JP2001077173A - Semiconductor manufacturing apparatus and manufacture of device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable quick and easy exchange of an SMIF pod accommodating a reticle or the like. SOLUTION: A pod stocker 10 having a pod hoisting and lowering base 20 and a hoisting and lowering means 30 is provided on the side of a chamber 1 incorporating an aligner or the like. At a first position S1 on a height of about 900 mm from the floor surface, exchange of a pod P is carried out by an operator or by an AGV of a floor surface running type or the like, to house the pod previously on each shelf of a pod holding shelf unit 50. At supplying or recovering of the pod P to or from an indexer 2 as an opening/closing means provided on a top of the chamber 1, the pod hoisting and lowering base 20 is moved to a second position S2 on the top part of the stocker 10 to transfer the pod P between a pod wait base 40 at a third position S3 and a horizontal transfer robot 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called open / close storage container (pod) capable of keeping a cassette containing a substrate such as a semiconductor wafer or a reticle clean. The present invention relates to a semiconductor manufacturing apparatus such as an exposure apparatus using a standard mechanical interface system and a device manufacturing method.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, in particular, in a lithography process, a substrate such as a semiconductor wafer has been processed in a clean room in which submicron-sized dust causing element defects is controlled in order to improve the yield. Nowadays, with high integration of elements and miniaturization of circuits, realization of a clean room for managing dust having a particle size corresponding to these is becoming technically and costly difficult.

In order to improve the cleanliness of a clean room, a method of improving the cleanliness of a clean room is to store a cassette or the like containing a substrate in a closed and openable container whose inside is kept clean.
A standard mechanical interface system (SMIF) that enables clean transfer of a substrate by disposing the container opening / closing means in each semiconductor manufacturing apparatus has been proposed.

For example, as shown in FIG. 8, a SMIF for carrying in and out a reticle in a semiconductor exposure apparatus has been developed.

This has opening / closing elevating means (SMIF indexer) 103 for opening / closing the SMIF pod 102 and pulling out the stored reticle carrier (cassette) 102a from the pod 102. The SMIF indexer 103 pulls the reticle carrier 102a into the semiconductor exposure apparatus 101. Cassette 102
a fork-shaped hand 104 for taking out the reticle 102b from the cassette 102a, and a transfer means 105 for moving the hand 104 up and down and up and down with respect to the cassette 102a and transferring the hand 104 to a pre-alignment stage (not shown). In order to reduce contamination of the reticle 102b conveyed by the conveyance means 105 and the time required for exchanging the reticle 102b, the height at which the reticle 102b is taken out of the cassette 102a is set to the height at which the reticle 102b is conveyed to the pre-alignment stage. The transport system path is shortened by almost matching.

[0006] For this, pod mounting surface T ₁ of the SMIF indexer 103, would be disposed somewhat above said reticle conveying surface T _2, moreover, the height of the reticle-carrying surface T ₂ are exposure apparatus Is near the height of the reticle stage, and therefore is 1600 mm or more from the floor.

[0007]

However, according to the above prior art, as described above, the mounting surface of the pod is as high as 1600 mm or more from the floor. Automatic guided vehicle (AGV)
It is difficult to supply and recover pods. As a result, it becomes necessary to use an overhead traveling type AGV that travels on a track suspended from the ceiling of the clean room, which increases equipment costs and increases restrictions on layout.

On the other hand, if the position of the SMIF indexer is set at a height of 800 to 1000 mm from the floor surface in order to cope with pod replacement by the operator or a floor traveling type AGV, a clean environment in the semiconductor manufacturing apparatus is required. (Chamber)
Because the distance over which the reticle is transported within the chamber is significantly increased, dust from the transport mechanism may contaminate the clean environment and reticle inside the chamber. For example, it is necessary to store the removed reticle in a cassette with another lid and transport the reticle, or to suppress the generation of dust by combining the drive unit with a rotating arm. Further, when a plurality of reticles are stored in the pod, there is a disadvantage that the time required for reticle replacement is increased.

