TW200425376A - Method of inspecting cassette of wafer box for deformation - Google Patents

Abstract

A kind of method of inspecting cassette of wafer box for deformation comprises two practice types, in which the first practice type is to position a cassette, emit a inspection light beam to an inspection region of the cassette, then, receive the inspection light beam after passing through the inspection region to obtain a reception value and finally compare the reception value with a predetermined value to determine if the cassette has been deformed; and the second practice type is to position a cassette, emit a inspection wave to an inspection region of the cassette, then, receive the inspection wave after passing through the inspection region to obtain a reception value and finally compare the reception value with a predetermined value to determine if the cassette has been deformed.

Description

200425376 Description of invention (1) ... [Technical field to which the invention belongs] The present invention relates to a detection method, and particularly to a method that can detect whether a cassette of the wafer cassette is deformed. [Previous technology] 5 纟 In the semiconductor process, in order to allow most wafers to be transferred more efficiently between different workstations, in practice, a certain number of wafers are inserted in a -wafer box at a horizontal angle. So that several wafers can be moved during one transfer. Because the aforementioned wafers are inserted at a horizontal angle, once the wafer box is unable to detect that the wafer box has been deformed, inserting the wafer directly into the wafer box ^ may easily cause the wafer to be damaged. Among them, this wafer box is deformed: The timing can be roughly divided into two stages. The first stage is that the wafer box has defects such as verticality and horizontality in the finished product due to poor precision in the manufacturing process, and the second The stage is that after the wafer cassette has been used for many times, it is easy to be deformed due to collisions or temperature differences in the process. However, no matter what stage of deformation, it is easy to cause damage to the inserted wafer. In view of this situation, some industry researchers have developed methods and equipment that can detect the deformation of the wafer box, such as the "apparatus and method for inspecting the deformation of the wafer boat" such as the announcement No. 430915. The aforementioned device for inspecting the deformation of the wafer boat mainly includes an acquisition unit that can output the internal image of the wafer boat, such as a scanner or a projector, and uses this acquisition unit to capture several inspection surface images of the wafer boat to be inspected. 'Then compare the acquired images of each detection surface with the images previously stored in an image database, and then use the comparison results to determine the degree of deformation of the crystal boat 0 200425376 玖, Description of the invention: (2) ·, One: '^, 丨' Since the crystal boat is approximately three-dimensional, the process of detecting its deformation usually requires multiple detection surfaces, that is, the crystal boat needs to be taken out during the inspection Top, bottom, left, and right side images to detect 5 10 15 20

The deformation degree of the crystal boat is known, and the design of the conventional inspection device and method can indeed detect the deformation degree of the crystal boat, but it is still not ideal. The reasons are as follows: 1. It is impossible to determine whether the relative positions of the detection surfaces are aligned: Xi After acquiring the image of each detection surface, the known technology can only compare the image with the image established in the database in advance, and the images of each detection surface of the crystal boat are mutually beneficial to each other ^ in the comparison action, this design The method easily results in that the detection surfaces of the wafer boat are not deformed, but when there is a difference in relative height or level between the detection surface and other detection surfaces, the detection method obviously cannot determine the relative position of each detection surface, and each detection The relative positional relationship between the surfaces is one of the important judging dimensions of whether the boat can be used. First, the placement operation is more complicated: because the crystal wire has a variety of different sizes, to meet the different wafers or different numbers of wafers to be inserted, this' right needs to use the same testing equipment to detect all different wafer boats In the poor material warehouse, standard images of wafer boats of various sizes need to be built as t = using 'plus each-the wafer boat needs to be detected more than a few items', so 'f' The number of standard image data is quite large, which is the base storage capacity. Beiku also needs to have enough a. 々 忒 is to capture the image of the side of each day boat through photography deafness,

