neck portion 18 of the flange portion 19, so that light cannot be received at the detection distance L ', and the light sensor 30 is turned off. It becomes. In this state, as shown in FIG. 6, when the arm portion 23 is handed up in the Z-axis direction and the lower surface of the flange portion 19 is gripped by the holding piece 24, the first and third sensors 28a on the light emitting side, The light 29a is received by the light receiving side sensors 28b and 29b and turned off (or ON), and the second reflection type optical sensor 30 is reflected by the side of the flange portion 19 and can be detected. Since it is L, it is received and turned ON. It should be noted that the detection distance of the reflection type optical sensor 30 can be appropriately set according to the implementation.
[0030]
Next, the operation of the above embodiment will be described.
When the closed storage container (cassette) 3 located on the mounting table 4 in the state of FIG. 1 is transported by the cassette transport mechanism 7, the cassette transport mechanism 7 is composed of a Z-axis elevating unit 7a and an X-axis horizontal unit 7b. The X-axis, the Y-axis, and the Z-axis are moved by operating the joint arm 7c, and the arm 23 is positioned on the side of the flange 19 as shown in FIG. In this case, the optical sensors 28, 29, 30 are in the OFF state. Next, as shown in FIG. 8, when the X-axis horizontal portion 7b is operated to insert the arm portion 23 into the flange portion 19, the optical sensor 28 is turned on, and the optical sensors 29 and 30 are turned off. Further, as shown in FIG. 9, when the X-axis horizontal portion 7b is operated to insert the arm portion 23 into the flange portion 19 to the completion state, the optical sensors 28 and 29 are turned on, and the optical sensor 30 is in the off state. .
[0031]
Next, as shown in FIG. 10, when the arm 23 was raised in the Z-axis direction and the lower surface of the flange 19 was gripped by the holding piece 24, the reflection type optical sensor 30 reflected on the side of the flange 19. The reflected light is received and turned ON, and the sensors 28 and 29 are received by the light receiving side sensors 28b and 29b and turned OFF (or ON). Thereafter, as shown in FIG. 2, the cassette 3 is gripped by the arm 23 of the cassette transport mechanism 7 and transported to a predetermined transport position.
[0032]
In the embodiment described above, the transmission type first optical sensor 28, the transmission type third optical sensor 29, and the reflection type second optical sensor 30 are provided on the arm 23, and the transmission type optical sensor 28, At 29, the presence or absence of the flange portion 19 is confirmed, and at the reflection type optical sensor 30, the state of holding the flange portion 19 of the closed storage container 3 by the holding piece 24 of the arm portion 23 is confirmed. The transmission optical sensor (photoelectric switch) 30 ′ may be used as the transmission sensor 30 ′. This case will be described with reference to FIGS. 7 to 10. In FIG. 7, the optical sensors 28, 29, and 30 'are in the OFF state, and then, as shown in FIG. When 23 is inserted into the flange 19, the optical sensor 28 is turned on, and the optical sensors 29 and 30 'are turned off. Further, as shown in FIG. 9, when the X-axis horizontal portion 7b is operated and the arm portion 23 is inserted into the flange portion 19 to the completion state, the optical sensors 28 and 29 are turned ON, and the optical sensor 30 'is turned ON (or OFF) state. In this case, if the light projecting portion of the neck portion 18 of the flange portion 19 has a hollow structure, the light of the optical sensor 30 is received by the sensor on the light receiving side and is turned off. Next, as shown in FIG. 10, when the arm 23 is handed up in the Z-axis direction and the lower surface of the flange 19 is gripped by the holding piece 24, the transmission type optical sensor 30 ′ is placed on the side of the flange 19. The sensors 28 and 29 are turned on after being shielded from light, and are turned off by being received by the light-receiving sensors 28b and 29b.
[0033]
FIG. 12 shows another embodiment of the arm portion 32 provided in the cassette transport mechanism. The arm portion 32 having a substantially U-shaped cross section has a structure which expands and contracts in the horizontal direction. As shown in (a), it is positioned above the flange portion 19 of the cassette 3, and then, as shown in FIG. 3 (b), the arm 32 is driven so as to expand in the horizontal direction. As shown in (c), the arm 32 is moved horizontally so as to be reduced, and the arm 32 is further raised to be held by the holding piece 33 of the arm 32. In this case, the same optical sensors 28, 29, and 30 as those in the above-described embodiments are arranged on the side of the arm 32. In this case, the same operation and effect as described above are provided, and therefore, the description thereof is omitted.
[0034]
【The invention's effect】
As is clear from the above, according to the present invention, the flange is provided on the upper surface of the object to be transferred (closed container) and the container is held and transferred, so that the space during transfer is made more efficient. In addition, the positional relationship between the flange portions on the upper surface of the transported object located in the arm portion can be easily detected.