Further, as a structural problem of the SMIF,
Since only a few indexers can be mounted, there is an unsolved problem that frequent pod replacement is required.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned unresolved problems of the prior art, and has been described in connection with an exposure apparatus or the like having a standard mechanical interface system, that is, a SMIF. It is an object of the present invention to provide a semiconductor manufacturing apparatus and a device manufacturing method which can easily reduce the time required for pod replacement by providing a pod holding shelf for storing a large number of pods. .

[0011]

In order to achieve the above object, a semiconductor manufacturing apparatus according to the present invention is a semiconductor manufacturing apparatus having a standard mechanical interface system for loading and unloading a substrate by a substantially sealed pod. A closed chamber provided with a plurality of opening / closing means for opening and closing the pod; and a reciprocating movement from a predetermined first height position of the closed chamber to a second height position close to the height position of the opening / closing means. A pod elevating platform, elevating means for reciprocating the pod elevating platform, a pod standby platform for waiting the pod at the second height position, and the pod at the second height position. A horizontal transfer robot for transferring the pod between the pod lift and the opening / closing means is provided.

Preferably, a pod holding shelf for storing the pod is provided between the first height position and the second height position.

It is preferable that the pod lifting platform and the pod standby platform each have a delivery unit for delivering the pod.

[0014]

A pod stocker is provided on the side of a closed chamber containing an exposure apparatus used for a lithography process.
A pod holding shelf for vertically storing a plurality of pods in a pod stocker, and a second height position close to the height of the pod opening / closing means, ie, the indexer, from a first height position of, for example, about 900 mm from the floor surface. A pod lift that can reciprocate up and down is provided.

The pod lift receives the pod from the operator or a floor traveling type AGV at the first height position, rises along the pod holding shelf, and stores the pod on a predetermined shelf. In the pod supply / recovery process to the closed chamber, the pod lift receiving the pod from the pod holding shelf rises to the second height position on the top of the pod stocker, delivers the pod to the horizontal transfer robot, and receives the pod. The horizontal transfer robot transfers the pod to predetermined opening / closing means.

After the pod is opened by the opening / closing means and a substrate such as a reticle is taken out of the closed chamber, the empty pod is returned to the top of the pod stocker by a horizontal transfer robot and delivered to the pod stand. During this time, the pod lift that transported the next pod delivered the next pod to the horizontal transport robot at the second height position at the top of the pod stocker, and subsequently received an empty pod from the pod standby platform. To drop and store empty pods on the pod holding shelf.

During the horizontal transfer of the pod by the horizontal transfer robot at the second height position, the pod is moved between the first height position or each of the pod holding shelves and the second height position. By transporting the pods vertically and alternately transferring the pods at the top of the pod stocker between the pod standby table, the pod lifting table, and the horizontal transport robot, the pod exchange time can be reduced.

Further, the supply and collection of the pod to and from the pod lift are performed at the first height position convenient for the work by the operator or the floor traveling type AGV.
This can greatly contribute to improving work efficiency, reducing equipment costs, increasing the degree of freedom in layout, and the like.

[0019]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an entire semiconductor manufacturing apparatus according to one embodiment. A standard mechanical interface system (SMI) for a reticle as a substrate is provided on the upper left of a front surface of a chamber 1 which is a closed chamber containing an exposure apparatus.
A plurality of indexers 2 which are opening / closing means of F) are provided,
Inside the chamber 1, a reticle transport unit for transporting the reticle introduced into the apparatus by each indexer 2 and a reticle stocker 1a for storing the reticle are provided.

The pod mounting surface of the indexer 2, which opens and closes the substantially closed pod P, is set at a predetermined height higher than the reticle transport height with respect to the reticle stocker 1a.

On the side of the chamber 1, a pod stocker 10 for storing a large number of pods P is arranged. The pod stocker 10 has a pod lifting platform 20 and a pod lifting platform 20 located near a pod mounting surface of the indexer 2 from a first position S ₁ at a first height of approximately 900 mm above the floor. Lifting means 30 for reciprocating up and down to a second position S ₂ at a second height position is provided, and when the pod lifting table 20 rises to the second position S ₂ at the top of the pod stocker 10, it will be described later. The pod lift 20 is exposed from the opening 11 of the pod stocker 10 as shown in FIG. Second position S
_The pods P transferred to the indexer 2 are transferred to each indexer 2 by a horizontal transfer robot 3 having a robot hand 3a for gripping a handling member formed on the pod P and a vertically moving means 3b for horizontally moving the pods P up and down. Conveyed. Note that the mechanism of the elevating / lowering horizontal moving means 3b is constituted by a known mechanism, for example, a pulse motor, a ball screw, a linear guide and the like.