Li said that the price of the main lens α L is the price of the photographic lens J, which will increase the cost of the manufacturer. 200425376 i__ · Description of the invention (—… .i: ^ ::: ^: 'r: S'y ^' :. i: / ·: ;;;; :: ;; · :: ': ::::: '.'-^ r ::::: i / ·-· '-:-y.4-r-' From the above three points, we can know that the device for measuring the deformation of the crystal boat is known when the picking date a is known. Although the method and method can achieve the effect of detecting the deformation sound of a single detection surface ^ I, but it can not meet the double deformation measurement of the relative deformation between the detection surfaces, and the conventional detection method not only has a complicated operation process, but also the The database also has a large storage capacity to accommodate the standard image data as a reference. Furthermore, the design of using the photographic lens to manipulate the image must cost a relatively high cost. Based on the above, it can be seen that the aforementioned detection device It is obvious that there is a need for improvement. [Summary of the Invention] 10 Therefore, the purpose of the present invention is to provide-a type that can also detect the degree of deformation of each tested part of the card E of a wafer cassette. And the method for detecting the relative position between the tested parts, the method for detecting whether the cassette of the wafer cassette is deformed by the present invention has the advantages of simplifying the inspection work and reducing The advantage of low detection cost. Yu Zheng, a method of detecting whether the cassette of the wafer box is deformed, including: positioning a cassette; transmitting a detection beam at one of the tested parts of the card E; The detection unit detects a beam to obtain a received value, and compares the received value with a predetermined value to detect whether the cassette is deformed.-Also, the present invention is a method for detecting whether a cassette of a wafer cassette is deformed, Including: positioning-^ 1 £; sending a detection wave to one of the tested parts of the card E; receiving a detection wave reflected by the tested part to obtain a received value; and 200425376

(Ii) Invention description (4) The received value is compared with a predetermined value to detect whether the cassette is deformed. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of the preferred embodiment with reference to the drawings. Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same reference numerals. As shown in the first figure, a preferred embodiment of the method for detecting whether a cassette of a wafer cassette is deformed according to the present invention is used to detect a cassette 10 contained in a wafer cassette 1. The structure of 1 includes a base 10 and a cover detachably covered above the base 10! 2. The cassette U is erected in the space formed by the cover 12 and the base 10, and the cassette u can carry several wafers at a time during the manufacturing process, and the structure of the cassette 11 has an interval β and The upper and lower sides 111 of the side plates 111 are provided with a top 15 plate U2 and a bottom plate 113 on the upper and lower sides, and constitute a space for the entire batch of wafers (not shown) to be accommodated. In order to position each wafer, a number of rows of positioning slots 114 corresponding to the number of wafers are provided on the two side plates ui. A predetermined distance is maintained between the rows of positioning slots 114, and longitudinally, the The equal positioning slots 114 are arranged in three straight rows, and the 20 circles of the aforementioned crystals can be correspondingly inserted into the positioning slots 114. Among them, each side plate ⑴ further has a transverse plate surface 116 located at the front end thereof and perpendicular to each other. With straight board surface 117. In this embodiment, the tested part of the card E u is a positioning rib 15 formed laterally at the middle position of the bottom plate U3, one formed on each side plate 200425376

Second detection edge 14. Second detection edges of the π 1 rear end portions having a predetermined slot width

No equal height setting and judge whether the detection positioning slot 114 is misaligned. Among them, the aforementioned detection items can be implemented in three stages and the order can be adjusted according to the needs of private control. The aforementioned first detection surface 13 is defined and formed. Near the intersection of the horizontal plate surface 116 and the straight plate surface 117 of each side plate 111. First, the following is a description of a detection device 2 that can perform the detection method of the present invention. The second execution unit 24 of 20, as shown in the first and the first picture along this first, is used to detect the 'deformation' of the cassette 11 by setting the cassette 11 on the detection device 2 and the detection device 2 It has a first base 21 arranged in a straight direction, a second base 22 arranged laterally on the side of the first base 21, and a first roadway unit 23 always arranged in the center of the first base 2. A passenger seat 29 which is horizontally displaced in the length direction of the first and second base stations 21 and 22, and the aforementioned cartridge 11 is erected on this passenger seat 29 and can be synchronized with it. Shift. The detection device 2 further has a first inspection provided on the second track unit 24 and capable of being displaced along the length of the second track unit 24. 10 200425376