[0035]
ADVANTAGE OF THE INVENTION According to this invention, since the arm part of a substantially U-shaped cross section is inserted in the flange part of a to-be-conveyed body, and the optical sensor was provided in the arm part, there are few drive elements and adjustment can be performed reliably and easily. be able to. Further, the flange portion is securely held in the arm portion, and the transferred object can be transferred with high accuracy.
[0036]
In addition, when the transfer mechanism is disposed in the processing apparatus, it is possible to provide a processing apparatus in which space can be efficiently used and the number of driving elements is reduced, and the transfer apparatus can be transferred to the loading / unloading stage of the processing apparatus. When the body is placed, positioning is performed reliably, and high-precision transport is possible.
[0037]
Furthermore, it is possible to provide a transport method that achieves space efficiency at the time of transport, has few drive elements, is easy to adjust, and can reliably and easily detect the transport during transport of the transported object.
[Brief description of the drawings]
FIG. 1 is an explanatory perspective view of a processing apparatus using a transport device according to the present invention.
FIG. 2 is an enlarged explanatory view showing a transport device in FIG. 1;
FIG. 3 is an explanatory plan view showing a state in which a flange portion is gripped by an arm portion of the transfer device according to the present invention.
FIG. 4 is an explanatory front view of FIG. 3;
FIG. 5 is an explanatory front view illustrating a relationship between an optical sensor provided on an arm and a flange according to the present invention.
FIG. 6 is an explanatory front view showing a state in which a flange is held by an arm in FIG. 5;
FIG. 7 is an explanatory diagram showing a state before an arm portion is inserted into a flange portion in the present invention.
FIG. 8 is an explanatory view showing a state in which the arm shown in FIG. 7 is being inserted into the flange.
FIG. 9 is an explanatory view showing a state in which the arm portion of FIG. 8 has been completely inserted into the flange portion.
10 is an explanatory view showing a state in which the arm portion of FIG. 9 holds the cassette while holding the flange portion. FIG. 11 is a bottom view showing the object to be conveyed in the present invention.
FIGS. 12A, 12B, and 12C are explanatory views showing another example of a state in which the flange portion is gripped by the arm portion of the transfer device according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Apparatus main body 2 Loading / unloading stage 3 Sealed storage container (conveyed object)
4 mounting table 5 storage shelf 6 holding table 7 cassette transport mechanism (transport device)
18 Neck 19 Flange 20 Notch 23, 32 Arm 24, 33 Holding piece 25 Projection 28 First optical sensor 29 Third optical sensor 30 Second optical sensor

Claims (15)

被搬送体の上面に設けたフランジ部をアーム部で把持して搬送する搬送装置において、前記アーム部に複数のセンサを設け、このセンサでアーム部内の前記フランジ部の有無及び保持状態を認識するようにしたことを特徴とする搬送装置。In a transfer device for holding and transporting a flange portion provided on an upper surface of an object to be transported while gripping the arm portion with an arm portion, a plurality of sensors are provided on the arm portion, and the presence / absence and holding state of the flange portion in the arm portion are recognized by the sensors. A transport device characterized in that: 前記アーム部を断面略コ字形状に形成し、このアーム部の側面両端部位に第一・第三の光センサと側面中央部位に第二の光センサを設け、これらの光センサで前記フランジ部の有無及び保持状態を確認することを特徴とする請求項1記載の搬送装置。The arm portion is formed in a substantially U-shaped cross section, and first and third optical sensors are provided at both end portions of the side surface of the arm portion and a second optical sensor is provided at a central portion of the side surface. The transfer device according to claim 1, wherein the presence or absence and the holding state are checked. 上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサであることを特徴とする請求項2記載の搬送装置。The transport device according to claim 2, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor. 前記フランジ部の両側縁部に切欠部を形成し、一方、前記アーム部の下端の両側に内向き状に形成した保持片に突部を形成し、前記切欠部と前記突部でアーム部内の前記フランジ部の位置決めを行うことを特徴する請求項1ないし3のいずれかに記載の搬送装置。Notches are formed at both side edges of the flange portion, while projections are formed on holding pieces formed inward on both sides of the lower end of the arm portion, and the notch and the projection form an inside of the arm portion. The transport device according to claim 1, wherein the positioning of the flange portion is performed. 