At a third position S ₃ located behind the second position S _2, a pod standby table 40 is provided, and the pod lifting table 20 is raised from the first position S ₁ to the second position S ₂ . A pod holding shelf 5 having a plurality of shelves
0 is arranged.

The pod lift 20 is, as shown in FIG.
Three positioning pins 21a for positioning the pod P by fitting into positioning holes provided on the bottom surface of the pod P
(See FIG. 3) and a base plate 21 having a one-way guide portion 21b for rough positioning based on the outer shape of the pod;
A slide plate 22 serving as a transfer unit for moving the base plate 21 forward and backward in the horizontal direction, and an elevating plate 23 cantilevered by the elevating unit 30 are provided. The elevating plate 23 is formed with a guide portion 23a for roughly positioning according to the outer shape of the pod P, and guides in a direction orthogonal to the guide portion 21b formed on the base plate 21.

The pod stand 40 includes a guide 41a for positioning in a plane based on the outer shape of the pod, a base 41 having a notch 41b for preventing interference with the pod lift 20, and a base 41. The pod stocker 10 has a slide plate 42 serving as a transfer means for moving the slide plate 41 horizontally and a support plate 43 for supporting the slide plate 42. The support plate 43 is supported on the pod stocker 10.

[0026] FIG. 3 is for explaining a sequence of exchanging the pod P ₂ to be supplied to the empty pod P ₁ and any indexer 2 recovered from any of the indexer 2, recovery pod P ₁ is 3 (A), the supply pod P ₂ is transported above the second position S ₂ by the robot hand 3 a and the vertical movement horizontal moving means 3 b, and is placed on the pod lifting table 20. than 2 position S ₂ to wait slightly lower position. Subsequently, as shown in (b) of FIG. 3, the slide plate of the third position S ₃ of the pod standby stage 40 42
There was moved to the second position S _2, it receives a recovered pod P ₁ from the robot hand 3a. When the robot hand 3a is opened to recover the pod P _1, as shown in (c) of FIG. 3, the pod standby base sliding plate 42 is a base plate 41 of the 40 third position S
₃ is retracted into the pod elevator platform 20 is raised to the second position S _2.

The supply pod P is provided by the robot hand 3a._TwoGrasp
Pod P supplied from the pod lift 20_Two Unloaded
(See (d) of FIG. 3), the pod elevating table 20 is
1 is a collection pod P supported on a pod stand 40₁of
Lower until it is lower than the lower surface, as shown in FIG.
As shown in FIG. ₁
To move the pod lift 20 upward. This
Pod P from the pod stand 40₁To
receive. Then, the slide 21 and the plate 21 of the pod lift 20
The guide plate 22 is returned to the lift plate 23, and an operator or the like directly
When collecting, first position S₁Move to Podst
When stocking in the locker 10, the pod
Any shelf (slot) of the pod holding shelf 50 arranged below
G).

Here, the sequence in which the collection and the supply of the pod are performed simultaneously has been described. However, in the case of the collection only or the supply only, the pod is directly exchanged between the pod lift 20 and the robot hand 3a. Needless to say, it should be.

[0029] Figures 4 and 5 is for explaining loading and unloading of the pod with respect to the structure and the shelf of the pod holding rack 50, each shelf of the pod holding rack 50, the positioning in the plane by the outer shape of the pod P ₃ The shelf 51 is provided with a notch 51b for preventing the guide portion 51a from interfering with the pod lift 20.

In the step of transferring the pod P _{3 to} each shelf, first, as shown in FIG.
With the pod P ₃ to be stored in the designated slot (shelf) at 0, the pod lift 20 is raised and lowered to a position slightly higher than the shelf 51 of the designated slot, and as shown in FIG. When the base plate 21 is moved above the shelf plate 51 by the slide plate 22, the pod lift base 20 is lowered by the lifting / lowering means 30 as shown in (c), and the slide plate 22 is moved as shown in (d). The pod storage operation is completed by returning the base plate 21 onto the lifting plate 23. When taking out the pod, the reverse operation is performed.