发明 、 Explanation of the invention::, "I • ':' · ·; · V-'·:: ·· X.': ^: ·; &Quot; Λ:: ': ^ ?! iVr, test unit 25, this section A detection unit 25 has a shifting frame 251 assembled on the second track unit 24. The shifting frame 251 has a front arm bar 252 and a rear arm bar 253 arranged in parallel in front and rear, and a connection between the front and rear arms. The connecting arms 254 on the same side ends of the rear arms 252 and 253 make the overall movement of the 5-position frame 251 to form a near u-shape, and the first detection unit 25 has a forearm lever 252 located far away from the connecting arms 254. A transmitting element 255 at one end position and a receiving element 256 provided at the one end position of the rear arm 253 away from the engaging arm 254, and since the transmitting element 255 emits a detection beam, the receiving element 256 Receiving, so 10, the transmitting element 255 is arranged in a line-aligned position with the receiving element 256. The detection device 2 further has a second detection unit 26 provided on both sides of the first roadway unit 23,- The third detection unit 27 and the fourth detection unit 28. The first detection unit 26 has An execution order is 15 yuan 23 on both sides, and one transmitting element 261 and one receiving element 262 are aligned in a horizontal straight line. The third detection unit 27 is a detection element 271 having two functions of transmitting and receiving a detection beam. The detection element M is on both sides of the fourth track unit 23 and the two elements are aligned with each other in a straight line, and the fourth detection unit 28 also has two detection elements 281 with the same structure as the detection element 271. The internal structure of the transmitting element attack, 261 and receiving elements 256, 262, and the detection elements 271, 281 described above is a conventional technology, and it is not the focus of the invention of the present invention. I will not go into details. Next, the following description The present invention detects the half of the deformation degree of the cassette u 200425376. 玖, the invention said, Ming Γ7) ...,. '' '' '11: ^; ί :: ..: · /: ·· ;,-.,: ：： .. ： ： ';: Γ:' ^:;::; · ;:;;. '&Quot;: f :: ;;;' Step flow. See also the second to fourth figures, the first The stage is to detect the level of the positioning ribs 15 of the cassette 11 and the height of the detection bumps 1 丨 5. , Execute a flow 31, the flow 31 is fixedly positioning the cassette 丨 丨 on the loading seat 29 by fixing a five-position fixture (not shown). Then a flow 32 is performed, and the flow 32 makes the first The detection unit 25 starts to shift to a predetermined position relative to the cassette 11 in the direction in which the cassette 11 is set. With reference to the fifth and fifth drawings A and F, the process 33 is continued. At the foregoing predetermined position, the first detection unit 25 The emitting element 255 emits a detection beam 30 of equal width in a direction perpendicular to the positioning rib 15 of the cassette 11. The detection beam 30 first detects one of the detection bumps 115 and the beam 30 passes through the detection bump 115. The first set of received value data received by the receiving element 256 and displayed on a display 301. A process 34 is executed, and the detection beam 30 is then directed toward the positioning rib 15 to detect the positioning rib 15. The receiving element 256 also receives the detection beam 30 after passing the positioning rib 15 and obtains a second set of received values. Data, the first detection unit 25 will continue to move to several different predetermined positions, and the transmitting element 255 will respectively emit the detection beam 30 toward the positioning rib 15 at each predetermined position, and the receiving element 256 will cooperate to receive the detection beam 20 And receive the array of received value data that will be displayed on the display 301. A process 35 is executed, and the detection light beam 30 continues to be directed to the detection bump 115 on the other side to detect the detection bump ι15, and another set of received value data is obtained to be displayed on the display 301. The above-mentioned received value refers to the length as shown in the fifth A and fifth B graphs. 12 200425376