被搬送体は、半導体ウエハを収納した密閉型カセットであることを特徴とする請求項1ないし4のいずれかに記載の搬送装置。5. The transfer device according to claim 1, wherein the transfer target is a sealed cassette containing semiconductor wafers. 上面にフランジ部が設けられた被搬送体を搬出入する載置台と、同被搬送体を収納する収納棚と、同被搬送体に収納された被処理体を受け渡すための保持台とを備えた処理装置において、前記載置台、収納棚あるいは保持台上に位置する同被搬送体を、前記被搬送体の上面に設けられたフランジ部をアーム部で把持すると共に、前記アーム部に複数のセンサを設け、このセンサでアーム部内の前記フランジ部の有無及び保持状態を認識するようにした搬送装置を備えたことを特徴とする処理装置。A mounting table for loading and unloading a transferred object provided with a flange portion on the upper surface, a storage shelf for storing the transferred object, and a holding table for transferring the processed object stored in the transferred object. In the processing apparatus provided, the transported object located on the mounting table, the storage shelf or the holding table is gripped by an arm portion with a flange portion provided on the upper surface of the transported object, and a plurality of A transfer device provided with a sensor for detecting the presence or absence and the holding state of the flange portion in the arm portion using the sensor. 前記アーム部を断面略コ字形状に形成し、このアーム部の側面両端部位に第一・第三の光センサと、側面中央部位に第二の光センサを設け、これらの光センサで前記フランジ部の有無及び保持状態を確認するようにしたことを特徴とする請求項6記載の処理装置。The arm portion is formed in a substantially U-shaped cross section, and first and third optical sensors are provided at both end portions of the side surface of the arm portion, and a second optical sensor is provided at a central portion of the side surface. 7. The processing apparatus according to claim 6, wherein the presence / absence and the holding state of the copy are confirmed. 上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサであることを特徴とする請求項7記載の処理装置。The processing apparatus according to claim 7, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor. 前記フランジ部の両側縁部に切欠部を形成し、一方、前記アーム部の下端の両側に内向き状に形成した保持片に突部を形成し、前記切欠部と前記突部でアーム部内の前記フランジ部の位置決めを行うようにしたことを特徴する請求項6ないし8のいずれかに記載の処理装置。Notches are formed at both side edges of the flange portion, while projections are formed on holding pieces formed inward on both sides of the lower end of the arm portion, and the notch and the projection form an inside of the arm portion. 9. The processing apparatus according to claim 6, wherein the positioning of the flange portion is performed. 前記載置台と収納棚と保持台には、被搬送体の位置決めピンを立設し、一方、被搬送体の下面には、前記ピンに嵌合して被搬送体を位置決めする位置決め溝を形成したことを特徴とする請求項6ないし9のいずれかに記載の処理装置。The positioning table, the storage shelf, and the holding table are provided with the positioning pins for the transported object, and the lower surface of the transported object is formed with positioning grooves for fitting the pins and positioning the transported object. The processing apparatus according to claim 6, wherein the processing is performed. 被搬送体は、半導体ウエハを収納した密閉型カセットであることを特徴とする請求項6ないし10のいずれかに記載の処理装置。The processing apparatus according to any one of claims 6 to 10, wherein the object to be transported is a sealed cassette containing semiconductor wafers. 搬送機構に設けられた略コ字形状のアーム部で被搬送体の上面に設けたフランジ部を把持して搬送する搬送方法であって、前記アーム部をフランジ部に挿入した挿入状態と挿入完了状態と、前記フランジ部を前記アーム部で保持した保持状態とを、前記アーム部に配設された複数のセンサにより確認するようにしたことを特徴とする搬送方法。A transport method in which a substantially U-shaped arm provided in a transport mechanism grips and transports a flange provided on an upper surface of a body to be transported, wherein the arm is inserted into the flange and insertion is completed. A transfer method, wherein a state and a holding state in which the flange section is held by the arm section are confirmed by a plurality of sensors provided in the arm section. 前記アーム部をフランジ部に挿入した挿入状態と挿入完了状態と、前記フランジ部を前記アーム部で保持した保持状態とを確認するセンサは、前記アーム部の側面両端部位に設けた第一・第三の光センサと、側面中央部位に設けた第二の光センサの何れかにより確認するようにしたことを特徴とする請求項12記載の搬送方法。Sensors for confirming the insertion state in which the arm part is inserted into the flange part, the insertion completed state, and the holding state in which the flange part is held by the arm part are provided at first and second end portions on both side surfaces of the arm part. 13. The transport method according to claim 12, wherein the confirmation is performed by one of the three optical sensors and a second optical sensor provided at a central portion of the side surface. 上記第一・第三の光センサは透過型センサであり、上記第二の光センサは反射型センサであることを特徴とする請求項13記載の搬送方法。14. The transport method according to claim 13, wherein the first and third optical sensors are transmission sensors, and the second optical sensor is a reflection sensor. 被搬送体は、半導体ウエハを収納した密閉型カセットであることを特徴とする請求項12ないし14のいずれかに記載の処理方法。15. The processing method according to claim 12, wherein the object to be transported is a sealed cassette containing semiconductor wafers.
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