In the present embodiment, the pod stand 40 is arranged behind the pod lift 20 in order to minimize the footprint. However, it may be provided between the indexer 2 on the chamber 1 and the pod lift 20. Needless to say.

Next, an embodiment of a device manufacturing method using the above-described semiconductor manufacturing apparatus will be described. FIG. 6 shows a flow of manufacturing a semiconductor device (a semiconductor chip such as an IC or an LSI, or a liquid crystal panel or a CCD). Step 1
In (circuit design), a circuit of a semiconductor device is designed.
In step 2 (mask fabrication), a mask, which is a substrate on which the designed circuit pattern is formed, is fabricated. In step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing, bonding),
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 7 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment, it is possible to manufacture a highly integrated semiconductor device, which has been conventionally difficult to manufacture.

[0034]

Since the present invention is configured as described above, it has the following effects.

In a semiconductor manufacturing apparatus equipped with a SMIF, pod supply / recovery operations by an operator or a floor traveling type AGV are easy. Therefore, it is possible to greatly contribute to improvement of the work efficiency of the pod replacement, reduction of the equipment cost, increase of the degree of freedom of the layout, and the like.

Further, since a plurality of pods can be stored in the pod stocker, the time required for pod replacement can be greatly reduced, and the throughput of the semiconductor manufacturing apparatus can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an entire semiconductor manufacturing apparatus according to an embodiment.

FIG. 2 shows a pod lifting platform and a pod standby platform.
(A) is a plan view thereof, (b) is a cross-sectional view taken along line AA of (a), and (c) is a cross-sectional view taken along line BB of (a). .

FIG. 3 is a diagram illustrating a process of transferring a pod between a pod lifting platform and a pod standby platform.

FIG. 4 shows a pod elevator and a pod holding shelf;
(A) is a plan view of these, and (b) is a cross-sectional view taken along line AA of (a).

FIG. 5 is a diagram illustrating a process of storing a pod from a pod lifting table on a pod holding shelf.

FIG. 6 is a flowchart illustrating a device manufacturing method.

FIG. 7 is a flowchart showing a wafer process.

FIG. 8 shows a semiconductor manufacturing apparatus according to a conventional example.
(A) is a perspective view showing the appearance, and (b) is a partially enlarged view showing the inside of the semiconductor manufacturing apparatus in cross section.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chamber 2 Indexer 3 Horizontal transfer robot 3a Robot hand 10 Pod stocker 11 Opening 20 Pod elevating table 21, 41 Base plate 22, 42 Slide plate 23 Elevating plate 30 Elevating means 40 Pod standby table 43 Support plate 50 Pod holding shelf 51 Shelf plate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/027 H01L 21/30 502J 503E

Claims (5)

[Claims] 1. A semiconductor manufacturing apparatus having a standard mechanical interface system for carrying a substrate in and out of a substantially closed pod, comprising: a closed chamber provided with a plurality of opening / closing means for opening / closing the pod; A pod elevator that is reciprocally movable from a predetermined first height position to a second height position closer to the height position of the opening / closing means, an elevating means for reciprocating the pod elevator, A pod standby table for holding the pod at a second height position; and a horizontal transfer robot for transferring the pod between the pod lift table and the opening / closing means at the second height position. A semiconductor manufacturing apparatus characterized by the above-mentioned. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a pod holding shelf for storing the pod is provided between the first height position and the second height position. 3. The semiconductor manufacturing apparatus according to claim 1, wherein the pod lifting table and the pod standby table each have a transfer unit for transferring the pod. 4. A pod stocker including a pod holding shelf, a pod lifting platform, and a lifting means, and a pod standby platform is provided on the pod stocker. 4. The semiconductor manufacturing apparatus according to 3. 5. A device manufacturing method comprising a step of manufacturing a semiconductor device by the semiconductor manufacturing apparatus according to claim 1.