玖, description of the invention (8) degrees Li, L〗. In the process of the processes 33 to 35, the detection beam 30 is a laser light type and a part of the light amount is blocked by the positioning rib 15 and the width of the detection light 30 of the laser light type is set to 5 mm. Among them, the width of the detection beam 5 can be changed as required. A process 36 is executed to compare the measured data of each set of received values with the pre-set value to determine whether the detection bumps 1 i 5 and the positioning ribs 15 of the cassette 11 are deformed. As shown in Figures 6 to 8, after the cassette Η has completed the level detection of the 10-b b of the positioning ribs in the first stage, it continues to perform the following steps to perform the second-stage detection action. Among them, the second stage is to detect the slot width of each positioning slot 114 of the cassette u and the level of alignment between the two side plates i and i to further detect whether the positioning slot i 14 on both sides is misaligned. A process 41 is executed, and the carriage 29 moves the cassette u along the 15-way order 70 23 to the position of the second detection unit 20, so that the two side plates 111 of the cassette u face the second detection respectively. The transmitting element 261 and the receiving element 262 of the unit 26. A process 42 is executed. The transmitting element 261 emits a speculative beam 40 of equal width to pass through the first pair of positioning slots 114 near the top, and the receiving unit 262 receives the detection beam 40 to obtain a first set of received value data. 'And this data will be displayed on a display 401. A process 43 is executed. The transmitting element 261 and the receiving element 262 are moved down to the height of the second pair of positioning slots U4, and a detection beam 40 is emitted by the transmitting element 261. The detection beams pass through the positioning slots 114, and the receiving element 262 13 200425376

Chopping and sending __ (9) After receiving the detection beam 40, a second set of received value data is obtained, and this data is displayed on the display 401. In this embodiment, the detection beams 40 are emitted one by one from the bottom to the respective positioning slots 114, that is, the process must be repeated 42 times, and the array received value data can be obtained and displayed on the display 5 10 15 20 device 401. The data of the aforementioned received values show the width of the positioning slots ιΐ4. A process 44 is executed to compare the aforementioned data of each set of received values with a predetermined value, so as to detect whether the slot width of the positioning slots 114 conforms to the standard or a misalignment occurs, so that the side plates u and the positioning slots can be judged. Whether the part 114 is deformed, it is specifically stated that the predetermined value is a standard width of the positioning slot hole m. Cooperating with the detection at the stage of dagger as shown in the ninth figure, when the positioning slot hole H4 has a slot width defect as shown in the eighth figure, or 'the positioning slot 114 as shown in the ninth figure is out of position. At this time, the abnormal state of the positioning slot 114 can be detected. The foregoing action has completed the second stage of detection, and then the third stage of detection is continued below, and the third stage is the vertical detection of the first and second detection edges i3 and 14 of the card E u. The third stage is to first execute a process rail system to make the carrier 29 cut the n again along the length of the first lane, and place it on one of the two sides of the card Eu-the knife does not face the first Three detection units: one detection element 271, and at the same time, the second detection edge 14 (see in the first) of the poor clothes Chu Yizhuo can face the fourth detection sheet., 28 28 detection elements 281 〇 perform a process 52 The stupid, Japanese, and Japanese detection files 271 and 281 are respectively facing the 2004th 200425376

发明, description of the invention, ('l0: ... V, the two detection edges 13, 14 emit four detection waves 50, and receive the detection waves 50 reflected from the first and second detection edges 13, 14 to obtain four sets of received values Data, and simultaneously display the data on a display 501. 5 10 15 20

56S executes a process 53 so that the detection elements 271 and 281 cooperate with a displacement mechanism (not shown) to move the two first detection surfaces 13 and the second detection and edge 14 in parallel from top to bottom. After moving to a predetermined position, a detection wave 50 is sent to the first and second detection edges 13, 14 respectively, and after receiving the detection wave 5G reflected by the first detection surface 13, 14, four groups can be learned again. The received value data is also displayed on the aforementioned display. As mentioned above, the detection elements 271, 281 will move from top to bottom along the parallel first and second detection edges 13, 14 and intermittently emit detection waves 50 to the first and second detection edges 13, 14. Therefore, the entire third stage of the detection operation can obtain array detection data. Execute-process 54, compare the data of each set of received values with a predetermined value 'to determine whether the first and second detection edges 13 are deformed or not, and their miscellaneous conditions. The explanation is that the aforementioned touch value The data represents the detection elements, and the distances from 271, 281 to the first and second detection edges 13, 14 are therefore the predetermined value data used as the comparison reference, which are the detection elements 27, 281 to the first and second detection edges 13, 14 respectively. Standard distance. It is specifically stated here that the size detection of the card U of the wafer box i in practice is not limited to the above-mentioned detection items. The second aspect of the present invention uses various types of light detection components to detect each of the cards. Parts are inspected, and there is no restriction on the number of inspections and inspection items. According to the technical content disclosed above, the recording and recording units 25 to 28 of the present invention 15 200425376, and the description of the invention are based on the transmitting elements 255, 261, The receiving elements 256 and 262 and the reflective detection components 271 and 281 are used to detect the degree of deformation of the measured portion of the cassette 11. Among the detection waves 50 and 60 in this embodiment, the laser beam is used as the detection beam. The description, but the present invention does not limit the types of detection waves 50, 60 and 5L heart. For example, infrared and ultrasonic waves can be used in the detection method of the present invention. The detection method of the subject can not only detect the horizontality and verticality of the element It can also detect whether the symmetrical two parts form an aligned state. Compared with the detection technology known by t, the present invention can indeed simplify the pre-operation and save δχ preparation costs, providing users with another Options. However, the above is only a preferred embodiment of the present invention. When the scope of implementation of the present invention cannot be limited in this way, that is, simple equivalent changes and modifications made according to the patent application scope of the present invention and the contents of the invention specification. Modifications should still fall within the scope of the invention patent. [Brief description of the drawings] The first figure is an exploded perspective view of one of the common wafer cassettes; the first diagram is a schematic plan view of a detection device of a method for detecting whether the cassette of the wafer cassette is deformed by using the present invention; Figure 疋 is a plan view similar to the second figure, illustrating a state where a first detecting unit detects a positioning rib of the cassette; The fourth figure is a preferred implementation of the method for detecting whether the card E of the wafer cassette is deformed according to the present invention A flowchart of the detection of the first stage of the example; FIG. 5A is a view showing the detection of one of the detection bumps in the preferred embodiment; FIG. 5B is a cross-section view of the detection of one of the positioning ribs by the preferred embodiment 16 2004253 76, 玖, invention description '(12) Γ: ν' '...... "!·:-':,; &Quot;: '':: λ · νΐ ': Μ; ::';.:-;: ...............: ·: · ^ ν: ^, Ι :: ί :; ^^ Intention; The sixth diagram is a plan view similar to the second diagram, illustrating the state of a second detection unit detecting the number of positioning slots of the cassette; the seventh diagram is a process of the second stage detection of the preferred embodiment Figure; 8th It is the preferred embodiment to detect the cross section of one of the two positioning grooves. Figure 9 shows that the positioning slots are aligned at the same height. The ninth figure is a schematic cross-section similar to the eighth figure and illustrates the positioning slots. Figure 10 is a plan view similar to the second figure, illustrating the state of a third, fourth inspection and 10 detection unit detecting the first, second detection edge of the cassette; the eleventh is A flowchart of the third stage detection of the preferred embodiment; FIG. 11 is a front view schematic diagram of the preferred embodiment detecting one of the first detection surfaces; and FIG. 13 is a diagram of the preferred embodiment detecting the first detection surfaces. One of the two or two detection edges 15 It is not intended to look down. 17 200425376

发明 Description of the invention '(13, [Simplified description of the main components of the drawings] 1 .......... 253 ................ ............ Cassette 254 .................... Connecting to the boom 10 .................... Base 255 .... .... ..... Transmitting element 12 .............. Cover 256 .............. Receiving element 111 ...... ...... Side plate 26 .... ..... · Second detection unit 112 ···· ............ Top plate 261 ................ transmitting element 113 ··· ... .... Base plate 262 .............. Receiving element 114 • ... " …… Positioning slot 27 ............. Second detection unit 115 …… 271 ........ 116 " ... · ...... Horizontal plate surface 28 .......... •• ... Fourth detection unit 117 ............ .. Straight plate surface 281 .............. Detection element 12 .............. Positioning rib 29 .............. .... Carrier 13 ........... First detection surface 30 .................... Detection beam 14 .. .............. Second detection edge 301 ................. Display 15 ............... Positioning rib 31 ~ 36 ............ Flow 2 .............. Detection device 40 .............. Detection Beam 21 ............... the first abutment 401 ............... the display 22 ............... the second abutment 41 ~ 44 ... ,, ......... Flow 23 ............... First track unit 50 ................. Detection wave 24 .. ....... .. The second track unit 501........ The display 25....... … ,, 251 •…… .. Shift frame 60 ............ Detection wave 252 ...... Forearm 601 .. .............. Display 12 568.

Claims (1)

200425376 _ Patent scope 'V:' ': V 1. A method for detecting whether the lightness of the wafer box is deformed, including: positioning-^ | £; transmitting a detection beam to one of the tested parts of the cassette; receiving A received value is obtained by the detection beam of the tested part; and the received value is compared with a predetermined value to detect whether the card g is deformed. 2. The method for detecting whether the caliper of the wafer cassette is deformed according to item 丨 of the patent application scope, wherein the detection beam is a laser beam. 3. According to the method described in Patent Application No. μ to check whether the caliper of the wafer cassette is deformed. The test part of the cassette is the majority of positioning slots formed on the two side plates of the cassette. 4. The method for detecting whether or not the kakun of the Japanese-Japanese-Japanese round box is deformed according to item 丨 in the scope of the patent application, wherein the tested part of the cassette is a positioning rib formed on a bottom plate. 5. According to the eighth method of detecting the deformation of the cassette of the wafer cassette according to item 丨 of the scope of the patent application, the tested part of the cassette is two formed at the bottom positions of the front ends of the two side plates of the cassette and protruding downward. Detect bumps. 6. The method for detecting whether the cassette of the wafer cassette is deformed according to item 丨 of the patent application scope, wherein the received value can be displayed on a display. 7 · A method for detecting whether a cassette of a wafer cassette is deformed, including: positioning-^ l £; sending a detection wave to a test part of one of the cassettes; receiving a detection wave reflected by the test part to obtain a Receiving value; and comparing the receiving value with a predetermined value to detect whether the cassette is deformed. 8. Detect whether the cassette of the wafer cassette is deformed according to item 7 of Shen Qing's patent scope 19 200425376 Pick up patent scope. Ν ^ ",;ν-:;·,; ί ·:-' Among them, after receiving the detection wave, a distance between a transmitting element for transmitting the detection wave and the measured part can be calculated. 9. The method for detecting whether a cassette of a wafer cassette is deformed according to item 7 of the scope of the patent application, wherein the detection wave is an ultrasonic wave. 10. The method for detecting whether a cassette of a wafer cassette is deformed according to item 7 of the scope of the patent application, wherein the detection wave is infrared. 11. The method for detecting whether the card g of the wafer cassette is deformed according to item 7 of the patent application, wherein the test portions of the 'card E' are two first detection surfaces formed respectively at the front ends of the two side plates of the card e. The method for detecting whether the cut of the wafer box is deformed according to the patent claim # 7, wherein the test portion of the card E is the second detection edge formed at the rear end of the two side plates of the cardmaker. 13. According to the method of patent application No.8, the method of checking whether the cassette called “Sunri®” is deformed, in which the calculated emission element, the distance between 70 pieces of Chimachi and the measured part can be displayed. On a monitor. 20